Cooling glue smearing device for computer hardware CPU board

Abstract

The utility model discloses a computer hardware CPU board heat dissipation glue smearing device which comprises a base, a fixing frame fixedly connected to the top of the base and a placing table fixedly connected to the top of the base and further comprises a smearing assembly and a uniform smearing assembly, the smearing assembly is arranged on the fixing frame, and the uniform smearing assembly is arranged on the fixing frame. The utility model belongs to the technical field of computer hardware processing, and particularly relates to a computer hardware CPU board heat dissipation glue smearing device which can separate and extrude heat dissipation glue, enables the heat dissipation glue to be smeared more evenly through rolling of a roller and guarantees the heat dissipation effect of a CPU in use.

Description

Technical Field

[0001] The utility model belongs to the technical field of computer hardware processing, and particularly relates to a heat dissipation glue smearing device for a computer hardware CPU board. Background Art

[0002] Computer hardware refers to the general term for various physical devices in a computer system that are composed of electronic, mechanical and optoelectronic components. From the appearance point of view, a microcomputer consists of a mainframe and external devices. The mainframe mainly includes the CPU, memory, motherboard, etc.; external devices include the mouse, keyboard, etc. The CPU, as the computing and control core of the computer system, is the final execution unit for information processing and program operation. Since its creation, the CPU has made great progress in logical structure, operating efficiency and functional extension.

[0003] The CPU board of computer hardware needs to be coated with heat dissipation glue during processing to enhance its heat dissipation effect. However, the existing heat dissipation glue is not applied evenly to the CPU board, which easily leads to poor heat dissipation effect of the CPU during use and shortens its service life. Utility Model Content

[0004] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a computer hardware CPU board heat dissipation glue smearing device, which can separate and extrude the heat dissipation glue, and make the heat dissipation glue more evenly applied by rolling the roller, thereby ensuring the heat dissipation effect of the CPU when in use.

[0005] The technical solution adopted by the utility model is as follows: a computer hardware CPU board heat dissipation glue smearing device, comprising a base, a fixing frame fixedly connected to the top of the base and a placing table fixedly connected to the top of the base, and also comprising a smearing component and a smoothing component, wherein the smearing component is arranged on the fixing frame, and the smoothing component is arranged on the fixing frame;

[0006] The coating assembly includes an electric push rod that passes through a fixed frame and is fixedly connected to the fixed frame, a connecting frame fixedly connected to the free end of the electric push rod, a storage tube fixedly connected to the inside of the connecting frame, a cylinder that passes through the storage tube and is fixedly connected to the storage barrel, a piston fixedly connected to the free end of the cylinder, and a discharge pipe fixedly connected to the bottom of the storage tube, wherein the discharge pipes are evenly arranged.

[0007] Furthermore, the coating assembly also includes a sealing head threadedly connected to the lower end of the discharge pipe, a fixed plate fixedly connected to both sides of the storage cylinder, a sliding column penetrating the fixed plate and slidably connected to the fixed plate, and a spring sleeved on the outer wall of the sliding column, and the spring is fixedly connected between the outer wall of the sliding column and the bottom wall of the fixed plate.

[0008] Furthermore, the smoothing assembly includes an electric telescopic rod fixedly connected to the middle position of both sides of the fixed frame, a square plate fixedly connected to the free end of the electric telescopic rod, a linear guide rail fixedly installed on the bottom wall of the square plate, a slider slidably set on the linear guide rail, a connecting plate fixedly connected to the bottom wall of the slider, a tower spring fixedly connected to the bottom wall of the connecting plate, an installation frame fixedly connected to the lower end of the tower spring, and a roller rotatably connected between the opposite side walls of the installation frame, and the tower springs are arranged at equal intervals.

[0009] Furthermore, rubber pads are provided on the top of the placement table, and the rubber pads are evenly arranged.

[0010] Furthermore, the sliding column is arranged in an I-shape, and the installation frame is arranged in a ∩ shape.

[0011] After adopting the above structure, the beneficial effects of the utility model are as follows: The utility model proposes a computer hardware CPU board heat dissipation glue coating device:

[0012] (1) According to the coating area, you can unscrew the corresponding number of plugging heads, so that the discharge pipe is close to the top of the CPU board and the heat dissipation glue is squeezed onto the CPU board through different discharge pipes;

[0013] (2) By adjusting the height and front and rear position of the roller, the extruded heat dissipation glue can be rolled and spread evenly to ensure the heat dissipation effect of the CPU board;

[0014] (3) The tower spring can be set to give the roller the elasticity to move up and down, thus avoiding damage to the CPU board when rolling and smoothing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.

[0016] Figure 1 This is a schematic diagram of the overall structure of a computer hardware CPU board heat dissipation glue coating device proposed by the utility model;

[0017] Figure 2 This is a front view of a heat dissipation glue coating device for a computer hardware CPU board proposed by the utility model;

[0018] Figure 3 This is a three-dimensional structural schematic diagram of a computer hardware CPU board heat dissipation glue coating device proposed by the utility model;

[0019] Figure 4 The utility model discloses a cross-sectional view of a coating component of a heat dissipation adhesive coating device for a computer hardware CPU board.

[0020] In the attached drawings: 1. base, 2. fixed frame, 3. placing table, 4. electric push rod, 5. connecting frame, 6. storage cylinder, 7. cylinder, 8. piston, 9. discharge pipe, 10. plugging head, 11. fixed plate, 12. sliding column, 13. spring, 14. electric telescopic rod, 15. square plate, 16. linear guide rail, 17. slider, 18. connecting plate, 19. tower spring, 20. mounting frame, 21. roller, 22. rubber pad. DETAILED DESCRIPTION

[0021] like Figure 1-2 As shown, a computer hardware CPU board heat dissipation glue smearing device includes a base 1, a fixing frame 2 fixedly connected to the top of the base 1, and a placing table 3 fixedly connected to the top of the base 1, and also includes a smearing component and a smoothing component. The smearing component is arranged on the fixing frame 2, and the smoothing component is arranged on the fixing frame 2.

[0022] like Figure 1-4 As shown, in order to squeeze the heat dissipation glue onto the CPU board in an efficient and dispersed manner, the coating component includes an electric push rod 4 that penetrates the fixing frame 2 and is fixedly connected to the fixing frame 2, a connecting frame 5 that is fixedly connected to the free end of the electric push rod 4, a storage tube 6 that is fixedly connected to the inside of the connecting frame 5, a cylinder 7 that penetrates the storage tube 6 and is fixedly connected to the storage barrel, a piston 8 that is fixedly connected to the free end of the cylinder 7, a discharge pipe 9 that is fixedly connected to the bottom of the storage tube 6, a plugging head 10 that is threadedly connected to the lower end of the discharge pipe 9, a fixing plate 11 that is fixedly connected to both sides of the storage tube 6, a sliding column 12 that penetrates the fixing plate 11 and is slidably connected to the fixing plate 11, and a spring 13 that is sleeved on the outer wall of the sliding column 12, the spring 13 is fixedly connected between the outer wall of the sliding column 12 and the bottom wall of the fixing plate 11, and the discharge pipes 9 are evenly arranged.

[0023] like Figure 1-4 As shown, in order to make the heat dissipation glue more evenly applied and ensure the heat dissipation effect of the CPU when in use, the smoothing component includes an electric telescopic rod 14 fixedly connected to the middle position of both sides of the fixed frame 2, a square plate 15 fixedly connected to the free end of the electric telescopic rod 14, a linear guide 16 fixedly installed on the bottom wall of the square plate 15, a slider 17 slidably set on the linear guide 16, a connecting plate 18 fixedly connected to the bottom wall of the slider 17, a tower spring 19 fixedly connected to the bottom wall of the connecting plate 18, a mounting frame 20 fixedly connected to the lower end of the tower spring 19 and a roller 21 rotatably connected between the opposite side walls of the mounting frame 20, and the tower springs 19 are arranged at equal intervals.

[0024] In order to reduce the damage to the CPU board caused by the rolling of the roller 21, rubber pads 22 are arranged on the top of the placement table 3, and the rubber pads 22 are arranged in a uniform manner.

[0025] The sliding column 12 is arranged in an I-shape, and the mounting frame 20 is arranged in a ∩-shape.

[0026] When in use, a feeding tube for one-way feeding is usually provided on the side wall of the storage tube 6. The CPU board to be coated with glue is placed on the rubber pad 22. The corresponding number of plugging heads 10 can be unscrewed according to the coating area of ​​the CPU board. The electric push rod 4 is controlled to extend to move the storage tube 6 downward. After the slide column 12 contacts the top of the placement table 3, the spring 13 is deformed by force to prevent the discharge pipe 9 from directly contacting the CPU board. The discharge pipe 9 is close to the top of the CPU board, the control cylinder 7 is extended, and the piston 8 is moved downward to squeeze the heat dissipation glue through different discharge pipes 9 onto the CPU board, so that the heat dissipation glue is dispersed on the CPU board.

[0027] In the initial state, the slider 17 is at one end of the linear guide rail 16, and the two sets of electric telescopic rods 14 are controlled to extend at the same time, so that the bottom of the roller 21 contacts the top wall of the placement table 3 and the tower spring 19 is slightly deformed. The two sets of linear guide rails 16 are controlled to run, so that the slider 17 drives the roller 21 to roll on the placement plate. When the roller 21 contacts the CPU board, the tower spring 19 is squeezed and deformed again. The roller 21 with the up and down moving effect can avoid damage to the CPU board during rolling. The front and rear position adjustment of the roller 21 can roll and spread the extruded heat dissipation glue to ensure the heat dissipation effect of the CPU board.

[0028] Although the embodiments of the utility model have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the utility model, and the scope of the utility model is defined by the attached claims and their equivalents. In short, if those skilled in the art are inspired by them and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the scope of protection of the utility model.

Claims

1. A computer hardware CPU board heat dissipation glue coating device, comprising a base, a fixing frame fixedly connected to the top of the base, and a placing table fixedly connected to the top of the base, characterized in that: It also includes a smearing component and a smoothing component, wherein the smearing component is arranged on a fixed frame, and the smoothing component is arranged on the fixed frame; The coating assembly includes an electric push rod that passes through a fixed frame and is fixedly connected to the fixed frame, a connecting frame fixedly connected to the free end of the electric push rod, a storage tube fixedly connected to the inside of the connecting frame, a cylinder that passes through the storage tube and is fixedly connected to the storage barrel, a piston fixedly connected to the free end of the cylinder, and a discharge pipe fixedly connected to the bottom of the storage tube, wherein the discharge pipes are evenly arranged.

2. A computer hardware CPU board heat dissipation glue coating device according to claim 1, characterized in that: The coating assembly also includes a sealing head threadedly connected to the lower end of the discharge pipe, a fixed plate fixedly connected to both sides of the storage tube, a sliding column penetrating the fixed plate and slidably connected to the fixed plate, and a spring sleeved on the outer wall of the sliding column, wherein the spring is fixedly connected between the outer wall of the sliding column and the bottom wall of the fixed plate.

3. A computer hardware CPU board heat dissipation glue coating device according to claim 2, characterized in that: The smoothing assembly includes an electric telescopic rod fixedly connected to the middle position of both sides of the fixed frame, a square plate fixedly connected to the free end of the electric telescopic rod, a linear guide rail fixedly installed on the bottom wall of the square plate, a slider slidably set on the linear guide rail, a connecting plate fixedly connected to the bottom wall of the slider, a tower spring fixedly connected to the bottom wall of the connecting plate, an installation frame fixedly connected to the lower end of the tower spring, and a roller rotatably connected between the opposite side walls of the installation frame, and the tower springs are arranged at equal intervals.

4. A computer hardware CPU board heat dissipation glue coating device according to claim 3, characterized in that: The top of the placing table is provided with rubber pads, and the rubber pads are arranged evenly.

5. A computer hardware CPU board heat dissipation glue coating device according to claim 4, characterized in that: The sliding column is arranged in an I-shape, and the installation frame is arranged in a ∩ shape.

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