Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device which comprises a base frame, a cleaning structure and a conveying structure, and the base frame is provided with a wafer loading port; the cleaning structures are detachably arranged on one side of the base frame, the extension direction of the side edge of the side where the cleaning structures are located is the first direction, the multiple cleaning structures are arranged in an array mode in the first direction, and the cleaning structures are suitable for cleaning wafers; the conveying structure is connected with the base frame, the conveying structure is connected with the base frame, and the conveying structure is used for transferring the wafer; the cleaning structure comprises a cleaning assembly and a flushing assembly, and the cleaning assembly and the flushing assembly are sequentially arranged in the second direction perpendicular to the first direction. When different process tests are newly added, equipment does not need to be replaced, the requirement can be met only by replacing one or more cleaning structures, compared with existing equipment, the cleaning structures are more convenient to replace, and the process of process research and development and testing is accelerated.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device. Background Art

[0002] For the semiconductor industry, with the continuous reduction of the key dimensions of semiconductor devices and the introduction of new materials, the cleanliness requirements for semiconductor substrates such as wafer surfaces are becoming increasingly stringent during the manufacturing process of semiconductor devices. Nowadays, the requirements for the ability to remove contaminants on the substrate and the degree of scratches and structural damage on the substrate surface are becoming increasingly higher. Contaminants such as particles, organic matter and metals on the substrate usually need to be removed by chemical reactions or physical forces to overcome the attraction of chemical bonds or physical adhesion.

[0003] Currently, the existing cleaning devices for this type of demand all use mass production models / semi-automatic equipment, and the tank-type cleaning equipment can only correspond to different processes. If there is a demand for other processes, the entire equipment needs to be replaced, which is very costly. Utility Model Content

[0004] Therefore, the technical problem to be solved by the utility model is that the existing cleaning devices currently used for such needs are all mass production models / semi-automatic equipment, and the tank cleaning equipment can only be fixed to correspond to different processes. If there are requirements for other processes, then the entire equipment needs to be replaced, which is very costly.

[0005] To this end, the utility model provides a wafer cleaning device, comprising:

[0006] A base frame, wherein a wafer loading port is mounted on the base frame;

[0007] A cleaning structure, wherein the cleaning structure is detachably arranged on one side of the base frame, the side edge of the side where the cleaning structure is located extends in a first direction, a plurality of the cleaning structures are arranged in an array along the first direction, and the cleaning structure is suitable for cleaning wafers;

[0008] A conveying structure, the conveying structure is connected to the base frame, and the conveying structure is used to transfer the wafer;

[0009] Wherein, the cleaning structure includes a cleaning component and a flushing component, and the cleaning component and the flushing component are arranged in sequence along a second direction perpendicular to the first direction.

[0010] Optionally, the above transmission structure includes:

[0011] A flip assembly, the flip assembly is arranged on the base frame, and the flip assembly is used to flip the wafer;

[0012] A first transmission member, which is disposed between the flip assembly and the wafer transfer port, and is suitable for transferring the wafer between the flip assembly and the wafer transfer port;

[0013] and a second transmission member, wherein the second transmission member is arranged between the turning assembly and the cleaning structure.

[0014] Optionally, the second transmission component includes a robot arm and a clamp, wherein the clamp is installed at an output end of the robot arm, and the robot arm drives the clamp to clamp or release the wafer.

[0015] Optionally, the cleaning component includes:

[0016] A cleaning tank, wherein a space for placing a cleaning agent and the wafer is provided in the cleaning tank, and a liquid inlet and a liquid outlet are also provided on the cleaning tank;

[0017] A power pump, wherein a liquid output end of the power pump is connected to a liquid inlet of the cleaning tank through a first pipeline;

[0018] A first filter element, wherein the liquid inlet end of the first filter element is connected to the liquid outlet of the cleaning tank, and the liquid outlet end of the first filter element is connected to the liquid input end of the power pump through a second pipeline.

[0019] Optionally, the cleaning component further comprises a temperature control component, and the temperature control component is arranged on the second pipe.

[0020] Optionally, the above-mentioned wafer cleaning device further comprises a drying structure; the drying structure is arranged on a side of the base frame relative to the wafer loading port;

[0021] The drying structure includes a first drying component and a second drying component. The first drying component is used for cleaning and drying the second transmission member; and the second drying component is used for drying the wafer.

[0022] Optionally, the base frame has an openable and closable accommodation space built in, and the cleaning structure, the conveying structure and the drying structure are all arranged in the accommodation space.

[0023] Optionally, the cleaning structure further comprises an exhaust member, which is arranged on a side of the cleaning component away from the flushing component to extract the gas in the accommodating space to the outside.

[0024] Optionally, the above-mentioned wafer cleaning device further includes:

[0025] A second filter element is disposed on the base frame to filter gas flowing from the outside into the accommodation space.

[0026] The technical solution provided by the utility model has the following advantages:

[0027] 1. The utility model provides a wafer cleaning device, including: a base frame, a cleaning structure and a conveying structure. From the top view of the entire wafer cleaning device, a wafer loading port is installed on the left side of the base frame, and the cleaning structure is arranged at the upper side end of the base frame. The side extension direction of the upper side is the left-right direction, that is, the first direction. A plurality of cleaning structures are arranged, and a plurality of cleaning structures are detachably arranged on the base frame. A plurality of cleaning structure arrays are arranged on the base frame. Specifically, a cleaning structure constitutes a module. The cleaning structure includes a cleaning component and a flushing component. Along a second direction perpendicular to the first direction, that is, from top to bottom, the cleaning component and the flushing component are arranged in sequence, and the cleaning component and the flushing component are fixedly connected. The conveying structure is connected to the base frame, and the conveying structure is arranged between the wafer loading port and the cleaning structure. Different cleaning components correspond to different processes, and the process needs to be implemented according to demand. Specifically, for example, the cleaning agents in different cleaning components are different. When the wafer cleaning device in this embodiment is used to clean the wafer, the wafer is first placed in the wafer loading port manually or by mechanical means, and then the wafer is taken out of the wafer loading port by the conveying structure, and is transported to the cleaning component according to the required cleaning process, and the cleaning component removes the stains on the surface of the wafer; then the cleaning component removes the wafer from the cleaning component and transports it to the rinsing component for rinsing to remove the cleaning agent on the surface. Finally, the conveying structure rinses and transfers the rinsed wafer to the wafer loading port, completing the entire cleaning process.

[0028] This application sets up a detachable cleaning structure, and only needs equipment to meet the current research and development needs of cleaning equipment. When adding different process tests, there is no need to replace the equipment, and only one or more cleaning structures need to be replaced to meet the needs. Compared with existing equipment, replacing the cleaning structure is more convenient, which speeds up the process of process development and testing. In addition, the cleaning component and the flushing component are combined together in the longitudinal direction, and several cleaning structures are integrated into a set of equipment in the transverse direction. There is no need to develop different equipment for different research and development needs, which reduces a lot of costs, reduces the land cost of the machine, and reduces the operating costs of customers, thereby achieving better economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 This is a schematic diagram of the overall structure of the wafer cleaning device provided in the utility model;

[0031] Figure 2 A top view of the internal structure of the wafer cleaning device provided in the utility model;

[0032] Description of reference numerals:

[0033] 1 – base frame;

[0034] 2 – Wafer loading port;

[0035] 3-cleaning structure; 31-cleaning assembly; 32-flushing assembly; 33-air extraction component;

[0036] 4-transmission structure; 41-turning assembly; 42-first transmission member; 43-second transmission member;

[0037] 5-drying structure; 51-first drying component; 52-second drying component;

[0038] 6 - Second filter element. DETAILED DESCRIPTION

[0039] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0043] Example 1

[0044] like Figure 1 to Figure 2 As shown, this embodiment provides a wafer cleaning device, including: a base frame 1, a cleaning structure 3 and a conveying structure 4. From the top view of the entire wafer cleaning device, a wafer loading port 2 is installed on the left side of the base frame 1. The cleaning structure 3 is arranged at the upper side end of the base frame 1, and the side extension direction of the upper side is the left-right direction, that is, the first direction. A plurality of cleaning structures 3 are arranged, and a plurality of cleaning structures 3 are detachably arranged on the base frame 1. A plurality of cleaning structures 3 are arranged in an array on the base frame 1. Specifically, one cleaning structure 3 forms a module. The cleaning structure 3 includes a cleaning component 31 and a flushing component 32. Along the second direction perpendicular to the first direction, that is, from top to bottom, the cleaning component 31 and the flushing component 32 are arranged in sequence, and the cleaning component 31 and the flushing component 32 are fixedly connected. The conveying structure 4 is connected to the base frame 1, and the conveying structure 4 is arranged between the wafer loading port 2 and the cleaning structure 3. Different cleaning components 31 correspond to different processes, and the process needs to be implemented according to demand. Specifically, for example, the cleaning agents in different cleaning components 31 are different. When the wafer cleaning device in this embodiment is used to clean the wafer, the wafer is first placed in the wafer loading port 2 manually or mechanically, and then the wafer is taken out from the wafer loading port 2 by the conveying structure 4, and is transported to the cleaning component 31 according to the required cleaning process, and the cleaning component 31 removes the stains on the surface of the wafer; then the cleaning component 31 removes the wafer in the cleaning component 31 and transports it to the rinsing component 32 for rinsing to remove the cleaning agent on the surface. Finally, the conveying structure 4 rinses and transfers the rinsed wafer to the wafer loading port 2. The entire cleaning process is completed.

[0045] By setting up a detachable cleaning structure 3, the present application only needs equipment to meet the current research and development needs of cleaning equipment. When adding different process tests, there is no need to replace the equipment, only one or more cleaning structures 3 need to be replaced to meet the needs. Compared with existing equipment, replacing the cleaning structure 3 is more convenient, which speeds up the process of process development and testing. The cleaning component 31 and the flushing component 32 are combined together in the longitudinal direction, and several cleaning structures 3 are integrated into a set of equipment in the transverse direction. There is no need to develop different equipment for different research and development needs, which reduces a lot of costs, reduces the land cost of the machine, and reduces the operating costs of customers, thereby achieving better economic benefits.

[0046] like Figure 2 As shown, specifically, the wafer cleaning device also includes a drying structure 5, which is arranged on the right side of the base frame 1. The drying structure 5 includes a second drying component 52. The conveying structure 4 includes: a flip component 41, a first transmission component 42 and a second transmission component 43. The flip component 41 can be a mechanical flip device with a suction cup. The flip component 41 is arranged on the base frame 1. The top surface of the flip component 41 is provided with a flip platform that fits the wafer. The flip component 41 can be used to flip the wafer. The first transmission component 42 is a vacuum manipulator, which is arranged between the flip component 41 and the wafer loading port 2. The second transmission component 43 is a six-axis robot with a wafer clamp, and the clamp is installed at the output end of the robot. The second transmission component 43 is arranged between the flip component 41 and the cleaning structure 3. The process of moving the wafer from the wafer loading port 2 to the cleaning structure 3 is as follows: first, the wafer is in a horizontal state when it is placed on the wafer loading port 2; the wafer on the wafer loading port 2 is moved to the flip assembly 41 by a vacuum manipulator; then, the flip assembly 41 flips the horizontal wafer into a vertical state to facilitate the picking up of the second transmission component 43; further, the robot arm drives the clamp to move to the flip assembly 41 position, clamps the wafer in the vertical state, and moves the wafer to the cleaning component 31 for cleaning. After a period of cleaning, the wafer is moved to the rinsing component 32 for rinsing; finally, the robot arm drives the clamp to move the wafer in the rinsing component 32 to the second drying component 52 for drying, and then the dried wafer is placed on the flip assembly 41, and the flip assembly 41 flips the vertical wafer to the horizontal direction, and the first transmission component 42 drives the wafer to move the wafer on the flip assembly 41 to the wafer loading port 2, and the process ends.

[0047] like Figure 2As shown, in this embodiment, the wafer cleaning device also includes a first drying component 51 to clean the second transmission component 43. The process position of the cleaning and drying process here is: the first type, when the second transmission component 43 places the wafer into the second drying component 52, the robot arm places the clamp into the first drying component 51 for rinsing and drying, which can be specifically water spray cleaning and then nitrogen drying; the second type, after the previous wafer is clamped by the clamp and placed in the cleaning component 31, when the next wafer needs to be placed in another cleaning component 31, the robot arm needs to be used to place the clamp into the first drying component 51 for drying between the two steps. Through the above settings, the cleaning agents in different cleaning components 31 are prevented from contaminating each other.

[0048] like Figure 2 As shown, specifically, the cleaning component 31 includes: a cleaning tank, a power pump, a first filter element and a temperature control element; a storage space for placing cleaning agents and wafers is provided in the cleaning tank, and a liquid inlet and a liquid outlet are also provided on the cleaning tank; the liquid output end of the power pump is connected to the liquid inlet of the cleaning tank through a first pipe; the liquid inlet end of the first filter element is connected to the liquid outlet of the cleaning tank, and the liquid outlet end of the first filter element is connected to the liquid input end of the power pump through a second pipe. The power pump can pump cleaning agents into the storage space of the cleaning tank through the first pipe, and can pump out the cleaning agents in the storage space through the second pipe. A first filter element is also connected in series on the second pipe, and the first filter element can filter the impurities cleaned from the cleaning agent to realize the recycling of the cleaning agent and save costs. And one cleaning structure 3 corresponds to the entire above-mentioned cleaning agent circulation pipeline. Corresponding to different processes, a temperature control element can also be connected in series on the first pipeline to control the temperature of the cleaning agent entering the storage space to improve the cleaning effect.

[0049] like Figure 1 to Figure 2 As shown, the first pipe and the second pipe can be hoses and have a long length. The cleaning structure 3 and the base frame 1 are assembled in a pull-out manner. When a cleaning structure 3 is replaced, the entire cleaning structure 3 including the first pipe and the second pipe can be directly pulled out, and the cleaning component 31 and the first pipe and the second pipe can be connected outside, which can improve work efficiency. Here, the first pipe and the second pipe can be hoses and have a long length as an example. The specific implementation method of the first pipe and the second pipe is not limited, as long as the connection position of the first pipe and the second pipe with the cleaning component 31 can be pulled out along with the cleaning structure 3.

[0050] like Figure 1As shown, in this embodiment, the base frame 1 is a closed storage space, and only an openable and closable inlet and outlet are provided at the position of the wafer loading port 2. The cleaning component 31, the flushing component 32 and the conveying structure 4 are arranged in the storage space. In the process of cleaning the wafer, acid gas will be generated. By fixing an exhaust member on the cleaning component 31, and the exhaust member 33 is arranged on the side of the cleaning component 31 away from the flushing component 32, the acid gas in the storage space can be extracted to the outside to prevent the acid gas from corroding the internal parts. The wafer cleaning device also includes: a second filter element 6. In the process of exhausting the exhaust member 33, fresh air needs to enter the storage space. At this time, a second filter element 6 is arranged on the base frame 1. While realizing air circulation, it can filter the gas flowing from the outside to the storage space to prevent impurities from entering and causing insufficient wafer cleaning.

[0051] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A wafer cleaning device, characterized in that: include: A base frame (1), wherein a wafer loading port (2) is mounted on the base frame (1); A cleaning structure (3), the cleaning structure (3) being detachably arranged on one side of the base frame (1), the side edge of the side where the cleaning structure (3) is located extending in a first direction, a plurality of the cleaning structures (3) being arranged in an array along the first direction, and the cleaning structure (3) being suitable for cleaning wafers; A conveying structure (4), the conveying structure (4) is connected to the base frame (1), and the conveying structure (4) is used to transfer the wafer; Wherein, the cleaning structure (3) comprises a cleaning component (31) and a flushing component (32), and the cleaning component (31) and the flushing component (32) are arranged in sequence along a second direction perpendicular to the first direction.

2. The wafer cleaning device according to claim 1, characterized in that: The transmission structure (4) comprises: A flipping assembly (41), the flipping assembly (41) being arranged on the base frame (1), and the flipping assembly (41) being used to flip the wafer; a first transmission member (42), the first transmission member (42) being arranged between the flip assembly (41) and the wafer transfer port, and being suitable for transferring the wafer between the flip assembly (41) and the wafer transfer port; and a second transmission member (43), wherein the second transmission member (43) is arranged between the turning assembly (41) and the cleaning structure (3).

3. The wafer cleaning device according to claim 2, characterized in that: The second transmission member (43) comprises a mechanical arm and a clamping claw, wherein the clamping claw is installed at the output end of the mechanical arm, and the mechanical arm drives the clamping claw to clamp or release the wafer.

4. The wafer cleaning device according to claim 2, characterized in that: The cleaning component (31) comprises: A cleaning tank, wherein a space for placing a cleaning agent and the wafer is provided in the cleaning tank, and a liquid inlet and a liquid outlet are also provided on the cleaning tank; A power pump, wherein a liquid output end of the power pump is connected to a liquid inlet of the cleaning tank through a first pipeline; A first filter element, wherein the liquid inlet end of the first filter element is connected to the liquid outlet of the cleaning tank, and the liquid outlet end of the first filter element is connected to the liquid input end of the power pump through a second pipeline.

5. The wafer cleaning device according to claim 4, characterized in that: The cleaning component (31) further comprises a temperature control component, wherein the temperature control component is arranged on the second pipe.

6. The wafer cleaning device according to any one of claims 2 to 5, characterized in that: The wafer cleaning device further comprises a drying structure (5); the drying structure (5) is arranged on a side of the base frame (1) relative to the wafer loading port (2); The drying structure (5) comprises a first drying component (51) and a second drying component (52), wherein the first drying component (51) is used for cleaning and drying the second transmission component (43); and the second drying component (52) is used for drying the wafer.

7. The wafer cleaning device according to claim 6, characterized in that: The base frame (1) has an openable and closable accommodation space built in, and the cleaning structure (3), the conveying structure (4) and the drying structure (5) are all arranged in the accommodation space.

8. The wafer cleaning device according to claim 7, characterized in that: The cleaning structure (3) further comprises an exhaust member (33), wherein the exhaust member (33) is arranged on a side of the cleaning component (31) away from the flushing component (32) so as to exhaust the gas in the accommodating space to the outside.

9. The wafer cleaning device according to claim 7, characterized in that: The wafer cleaning device also includes: A second filter element (6), the second filter element (6) is arranged on the base frame (1) to filter gas flowing from the outside into the containing space.

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