Heating device

Abstract

The utility model provides a heating device, which is used for drying a wafer in wafer etching and cleaning equipment, and mainly comprises a light source module, the light source module comprises a plurality of cold light sources, the plurality of cold light sources are arranged into a light source array, the light emitting side of the light source module is opposite to the back surface of the wafer, the size of the light source module is matched with the size of the wafer, and the plurality of cold light sources are used for heating the wafer; the driving module is electrically connected with the light source module and is used for controlling the cold light sources according to the driving signal; the controller is electrically connected with the driving module, and the controller is used for sending a driving signal to the driving module. The driving signal can be sent through the control module, so that the driving module controls the plurality of cold light sources in the light source module according to the driving signal. After the cold light source is lightened, the cold light source emits high-brightness light energy, then the light energy is converted into heat energy on the surface of the wafer, the surface tension of residual liquid is reduced by heating the back face of the wafer, the process effect of the Maragol effect is improved, and the drying effect is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a heating device. Background Art

[0002] In the process of single-wafer etching, cleaning and drying, deionized water (DIW) is first sprayed on the wafer surface to rinse residual chemicals and particulate matter, and then nitrogen N2 is sprayed to sweep the moisture on the wafer surface. At the same time, the wafer keeps rotating at a preset speed. Under the combined action of centrifugal force and nitrogen purge, the moisture on the wafer surface completely leaves the wafer (to achieve wafer drying) and enters the machine drainage and exhaust gas collection structure. Among them, the wafer can be clamped and fixed by a carrier plate and driven to rotate by the carrier plate. However, as the semiconductor process continues to develop towards smaller line widths, the aspect ratio of the graphics on the wafer continues to increase. Under the influence of surface tension, the moisture in the narrow grooves is difficult to escape from the bottom of the grooves, resulting in poor drying effect and even causing the graphics to topple and collapse.

[0003] In related technologies, after DIW is sprayed on the wafer surface, heated isopropyl alcohol (IPA) is slowly and oscillatingly sprayed from the center of the wafer toward the edge to displace the DIW remaining in the pattern grooves on the wafer surface, and nitrogen N2 is used to assist in ensuring that the wafer is thoroughly dried. Due to the low flash point of IPA, continuously increasing the heating temperature of IPA may cause IPA to boil, vaporize, or even explode. Therefore, the IPA heating temperature is limited. On this basis, due to the small flow rate of IPA used for replacement, when IPA is sprayed onto the wafer surface, the heating effect on the working area of ​​the wafer surface is limited, making it difficult to improve the drying effect. Utility Model Content

[0004] The technical problem to be solved by this application is the poor drying effect of existing wafers.

[0005] To solve the above technical problems, the present application provides a heating device for drying wafers in wafer etching and cleaning equipment, comprising: a light source module, the light source module comprising multiple cold light sources, the multiple cold light sources being arranged into a light source array, the light-emitting side of the light source module being arranged opposite to the back side of the wafer, the size of the light source module being adapted to the size of the wafer, and the multiple cold light sources being used to heat the wafer; a driving module, the driving module being electrically connected to the light source module, the driving module being used to control the multiple cold light sources according to a driving signal; and a controller, the controller being electrically connected to the driving module, the controller being used to send the driving signal to the driving module.

[0006] In some embodiments of the present application, the light source array includes multiple light source areas, each of which is a circular area, and multiple light source areas are concentric rings; the light source areas evenly arrange multiple cold light sources in series.

[0007] In some embodiments of the present application, the light source area includes: a plurality of arc-shaped sub-areas, and at least one connecting member for connecting the plurality of arc-shaped sub-areas.

[0008] In some embodiments of the present application, the heating device also includes: a current detection module, a first end of the current detection module is electrically connected to the driving module, a second end of the current detection module is electrically connected to the light source module, and the current detection module is used to detect the driving current value flowing into the driving module; a first alarm module, the first alarm module and the third end of the current detection module, the first alarm module is configured to issue a first alarm signal when the driving current value does not fall within a preset current range.

[0009] In some embodiments of the present application, the heating device also includes a heat dissipation module; the heat dissipation module includes a heat dissipation plate, a water-cooling tube arranged on the heat dissipation plate, a coolant filled in the water-cooling tube, and a circulating pump driving the coolant; the first surface of the heat dissipation plate is arranged opposite to the light source module, and the second surface of the heat dissipation plate is arranged opposite to the driving module.

[0010] In some embodiments of the present application, the heat sink is a copper alloy heat sink.

[0011] In some embodiments of the present application, the water cooling pipe is S-shaped and evenly surrounds the heat sink.

[0012] In some embodiments of the present application, the heating device also includes: a flow detection module, the first end of the flow detection module is arranged in the water-cooling pipe, and the flow detection module is configured to detect the real-time flow of the coolant in the water-cooling pipe; a second alarm module, the second alarm module is connected to the second end of the flow detection module, and the second alarm module is configured to issue a second alarm signal when the real-time flow does not fall within a preset flow range.

[0013] In some embodiments of the present application, the heating device further includes: a sealable cavity, which encapsulates the light source module, the driving module and the controller; the light-emitting side of the light source module is arranged opposite to the back side of the wafer through the sealable cavity.

[0014] In some embodiments of the present application, the sealable cavity further encapsulates one or more of the current detection module, the first alarm module, the heat dissipation module, the flow detection module, and the second alarm module.

[0015] In some embodiments of the present application, the heating device further includes: a limiting column, one end of which is fixed to the sealable cavity, and the other end of which is in contact with the side of the wafer.

[0016] In some embodiments of the present application, the sealable cavity is sealed and connected to an air inlet pipe, and the air inlet pipe is used to fill with gas.

[0017] Compared to existing technologies, this application provides a heating device that uses a control module to send a drive signal, which in turn controls multiple cold light sources in a light source module. When the cold light sources are activated, they emit high-brightness light energy, which is then converted into heat energy on the wafer surface. This heats the back of the wafer, reducing the surface tension of residual liquid, enhancing the Maragni effect, and improving the drying process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following figures describe in detail exemplary embodiments disclosed in this application. Like reference numerals denote similar structures throughout the several views of the drawings. Those skilled in the art will appreciate that these embodiments are non-limiting, exemplary embodiments, and that the drawings are provided for illustration and description purposes only and are not intended to limit the scope of this application. Other embodiments may also achieve the inventive intent of this application. It should be understood that the drawings are not drawn to scale.

[0019] Figure 1 is a schematic structural diagram of a heating device according to some embodiments of the present application;

[0020] Figure 2 is a schematic structural diagram of a wafer drying device according to some embodiments of the present application;

[0021] Figure 3 is a structural schematic diagram of a heat dissipation module according to some embodiments of the present application;

[0022] Figure 4 is another structural schematic diagram of a heat dissipation module according to some embodiments of the present application;

[0023] Figure 5 is a schematic structural diagram of another heating device according to some embodiments of the present application;

[0024] Explanation of the accompanying figures: 11-light source module, 12-driving module, 13-controller, 21-rotating table, 22-wafer rack, 23-drying auxiliary device, 14-heat dissipation module, 141-heat dissipation plate, 142-water cooling pipe, 41-sealed cavity, 42-limiting column and 43-air inlet pipe. DETAILED DESCRIPTION

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For those of ordinary skill in the art, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language context or otherwise explained, the same reference numerals in the figures represent the same structure or operation. It should be clearly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification.

[0026] It should be understood that the "module" and "circuit" used herein are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0027] The terms used in this application are for the purpose of describing specific example embodiments only and are not restrictive. When used in this specification, the terms "comprise", "include" and / or "contain" mean that the associated integers, steps, operations, elements and / or components exist, but do not exclude the existence of one or more other features, integers, steps, operations, elements, components and / or groups or that other features, integers, steps, operations, elements, components and / or groups may be added to the heating device. When describing the association of different components in this specification, it can be a direct relationship or an indirect relationship. For example, "A and B are connected" can mean that A and B are directly connected, or A and B are indirectly connected through other components.

[0028] After spraying DIW onto the wafer surface, heated IPA is slowly and oscillatingly sprayed from the center of the wafer toward the edge, displacing any remaining DIW within the pattern grooves on the wafer surface. Nitrogen (N2) is used to assist in ensuring thorough drying of the wafer. Due to IPA's low flash point, continuously increasing the IPA heating temperature can cause it to boil, vaporize, or even explode. Consequently, the IPA heating temperature is limited. Furthermore, due to the low flow rate of IPA used for displacing the DIW, once sprayed onto the wafer surface, the heating effect on the working area is limited, making it difficult to achieve optimal drying results.

[0029] Specifically, the surface tension of the residual liquid inside the patterned grooves on the wafer is high, making it impossible to reduce the surface tension by heating the wafer surface. Furthermore, it is difficult to fully heat the wafer surface, making it difficult to achieve enhanced drying efficiency through the Maragni effect at the dry-wet interface. This interface is where the DIW, IPA, and N2 layers meet on the wafer surface.

[0030] Therefore, to meet the cleaning and drying requirements of advanced manufacturing processes for the interior of high-aspect-ratio grooves, this application provides a heating device. This device utilizes a large array of high-power LEDs to emit high-brightness light energy, which is then converted into heat energy on the wafer surface. This heats the backside of the wafer, reducing the surface tension of residual liquid and enhancing the Maragni effect, resulting in superior drying performance within high-aspect-ratio grooves. Furthermore, the LED matrix can dynamically control heating power by region, enabling precise heating at the dry-wet interface, further enhancing drying effectiveness.

[0031] Based on the above analysis, if Figure 1 As shown, the embodiment of the present application provides a heating device, which may include:

[0032] A light source module 11 includes a plurality of cold light sources arranged in a light source array. The light-emitting side of the light source module is disposed opposite the back surface of the wafer. The size of the light source module 11 is adapted to the size of the wafer. The plurality of cold light sources are used to heat the wafer.

[0033] A driving module 12, the driving module 12 being electrically connected to the light source module 11, and configured to control the plurality of cold light sources according to a driving signal;

[0034] The controller 13 is electrically connected to the driving module 12 , and is configured to send the driving signal to the driving module 12 .

[0035] In the embodiments of this application, Figure 2 As shown, the wafer drying equipment includes a rotating table 21, a wafer rack 22 connected to the rotating table 21 and used to place wafers, and a drying auxiliary device 23 opposite the wafer rack and used to blow air toward the wafers. Driven by the wafer-carrying rotating table 21, the drying auxiliary device maintains high-speed rotation, while a robotic arm in the drying auxiliary device drives the spray head on the robotic arm from the center of the wafer toward the edge. The spray head of the drying auxiliary device 23 is used to spray DIW, IPA, and N2 to dry the wafer surface.

[0036] In the embodiments of the present application, the cold light source may be a light-emitting diode (LED). By illuminating the wafer with multiple LEDs, the light energy is converted into heat energy on the wafer surface, thereby heating the wafer. To enhance the heating effect of the cold light source on the wafer, the cold light source may also be a high-power LED.

[0037] It is understandable that the light source module 11 includes a plurality of cold light sources, and the heating effect of the wafer can be increased by increasing the number of cold light sources.

[0038] In the embodiment of the present application, a plurality of cold light sources are arranged into a light source array. For example, the light source array can be a square array or a circular array. Since wafers are generally circular, in order to adapt the size of the light source module 11 to the size of the wafer, the light source array is a circular array.

[0039] It is understandable that the cold light sources may be soldered on a circuit board, and the plurality of cold light sources may be connected via wiring on the circuit board to form a light source array.

[0040] In the embodiment of the present application, the controller 13 can generate a drive signal that can be used to simultaneously control (turn on / off) all of the multiple cold light sources, or to dynamically control the multiple cold light sources by region. If the multiple cold light sources are dynamically controlled by region, the heating position of the wafer can be precisely controlled, further improving the drying effect.

[0041] In the embodiment of the present application, the controller 13 is electrically connected to the driving module 12, and the controller 13 is used to send the driving signal to the driving module 12. The driving module 12 is electrically connected to the light source module 11, and the driving module 12 is used to control the multiple cold light sources according to the driving signal.

[0042] In this way, by heating the back side of the wafer, the surface tension of the residual liquid is reduced, the process effect of the Maragni effect is improved, and a better drying effect is achieved inside the grooves of high aspect ratio patterns.

[0043] In some embodiments of the present application, the light source array includes multiple light source areas, each of which is a circular area, and multiple light source areas are concentric rings; the light source areas evenly arrange multiple cold light sources in series.

[0044] Wherein, a control terminal may be correspondingly provided for each light source area, and the control terminal of each light source area may be electrically connected to the driving module.

[0045] To dry the wafer, the auxiliary drying device moves so that the nozzle's projection on the wafer is positioned between the center and edge of the wafer, reciprocating along the wafer's radial direction. Simultaneously, the wafer rotates with the turntable, ensuring that the DIW, IPA, and N2 sprayed by the nozzle dry all locations on the wafer.

[0046] In the embodiment of the present application, the wafer is dried in circles starting from the center of the wafer as the auxiliary drying device 23 moves. The center of each light source area can be set at the projection position of the wafer center.

[0047] It is understood that the difference in radius between adjacent light source areas corresponds to the spray range of the nozzle of the auxiliary drying device 23. The radius difference is the difference between the outer diameter and the inner diameter of the light source area.

[0048] In the embodiment of the present application, there is no limitation on the number of cold light sources included in each light source area.

[0049] In this way, the present application is compatible with the drying auxiliary device to improve the drying effect.

[0050] In some embodiments of the present application, the light source area includes: a plurality of arc-shaped sub-areas, and at least one connecting member for connecting the plurality of arc-shaped sub-areas.

[0051] In the embodiment of the present application, in order to facilitate the installation of the light source area, the light source area can be divided into multiple arc-shaped sub-areas. The multiple arc-shaped sub-areas are detachably connected by at least one connecting member to form a circular ring area.

[0052] Exemplarily, the light source area includes 3 to 5 arc-shaped sub-areas and 2 to 4 connecting members. Specifically, the light source area includes four arc-shaped sub-areas and three connecting members.

[0053] In this way, the assembly or maintenance efficiency of the light source area can be improved, the manufacturing cost of the light source area can be reduced, and the efficiency of drying the wafers can be improved.

[0054] In some embodiments of the present application, the driving module 12 includes a plurality of driving circuits configured to control the plurality of cold light sources according to a driving signal, and the number of the driving circuits corresponds to the number of the light source regions.

[0055] It should be noted that the controller 13 is used to control the auxiliary drying device 23 and generate a driving signal. The driving signal may be generated by the controller 13 according to the relative position of the auxiliary drying device and the wafer.

[0056] In this way, the cold light source can be precisely controlled by the driving signal, that is, the heating position of the wafer can be precisely controlled, further improving the drying effect.

[0057] In some embodiments of the present application, the drive circuit is an insulated gate bipolar transistor (IGBT) drive circuit. The IGBT drive circuit is a composite, fully controlled, voltage-driven power semiconductor device composed of a bipolar transistor and an insulated gate field-effect transistor (IGFET), combining the advantages of high input impedance and low on-state voltage drop.

[0058] In some embodiments of the present application, the heating device further includes:

[0059] a current detection module, wherein a first end of the current detection module is electrically connected to the driving module, a second end of the current detection module is electrically connected to the light source module, and the current detection module is used to detect a driving current value flowing into the driving module;

[0060] A first alarm module is connected to a third end of the current detection module, and the first alarm module is configured to send a first alarm signal when the driving current value does not fall within a preset current range.

[0061] In the embodiment of the present application, when the driving current value does not fall within the preset current range, the cold light sources and other components are damaged, and the driving module cannot control the multiple cold light sources.

[0062] The first alarm module may include any one or more of a buzzer, a display screen, and an indicator light. The first alarm signal may be used to indicate that the buzzer sounds an alarm, the display screen indicates that the light emitting diode is abnormal, the indicator light flashes, and the like.

[0063] In this way, it can be determined through the first alarm signal that the wafer can be heated normally, so as to ensure the drying effect of the wafer.

[0064] In some embodiments of the present application, a temperature sensor can be used to detect the temperature of the light source module, or a photosensor can be used to detect the light intensity of the light source module to determine whether an abnormality has occurred in the light source module or the driver module. In this way, an alarm signal can be used to confirm that the wafer is being heated normally, thereby ensuring the drying effect of the wafer.

[0065] In some embodiments of the present application, the heating device further includes a heat dissipation module 14, wherein the heat dissipation module 14 includes a heat dissipation plate 141, a water cooling tube 142 disposed on the heat dissipation plate, a coolant filled in the water cooling tube 142, and a circulation pump for driving the coolant;

[0066] like Figure 3 As shown, the first surface of the heat dissipation plate 141 is disposed opposite to the light source module, and the second surface of the heat dissipation plate 141 is disposed opposite to the driving module 12 .

[0067] In some embodiments of the present application, the heat sink 141 is a copper alloy heat sink.

[0068] In some embodiments of the present application, Figure 4 As shown, the water cooling pipe 142 is formed into an S shape and uniformly surrounds the heat dissipation plate 141.

[0069] Because cold light sources operate at high power, they have an upper limit on their operating temperature. Exceeding this limit will lead to a rapid reduction in lifespan and brightness. The driver module 12 also generates significant operating heat. Therefore, the first surface of the heat sink 141 is used to cool the light source module 11; the second surface of the heat sink 141 also cools the driver module 12. Coolant is kept flowing in the water-cooling tubes 142 located on the heat sink 141. These water-cooling tubes 142 are arranged in an S-shaped loop to ensure uniform cooling.

[0070] In some embodiments of the present application, the heat dissipation module 13 further includes:

[0071] a flow detection module, wherein a first end of the flow detection module is disposed in the water-cooling pipe, and the flow detection module is configured to detect a real-time flow rate of the coolant in the water-cooling pipe;

[0072] The second alarm module is connected to the second end of the flow detection module, and the second alarm module is configured to send a second alarm signal when the real-time flow does not fall within the preset flow range.

[0073] In an embodiment of the present application, the flow detection module can detect the real-time flow of the coolant in the water-cooling pipe through a flow meter.

[0074] In the embodiment of the present application, the second alarm module may include any one or more of a buzzer, a display screen, and an indicator light. The second alarm signal may be used to indicate that the buzzer sounds an alarm, the display screen indicates that the light emitting diode is abnormal, and the indicator light flashes, etc.

[0075] In this way, the second alarm signal can be used to determine that the water cooling system of the heat dissipation module 14 can dissipate heat normally, thereby increasing the service life of the cold light source and ensuring the drying effect on the wafer.

[0076] In some embodiments of the present application, Figure 5 As shown, the heating device also includes a sealable cavity 41, which encapsulates the light source module 11, the driving module 12 and the controller 13; the light-emitting side of the light source module 11 is arranged opposite to the back side of the wafer through the sealable cavity 41.

[0077] In some embodiments of the present application, the sealable cavity 41 further encapsulates one or more of the current detection module, the first alarm module, the heat dissipation module 14 , the flow detection module, and the second alarm module.

[0078] In the embodiment of the present application, the sealable cavity 41 on the light-emitting side of the light source module 11 is transparent. Exemplarily, the driving module 12, the heat dissipation module 13 and the light source module 11 are fixed in the sealable cavity 41 in order from the bottom.

[0079] In some embodiments of the present application, Figure 5 As shown, the heating device further includes a limiting column 42 , one end of which is fixed to the sealable cavity 41 , and the other end of which is in contact with the side of the wafer.

[0080] In some embodiments of the present application, Figure 5 As shown, the sealable cavity 41 is sealed and connected to an air inlet pipe, which is used to fill gas. The sealable cavity 41 is a sealed structure, and the air inlet pipe 43 is used to fill gas (such as nitrogen) to increase the internal air pressure of the housing 41 and create a waterproof and anti-oxidation environment.

[0081] In the embodiment of the present application, the mounting hole of the limiting column 42 can be used as an outlet for nitrogen. The airtight cavity 41 can also be provided with an air pressure detection device to maintain a certain pressure inside the airtight cavity 41.

[0082] The application provides a heating device that transmits a drive signal through a control module, which controls multiple cold light sources in a light source module according to the drive signal. When the cold light sources are illuminated, they emit high-brightness light energy, which is then converted into heat energy on the wafer surface. This heats the back of the wafer, reducing the surface tension of residual liquid, enhancing the Maragni effect, and improving the drying process.

[0083] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

[0084] In summary, after reading the contents of this application, those skilled in the art will understand that the foregoing contents are presented by way of example only and are not intended to be limiting. Although not expressly stated herein, those skilled in the art will understand that this application is intended to encompass various reasonable changes, improvements, and modifications to the embodiments. Such changes, improvements, and modifications are within the spirit and scope of the exemplary embodiments of this application.

[0085] It should also be understood that although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Therefore, without departing from the teachings of the present application, the first element in some embodiments may be referred to as the second element in other embodiments. The same reference numerals or the same reference designators represent the same elements throughout the specification.

Claims

1. A heating device for drying wafers in a wafer etching and cleaning device, characterized in that: include: A light source module, wherein the light source module comprises a plurality of cold light sources, the plurality of cold light sources are arranged into a light source array, the light emitting side of the light source module is arranged opposite to the back side of the wafer, the size of the light source module is adapted to the size of the wafer, and the plurality of cold light sources are used to heat the wafer; A driving module, the driving module is electrically connected to the light source module, and the driving module is used to control the plurality of cold light sources according to a driving signal; A controller is electrically connected to the driving module, and is used to send the driving signal to the driving module.

2. The heating device according to claim 1, characterized in that The light source array includes a plurality of light source areas, each of which is a circular ring-shaped area, and the plurality of light source areas are concentric rings; the plurality of cold light sources are evenly arranged in series in the light source area.

3. The heating device according to claim 2, characterized in that The light source area includes: a plurality of arc-shaped sub-areas, and at least one connecting member for connecting the plurality of arc-shaped sub-areas.

4. The heating device according to claim 1, characterized in that Also includes: a current detection module, wherein a first end of the current detection module is electrically connected to the driving module, a second end of the current detection module is electrically connected to the light source module, and the current detection module is used to detect a driving current value flowing into the driving module; A first alarm module, the first alarm module and the third end of the current detection module, the first alarm module is configured to send a first alarm signal when the driving current value does not belong to a preset current range.

5. The heating device according to claim 4, characterized in that Also includes a heat dissipation module; The heat dissipation module includes a heat dissipation plate, a water cooling tube arranged on the heat dissipation plate, a coolant filled in the water cooling tube, and a circulation pump driving the coolant; The first surface of the heat dissipation plate is disposed opposite to the light source module, and the second surface of the heat dissipation plate is disposed opposite to the driving module.

6. The heating device according to claim 5, characterized in that The heat sink is a copper alloy heat sink.

7. The heating device according to claim 5, characterized in that The water cooling pipe is formed into an S shape and uniformly surrounds the heat sink.

8. The heating device according to claim 5, characterized in that Also includes: A flow detection module, wherein a first end of the flow detection module is disposed in the water cooling pipe, and the flow detection module is configured to detect a real-time flow of the coolant in the water cooling pipe; The second alarm module is connected to the second end of the flow detection module, and the second alarm module is configured to send out a second alarm signal when the real-time flow does not belong to the preset flow range.

9. The heating device according to claim 8, characterized in that It also includes a sealable cavity, which encapsulates the light source module, the driving module and the controller; the light-emitting side of the light source module is arranged opposite to the back side of the wafer through the sealable cavity.

10. The heating device according to claim 9, characterized in that The sealable cavity further encapsulates one or more of the current detection module, the first alarm module, the heat dissipation module, the flow detection module and the second alarm module.

11. The heating device according to claim 9, characterized in that It also includes a limiting column, one end of which is fixed on the sealable cavity, and the other end of which is in contact with the side of the wafer.

12. The heating device according to claim 9, characterized in that The sealable cavity is sealingly connected to an air inlet pipe, and the air inlet pipe is used for filling with gas.

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