Variable-pitch edge searching assembly

Abstract

The utility model discloses a variable pitch edge searching assembly, and relates to the technical field of silicon wafer processing, the variable pitch edge searching assembly comprises a pedestal, a variable pitch module arranged on the pedestal and a driving member, the variable pitch module comprises two carrying seats arranged on the pedestal in parallel, and the driving member is used for driving the two carrying seats to be close to or far away from each other; when the device is used, the distance between the two carrying seats is adjusted to be consistent with the distance between the upstream process silicon wafers through the driving part, after the upstream process silicon wafers are conveyed to the two carrying seats, the driving part drives the two carrying seats to move, and the distance between the two carrying seats is adjusted to be consistent with the distance between the silicon wafers required by the downstream process. And then the silicon wafers on the two carrying seats are conveyed to a downstream process, so that the adjustment of the distance between the silicon wafers is completed, processing of different processes is met, the structure is simple and stable, and the situation that the silicon wafers fall off in the distance changing process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a variable distance edge finding component. Background Art

[0002] Silicon is refined from quartz sand. Silicon wafers are purified silicon elements. Then the pure silicon is made into silicon crystal rods, which become the material of quartz semiconductors for manufacturing integrated circuits. With the development of large-scale integrated circuits, silicon wafers are widely used as the main substrate material for semiconductors and other electronic products.

[0003] During the silicon wafer processing, a transfer device is required to transfer the silicon wafers between different processing techniques. In different process links, the requirements for the spacing between silicon wafers are different. In the prior art, the adjustment of the silicon wafer spacing is generally achieved by a transfer nozzle set on a gantry. The transfer nozzle needs to move continuously during the process (including lifting and lowering movements, translation, etc.), and the movement trajectory and structure are very complex. Long-term distance change will reduce the accuracy of the distance change, resulting in chip transfer offset, and the distance change during the transportation process is likely to cause the chip to shake or even fall.

[0004] In view of this, a variable distance edge finding component is urgently needed. Summary of the invention

[0005] In view of the problems existing in the prior art, the utility model solves the problems with the following technical structure.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A variable distance edge finding component comprises: a base, a variable distance module arranged on the base and a driving member, wherein the variable distance module comprises two carriers arranged in parallel on the base, and the driving member is used for driving the two carriers to move closer to or away from each other.

[0008] A further feature is that

[0009] The variable pitch modules are provided in plurality.

[0010] The carriers of the plurality of variable pitch modules are distributed in a straight line.

[0011] The driving member includes a driving wheel, a driven wheel, a belt and a motor, wherein the driven wheel and the motor are respectively arranged at two ends of the carrier, the driving wheel is arranged at the output end of the motor, the belt is sleeved on the driven wheel and the driving wheel, and the belt forms an upper belt and a lower belt which are parallel to each other;

[0012] The carriers on the same side of the plurality of variable pitch modules are connected to the upper belt, and the carriers on the other side of the plurality of variable pitch modules are connected to the lower belt.

[0013] The base is provided with a slide rail, and the bottom of the carrier is provided with a slide block clamped on the slide rail.

[0014] A carrier is arranged on the top of the carrier.

[0015] Conveyor belt assemblies are arranged on both sides of the carrier, and a power assembly for driving the two conveyor belt assemblies to move synchronously is arranged on the carrier.

[0016] A slot-type optical coupler is arranged on the base, and a photoelectric baffle is arranged on one of the carriers.

[0017] The base is provided with a slide groove, and the slot-type optical coupler is slidably arranged in the slide groove.

[0018] An infrared sensor is arranged at one end of the carrier.

[0019] The above structure of the utility model can achieve the following beneficial effects:

[0020] When in use, the distance between the two carriers is adjusted to be consistent with the distance between the silicon wafers of the upstream process through the driving component. When the silicon wafers of the upstream process are transported to the two carriers, the driving component drives the two carriers to move, adjusts the distance between the two carriers to be consistent with the distance between the silicon wafers required by the downstream process, and then transports the silicon wafers on the two carriers to the downstream process, thereby completing the adjustment of the silicon wafer distance to meet the processing of different processes. The structure is simple and stable, and the situation of silicon wafers falling during the distance change process is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of this embodiment;

[0022] Figure 2 This is a structural schematic diagram of another viewing angle of this embodiment;

[0023] Figure 3 is a top view of this embodiment;

[0024] Figure 4 for Figure 1 A schematic diagram of the enlarged structure at point A in the middle.

[0025] In the figure: 1. carrier; 11. carrier; 12. infrared sensor; 13. conveyor belt assembly; 14. power assembly; 15. slider; 2. driving wheel; 3. driven wheel; 4. belt; 5. motor; 6. slide rail; 7. slotted optical coupler; 8. photoelectric baffle; 9. slide groove. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0027] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0028] The following is combined with Figure 1-4 This application is described in further detail.

[0029] refer to Figure 1-3 A variable distance edge-finding component is shown, comprising: a base, a variable distance module arranged on the base, and a driving member, wherein the variable distance module comprises two carriers 1 arranged in parallel on the base, and the driving member is used to drive the two carriers 1 to move closer to or farther away from each other, so that when in use, the distance between the two carriers 1 is adjusted to be consistent with the distance between silicon wafers of the upstream process through the driving member, and when the silicon wafers of the upstream process are conveyed to the two carriers 1, the driving member drives the two carriers 1 to move, adjusts the distance between the two carriers 1 to be consistent with the distance between silicon wafers required by the downstream process, and then conveys the silicon wafers on the two carriers 1 to the downstream process, thereby completing the adjustment of the distance between the silicon wafers to meet the processing of different processes, and the structure is simple and stable.

[0030] Further optimization is to refer to Figure 1-3 As shown, in order to improve the efficiency of silicon wafer pitch change, the number of pitch change modules can be set to multiple according to specific needs. In this embodiment, four pitch change modules are set. In this way, multiple groups of silicon wafers can be pitched synchronously, which greatly improves the efficiency of silicon wafer transportation. In order to facilitate the layout of the structure, the optimal arrangement of the carriers 1 of the multiple pitch change modules is in a straight line, so that multiple upstream and downstream conveying tracks can be arranged side by side on both sides of the base.

[0031] refer to Figure 1-3As shown, the specific structure of the driving member includes a driving wheel 2, a driven wheel 3, a belt 4 and a motor 5. The driven wheel 3 and the motor 5 are respectively arranged at the two ends of the carrier 1, the driving wheel 2 is arranged at the output end of the motor 5, and the belt 4 is sleeved on the driven wheel 3 and the driving wheel 2. In this way, the motor 5 drives the driving wheel 2 to rotate, so that the belt 4 rotates on the driving wheel 2 and the driven wheel 3. The belt 4 forms an upper belt and a lower belt parallel to each other. The carrier 1 on the same side of the multiple variable pitch modules is connected to the upper belt, and the carrier 1 on the other side of the multiple variable pitch modules is connected to the lower belt. In this design, when the belt 4 rotates, the carrier 1 connected to the upper belt and the carrier 1 connected to the lower belt in the same variable pitch module move closer to or away from each other (the switching of the two movement modes is carried out by changing the movement direction of the belt 4). In this way, the distance between the two carriers 1 of the multiple variable pitch modules is synchronously adjusted at one time, so as to further improve the variable pitch efficiency.

[0032] refer to Figure 1-2 As shown, the specific installation method of the carrier 1 can be: a slide rail 6 is provided on the base (the extension direction of the slide rail 6 is consistent with the direction of the belt 4), and a slider 15 is provided at the bottom of the carrier 1 and is clamped on the slide rail 6. In this way, the purpose of sliding the carrier 1 on the base 1 is achieved.

[0033] refer to Figure 1-3 As shown, it is further optimized that a platform 11 is provided on the top of the carrier 1 for carrying corresponding components.

[0034] refer to Figure 1-3 As shown, in order to facilitate the transportation of silicon wafers to the carrier 11 or the transportation of silicon wafers on the carrier 11 to the downstream runway, conveyor belt assemblies 13 are arranged on both sides of the carrier 11 (two conveyor belt assemblies 13 are arranged in parallel, and the conveyor belt assemblies 13 are composed of conveyor belts, pulleys, etc.), and a power assembly 14 for driving the two conveyor belt assemblies 13 to move synchronously is arranged on the carrier 1 (the power assembly 14 can be composed of a motor and a synchronous shaft, so that the conveyor belts of the two conveyor belt assemblies 13 can move synchronously). In this way, the silicon wafer is placed on the conveyor belts of the two conveyor belt assemblies 13, and the conveyor belts move, so that the silicon wafer moves on the carrier 11.

[0035] refer to Figure 1 and 4 As shown, in order to facilitate the positioning of the pitch change position of the carrier 1, a slot-type optical coupler 7 is provided on the base, and a photoelectric baffle 8 is provided on one of the carriers 1. When the slot-type optical coupler 7 detects the photoelectric baffle 8, it indicates that the pitch change of the carrier 1 is completed. In addition, in order to adapt to the detection of various pitch changes, a slide groove 9 is provided on the base (the extension direction of the slide groove 9 is consistent with the extension direction of the slide rail 6). The slot-type optical coupler 7 is slidably set in the slide groove 9. The position of the slot-type optical coupler 7 can be adjusted according to different pitch change requirements to adapt to the detection and positioning of different pitch change requirements.

[0036] A further optimization is that an infrared sensor 12 is provided at one end of the carrier 11 (the conveying direction of the conveyor belt assembly 13, that is, the end in the unloading direction) for detecting whether the position of the silicon wafer on the carrier 11 is accurate, to prevent the conveyor belt assembly 13 from conveying the silicon wafer beyond or failing to completely reach the carrier 11, thereby achieving the effect of edge finding (detecting the edge of the silicon wafer), and each conveyor belt assembly 13 works independently, and the silicon wafer moves on the carrier 11 until the silicon wafer triggers the sensor to stop, so that the front and rear edges of the entire row of silicon wafers can be in a straight line, and the two actions of edge finding and distance changing are performed simultaneously to improve the processing efficiency of the silicon wafers.

[0037] In summary, when in use, the distance between the two carriers 1 is adjusted to be consistent with the distance between the silicon wafers of the upstream process through the driving component. When the silicon wafers of the upstream process are transported to the two carriers 1, the driving component drives the two carriers 1 to move, and adjusts the distance between the two carriers 1 to be consistent with the silicon wafer distance required by the downstream process. Then, the silicon wafers on the two carriers 1 are transported to the downstream process, thereby completing the adjustment of the silicon wafer distance to meet the processing of different processes. The structure is simple and stable, and the situation of silicon wafers falling during the distance change process is reduced.

[0038] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.

Claims

1. A variable distance edge finding component, characterized in that: include: A base, a variable pitch module arranged on the base, and a driving member, wherein the variable pitch module comprises two carriers (1) arranged in parallel on the base, and the driving member is used to drive the two carriers (1) to move closer to or farther from each other.

2. A variable distance edge finding assembly according to claim 1, characterized in that: The variable pitch modules are provided in plurality.

3. A variable distance edge finding assembly according to claim 2, characterized in that: The carriers (1) of the plurality of variable pitch modules are distributed in a straight line.

4. A variable distance edge finding assembly according to claim 3, characterized in that: The driving member comprises a driving wheel (2), a driven wheel (3), a belt (4) and a motor (5); the driven wheel (3) and the motor (5) are respectively arranged at two ends of the carrier (1); the driving wheel (2) is arranged at the output end of the motor (5); the belt (4) is sleeved on the driven wheel (3) and the driving wheel (2); the belt (4) forms an upper belt and a lower belt which are parallel to each other; The carriers (1) on the same side of the plurality of variable pitch modules are connected to the upper belt, and the carriers (1) on the other side of the plurality of variable pitch modules are connected to the lower belt.

5. The variable distance edge finding assembly according to claim 1, characterized in that: A slide rail (6) is arranged on the base, and a slider (15) clamped on the slide rail (6) is arranged at the bottom of the carrier (1).

6. The variable distance edge finding assembly according to claim 1, characterized in that: A carrier platform (11) is arranged on the top of the carrier (1).

7. The variable distance edge finding assembly according to claim 6, characterized in that: Conveyor belt assemblies (13) are arranged on both sides of the carrier (11), and a power assembly (14) for driving the two conveyor belt assemblies (13) to move synchronously is arranged on the carrier (1).

8. The variable distance edge finding assembly according to claim 1, characterized in that: A slot-type optical coupler (7) is arranged on the base, and a photoelectric baffle (8) is arranged on one of the carriers (1).

9. The variable distance edge finding assembly according to claim 8, characterized in that: A slide groove (9) is provided on the base, and the groove-type optical coupler (7) is slidably arranged in the slide groove (9).

10. The variable distance edge finding assembly according to claim 6, characterized in that: An infrared sensor (12) is provided at one end of the carrier (11).

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