Camera module test frame
By integrating semiconductor refrigerator, heating plate and temperature sensor in the camera module test frame, the temperature of the camera module is adjusted in real time, the impact of temperature changes on the test results is solved, and the consistency and reliability of the test results are achieved.
Patent Information
- Application Number
- CN202421180829.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-05-27
AI Technical Summary
During factory testing, the camera module has a temperature rise in internal components due to changes in operating temperature, which affects the resolution test results, resulting in differences in factory and client tests, and the temperature adjustment of the module cannot be performed.
A camera module test frame is designed, including a semiconductor refrigerator and heating plate, and the temperature of the camera module is detected and adjusted in real time through a temperature sensor and controller to ensure that it is within the set temperature range.
It effectively solves the impact of temperature changes in camera modules on test results, ensures consistency of test results at the factory and client, and improves the reliability and accuracy of the test.
Smart Images
Figure CN222621084U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of camera modules, in particular to a camera module testing frame. Background Art
[0002] The camera module is composed of capacitors, chips, components, connectors, flexible circuit boards, lens + holder integrated materials and other main components. The camera module needs to undergo a series of tests at different positions before leaving the factory, such as connectivity test, image quality test, etc.
[0003] During the factory test, the camera module will heat up due to changes in the module's operating temperature. This temperature will change the design gap of the internal components, which will affect the resolution test. This will cause a large difference between the factory and client resolution tests and affect the benchmarking. During the test, the module temperature cannot be adjusted, which affects the test results. Utility Model Content
[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a camera module test stand.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A camera module test stand comprises: an upper cover, a first base and a second base which are arranged in sequence, a camera module to be tested is fixed between the first base and the second base, a PCB board is arranged on a side of the second base away from the upper cover, a semiconductor refrigerator for cooling and a heating plate for heating are arranged between the PCB board and the second base, a controller is arranged on the PCB board, and the semiconductor refrigerator, the heating plate and the PCB board are all electrically connected to the controller.
[0007] In one embodiment, a connecting groove is provided on a side of the second base facing the upper cover, and the connecting groove runs through two side surfaces of the second base. The camera module includes a substrate and a lens mounted on the substrate, and the lens is placed in the connecting groove accordingly. A receiving groove is provided on the second base relative to the position of the substrate, and the substrate is placed in the receiving groove.
[0008] In one embodiment, a placement groove is provided on the outer side of the second base relative to the connecting groove, and the placement groove is located on the side of the second base facing the first base. The first base is correspondingly placed in the placement groove. An air avoidance groove is provided on the first base, and the air avoidance groove is provided along the shape of the lens. The lens is embedded in the air avoidance groove.
[0009] In one embodiment, a through hole is formed in the upper cover at a position corresponding to the lens, and the lens is connected to the outside through the through hole.
[0010] In one embodiment, the semiconductor cooler is accommodated in the connecting groove, one side of the semiconductor cooler is in contact with the lens, the semiconductor cooler is provided with two pins, the second base is provided with slots respectively relative to the positions of the two pins, and the two pins are correspondingly accommodated in the two slots.
[0011] In one embodiment, a thermally conductive gasket is provided on a side of the semiconductor cooler away from the camera module, the thermally conductive gasket is in contact with the semiconductor cooler, and the thermally conductive gasket is used to conduct heat generated by the semiconductor cooler.
[0012] In one embodiment, a through groove is formed at a position of the PCB board relative to the thermally conductive gasket, the through groove runs through two sides of the PCB board, and the thermally conductive gasket is accommodated in the through groove.
[0013] In one embodiment, the heating plate is located on a side of the PCB board facing the second base, and the second base is provided with an opening relative to the position of the heating plate, and the heating plate is accommodated in the opening.
[0014] In one embodiment, a heat sink is disposed on a side of the PCB away from the second base, and the thermal conductive pad is in contact with the heat sink through the through groove.
[0015] In one embodiment, a temperature sensor is provided on a side of the PCB board facing the second base, the temperature sensor is electrically connected to the controller, the second base is provided with a recess relative to the position of the temperature sensor, and the temperature sensor is inserted into the recess.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] The utility model provides a camera module test stand which detects the temperature of the camera module during the camera module test by arranging a temperature sensor, a semiconductor cooler and a heating plate. When the temperature is too high, the semiconductor cooler is used to cool it down. When the temperature is too low, the heating plate is used to heat it up, so that the temperature of the camera module is maintained within the set temperature range, thereby ensuring the validity of the test result. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1A schematic diagram of the structure of a camera module test stand provided by the utility model;
[0020] Figure 2 A schematic diagram of the explosion structure of a camera module test stand provided by the utility model;
[0021] Figure 3 This is a structural schematic diagram of a camera module test stand provided by the utility model after removing the upper cover;
[0022] Figure 4 The utility model provides a schematic diagram of the exploded structure of a second base, a thermal pad and a PCB board in a camera module test frame.
[0023] Description of the drawings: 10. Upper cover; 11. Through hole; 12. Assembly rod; 20. First base; 21. Air avoidance groove; 30. Second base; 31. Communication groove; 32. Accommodation groove; 33. Placement groove; 34. Assembly groove; 35. Slot; 36. Opening hole; 37. Give way groove; 40. Camera module; 41. Base plate; 42. Lens; 50. Semiconductor refrigerator; 51. Pin; 60. Thermal pad; 70. PCB board; 71. Through groove; 80. Heating plate; 90. Heat sink; 100. Temperature sensor. DETAILED DESCRIPTION
[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0025] A camera module test stand, referring to Figure 1 and Figure 2 , including an upper cover 10, a first base 20 and a second base 30 which are arranged in sequence, a camera module 40 to be tested is fixed between the first base 20 and the second base 30, and the upper cover 10 covers the second base 30 to fix the camera module 40.
[0026] Reference Figure 2 and Figure 3 The second base 30 is the main body of the test stand. A connecting groove 31 is provided on the side of the second base 30 facing the upper cover 10. The connecting groove 31 runs through the two side surfaces of the second base 30. The camera module 40 includes a substrate 41 and a lens 42 mounted on the substrate 41. The substrate 41 is arranged in a long strip shape, and the lens 42 is mounted at the head of the substrate 41. The lens 42 of the camera module 40 is placed in the connecting groove 31, and the second base 30 is provided with a receiving groove 32 at a position relative to the substrate 41. The substrate 41 of the camera module 40 is placed in the receiving groove 32.
[0027] Reference Figure 2 and Figure 3The second base 30 is provided with a placement groove 33 on the outer side of the connecting groove 31. The placement groove 33 is provided on the side of the second base 30 facing the first base 20. The depth of the placement groove 33 matches the thickness of the first base 20. The placement groove 33 is connected with the connecting groove 31. The first base 20 is correspondingly placed in the placement groove 33 to fix the camera module 40.
[0028] Reference Figure 2 and Figure 3 The first base 20 is provided with a clearance groove 21, which is provided along the shape of the lens 42 of the camera module 40, so that the first base 20 can avoid the lens 42 of the camera module 40, so that the lens 42 of the camera module 40 can be embedded in the clearance groove 21 of the first base 20, and the first base 20 can be accommodated in the placement groove 33 of the second base 30, so that the camera module 40 is fixed between the first base 20 and the second base 30. The lower side of the clearance groove 21 is connected to the outside to avoid the position of the substrate 41.
[0029] Reference Figure 1 and Figure 2 A through hole 11 is provided on the upper cover 10 at a position corresponding to the lens 42 of the camera module 40. When the upper cover 10 is covered on the second base 30, the lens 42 of the camera module 40 is connected to the outside through the through hole 11. An assembly rod 12 is provided on the side of the upper cover 10 facing the second base 30, and an assembly groove 34 is provided on the side of the second base 30 facing the upper cover 10. The assembly rod 12 of the upper cover 10 and the assembly groove 34 of the second base 30 are correspondingly plugged and fixed, so that the upper cover 10 fixes the camera module 40 in the test frame.
[0030] Reference Figure 2 and Figure 4 A semiconductor cooler 50 is disposed on the back of the second base 30. The semiconductor cooler 50 is accommodated in the connecting groove 31. One side of the semiconductor cooler 50 is in contact with the lens 42 of the camera module 40. The semiconductor cooler 50 is used to cool the camera module 40 so as to cool the camera module 40 when the temperature of the camera module 40 is too high. The semiconductor cooler 50 is provided with two pins 51. The second base 30 is provided with slots 35 at positions corresponding to the two pins 51. When the semiconductor cooler 50 is accommodated in the connecting groove 31, the two pins 51 are correspondingly accommodated in the two slots 35.
[0031] Reference Figure 2 and Figure 4 A heat-conducting pad 60 is disposed on one side of the semiconductor cooler 50 away from the camera module 40. The heat-conducting pad 60 is arranged in a rectangular shape, and the size of the heat-conducting pad 60 is adapted to the size of the semiconductor cooler 50. The heat-conducting pad 60 is fitted with the semiconductor cooler 50. The heat-conducting pad 60 is used to conduct heat generated by the semiconductor cooler 50 when working.
[0032] Reference Figure 2 and Figure 4 A PCB board 70 is disposed on the side of the second base 30 away from the upper cover 10, and a heating plate 80 is disposed on the side of the PCB board 70 facing the second base 30. The heating plate 80 is used to heat the camera module 40, so as to increase the temperature of the camera module 40 when the temperature of the camera module 40 is too low. An opening 36 is provided in the second base 30 relative to the heating plate 80, so that when the second base 30 is assembled with the PCB board 70, the heating plate 80 on the PCB board 70 is accommodated in the opening 36, thereby facilitating heating of the camera module 40 fixed in the second base 30.
[0033] Reference Figure 2 and Figure 4 The PCB board 70 integrates the control circuits for heating and cooling. The heating plate 80 and the semiconductor refrigerator 50 are both electrically connected to the PCB board 70 . The PCB board 70 also integrates the switching circuit function of the camera module 40 .
[0034] Reference Figure 2 and Figure 4 A through groove 71 is provided at a position of the PCB board 70 relative to the thermal pad 60 , and the through groove 71 runs through both sides of the PCB board 70 , so that when the PCB board 70 is assembled with the second base 30 , the thermal pad 60 is avoided, and the thermal pad 60 is accommodated in the through groove 71 on the PCB board 70 .
[0035] Reference Figure 2 A heat sink 90 is disposed on one side of the PCB board 70 away from the second base 30. The size of the heat sink 90 matches the size of the PCB board 70. The thermal pad 60 contacts the heat sink 90 through the through groove 71. The thermal pad 60 conducts the heat generated by the semiconductor refrigerator 50 to the heat sink 90, and the heat sink 90 dissipates the heat into the air to reduce the temperature of the semiconductor refrigerator 50.
[0036] Further, refer to Figure 2 and Figure 4 , a temperature sensor 100 is arranged on the PCB board 70, the temperature sensor 100 is electrically connected to the PCB board 70, the temperature sensor 100 is located on the side of the PCB board 70 facing the second base 30, the second base 30 is provided with a clearance groove 37 relative to the position of the temperature sensor 100, and the temperature sensor 100 is inserted into the clearance groove 37. The temperature sensor 100 is used to detect the temperature of the camera module 40 in real time. A controller is arranged on the PCB board 70, and the controller is electrically connected to the temperature sensor 100, the semiconductor refrigerator 50, the heating plate 80 and the PCB board 70.
[0037] Reference Figure 2When the camera module 40 is fixed and connected to work normally, the heat generated by the camera module 40 is detected by the temperature sensor 100. When the temperature of the camera module 40 is higher than the set temperature, the controller controls the semiconductor refrigerator 50 to work. The semiconductor refrigerator 50 contacts the camera module 40 and absorbs the heat generated by the camera. The heat is transferred to the heat sink 90 through the thermal pad 60 to dissipate heat and cool down, so that the temperature of the camera module 40 is reduced. When the set temperature is reached, the controller stops the semiconductor refrigerator 50 from working. When the temperature of the camera module 40 is lower than the set temperature, the controller controls the heating plate 80 to work. The heat of the heating plate 80 is transferred to the camera module 40. The temperature sensor 100 detects the temperature. At the same time, the controller controls the semiconductor refrigerator 50 to work, so that the semiconductor refrigerator 50 and the heating plate 80 work alternately, so that the camera module 40 is within the set temperature range of the relative temperature. When the temperature of the camera module 40 is within the set temperature range, the controller does not need to control the semiconductor refrigerator 50 and the heating plate 80 to work.
[0038] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A camera module test stand, characterized in that: include: An upper cover (10), a first base (20) and a second base (30) are arranged in sequence; a camera module (40) to be tested is fixed between the first base (20) and the second base (30); a PCB board (70) is arranged on a side of the second base (30) away from the upper cover (10); a semiconductor refrigerator (50) for cooling and a heating plate (80) for heating are arranged between the PCB board (70) and the second base (30); a controller is arranged on the PCB board (70); and the semiconductor refrigerator (50), the heating plate (80) and the PCB board (70) are all electrically connected to the controller.
2. A camera module test stand according to claim 1, characterized in that: A connecting groove (31) is provided on a side of the second base (30) facing the upper cover (10), and the connecting groove (31) runs through two side surfaces of the second base (30). The camera module (40) comprises a substrate (41) and a lens (42) mounted on the substrate (41), and the lens (42) is placed in the connecting groove (31) accordingly. The second base (30) is provided with a receiving groove (32) at a position relative to the substrate (41), and the substrate (41) is placed in the receiving groove (32).
3. A camera module test stand according to claim 2, characterized in that: The second base (30) is provided with a placement groove (33) on the outer side relative to the connecting groove (31); the placement groove (33) is located on the side of the second base (30) facing the first base (20); the first base (20) is correspondingly placed in the placement groove (33); the first base (20) is provided with a space avoidance groove (21); the space avoidance groove (21) is provided along the outer shape of the lens (42); and the lens (42) is embedded in the space avoidance groove (21).
4. A camera module test stand according to claim 3, characterized in that: The upper cover (10) is provided with a through hole (11) at a position corresponding to the lens (42), and the lens (42) is connected to the outside through the through hole (11).
5. A camera module test stand according to claim 4, characterized in that: The semiconductor cooler (50) is accommodated in the connecting groove (31), one side of the semiconductor cooler (50) is in contact with the lens (42), the semiconductor cooler (50) is provided with two pins (51), the second base (30) is provided with slots (35) at positions relative to the two pins (51), and the two pins (51) are correspondingly accommodated in the two slots (35).
6. A camera module test stand according to claim 5, characterized in that: A heat-conducting gasket (60) is provided on a side of the semiconductor cooler (50) away from the camera module (40), the heat-conducting gasket (60) is in contact with the semiconductor cooler (50), and the heat-conducting gasket (60) is used to conduct heat generated by the semiconductor cooler (50).
7. A camera module test stand according to claim 6, characterized in that: The PCB board (70) is provided with a through groove (71) at a position relative to the thermal conductive pad (60), the through groove (71) runs through two sides of the PCB board (70), and the thermal conductive pad (60) is accommodated in the through groove (71).
8. A camera module test stand according to claim 7, characterized in that: The heating plate (80) is located on a side of the PCB board (70) facing the second base (30); an opening (36) is provided at a position of the second base (30) relative to the heating plate (80); and the heating plate (80) is accommodated in the opening (36).
9. A camera module test stand according to claim 8, characterized in that: A heat sink (90) is provided on a side of the PCB board (70) away from the second base (30), and the thermal conductive pad (60) is in contact with the heat sink (90) through the through groove (71).
10. A camera module test stand according to claim 9, characterized in that: A temperature sensor (100) is arranged on one side of the PCB board (70) facing the second base (30); the temperature sensor (100) is electrically connected to the controller; a clearance groove (37) is provided at a position of the second base (30) relative to the temperature sensor (100); and the temperature sensor (100) is inserted into the clearance groove (37).