Plastic package structure of IGBT (Insulated Gate Bipolar Translator) module

Abstract

The utility model discloses an IGBT module plastic package structure, and relates to the technical field of IGBT modules. The IGBT module plastic packaging structure comprises a module body, pins are fixedly connected to the upper surface of the module body, the outer surfaces of the two pins are sleeved with first protective sleeves, a supporting plate is fixedly connected between the two first protective sleeves, the outer surfaces of the two pins are movably sleeved with second protective sleeves, folding grooves are formed in the outer surfaces of the second protective sleeves, and the supporting plate is fixedly connected between the two first protective sleeves. The upper surface of the module body is fixedly connected with a limiting top column, the outer surface of the limiting top column is sleeved with a limiting ring, a shell is arranged on the upper surface of the module body, a groove is formed in the lower surface of the shell, a connecting plate is arranged in the groove, and a through hole extending out of the lower surface of the connecting plate is formed in the upper surface of the connecting plate. The pins can be prevented from making contact with one another through the second protective sleeves, the second protective sleeves can be folded by means of extrusion when the pins are connected with the connecting plate, and the safety of the pins is improved by means of the second protective sleeves.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT modules, in particular to an IGBT module plastic packaging structure. Background Art

[0002] IGBT module is a power semiconductor device, commonly used in high voltage and high current applications in the field of power electronics. IGBT (Insulated Gate Bipolar Transistor) combines the advantages of MOSFET and bipolar junction transistor (BJT), with high input impedance and low switching loss, while being able to withstand high voltage and high current. This makes IGBT module an ideal choice for industrial drive, power conversion, AC motor control and other fields.

[0003] The pins of IGBT modules are usually used to connect external circuits and control signals, and are extremely important components. However, since the pins are relatively fragile, they can easily be twisted or even contact each other due to accidental contact or collision during installation, which can easily lead to short circuits or even damage to the device. In view of this, we propose a plastic encapsulation structure for IGBT modules. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art and to provide an IGBT module plastic packaging structure, which can solve the problem that pins are prone to bending or even contacting each other.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an IGBT module plastic packaging structure, including a module body, the upper surface of the module body is fixedly connected with pins, the outer surfaces of the two pins are both sleeved with a first protective cover, a support plate is fixedly connected between the two first protective covers, the outer surfaces of the two pins are movably sleeved with a second protective cover, the outer surface of the second protective cover is provided with a folding groove, the upper surface of the module body is fixedly connected with a limiting top column, the outer surface of the limiting top column is sleeved with a limiting ring, a shell is provided on the upper surface of the module body, a groove is provided on the lower surface of the shell, a connecting plate is provided inside the groove, the upper surface of the connecting plate is provided with a through hole extending from its lower surface, and the through hole is adapted to the pin.

[0006] Preferably, a conical groove is formed on the lower surface of the connecting plate, and the upper side of the conical groove extends out of the upper surface of the connecting plate.

[0007] Preferably, the limiting top column is matched with the conical groove, and the upper surface of the module body is fixedly connected with a mounting column.

[0008] Preferably, a threaded hole extending out of the lower surface of the module body is formed on the upper surface of the mounting post, and a threaded hole is also formed on the lower surface of the shell.

[0009] Preferably, the outer surface of the shell is fixedly connected with heat dissipation fins, and the heat dissipation fins extend into the interior of the groove.

[0010] Preferably, a heat conducting plate is fixedly connected to the inner wall of the groove.

[0011] Preferably, a protrusion is fixedly connected to a surface of the heat conducting plate on one side away from the inner wall of the groove.

[0012] Preferably, the heat dissipation fins are fixedly connected to the heat conducting plate, and the connecting plate is fixedly connected to the heat conducting plate.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] (1) The IGBT module plastic encapsulation structure aligns the pins with the fixed through holes on the connecting plate during packaging. During the alignment, the pins can be positioned to a certain extent with the help of a limiting top column. After the pins are aligned and inserted, the connecting plate contacts the upper surface of the second protective cover and squeezes the second protective cover to deform and fold it, thereby exposing the pins in the second protective cover. When the pins are deformed due to external force, the first protective cover and the support plate can be used to reduce the degree of pin deformation. At the same time, the second protective cover can be used to prevent the pins from contacting each other after deformation, resulting in a short circuit. With the above structure, the second protective cover can be used to prevent the pins from contacting each other, and the second protective cover can be squeezed to fold when connected to the connecting plate. The setting of the second protective cover improves the safety of the pins.

[0015] (2) The IGBT module plastic package structure, when the module body is working, the heat will be transferred to the heat sink fins through the heat conduction plate, and then transferred to the outside air through the heat sink fins. The protrusions on the heat conduction plate can effectively increase the contact area between the heat conduction plate and the air, thereby improving the thermal conductivity efficiency. Through the above structure, when the module body is working, the heat in the groove can be transferred to the outside air by utilizing the cooperation between the heat conduction plate and the heat sink fins, thereby avoiding heat accumulation inside the groove and causing failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described below with reference to the accompanying drawings and embodiments:

[0017] Figure 1 This is a schematic diagram of the structure of an IGBT module plastic package structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the decomposition of the module body of the utility model;

[0019] Figure 3This is a schematic diagram of the lower surface of the module body of the utility model;

[0020] Figure 4 This is a schematic diagram of the connection plate of the utility model;

[0021] Figure 5 This is a schematic diagram of the module body of the utility model;

[0022] Figure 6 It is a schematic diagram of the groove of the utility model.

[0023] Figure numerals: 1. module body; 2. pin; 3. first protective cover; 4. support plate; 5. second protective cover; 6. folding groove; 7. limiting top column; 8. limiting ring; 9. shell; 10. groove; 11. connecting plate; 12. through hole; 13. conical groove; 14. mounting column; 15. threaded hole; 16. heat sink fin; 17. heat conducting plate; 18. protrusion. DETAILED DESCRIPTION

[0024] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0025] See also Figure 1-6The utility model provides a technical solution: an IGBT module plastic packaging structure, including a module body 1, a pin 2 is fixedly connected to the upper surface of the module body 1, the outer surfaces of the two pins 2 are both sleeved with a first protective cover 3, a support plate 4 is fixedly connected between the two first protective covers 3, the outer surfaces of the two pins 2 are both movably sleeved with a second protective cover 5, the outer surface of the second protective cover 5 is provided with a folding groove 6, the upper surface of the module body 1 is fixedly connected with a limited top column 7, the outer surface of the limited top column 7 is sleeved with a limited ring 8, a shell 9 is provided on the upper surface of the module body 1, a groove 10 is provided on the lower surface of the shell 9, a connecting plate 11 is provided inside the groove 10, the upper surface of the connecting plate 11 is provided with a through hole 12 extending from its lower surface, the through hole 12 is adapted to the pin 2, the second protective cover 5 is made of a flexible material, and can be Folding is carried out in conjunction with the folding groove 6. During packaging, the pin 2 is aligned with the fixed through hole 12 on the connecting plate 11. While aligning, it can be positioned to a certain extent with the help of the limiting top column 7. After the pin 2 is aligned and inserted, the connecting plate 11 contacts the upper surface of the second protective cover 5, and squeezes the second protective cover 5 to cause it to deform and fold, thereby exposing the pin 2 in the second protective cover 5. When the pin 2 is accidentally deformed due to external force, the first protective cover 3 and the support plate 4 can be used to reduce the degree of deformation of the pin 2. At the same time, the second protective cover 5 can be used to prevent the pins 2 from contacting each other after deformation and causing a short circuit. Through the above structure, the second protective cover 5 can be used to prevent the pins 2 from contacting each other, and the second protective cover 5 can be folded by squeezing when connected to the connecting plate 11, and the safety of the pin 2 is improved with the setting of the second protective cover 5.

[0026] Furthermore, a conical groove 13 is provided on the lower surface of the connecting plate 11, and the upper side of the conical groove 13 extends out of the upper surface of the connecting plate 11, and the limiting top column 7 is adapted to the conical groove 13. The upper surface of the module body 1 is fixedly connected with a mounting column 14, and the upper surface of the mounting column 14 is provided with a threaded hole 15 extending out of the lower surface of the module body 1. The lower side surface of the shell 9 is also provided with a threaded hole 15. The outer surface of the shell 9 is fixedly connected with a heat dissipation fin 16, and the heat dissipation fin 16 extends into the interior of the groove 10. The inner wall of the groove 10 is fixedly connected with a heat conducting plate 17, and the side surface of the heat conducting plate 17 away from the inner wall of the groove 10 is fixedly connected with a protrusion 18. The heat dissipation fin 16 is fixedly connected to the heat conducting plate 17, and the connecting plate 11 is fixedly connected to the heat conducting plate 17. The connection is fixed by inserting the limiting top column 7 into the inside of the conical groove 13, and the positioning is completed by gradually narrowing the conical groove 13, and then the threaded hole 15 on the mounting column 14 and the shell 9 is used in conjunction with screws to complete the connection. At the same time, when the module body 1 is working, the heat will be transferred to the heat dissipation fins 16 through the heat conduction plate 17, and the heat will be transferred to the outside air through the heat dissipation fins 16. The protrusion 18 on the heat conduction plate 17 can effectively increase the contact area between the heat conduction plate 17 and the air, thereby improving the thermal conductivity efficiency. Through the above structure, when the module body 1 is working, the heat in the groove 10 can be transferred to the outside air by utilizing the cooperation of the heat conduction plate 17 and the heat dissipation fins 16, thereby avoiding heat accumulation inside the groove 10 and causing failures.

[0027] Working principle: When packaging, align the pin 2 with the fixed through hole 12 on the connecting plate 11. During the alignment, the pin 2 can be positioned to a certain extent with the help of the limiting top column 7. After the pin 2 is aligned and inserted, the connecting plate 11 contacts the upper surface of the second protective cover 5 and squeezes the second protective cover 5 to deform and fold it, thereby exposing the pin 2 in the second protective cover 5. When the pin 2 is deformed due to an external force, the first protective cover 3 and the support plate 4 can be used to reduce the deformation of the pin 2, and the second protective cover 5 can be used to avoid To prevent the pins 2 from deforming and contacting each other to cause a short circuit, the limiting top column 7 is inserted into the inside of the conical groove 13, and the positioning is completed by gradually narrowing the conical groove 13. Then, the threaded hole 15 on the mounting column 14 and the shell 9 is used in conjunction with screws to complete the connection. At the same time, when the module body 1 is working, the heat will be conducted to the heat dissipation fins 16 through the heat conduction plate 17, and the heat will be conducted to the outside air through the heat dissipation fins 16. The protrusion 18 on the heat conduction plate 17 can effectively increase the contact area between the heat conduction plate 17 and the air, thereby improving the thermal conductivity efficiency.

[0028] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An IGBT module plastic package structure, comprising a module body (1), characterized in that: The upper surface of the module body (1) is fixedly connected to a pin (2), the outer surfaces of the two pins (2) are both covered with a first protective cover (3), a support plate (4) is fixedly connected between the two first protective covers (3), the outer surfaces of the two pins (2) are both movably covered with a second protective cover (5), the outer surface of the second protective cover (5) is provided with a folding groove (6), the upper surface of the module body (1) is fixedly connected to a limiting top column (7), the outer surface of the limiting top column (7) is covered with a limiting ring (8), a shell (9) is provided on the upper surface of the module body (1), a groove (10) is provided on the lower surface of the shell (9), a connecting plate (11) is provided inside the groove (10), the upper surface of the connecting plate (11) is provided with a through hole (12) extending from its lower surface, and the through hole (12) is adapted to the pin (2).

2. The IGBT module plastic packaging structure according to claim 1, characterized in that: A conical groove (13) is provided on the lower surface of the connecting plate (11), and the upper side of the conical groove (13) extends beyond the upper surface of the connecting plate (11).

3. The IGBT module plastic packaging structure according to claim 2, characterized in that: The limiting top column (7) is matched with the conical groove (13), and the upper surface of the module body (1) is fixedly connected with a mounting column (14).

4. The IGBT module plastic packaging structure according to claim 3, characterized in that: The upper surface of the mounting column (14) is provided with a threaded hole (15) extending out of the lower surface of the module body (1), and the lower side surface of the housing (9) is also provided with a threaded hole (15).

5. The IGBT module plastic packaging structure according to claim 4, characterized in that: The outer surface of the shell (9) is fixedly connected with a heat dissipation fin (16), and the heat dissipation fin (16) extends into the interior of the groove (10).

6. The IGBT module plastic packaging structure according to claim 5, characterized in that: A heat conducting plate (17) is fixedly connected to the inner wall of the groove (10).

7. The IGBT module plastic packaging structure according to claim 6, characterized in that: A protrusion (18) is fixedly connected to a surface of one side of the heat conducting plate (17) away from the inner wall of the groove (10).

8. The IGBT module plastic packaging structure according to claim 6, characterized in that: The heat dissipation fins (16) are fixedly connected to the heat conducting plate (17), and the connecting plate (11) is fixedly connected to the heat conducting plate (17).

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