Flip welding device

Abstract

The utility model provides a flip-chip bonding device comprising a pedestal, the pedestal is provided with a chip pose adjusting module and a pressure welding module which are used for respectively fixing and adjusting the positions of two chips to be subjected to flip-chip bonding, and an optical imaging mechanism used for monitoring the relative positions of the two chips; the pressure welding module is arranged above the chip pose adjusting module, the multiple sets of optical imaging mechanisms are arranged and distributed in the circumferential direction of the chip pose adjusting module at intervals, and cameras of the optical imaging mechanisms directly face two chips. According to the utility model, the structure is simple, a plurality of groups of optical imaging mechanisms are arranged in a plurality of directions on the side surfaces of the chips for observation so as to adjust the alignment of the two chips, the alignment precision is high, the distance between the two chips is not required, and the precision requirement on a pressure welding transmission system is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip reverse soldering, and in particular relates to a reverse soldering device. Background Art

[0002] The current chip flip soldering working method is to fix two target chips so that they are distributed up and down in the vertical direction with the front sides facing each other, and the optical imaging mechanism is located in the middle area of ​​the two chips with the optical axis perpendicular to the front sides of the chips; the optical imaging mechanism simultaneously obtains the alignment marks on the front sides of the two chips, calculates the position deviation of the two chips through a computer, and then controls the electromechanical system of the equipment to adjust the position of the upper chip so that the alignment marks of the two chips completely overlap, thereby achieving chip alignment; after the alignment is completed, the optical imaging mechanism moves in the horizontal direction, withdraws from the chip bonding working area, and then moves the upper chip downward in the vertical direction to be bonded to the lower chip.

[0003] However, the existing chip flip soldering process requires that the distance between the two chips is large enough to accommodate the optical imaging mechanism, resulting in a large welding stroke, so a very high-precision transmission system is required; and there is a lack of real-time monitoring of whether the chip position is offset during the process from chip alignment to welding, which poses a risk of chip position offset, thereby causing flip soldering failure. Utility Model Content

[0004] The utility model aims to provide a reverse welding device, which can at least solve some defects existing in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A reverse soldering device comprises a base, on which are provided a chip posture adjustment module and a pressure welding module for respectively fixing and adjusting the positions of two chips to be reverse soldered, and an optical imaging mechanism for monitoring the relative positions of the two chips; the pressure welding module is arranged above the chip posture adjustment module, and the optical imaging mechanism is provided with a plurality of groups, which are distributed at intervals along the circumference of the chip posture adjustment module, and the camera of the optical imaging mechanism is facing the two chips.

[0007] Furthermore, the optical imaging mechanism includes a camera lens module and a displacement slide assembly module that drives the camera lens module to move in multiple degrees of freedom directions.

[0008] Furthermore, the displacement slide assembly module includes an X-axis displacement adjustment slide, a Y-axis displacement adjustment slide and a Z-axis displacement adjustment slide that drive the camera lens module to move along the X-axis, Y-axis and Z-axis respectively, a swing angle adjustment slide that drives the camera lens module to swing around an axis perpendicular to the camera lens module, and a second rotation angle adjustment slide that drives the camera lens module to rotate around the Z-axis; the X-axis displacement adjustment slide, the Y-axis displacement adjustment slide, the swing angle adjustment slide, the second rotation angle adjustment slide and the Z-axis displacement adjustment slide are stacked and arranged in sequence from bottom to top.

[0009] Furthermore, the X-axis displacement adjustment slide includes a first slide base, a first slide rail, a first slider and a first differential head. The first slide rail extends along the X-axis direction and is arranged on the upper surface of the first slide base. The first slider is slidably connected to the first slide rail, and a return spring is provided between the first slider and the first slide base. The first differential head is fixedly connected to one side of the first slide base, and a connecting block is provided on the side of the first slider, and the connecting block abuts against the movable end of the first differential head.

[0010] Furthermore, the swing angle adjustment slide includes a second slide base, a second slide rail, a second slider and a second differential head. The upper surface of the second slide base is an arc-shaped concave surface. The second slider is slidably connected to the second slide base through the second slide rail, and a reset spring is provided between the second slider and the second slide base. The bottom surface of the second slider cooperates with the arc-shaped concave surface of the second slide base. The second differential head is fixedly connected to one side of the second slide base. The second slider is provided with a connecting shaft arranged along the axis perpendicular to the camera lens module, and one end of the connecting shaft is abutted against the movable end of the second differential head.

[0011] Furthermore, both sides of the second slide base are provided with limit baffles for limiting the second slider, and the limit baffles are arranged at both ends of the connecting shaft of the second slider.

[0012] Furthermore, the second rotation angle adjustment slide includes a third slide base, a third slider and a third differential head, the third differential head is fixedly mounted on the third slide base, the third slider is rotatably connected to the third slide base, and a return spring is provided between the third slider and the third slide base, and a push block is provided on the side of the third slider, and the push block abuts against the movable end of the third differential head.

[0013] Furthermore, the chip posture adjustment module includes a chip adsorption block, an X-axis displacement adjustment slide and a Y-axis displacement adjustment slide that drive the chip adsorption block to move along the X-axis and Y-axis respectively, an X-axis swing adjustment slide and a Y-axis swing adjustment slide that drive the chip adsorption block to swing around the X-axis and Y-axis respectively, and a first rotation angle adjustment slide that drives the chip adsorption block to rotate around the Z-axis; the X-axis displacement adjustment slide, the Y-axis displacement adjustment slide, the Y-axis swing adjustment slide, the X-axis swing adjustment slide, the first rotation angle adjustment slide and the chip adsorption block are stacked and arranged in sequence from bottom to top.

[0014] Furthermore, the bonding module includes a chip suction nozzle for fixing the chip, and a bonding slide for driving the chip suction nozzle to move up and down.

[0015] Furthermore, the pressure welding slide includes a pressure welding bracket, a fourth slide base, a fourth slider and a fourth differential head, the chip nozzle is installed on the pressure welding bracket, the pressure welding bracket is fixedly installed on the fourth slider, the fourth slide base is fixedly installed on the base, the fourth slider is slidably connected to the fourth slide base along the Z-axis direction, and a reset spring is provided between the fourth slider and the fourth slide base, the fourth differential head is installed on the base, and the movable end of the fourth differential head abuts against the fourth slider.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] (1) The reverse soldering device provided by the utility model arranges multiple sets of optical imaging mechanisms on the side of the chip for observation in multiple directions to adjust the alignment of two chips. Not only is the alignment accuracy high, but there is no requirement for the spacing between the two chips, thereby reducing the accuracy requirement for the pressure welding transmission system.

[0018] (2) The reverse soldering device provided by the utility model arranges the optical imaging mechanism on the side of the chip, so that the entire reverse soldering process can be monitored in real time. If the chip position is offset during the pressure welding process, it can be calibrated in real time, which can ensure the success of the reverse soldering without positioning deviation.

[0019] (3) The inverted soldering device provided by the utility model has a simple structure, a small size, a light weight, and a certain convenience.

[0020] The present invention will be described in further detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the chip in the embodiment of the utility model;

[0022] Figure 2 yes Figure 1 Schematic diagram of the cross section along the AA direction;

[0023] Figure 3 yes Figure 1 Schematic diagram of the cross section along the BB direction;

[0024] Figure 4 This is a schematic diagram of the relative position arrangement of the optical imaging mechanism and the chip in the embodiment of the utility model;

[0025] Figure 5 It is a structural schematic diagram of the inverted soldering device in the embodiment of the utility model;

[0026] Figure 6 It is a structural schematic diagram of the optical imaging mechanism in the embodiment of the utility model;

[0027] Figure 7 is an exploded view of the optical imaging mechanism in the embodiment of the utility model;

[0028] Figure 8 It is a schematic diagram of the X-axis displacement adjustment slide of the optical imaging mechanism in the embodiment of the utility model;

[0029] Fig. 9 It is a schematic diagram of a swing angle adjustment slide of an optical imaging mechanism in an embodiment of the utility model;

[0030] Fig.10 Schematic diagram of the second rotation angle adjustment slide of the optical imaging mechanism in the embodiment of the utility model;

[0031] Fig.11 It is a structural schematic diagram of a chip posture adjustment module in an embodiment of the utility model;

[0032] Fig.12 It is an exploded view of the chip posture adjustment module in the embodiment of the utility model;

[0033] Fig.13 It is a structural schematic diagram of a pressure welding module in an embodiment of the utility model;

[0034] Fig.14 , Fig.15 , Fig.16 They are schematic diagrams of the rotation angle deviation between two chips around the X / Y axis observed by three optical imaging mechanisms in the embodiment of the utility model;

[0035] Fig.17 , Fig.18 and Fig.19 They are schematic diagrams of displacement deviations between two chips along the X / Y axis observed by three optical imaging mechanisms in an embodiment of the utility model;

[0036] Fig. 20 It is a schematic diagram of the relative positions of two chips in an embodiment of the utility model;

[0037] Fig.21 It is a schematic diagram of the relative positions of two chips after the offset values ​​along the X and Y axis directions are adjusted in the embodiment of the utility model;

[0038] Fig. 22 It is a schematic diagram of the relative positions of two chips after alignment is completed in an embodiment of the utility model.

[0039] Explanation of the reference numerals: 1. Alignment mark; 2. Chip; 3. Optical imaging mechanism; 4. Base; 5. Pressure welding module; 6. Chip posture adjustment module; 7. Camera lens module; 8. Displacement slide assembly module; 9. X-axis displacement adjustment slide; 10. Y-axis displacement adjustment slide; 11. Swing angle adjustment slide; 12. Second rotation angle adjustment slide; 13. Z-axis displacement adjustment slide; 14. First slide base; 15. First slide rail; 16. First slider; 17. Push rod; 18. First differential head; 19. Knob; 20 , second slide base; 21, second slide rail; 22, second differential head; 23, second slider; 24, connecting shaft; 25, limit baffle; 26, third slide base; 27, third slider; 28, third differential head; 29, X-axis displacement adjustment slide; 30, Y-axis displacement adjustment slide; 31, Y-axis swing adjustment slide; 32, X-axis swing adjustment slide; 33, first rotation angle adjustment slide; 34, chip adsorption block; 35, chip suction nozzle; 36, fourth slider; 37, fourth slide base; 38, fourth differential head. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present utility model, unless otherwise specified, "plurality" means two or more.

[0044] like Figure 5 As shown, the present embodiment provides a reverse soldering device, including a base 4, on which are provided a chip posture adjustment module 6 and a pressure welding module 5 for respectively fixing and adjusting the positions of two chips 2 to be reverse soldered, and an optical imaging mechanism 3 for monitoring the relative positions of the two chips 2; the pressure welding module 5 is arranged above the chip posture adjustment module 6, and the optical imaging mechanism 3 is provided with a plurality of groups, which are distributed at intervals along the circumference of the chip posture adjustment module 6, and the camera of the optical imaging mechanism 3 is facing the two chips 2.

[0045] The process of performing reverse soldering on a chip using the reverse soldering device of this embodiment is as follows:

[0046] S1. Processing a positioning mark 1 with a certain height on the surface of the chip 2 to be reverse soldered. The positioning mark 1 can be of any shape, and only needs to have a certain height so that the optical imaging mechanism 3 can identify this feature from the side of the chip 2. The positioning marks at different positions on the surface of the chip 2 can be designed to have the same structure or different structures; specifically, the positioning mark 1 can be a convex structure set on the soldering surface of the chip 2, such as Figure 1 , Figure 2 and Figure 3 As shown, three protrusions are provided at the three corners of the square chip bonding surface as alignment marks 1, and the shapes and sizes of the three protrusions can be the same or different.

[0047] Preferably, the structures of the alignment marks at the corresponding positions of the two chips 2 to be reverse-welded are designed to be identical, so that the optical imaging mechanism 3 can quickly and accurately identify the relative position deviation of the two chips 2 .

[0048] S2. Fix the two chips 2 to be reverse-welded on the chip posture adjustment module 6 and the pressure welding module 5 respectively, and the welding surfaces of the two chips 2 are arranged opposite to each other. At the same time, the optical imaging mechanism 3 is located in the non-pressure welding working area on the side of the chip 2.

[0049] Specifically, multiple groups of optical imaging mechanisms 3 are arranged at intervals along the circumference of the chip 2, so that the relative position deviation between two chips 2 can be observed from different directions. In this embodiment, the optical imaging mechanisms 3 are preferably arranged in at least three side directions of the chip 2.

[0050] S3. Use the optical imaging mechanism 3 to detect the positions of the alignment marks 1 on the two chips 2, and adjust the positions and postures of the chips 2 accordingly through the chip posture adjustment module 6 according to the detection results, so that the alignment marks of the two chips 2 are aligned.

[0051] In order to ensure the accuracy of the relative position deviation analysis of the two chips 2 and the accuracy of the chip 2 alignment adjustment, it is preferred to provide at least two alignment marks 1 on the surface of the chip 2 corresponding to the lateral direction of each optical imaging mechanism 3, and the optical imaging mechanism 3 in each direction recognizes multiple alignment marks 1 to avoid positioning errors of a single alignment mark 1.

[0052] S4, press-welding the two aligned chips 2; specifically, the upper chip 2 is driven downward by the press-welding module 5 to contact the chip 2 on the chip posture adjustment module 6 to complete the press-welding.

[0053] During the bonding process, since the optical imaging mechanism 3 is arranged on the side of the chip 2, there is no requirement for the spacing between the two chips 2, and the distance between the two chips 2 can be made small enough. This not only improves the accuracy and effect of chip 2 alignment, but also reduces the accuracy requirements for the bonding transmission system.

[0054] Preferably, since the optical imaging mechanism 3 is arranged on the side of the chip 2, the optical imaging mechanism 3 can be turned on during the pressure welding process of the two chips 2 to monitor the offset of the position of the chip 2 in real time, so that the position of the chip 2 can be corrected in real time after it is offset during the pressure welding process, thereby ensuring successful reverse welding without alignment deviation.

[0055] As a specific implementation method, Figure 6 and Figure 7As shown, the optical imaging mechanism 3 includes a camera lens module 7 and a displacement slide assembly module 8 that drives the camera lens module 7 to move in multiple degrees of freedom. The camera lens module 7 is used to photograph and observe the positions of the two chips 2 and transmit the imaging data to the display. Specifically, the displacement slide assembly module 8 includes an X-axis displacement adjustment slide 9, a Y-axis displacement adjustment slide 10 and a Z-axis displacement adjustment slide 13 that drive the camera lens module 7 to move along the X-axis, the Y-axis and the Z-axis respectively, a swing angle adjustment slide 11 that drives the camera lens module 7 to swing around the axis of the camera lens module 7 perpendicular to the camera lens module 7, and a second rotation angle adjustment slide 12 that drives the camera lens module 7 to rotate around the Z-axis; the X-axis displacement adjustment slide 9, the Y-axis displacement adjustment slide 10, the swing angle adjustment slide 11, the second rotation angle adjustment slide 12, and the Z-axis displacement adjustment slide 13 are sequentially stacked and arranged from bottom to top; the X-axis displacement adjustment slide 9, the Y-axis displacement adjustment slide 10, the swing angle adjustment slide 11, the second rotation angle adjustment slide 12, and the Z-axis displacement adjustment slide 13 are used to realize the adjustment of 5 different degrees of freedom of the camera lens module 7, so that the camera lens module 7 can observe the alignment marks 1 on the two chips 2.

[0056] Optional implementations, such as Figure 8 As shown, the X-axis displacement adjustment slide 9 includes a first slide base 14, a first slide rail 15, a first slider 16 and a first differential head 18. The first slide rail 15 extends along the X-axis direction and is arranged on the upper surface of the first slide base 14. The first slider 16 is slidably connected to the first slide rail 15, and a return spring (not shown in the figure) is provided between the first slider 16 and the first slide base 14. The first differential head 18 is fixedly connected to one side of the first slide base 14. A connecting block is provided on the side of the first slider 16, and the connecting block abuts against the movable end of the first differential head 18. When it is necessary to adjust the displacement of the camera lens module 7 in the X-axis direction, the knob 19 of the first differential head 18 is rotated, and the push rod 17 of the first differential head 18 pushes the connecting block on the first slider 16, thereby pushing the first slider 16 to move in the X-axis direction. When the knob of the first differential head 18 is rotated in the opposite direction, the pushing action of the first differential head 18 on the connecting block is cancelled, and the first slider 16 can be reset under the action of the reset spring, thereby realizing the position adjustment of the camera lens module 7 in the X-axis direction. The structures of the Y-direction displacement adjustment slide 10 and the Z-direction displacement adjustment slide 13 are the same as those of the X-direction displacement adjustment slide 9, and are not repeated here. During installation, the X-direction displacement adjustment slide 9, the Y-direction displacement adjustment slide 10, and the Z-direction displacement adjustment slide 13 are orthogonally installed to realize the position adjustment of the camera lens module 7 in the three directions of X, Y, and Z.

[0057] Optional implementations, such as Fig. 9As shown, the swing angle adjustment slide 11 includes a second slide base 20, a second slide rail 21, a second slider 23 and a second differential head 22. The upper surface of the second slide base 20 is an arc-shaped concave surface. The second slider 23 is slidably connected to the second slide base 20 through the second slide rail 21, and a reset spring is provided between the second slider 23 and the second slide base 20. The bottom surface of the second slider 23 cooperates with the arc-shaped concave surface of the second slide base 20. The second differential head 22 is fixedly connected to one side of the second slide base 20. A connecting shaft 24 arranged along the axis perpendicular to the camera lens module 7 is penetrated by the second slider 23, and one end of the connecting shaft 24 is abutted against the movable end of the second differential head 22. When it is necessary to adjust the swing angle of the camera lens module 7 (i.e., pitch adjustment), the knob of the second differential head 22 is rotated, and the push rod of the second differential head 22 pushes the connecting shaft 24 on the second slider 23 to move, thereby driving the second slider 23 to move on the arc-shaped concave surface of the second slide base 20, thereby realizing the swing of the second slider 23 around the axis of the vertical camera lens module 7. When the knob of the second differential head 22 is rotated in the opposite direction, the pushing effect of the second differential head 22 on the connecting shaft 24 is cancelled, and the second slider 23 can be reset under the action of the reset spring, thereby realizing the adjustment of the pitch angle of the camera lens module 7.

[0058] Optimally, both sides of the second slide base 20 are provided with limit baffles 25 for limiting the second slider 23, and the limit baffles 25 are arranged at both ends of the connecting shaft 24 of the second slider 23. The movement of the second slider 23 along the axial direction of the connecting shaft 24 is limited by the limit baffles 25, so that the second slider 23 only swings on the arc-shaped concave surface of the second slide base 20.

[0059] In an optional embodiment, the second rotation angle adjustment slide 12 includes a third slide base 26, a third slider 27 and a third differential head 28, wherein the third differential head 28 is fixedly mounted on the third slide base 26, the third slider 27 is rotatably connected to the third slide base 26, and a reset spring is provided between the third slider 27 and the third slide base 26, and a push block is provided on the side of the third slider 27, and the push block abuts against the movable end of the third differential head 28. When the rotation angle of the camera lens module 7 needs to be adjusted, the knob of the third differential head 28 is rotated, and the push rod of the third differential head 28 pushes the push block on the third slider 27, thereby driving the third slider 27 to rotate at a small angle around the Z axis. When the knob of the third differential head 28 is rotated in the opposite direction, the push effect of the third differential head 28 on the push block is cancelled, and the third slider 27 can be reset under the action of the reset spring, thereby realizing the adjustment of the rotation angle of the camera lens module 7.

[0060] As a specific implementation method, Fig.11 and Fig.12As shown, the chip posture adjustment module 6 includes a chip adsorption block 34, an X-axis displacement adjustment slide 29 and a Y-axis displacement adjustment slide 30 that drive the chip adsorption block 34 to move along the X-axis and the Y-axis respectively, an X-axis swing adjustment slide 32 and a Y-axis swing adjustment slide 31 that drive the chip adsorption block 34 to swing around the X-axis and the Y-axis respectively, and a first rotation angle adjustment slide 33 that drives the chip adsorption block 34 to rotate around the Z-axis; the X-axis displacement adjustment slide 29, the Y-axis displacement adjustment slide 30, the Y-axis swing adjustment slide 31, the X-axis swing adjustment slide 32, the first rotation angle adjustment slide 33 and the chip adsorption block 34 are stacked and arranged in sequence from bottom to top. Among them, the chip adsorption block 34 is used to fix the chip, and the chip 2 can be fixed by but not limited to vacuum adsorption; the X-axis displacement adjustment slide 29, the Y-axis displacement adjustment slide 30, the Y-axis swing adjustment slide 31, the X-axis swing adjustment slide 32, and the first rotation angle adjustment slide 33 are combined to realize the adjustment of 5 different degrees of freedom of the chip 2 on the chip adsorption block 34, so that the chip 2 on the chip adsorption block 34 is aligned with the chip 2 on the pressure welding module 5.

[0061] In an optional implementation manner, the specific structure of the X-axis displacement adjustment slide 29 and the Y-axis displacement adjustment slide 30 is the same as the structure of the X-axis displacement adjustment slide 9 of the optical imaging mechanism 3, which will not be repeated here. During installation, the X-axis displacement adjustment slide 29 and the Y-axis displacement adjustment slide 30 are installed orthogonally, so that the displacement adjustment of the chip 2 on the chip adsorption block 34 along the X and Y directions can be achieved. The specific structure of the X-axis swing adjustment slide 32 and the Y-axis swing adjustment slide 31 is the same as the structure of the swing angle adjustment slide 11 of the optical imaging mechanism 3, which will not be repeated here. During installation, the X-axis swing adjustment slide 32 and the Y-axis swing adjustment slide 31 are installed orthogonally, so that the swing angle adjustment of the chip 2 on the chip adsorption block 34 around the X and Y axes can be achieved. The specific structure of the first rotation angle adjustment slide 33 is the same as the structure of the second rotation angle adjustment slide 12 of the optical imaging mechanism 3, which will not be repeated here. The rotation angle adjustment of the chip 2 on the chip adsorption block 34 around the Z axis is achieved by the first rotation angle adjustment slide 33.

[0062] As a specific implementation method, Fig.13 As shown, the bonding module 5 includes a chip suction nozzle 35 for fixing the chip 2, and a bonding slide for driving the chip suction nozzle 35 to move up and down; wherein, the chip suction nozzle 35 is used to fix the chip 2, and the chip 2 can be fixed by but not limited to vacuum adsorption. Specifically, an airway is provided inside the chip suction nozzle 35 to access the vacuum adsorption chip 2.

[0063] In an optional embodiment, the bonding slide comprises a bonding bracket, a fourth slide base 37, a fourth slider 36 and a fourth differential head 38, the chip suction nozzle 35 is mounted on the bonding bracket, the bonding bracket is fixedly mounted on the fourth slider 36, the fourth slide base 37 is fixedly mounted on the base 4, the fourth slider 36 is slidably connected to the fourth slide base 37 along the Z-axis direction, and a reset spring is provided between the fourth slider 36 and the fourth slide base 37, the fourth differential head 38 is mounted on the base 4, and the movable end of the fourth differential head 38 abuts against the fourth slider 36. By rotating the knob of the fourth differential head 38, the fourth slider 36 is pushed to move along the Z-axis, so that the downward displacement stroke of the chip 2 on the chip suction nozzle 35 during the bonding process can be accurately controlled.

[0064] The chip flip solder alignment process of the present invention is described below by a specific embodiment. Taking the arrangement of three sets of optical imaging mechanisms 3, which are respectively located on three sides of a square chip as an example, the layout of the optical imaging mechanisms 3 is as follows: Figure 4 shown.

[0065] The three optical imaging mechanisms 3 observe the position images of the two chips (ie, chip A and chip B) as follows: Fig.14 , Fig.15 and Fig.16 As shown. For the image observed by the first optical imaging mechanism 3 (i.e. Fig.14 The chip 2 on the chip adsorption block 34 is swung around the X-axis by rotating the differential knob of the X-axis swing adjustment slide 32 until the rotation angle deviation α between the two chips 2 around the X-axis is 0. Similarly, for the image observed by the second optical imaging mechanism 3 (i.e. Fig.15 The chip 2 on the chip adsorption block 34 is swung around the Y axis by rotating the differential knob of the Y-axis swing adjustment slide 31 until the rotation angle deviation β between the two chips 2 around the Y axis is 0. Fig.16 As shown in the image, since the third optical imaging mechanism 3 and the first optical imaging mechanism 3 are arranged relative to each other on the X-axis, when the aforementioned adjustment α is 0, the rotation angle deviation -α between the two chips 2 around the X-axis observed by the third optical imaging mechanism 3 is also 0.

[0066] After adjusting the rotation angle deviation between the two chips 2 around the X and Y axes, the images observed by the three optical imaging mechanisms 3 are as follows: Fig.17 , Fig.18 and Fig.19 As shown, at this time, there are offset values ​​between the two chips 2 along the X-axis and Y-axis directions. The images observed by the three optical imaging mechanisms 3 can be analyzed to find that the relative positions of the two chips 2 are as follows: Fig. 20At this time, the differential knob of the Y-axis displacement adjustment slide 30 can be rotated first to make the chip 2 on the chip adsorption block 34 translate along the Y-axis direction until d1 is 0, and then the differential knob of the X-axis displacement adjustment slide 29 can be rotated to make the chip 2 on the chip adsorption block 34 translate along the X-axis direction until d2 is 0. At this time, the relative positions of the two chips 2 are projected along the Z-axis direction as shown in FIG. Fig.21 shown.

[0067] After adjusting the offset values ​​between the two chips 2 along the X and Y axis directions, rotate the differential knob of the first rotation angle adjustment slide 33 to rotate the chip 2 on the chip adsorption block 34 around the Z axis until d3 is 0. At this time, the relative positions of the two chips 2 are projected along the Z axis as shown in FIG. Fig. 22 As shown, the alignment of the two chips 2 is completed, and pressure bonding can be performed.

[0068] During pressure welding, the micrometer knob of the pressure welding slide is rotated to drive the fourth slider 36 to move downward along the Z axis, that is, drive the chip 2 on the chip suction nozzle 36 to move downward along the Z axis until it contacts the chip 2 on the chip adsorption block 34 to complete the pressure welding. In this pressure welding process, if the positions of the two chips 2 are observed to be offset through the three optical imaging mechanisms 3, the relative positions of the two chips 2 can be adjusted in time according to the above alignment process, so as to ensure successful reverse welding without alignment deviation.

[0069] The above examples are merely illustrative of the present invention and do not constitute a limitation on the protection scope of the present invention. All designs that are identical or similar to the present invention fall within the protection scope of the present invention.

Claims

1. A reverse welding device, characterized in that: It comprises a base, on which are provided a chip posture adjustment module and a pressure welding module for respectively fixing and adjusting the positions of two chips to be reversely welded, and an optical imaging mechanism for monitoring the relative positions of the two chips; the pressure welding module is arranged above the chip posture adjustment module, and the optical imaging mechanism is provided with a plurality of groups, which are distributed at intervals along the circumference of the chip posture adjustment module, and the camera of the optical imaging mechanism is facing the two chips.

2. The reverse soldering device according to claim 1, characterized in that: The optical imaging mechanism comprises a camera lens module and a displacement slide assembly module which drives the camera lens module to move in multiple degrees of freedom.

3. The reverse soldering device according to claim 2, characterized in that: The displacement slide assembly module includes an X-direction displacement adjustment slide, a Y-direction displacement adjustment slide and a Z-direction displacement adjustment slide for driving the camera lens module to move along the X-axis, the Y-axis and the Z-axis respectively, a swing angle adjustment slide for driving the camera lens module to swing around an axis perpendicular to the camera lens module, and a second rotation angle adjustment slide for driving the camera lens module to rotate around the Z-axis; the X-direction displacement adjustment slide, the Y-direction displacement adjustment slide, the swing angle adjustment slide, the second rotation angle adjustment slide and the Z-direction displacement adjustment slide are sequentially stacked and arranged from bottom to top.

4. The reverse soldering device according to claim 3, characterized in that: The X-axis displacement adjustment slide includes a first slide base, a first slide rail, a first slider and a first differential head. The first slide rail extends along the X-axis direction and is arranged on the upper surface of the first slide base. The first slider is slidably connected to the first slide rail, and a return spring is provided between the first slider and the first slide base. The first differential head is fixedly connected to one side of the first slide base. A connecting block is provided on the side of the first slider, and the connecting block abuts against the movable end of the first differential head.

5. The reverse soldering device according to claim 3, characterized in that: The swing angle adjustment slide includes a second slide base, a second slide rail, a second slider and a second differential head. The upper surface of the second slide base is an arc-shaped concave surface. The second slider is slidably connected to the second slide base through the second slide rail, and a reset spring is provided between the second slider and the second slide base. The bottom surface of the second slider cooperates with the arc-shaped concave surface of the second slide base. The second differential head is fixedly connected to one side of the second slide base. A connecting shaft arranged along the axis perpendicular to the camera lens module is penetrated by the second slider, and one end of the connecting shaft abuts against the movable end of the second differential head.

6. The reverse soldering device according to claim 5, characterized in that: Limit baffles for limiting the position of the second slider are disposed on both sides of the second slide base, and the limit baffles are arranged at both ends of the connecting shaft of the second slider.

7. The reverse soldering device according to claim 3, characterized in that: The second rotation angle adjustment slide includes a third slide base, a third slider and a third differential head. The third differential head is fixedly mounted on the third slide base. The third slider is rotatably connected to the third slide base. A return spring is provided between the third slider and the third slide base. A push block is provided on the side of the third slider, and the push block abuts against the movable end of the third differential head.

8. The reverse soldering device according to claim 1, characterized in that: The chip posture adjustment module includes a chip adsorption block, an X-axis displacement adjustment slide and a Y-axis displacement adjustment slide that drive the chip adsorption block to move along the X-axis and the Y-axis respectively, an X-axis swing adjustment slide and a Y-axis swing adjustment slide that drive the chip adsorption block to swing around the X-axis and the Y-axis respectively, and a first rotation angle adjustment slide that drives the chip adsorption block to rotate around the Z-axis; the X-axis displacement adjustment slide, the Y-axis displacement adjustment slide, the Y-axis swing adjustment slide, the X-axis swing adjustment slide, the first rotation angle adjustment slide and the chip adsorption block are sequentially stacked from bottom to top.

9. The reverse soldering device according to claim 1, characterized in that: The pressure welding module comprises a chip suction nozzle for fixing the chip and a pressure welding slide table for driving the chip suction nozzle to move up and down.

10. The reverse soldering device according to claim 9, characterized in that: The pressure welding slide includes a pressure welding bracket, a fourth slide base, a fourth slider and a fourth differential head, the chip suction nozzle is installed on the pressure welding bracket, the pressure welding bracket is fixedly installed on the fourth slider, the fourth slide base is fixedly installed on the base, the fourth slider is slidably connected to the fourth slide base along the Z-axis direction, and a reset spring is provided between the fourth slider and the fourth slide base, the fourth differential head is installed on the base, and the movable end of the fourth differential head abuts against the fourth slider.

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