Camera module and vehicle-mounted camera equipment

Abstract

The camera module comprises a photosensitive main body, a lens main body and a heat transfer cover, the photosensitive main body comprises a first shell and a photosensitive assembly installed on the first shell, and the lens main body comprises a second shell connected with the first shell in a matched mode and an optical lens installed on the second shell. The optical lens is located on a photosensitive path of the photosensitive component, the heat transfer cover is provided with a first mounting end surrounding a photosensitive area of the photosensitive component and a second mounting end surrounding an image end of the lens body, the first mounting end is in heat transfer connection with the photosensitive component, and the second mounting end is in heat transfer connection with the second shell. In this way, a heat dissipation path is added for the photosensitive assembly in the camera module, the heat dissipation effect is improved, normal use of the photosensitive chip is guaranteed, and the service life of the photosensitive chip is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted cameras, in particular to a camera module and a vehicle-mounted camera device. Background Art

[0002] With the rapid development of the automobile industry, the application technology of vehicle-mounted cameras has become increasingly mature. Cars are equipped with cameras as advanced driving assistance systems. The imaging quality of the camera module is a very important parameter. A good chip structure is the key to ensuring the normal operation of the camera. The quality of the imaging surface directly affects the customer experience, and in serious cases it can even affect the user's driving safety.

[0003] Among them, ADIS high-pixel lenses are becoming more and more common. Usually, such lenses select high-power chips to ensure the clarity of the image, but such high-power chips are usually accompanied by high heat. Excessive chip temperature will affect the normal use of the camera module. Utility Model Content

[0004] Since the photosensitive chip in the existing vehicle-mounted camera has the problem of insufficient heat dissipation, it is necessary to provide a camera module and a vehicle-mounted camera device.

[0005] A camera module, comprising:

[0006] A photosensitive body, the photosensitive body comprising a first housing and a photosensitive component mounted on the first housing;

[0007] A lens body, the lens body comprising a second housing connected to the first housing, and an optical lens mounted on the second housing, the optical lens being located in a light-sensing path of the light-sensing component; and

[0008] The heat transfer hood has a first mounting end arranged around the photosensitive area of ​​the photosensitive component and a second mounting end arranged around the image end of the lens body, the first mounting end is heat-transferringly connected to the photosensitive component, and the second mounting end is heat-transferringly connected to the second housing.

[0009] This arrangement adds a heat dissipation path for the photosensitive component inside the camera module, thereby improving the heat dissipation effect, which is beneficial to ensuring the normal use of the photosensitive chip and extending the service life of the photosensitive chip.

[0010] In one embodiment, the heat transfer cover includes a cover tube, a first abutment ring and a second abutment ring respectively fixedly connected to two ends of the cover tube, the first abutment ring is heat-transferably connected to the first shell, and the second abutment ring is heat-transferably connected to the photosensitive component.

[0011] Such an arrangement increases the contact area between the heat transfer cover and the second housing and between the heat transfer cover and the photosensitive component, which is beneficial to improving the heat transfer effect.

[0012] In one embodiment, the photosensitive component includes a circuit board mounted on the first housing and a photosensitive chip mounted on the circuit board, and the first abutment ring is heat-transferably connected to a non-photosensitive area of ​​the photosensitive chip.

[0013] With such an arrangement, the heat transfer cover is in direct contact with the photosensitive chip, that is, in contact with the heat source, thereby increasing the heat conduction efficiency.

[0014] In one of the embodiments, the photosensitive component further includes a cover plate covering the photosensitive chip, and the first mounting end abuts against a peripheral side of the photosensitive chip.

[0015] With such an arrangement, the heat transfer cover can conduct heat of the photosensitive chip through the peripheral side of the photosensitive chip, which is beneficial to increasing the heat dissipation effect.

[0016] In one of the embodiments, the photosensitive component further includes a cover plate covering the photosensitive chip, the cover plate is provided with a spacing groove connected to a non-photosensitive area of ​​the photosensitive chip, and the first abutment ring is located in the spacing groove.

[0017] With this arrangement, the first abutting ring can be closer to the photosensitive area of ​​the photosensitive chip, that is, closer to the heat source of the photosensitive chip, thereby improving the heat dissipation effect. In addition, the spacing groove can also position the heat transfer cover to prevent the position of the heat transfer cover from being offset.

[0018] In one of the embodiments, the cover plate includes an inner plate and an outer plate located on both sides of the spacing groove, and the first abutting ring elastically abuts against the inner plate and the photosensitive chip.

[0019] With such arrangement, the first abutting ring is relatively fixed to the inner plate, and since the cover plate and the photosensitive chip are relatively fixed, there will be no displacement between the first abutting ring and the photosensitive chip, thereby being able to maintain a stable heat transfer path.

[0020] In one of the embodiments, the outer plate has a guide surface extending obliquely from a side of the outer plate away from the photosensitive chip toward the spacing groove.

[0021] In this way, the guide surface guides the first abutting ring of the heat transfer cover into the spacing groove, which facilitates assembly.

[0022] In one embodiment, the second abutment ring extends from the cover tube, and the second abutment ring is provided with a bolt hole, the second shell is provided with a matching hole, and the camera module further includes a fastening bolt, which is passed through the bolt hole and the matching hole to fix the heat transfer cover to the second shell.

[0023] Such an arrangement facilitates fixing the heat transfer cover to the second housing and prevents it from loosening, thereby ensuring stable heat transfer between the heat transfer cover and the second housing.

[0024] In one embodiment, the heat transfer cover further includes a light absorbing layer covering the inner wall of the cover tube.

[0025] With such a configuration, the heat transfer cover can also absorb light reflected by the glass cover, effectively preventing stray light inside the camera module from interfering with the photosensitive chip.

[0026] The present application also provides a vehicle-mounted camera device, comprising:

[0027] Mounting bracket; and

[0028] As for the camera module mentioned above, the camera module is installed on the mounting bracket.

[0029] With such a configuration, the use of the camera module with better heat dissipation provided by the present application prolongs the service life of the vehicle-mounted camera device, has the function of preventing stray light, and also improves the imaging quality of the vehicle-mounted camera device. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the internal structure of a camera module in the prior art;

[0031] Figure 2 A schematic diagram of the exploded structure of a camera module in one embodiment of the utility model;

[0032] Figure 3 for Figure 2 The internal structure diagram of the camera module shown;

[0033] Figure 4 A schematic diagram of the structure of a camera module at a photosensitive chip in an embodiment provided in the present application;

[0034] Figure 5 A schematic diagram of the structure of a camera module at a photosensitive chip in another embodiment provided in the present application;

[0035] Figure 6 A schematic diagram of the structure of a camera module at a photosensitive chip in another embodiment provided in the present application;

[0036] Figure 7 A schematic diagram of the structure of a binocular camera module in an embodiment provided in the present application.

[0037] Reference numerals:

[0038] 10. Photosensitive body; 11. First shell; 12. Photosensitive component; 121. Circuit board; 122. Photosensitive chip; 123. Cover plate; 12301. Spacing groove; 1231. Inner plate; 1232. Outer plate; 12321. Guide surface; 13. Snap-on tube; 20. Lens body; 21. Second shell; 22. Optical lens; 30. Heat transfer cover; 301. First mounting end; 302. Second mounting end; 303. Extension end; 31. Cover tube; 32. First abutting ring; 33. Second abutting ring; 40. Fastening bolts; 50. Thermal conductive adhesive. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0045] With the rapid development of the automobile industry, the application technology of vehicle-mounted cameras has become increasingly mature. Cars are equipped with cameras as advanced driving assistance systems. The imaging quality of the camera module is a very important parameter. A good chip structure is the key to ensuring the normal operation of the camera. The quality of the imaging surface directly affects the customer experience, and in serious cases it can even affect the user's driving safety.

[0046] Among them, ADIS high-pixel lenses are becoming more and more common. Usually, such lenses use high-power chips to ensure the clarity of the image. However, such high-power chips are usually accompanied by high heat. Excessive chip temperature will cause the normal use of the camera module. Please refer to Figure 1 , Figure 1 The heat of the existing photosensitive chip 122P can only be transferred to the first housing 11P through the circuit board 121P connected to the photosensitive chip 122P. During long-term use, the photosensitive chip 122P accumulates heat seriously and is easily damaged.

[0047] Based on this, it is necessary to provide a camera module and a vehicle-mounted camera device that can improve the heat dissipation effect of the photosensitive chip.

[0048] See also Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the exploded structure of a camera module in one embodiment of the utility model. Figure 3 for Figure 2 The schematic diagram of the internal structure of the camera module shown. The camera module provided by the present application includes a photosensitive body 10, a lens body 20 and a heat transfer cover 30. The photosensitive body 10 includes a first housing 11 and a photosensitive component 12 installed on the first housing 11. The lens body 20 includes a second housing 21 connected to the first housing 11 and an optical lens 22 installed on the second housing 21. The optical lens 22 is located in the photosensitive path of the photosensitive component 12. The heat transfer cover 30 has a first mounting end 301 arranged around the photosensitive area of ​​the photosensitive component 12 and a second mounting end 302 arranged around the image end of the lens body 20. The first mounting end 301 is heat-transferably connected to the photosensitive component 12, and the second mounting end 302 is heat-transferably connected to the second housing 21. In this way, a heat dissipation path is added to the photosensitive component 12 inside the camera module, which improves the heat dissipation effect, is conducive to ensuring the normal use of the photosensitive chip 122, and prolongs the service life of the photosensitive chip 122. Specifically, in the present embodiment, the camera module further includes a thermally conductive adhesive 50 disposed between the second housing 21 and the optical lens 22 , and the second housing 21 and the optical lens 22 are bonded together by the thermally conductive adhesive 50 .

[0049] See also Figure 2 and Figure 3 Specifically, in one embodiment provided in the present application, the heat transfer cover 30 includes a cover tube 31, a first abutting ring 32 and a second abutting ring 33 respectively fixedly connected to both ends of the cover tube 31, the first abutting ring 32 is heat-transferably connected to the first housing 11, and the second abutting ring 33 is heat-transferably connected to the photosensitive component 12. In this way, the contact area between the heat transfer cover 30 and the second housing 21 and between the heat transfer cover 30 and the photosensitive component 12 is increased, which is conducive to improving the heat transfer effect.

[0050] See also Figure 2 and Figure 3 Optionally, in an embodiment provided in the present application, the second abutting ring 33 extends from the cover tube 31, and the second abutting ring 33 is provided with a bolt hole, and the second housing 21 is provided with a matching hole, and the camera module further includes a fastening bolt 40, and the fastening bolt 40 is passed through the bolt hole and the matching hole to fix the heat transfer cover 30 to the second housing 21. This makes it convenient to fix the heat transfer cover 30 to the second housing 21, and it is not easy to loosen, so that the heat transfer between the heat transfer cover 30 and the second housing 21 is stable.

[0051] It is understandable that in other embodiments, the second abutting ring 33 and the second housing 21 may also be bonded together by means of the thermal conductive adhesive 50 .

[0052] See also Figure 3 Specifically, in one embodiment provided in the present application, the photosensitive component 12 includes a circuit board 121 mounted on the first housing 11 and a photosensitive chip 122 mounted on the circuit board 121, and the first abutting ring 32 is heat-conductingly connected to the non-photosensitive area of ​​the photosensitive chip 122. In this way, the heat transfer cover 30 is in direct contact with the photosensitive chip 122, that is, in contact with the heat source, thereby increasing the heat conduction efficiency.

[0053] See also Figure 4 , Figure 4 The schematic diagram of the structure of the camera module at the photosensitive chip 122 in one embodiment provided in the present application, the photosensitive component 12 also includes a cover plate 123 covering the photosensitive chip 122, and the first mounting end 301 is located at the peripheral side of the photosensitive chip 122. In this way, the heat transfer cover 30 can conduct the heat of the photosensitive chip 122 through the peripheral side of the photosensitive chip 122, which is conducive to increasing the heat dissipation effect.

[0054] See also Figure 5 , Figure 5 This is a schematic diagram of the structure of the camera module at the photosensitive chip 122 in another embodiment provided by the present application. Optionally, in one embodiment provided by the present application, the photosensitive component 12 also includes a cover plate 123 covering the photosensitive chip 122, and the cover plate 123 is provided with a spacing groove 12301 connected to the non-photosensitive area of ​​the photosensitive chip 122, and the first abutment ring 32 is located in the spacing groove 12301. In this way, the first abutment ring 32 can be closer to the photosensitive area of ​​the photosensitive chip 122, that is, closer to the heat source of the photosensitive chip 122, thereby improving the heat dissipation effect. In addition, the spacing groove 12301 can also position the heat transfer cover 30 to prevent the position of the heat transfer cover 30 from being offset.

[0055] See also Figure 5 Specifically, the cover plate 123 includes an inner plate 1231 and an outer plate 1232 located on both sides of the spacing groove 12301, and the first abutting ring 32 elastically abuts against the inner plate 1231 and the photosensitive chip 122. In this way, the first abutting ring 32 is relatively fixed to the inner plate 1231. Since the cover plate 123 and the photosensitive chip 122 are relatively fixed, the first abutting ring 32 and the photosensitive chip 122 will not move, so a stable heat transfer path can be maintained. The elastic abutment of the first abutting ring 32 against the photosensitive chip 122 can also avoid its own shaking, thereby ensuring stable heat transfer.

[0056] See also Figure 5Further, in an embodiment provided in the present application, the outer plate 1232 has a guide surface 12321 extending obliquely from the side of the outer plate 1232 away from the photosensitive chip 122 toward the spacing groove 12301. The guide surface 12321 guides the first abutting ring 32 of the heat transfer cover 30 into the spacing groove 12301, which facilitates assembly.

[0057] See also Figure 4 and Figure 6 , Figure 6 A schematic diagram of the structure of the camera module at the photosensitive chip 122 in another embodiment provided in the present application. Furthermore, in order to prevent the end of the first abutment ring 32 from causing scratches to the inner plate 1231, in this embodiment provided in the present application, the end of the first abutment ring 32 extends in a direction away from the photosensitive chip 122 to form an extended end 303 at the first mounting end 301, and the extended end 303 is arranged at an interval from the cover plate 123. In addition, this is also beneficial to increase the elasticity of the heat transfer cover 30 at the first abutment ring 32.

[0058] See also Figure 1 Since the surface of the photosensitive chip 122P is usually covered with CG (glass cover), the light enters from the optical lens 22P and is refracted by the lens inside the optical lens 22P. The light will be scattered in various corners inside the lens. At the same time, the light will also be refracted on the sensor imaging surface of the photosensitive chip 122P, thereby causing stray light to affect the imaging of the camera, resulting in unclear images and affecting the user's use and judgment.

[0059] Based on this, see Figure 3 Optionally, in one embodiment provided in the present application, the heat transfer cover 30 further includes a light absorbing layer covering the inner wall of the cover tube 31. In this way, the heat transfer cover 30 can also absorb the light reflected by the glass cover 123, effectively preventing the stray light inside the camera module from interfering with the photosensitive chip 122.

[0060] Optionally, in an embodiment provided in the present application, the heat transfer cover 30 is a metal part, and in particular, the heat transfer cover 30 is an integral steel part, which facilitates production through a unified mold.

[0061] The present application also provides a vehicle-mounted camera device, including a mounting bracket and the above-mentioned camera module, and the mounting bracket can be used for installing a monocular camera module or a binocular camera module.

[0062] For details, please refer to Figure 2 and Figure 3 The camera module further includes a card tube 13 located on a side of the first housing 11 away from the second housing 21, and the card tube 13 is card-connected to the mounting bracket.

[0063] See also Figure 7, Figure 7 This is a schematic diagram of the structure of a binocular camera module in an embodiment provided in the present application. The structure of the camera module provided in the present application can avoid mutual interference between refracted light from different optical lenses 22, thereby reducing stray light and improving imaging effects.

[0064] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A camera module, characterized in that: include: A photosensitive body, the photosensitive body comprising a first housing and a photosensitive component mounted on the first housing; A lens body, the lens body comprising a second housing connected to the first housing, and an optical lens mounted on the second housing, the optical lens being located in a light-sensing path of the light-sensing component; as well as The heat transfer hood has a first mounting end arranged around the photosensitive area of ​​the photosensitive component and a second mounting end arranged around the image end of the lens body, the first mounting end is heat-transferringly connected to the photosensitive component, and the second mounting end is heat-transferringly connected to the second housing.

2. A camera module according to claim 1, characterized in that: The heat transfer cover includes a cover tube, a first abutting ring and a second abutting ring respectively fixedly connected to two ends of the cover tube, the first abutting ring is heat-transferringly connected to the first shell, and the second abutting ring is heat-transferringly connected to the photosensitive component.

3. A camera module according to claim 2, characterized in that: The photosensitive component includes a circuit board installed on the first housing and a photosensitive chip installed on the circuit board, and the first abutment ring is heat-transferringly connected to a non-photosensitive area of ​​the photosensitive chip.

4. A camera module according to claim 3, characterized in that: The photosensitive component also includes a cover plate covering the photosensitive chip, and the first mounting end abuts against the peripheral side of the photosensitive chip.

5. A camera module according to claim 3, characterized in that: The photosensitive component also includes a cover plate covering the photosensitive chip, the cover plate is provided with a spacing groove connected to a non-photosensitive area of ​​the photosensitive chip, and the first abutment ring is located in the spacing groove.

6. A camera module according to claim 5, characterized in that: The cover plate includes an inner plate and an outer plate located on both sides of the spacing groove, and the first abutting ring elastically abuts against the inner plate and the photosensitive chip.

7. A camera module according to claim 6, characterized in that: The outer plate has a guide surface which extends obliquely from a side of the outer plate away from the photosensitive chip toward the spacing groove.

8. A camera module according to claim 2, characterized in that: The second abutment ring extends from the cover tube, and the second abutment ring is provided with a bolt hole, the second shell is provided with a matching hole, and the camera module also includes a fastening bolt, which is passed through the bolt hole and the matching hole to fix the heat transfer cover to the second shell.

9. A camera module according to claim 2, characterized in that: The heat transfer cover also includes a light absorbing layer covering the inner wall of the cover tube.

10. A vehicle-mounted camera device, characterized in that: include: Mounting bracket; and A camera module as described in any one of claims 1-9, wherein the camera module is mounted on the mounting bracket.

Images