Wafer edge grinding machine table
By designing an edge grinding machine for LED wafers, the damage caused by residual metal at the edge of the wafer is solved, and an efficient and precise edge grinding process is achieved, which reduces process costs and improves the environmental protection of the process.
Patent Information
- Application Number
- CN202421372227.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-17
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-06-17
AI Technical Summary
In the prior art, LED wafers are prone to residual metals at edges during edge grinding, resulting in high wafer breakage rate and increasing process costs.
A wafer edge grinding machine is designed, including a loading and unloading unit, a box detection device, a pick-up and drop-up device, a rotating device and a grinding head device. Through the combination of the cartridge detection and the pick-up and drop-up device, precise control of the wafer position is achieved. The grinding head device uses a spring microtension mechanism to adjust the contact angle between the grinding head and the wafer to effectively remove residual metal at the edge.
It improves the accuracy of the edge grinding process, reduces wafer damage, reduces production costs, and recovers metal particles through fan filtering devices, improving the environmental protection and efficiency of the process.
Smart Images
Figure CN222644130U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a wafer edge grinding machine. Background Art
[0002] At present, the metal materials used to connect LED chip devices and pads include (Cr, Ti, Al, Ni, Au, Pt and other high work function metals). A layer of photoresist is spin-coated on the surface of the LED wafer, and the designed electrode pattern is transferred to the photoresist through ultraviolet exposure and development technology; some areas on the surface of the LED wafer have photoresist, and some areas do not have photoresist; the above wafer is placed in an electron beam evaporator, and a metal material layer for connection is evaporated; the photoresist area is adhered and removed using a blue film, leaving the designed electrode pattern; since the photoresist in the edge area of the wafer will be removed during the coating and development process, this will cause the electrode metal to be evaporated in the edge area of the wafer where the photoresist is removed after metal evaporation. Since these edge metals are tightly adhered to the wafer, the metal in the edge area of the wafer (i.e., the residual metal at the edge) is not easy to be removed during the process of removing the blue film adhesion, and protruding metal particles are formed on the surface of the wafer, which in turn causes the wafer to be broken by the metal particles in the subsequent thinning and grinding process, increasing the edge breakage or fragmentation rate of the wafer, resulting in an increase in the cost of the wafer process.
[0003] Therefore, there is an urgent need for a device for removing metal from the edge region of the wafer to solve the above problems. Utility Model Content
[0004] The purpose of the present application is to solve the defect of residual metal on the edge of the wafer in the prior art, and to propose a wafer edge grinding machine.
[0005] In order to achieve the above purpose, this application adopts the following technical solutions:
[0006] The present application provides a wafer edge grinding machine, which is used to remove residual metal at the edge of a wafer. The wafer edge grinding machine includes:
[0007] A loading and unloading unit, wherein the loading and unloading unit is used to place a wafer cassette;
[0008] A material box detection device, the material box detection device is arranged on the loading and unloading unit, and the material box detection device is used to detect the placement position of the wafer in the wafer material box;
[0009] A wafer picking and placing device, which is arranged on one side of the loading and unloading unit and is used to absorb wafers from a wafer material box of the loading and unloading unit;
[0010] A rotating device, the rotating device is arranged at one side of the wafer picking and placing device and is used to carry the wafer adsorbed by the wafer picking and placing device and serve as a target wafer, the rotating device comprises an adsorption module and a rotating module, the adsorption module is used to provide a vacuum adsorption force for adsorbing the wafer, and the rotating module is arranged below the adsorption module and is used to provide a rotational driving force for the adsorption module;
[0011] A grinding head device, the grinding head device comprising a grinding head mounting rod, a grinding head body and a spring micro-tension mechanism, the front end of the grinding head mounting rod is connected to the area of the side of the grinding head body away from the target wafer, and the spring micro-tension mechanism is arranged between the grinding head body and the grinding head mounting rod; the grinding head body is used to contact the residual metal on the edge of the target wafer, and the spring micro-tension mechanism is used to adjust the opening angle of the grinding head body relative to the target wafer.
[0012] In some possible implementations, the wafer picking and placing device is an automatic robot, the automatic robot includes a robot arm fork for picking and placing wafers, the robot arm fork includes a suction cup gasket, and the suction cup gasket is used to absorb the wafer.
[0013] In some possible implementations, the rotation module includes a rotation motor and a connecting member, the rotation motor is used to generate a rotational driving force, the connecting member is arranged between the rotation motor and the adsorption module and is used to transmit the rotational driving force to the adsorption module, and the rotation motor is a water-cooled direct-drive motor.
[0014] In some possible implementations, the grinding head device further includes a blowing nozzle, which is disposed at a front end of the grinding head mounting rod and faces a position where the grinding head body contacts the target wafer.
[0015] In some possible implementations, the spring micro-tension mechanism includes a spring and an adjusting screw, and both ends of the spring are clamped and fixed to the grinding head mounting rod and the side area of the grinding head body close to the target wafer; the adjusting screw is used to provide a locking mechanism to fix the compression state of the spring.
[0016] In some possible implementations, the material box detection device includes a micro switch and a laser reflection sensor.
[0017] In some possible implementations, the wafer edge grinding machine further includes a wafer centering device, which is disposed on one side of the wafer pick-up and placement device and is used for centering detection of the wafer picked up by the wafer pick-up and placement device.
[0018] In some possible implementations, the wafer edge grinding machine further includes a fan filter device, which is disposed around the grinding head device and is used to recover metal particles generated by the grinding head device.
[0019] In some possible implementations, the wafer edge grinding machine further includes a control module, and the control module is electrically connected to the material box detection device, the wafer picking and placing device, and the rotating device.
[0020] In some possible implementations, the control module includes a controller and a touch display screen, the controller is electrically connected to the material box detection device, the wafer picking and placing device and the rotating device, and the touch display screen is electrically connected to the controller for displaying the status of the wafer edge grinding machine through a graphical user interface of the touch display screen.
[0021] The beneficial effects of the technical solution provided by the embodiment of the present application are:
[0022] The wafer edge grinding machine provided in the present application can achieve precise control of the wafer position and improve the accuracy of the edge grinding process through the cooperation of the material box detection device and the wafer placement device. By adjusting the grinding head angle, the residual metal on the edge of the wafer can be effectively removed, wafer damage can be reduced, and product yield can be improved. Precise grinding can reduce unnecessary consumption of wafer materials and reduce production costs. The design of the grinding head device allows for quick replacement of the grinding head, which is easy to maintain and adjust to meet different grinding needs.
[0023] To sum up, the wafer edge grinding machine provided in the present application can remove residual metal on the edge of the wafer, avoid the wafer being broken by metal particles in the subsequent thinning and grinding process, reduce the wafer edge breakage or chip breakage rate, and reduce the wafer process cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The present application is further described below in conjunction with the accompanying drawings and embodiments.
[0025] Figure 1 This is a structural block diagram of a wafer edge grinding machine proposed in this application;
[0026] Figure 2 This is a structural block diagram of another wafer edge grinding machine proposed in this application;
[0027] Figure 3 This is a schematic structural diagram of a rotating device and a grinding head device proposed in this application.
[0028] Figure numerals: 100, loading and unloading unit; 200, material box detection device; 300, wafer picking and placing device; 400, rotating device; 500, grinding head device; 600, wafer centering device; 700, fan filter device; 800, control module; 401, adsorption module; 402, rotating module; 501, grinding head mounting rod; 502, spring micro-tension mechanism; 503, grinding head body; 504, blowing nozzle. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.
[0030] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present application. However, it is apparent to one of ordinary skill in the art that these specific details do not need to be adopted to practice the present application. In other embodiments, in order to avoid confusing the present application, well-known structures, materials or methods are not specifically described.
[0031] In the current wet process equipment, during the static wet etching process, the edge area of the wafer is a three-dimensional open solution space, and its effective etching ions exchange with the area to be etched relatively quickly; while the central area of the wafer is a two-dimensional locally restricted solution space, and its effective etching ions exchange with the area to be etched relatively slowly; this will cause the etching speed of the wafer edge area with the same lithography line width to be lower than the etching speed of the wafer center, causing the wafer edge to be over-etched compared to the center, thereby affecting the product yield. The present application designs a wafer edge grinding machine to grind off the evaporated metal (i.e., residual metal at the edge) in the wafer edge area, which can significantly reduce the raised metal particles on the wafer surface, improve the process yield, and reduce the production and manufacturing cost of the wafer;
[0032] Reference Figure 1 , Figure 3 The embodiment of the present application provides a wafer edge grinding machine, which is used to remove residual metal on the edge of a wafer. The wafer edge grinding machine includes:
[0033] A loading and unloading unit 100, wherein the loading and unloading unit 100 is used to place a wafer material box;
[0034] A material box detection device 200, the material box detection device 200 is arranged in the loading and unloading unit 100, and the material box detection device 200 is used to detect the placement position of the wafer in the wafer material box;
[0035] A wafer pick-up and placement device 300, which is disposed at one side of the loading and unloading unit 100 and is used to absorb wafers from a wafer material box of the loading and unloading unit 100;
[0036] A rotating device 400, which is arranged at one side of the wafer picking and placing device 300 and is used to carry the wafer adsorbed by the wafer picking and placing device 300 and serve as a target wafer. The rotating device 400 includes an adsorption module 401 and a rotating module 402. The adsorption module is used to provide a vacuum adsorption force for adsorbing the wafer. The rotating module 402 is arranged below the adsorption module 401 and is used to provide a rotational driving force for the adsorption module 401.
[0037] A grinding head device 500, the grinding head device 500 includes a grinding head mounting rod 501, a grinding head body 503 and a spring micro-tension mechanism 502, the front end of the grinding head mounting rod 501 is connected to the side area of the grinding head body 503 away from the target wafer, and the spring micro-tension mechanism 502 is arranged between the grinding head body 503 and the grinding head mounting rod 501; the grinding head body 503 is used to contact the residual metal on the edge of the target wafer, and the spring micro-tension mechanism is used to adjust the opening angle of the grinding head body relative to the target wafer.
[0038] Thus, through the cooperation of the material box detection device 200 and the wafer placement device 300, the wafer position can be precisely controlled and the accuracy of the edge grinding process can be improved. By adjusting the grinding head angle, the residual metal on the edge of the wafer can be effectively removed, the wafer breakage can be reduced, and the product yield can be improved. Precise grinding can reduce unnecessary consumption of wafer materials and reduce production costs. The design of the grinding head device 500 allows for quick replacement of the grinding head, which is convenient for maintenance and adjustment and can adapt to different grinding needs.
[0039] To sum up, the wafer edge grinding machine provided in the present application can remove residual metal on the edge of the wafer, avoid the wafer being broken by metal particles in the subsequent thinning and grinding process, reduce the wafer edge breakage or chip breakage rate, and reduce the wafer process cost.
[0040] In specific applications, see Figure 2 The wafer edge grinding machine includes multiple sets of rotating devices 400 and grinding head devices 500 (not shown), and each set of rotating devices 400 and grinding head devices 500 respectively implements the wafer edge grinding in the above-mentioned embodiment. In other words, one wafer loading and unloading device 300 can correspond to multiple sets of rotating devices 400 and grinding head devices 500, thereby improving processing efficiency.
[0041] Figure 3The object on the adsorption module 401 is a target wafer, and the grinding head body 503 is used to contact the residual metal on the edge of the target wafer. It can be considered that the grinding head device 500 is movably arranged above the rotating device 400, and the grinding head device 500 includes a lifting mechanism to make the grinding head body 503 close to or away from the rotating device 400. The lifting mechanism is, for example, a pneumatic lifting mechanism, and this application does not limit its selection. Due to the setting of the spring micro-tension mechanism, the opening angle of the grinding head body 503 relative to the target wafer is fixed.
[0042] In specific applications, if the metal residual area is large in some processes, the grinding head angle needs to be adjusted to a large angle to grind off more residual metal; if the metal residual area is small in some processes, the grinding head needs to be adjusted to a small angle to grind off the residual metal in the appropriate area, which can prevent over-grinding or under-grinding and provide a good foundation for the subsequent blue film adhesion process. The contact angle between the grinding head body 503 and the wafer of the wafer edge grinding machine provided by the present application can be defined according to different electrode processes and the degree of residual metal on the edge of the wafer and adjusted by the spring micro-tension mechanism 502.
[0043] As an example, the adsorption module 401 includes a vacuum mechanism, and its vacuum adsorption pressure can be adjusted according to materials of different weights (for example, the vacuum suction cup has a diameter of 50 mm, is made of PPS material, and uses a digital vacuum pressure sensor); the rotation speed in the rotation module 402 can be adjusted and set according to materials of different weights (speed range 0~6000rpm, maximum acceleration 30000rpm / sec, minimum adjustment amount 1rpm, speed accuracy ±1rpm).
[0044] In one embodiment, the wafer picking and placing device 300 is an automatic robot, and the automatic robot includes a robot arm fork for picking and placing wafers, and the robot arm fork includes a suction cup gasket, and the suction cup gasket is used to absorb the wafer.
[0045] The automatic manipulator can be used to automatically pick up and place wafers. The automatic manipulator has high precision and repeatability to ensure the stability and safety of the wafer during handling. The robot arm fork of the end actuator of the automatic manipulator can adopt a five-axis Y-shaped fork design (X1, X2, X3, Z, θ axis) to adapt to complex pick-and-place actions. The end of the robot arm fork is equipped with a suction cup pad, which can use the vacuum adsorption principle to stably adsorb and transport the wafer. The suction cup pad can be adjusted according to the shape and size of the wafer to ensure uniformity and firmness of adsorption.
[0046] During operation, the position information of the wafer is obtained by the material box detection device 200 of the loading and unloading unit 100, and then the wafer is moved by the automatic manipulator, that is, the suction pad of the robot arm fork is used to absorb the wafer. The automatic manipulator moves the wafer to the rotating device 400 for subsequent edge grinding operations.
[0047] As a result, the design of the robot arm fork provides a larger operating range and flexibility, which can adapt to the needs of pick-and-place in different positions and directions, and ensure the precise positioning of the wafer during the pick-and-place process. The suction cup pad can be adjusted according to the physical characteristics of the wafer, suitable for wafers of different sizes, and improve the versatility of the equipment.
[0048] As an example, the material design of the robot arm's fork is aluminum alloy + suction cup gasket, which can be suitable for warped wafers.
[0049] In one embodiment, the rotating module 402 includes a rotating motor and a connecting member, wherein the rotating motor is used to generate a rotating driving force, the connecting member is arranged between the rotating motor and the adsorption module 401 and is used to transmit the rotating driving force to the adsorption module 401, and the rotating motor is a water-cooled direct-drive motor.
[0050] The selection of a direct-drive motor can reduce transmission losses and improve efficiency and response speed. The water-cooling design helps to dissipate heat and maintain the stability of the motor under high load or long-term operation. The connector is arranged between the rotary motor and the adsorption module 401, which transmits the rotational driving force generated by the motor to the adsorption module 401 to ensure that the wafer can rotate stably. The adsorption module 401 may include a plurality of vacuum suction cups for adsorbing and fixing the wafer. When the connector transmits the rotational force to the adsorption module 401, the adsorption module 401 drives the wafer to rotate to achieve the rotational action required in the edge grinding process.
[0051] As a result, the water-cooled direct-drive motor reduces energy loss during the transmission process and improves the efficiency of the overall system. The direct-drive motor can reduce the transmission links and has higher positioning accuracy and repeatability. The water-cooling design effectively controls the temperature of the motor, prevents overheating, and ensures long-term stable operation.
[0052] In summary, the rotation module 402 provides a precise and stable rotation driving force for the wafer edge grinding machine by using a water-cooled direct-drive motor and effective connectors, which helps to improve efficiency.
[0053] In one embodiment, the grinding head device 500 further includes a blowing nozzle 504, which is disposed at the front end of the grinding head mounting rod 501 and faces the position where the grinding head body 503 contacts the target wafer. The pressure of the blowing air in the blowing nozzle 504 can be adjusted.
[0054] The blowing nozzle 504 is arranged at the front end of the grinding head mounting rod 501 and is oriented toward the position where the grinding head body 503 contacts the target wafer, ensuring that the blowing nozzle 504 can directly purge the grinding area. During the grinding process, the grinding head body 503 contacts the residual metal at the edge of the wafer and performs grinding to remove unnecessary materials. The blowing nozzle 504 plays a role in the grinding process by spraying gas (for example, compressed air or inert gas, such as nitrogen) to remove metal debris and dust generated by grinding. The gas sprayed by the blowing nozzle 504 helps to keep the grinding area clean, prevent the accumulation of metal debris and dust, and avoid the accumulation from affecting the grinding quality. The blowing nozzle 504 can be sprayed continuously or intermittently as needed to adapt to different grinding conditions and process requirements.
[0055] Thus, by timely removing the debris generated by grinding, the blowing nozzle 504 helps to keep the grinding head and the wafer surface clean, thereby improving the grinding quality. At the same time, the wear of the grinding head by the debris is reduced, which helps to extend the service life of the grinding head.
[0056] In one embodiment, a negative pressure adsorption barrel for recovering metal dust and particles after edge grinding is also provided under the grinding head device 500. The negative pressure adsorption barrel includes a negative pressure system. After edge grinding, metal particles exist in the surrounding air. At this time, the negative pressure adsorption barrel with negative pressure is connected to the bottom of the edge grinding device. There are several layers of filter nets in the barrel to collect metal particles, which can improve the metal recovery rate in the wafer process and reduce the metal consumption cost.
[0057] In one embodiment, the spring micro-tension mechanism 502 includes a spring and an adjusting screw, and the adjusting screw is used to provide a locking mechanism to fix the compression state of the spring.
[0058] The spring provides an adjustable elastic force in the mechanism, which can apply different amounts of force as needed. The adjusting screw is used to adjust the compression of the spring, thereby changing the amount of force provided by the spring. When the adjusting screw is tightened, the adjusting screw fixes the current compression state of the spring, ensuring that the spring force will not change due to external vibration or impact. During the grinding process, if the grinding head wears and the pressure decreases, the user can change the compression state of the spring by turning the adjusting screw to adjust the force applied by the spring. At the same time, the spring can provide a stable force, even if the wear of the grinding head changes during the grinding process, the spring can maintain a constant pressure
[0059] Thus, the pressure applied to the wafer can be adjusted by adjusting the screw to ensure the consistency and uniformity of the grinding process. The spring micro-tension mechanism 502 can be quickly adjusted according to different process requirements, thereby improving the flexibility and adaptability of the process. In summary, the design of the spring micro-tension mechanism 502 provides a simple, reliable and flexible pressure adjustment solution for the wafer edge grinding machine.
[0060] In one embodiment, the magazine detection device 200 includes a micro switch and a laser reflection sensor. Specifically, the micro switch is used to sense whether the wafer is placed in the wafer magazine, and the laser reflection sensor can obtain the exact position of the wafer in the wafer magazine.
[0061] In one embodiment, the wafer edge grinding machine further includes a wafer centering device 600 , which is disposed on one side of the wafer pick-up and placement device 300 and is used for centering detection of the wafer picked up by the wafer pick-up and placement device 300 .
[0062] The wafer centering device 600 is arranged on one side of the wafer handling device 300 so as to be located on the path of the wafer handling device 300 for handling the wafer. The main function of the wafer centering device 600 is to perform centering detection on the wafer picked up by the wafer handling device 300 to ensure that the wafer placed on the rotating device 400 by the wafer handling device 300 is accurately positioned. The centering device may include an optical sensor for detecting the deviation between the center position and the geometric center of the wafer, thereby ensuring that the wafer is accurately centered during the edge grinding process, thereby improving the edge grinding accuracy.
[0063] As an example, since the geometric center of the wafer may be offset during transportation, the wafer needs to be rotated symmetrically along the center during edge grinding, and the center is aligned before the wafer is placed in the rotating equipment. The wafer alignment device 600 can include a wafer infrared blocking sensor convex edge detection to achieve auxiliary alignment.
[0064] In one embodiment, the wafer edge grinding machine further includes a fan filter device 700, which is disposed around the grinding head device 500 and is used to recover metal particles generated by the grinding head device 500. The fan filter device 700 may be a high-efficiency FFU with integral exhaust.
[0065] In specific applications, in order to reduce the pollution of metal particles to the workshop environment, air supply is designed inside the wafer edge grinding machine. The fan filter device 700 filters the air in the machine, and then discharges the filtered air into the exhaust gas recovery system. The fan filter device 700 includes a three-layer filter mesh, and the filter diameters of the filter mesh are 10μm, 5μm, and 1μm respectively to maintain the cleanliness of the workshop environment of the wafer edge grinding machine.
[0066] In one embodiment, the wafer edge grinding machine further includes a control module 800 , and the control module 800 is electrically connected to the material box detection device 200 , the wafer placement device 300 , and the rotating device 400 .
[0067] In one embodiment, the control module 800 includes a controller and a touch screen, the controller is electrically connected to the magazine detection device 200, the wafer placement device 300 and the rotating device 400, and the touch screen is electrically connected to the controller to display the state of the wafer edge grinding machine through the graphical user interface of the touch screen. The controller obtains the placement of the wafer in the wafer magazine through the magazine detection device 200, controls the wafer placement device 300 to move the wafer, and controls the rotating device 400 to rotate.
[0068] In specific applications, the controller is a PLC programmable controller, which executes process flow writing, process production operations, module status display, and fault prompts on a 15-inch touch screen via a graphical human-machine interface (GUI). The control module 800 can also store parameters such as process programs, production records, fault information, etc., and can also be connected to the CIM (computer integrated manufacturing) system to upload stored data to the remote equipment automation management system (optional), and can be scanned by a barcode gun for production management. Barcodes are provided on materials such as wafers. Using a barcode gun to scan can quickly identify the identity information of the wafer, automatically record key data in the production process, and improve the efficiency and accuracy of production management. Using the wafer edge grinding machine provided in this application, the wafer after edge grinding can be cleaned of metal in the excess area of the wafer surface by a subsequent blue film adhesion, without the need for repeated blue film adhesion, saving production time and reducing wafer production costs.
[0069] The above is only a preferred specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent substitutions or changes within the technical scope disclosed in the present application according to the technical solution and application concept of the present application, which should be covered by the protection scope of the present application.
Claims
1. A wafer edge grinding machine, characterized in that: The wafer edge grinding machine is used to remove residual metal from the edge of the wafer, and the wafer edge grinding machine includes: A loading and unloading unit, wherein the loading and unloading unit is used to place a wafer cassette; A material box detection device, the material box detection device is arranged on the loading and unloading unit, and the material box detection device is used to detect the placement position of the wafer in the wafer material box; A wafer picking and placing device, the wafer picking and placing device is arranged on one side of the loading and unloading unit, and the wafer picking and placing device is used to absorb wafers from a wafer material box of the loading and unloading unit; A rotating device, the rotating device is arranged at one side of the wafer picking and placing device and is used to carry the wafer adsorbed by the wafer picking and placing device and serve as a target wafer, the rotating device comprises an adsorption module and a rotating module, the adsorption module is used to provide a vacuum adsorption force for adsorbing the wafer, and the rotating module is arranged below the adsorption module and is used to provide a rotational driving force for the adsorption module; A grinding head device, the grinding head device comprises a grinding head mounting rod, a grinding head body and a spring micro-tension mechanism, the front end of the grinding head mounting rod is connected to the area of the side of the grinding head body away from the target wafer, and the spring micro-tension mechanism is arranged between the grinding head body and the grinding head mounting rod; the grinding head body is used to contact the residual metal on the edge of the target wafer, and the spring micro-tension mechanism is used to adjust the opening angle of the grinding head body relative to the target wafer.
2. The wafer edge grinding machine according to claim 1, characterized in that: The wafer picking and placing device is an automatic robot, which includes a robot arm fork for picking and placing wafers, and the robot arm fork includes a suction cup gasket, which is used to absorb the wafer.
3. The wafer edge grinding machine according to claim 1, characterized in that: The rotating module includes a rotating motor and a connecting member, wherein the rotating motor is used to generate a rotating driving force, the connecting member is arranged between the rotating motor and the adsorption module and is used to transmit the rotating driving force to the adsorption module, and the rotating motor is a water-cooled direct-drive motor.
4. The wafer edge grinding machine according to claim 1, characterized in that: The grinding head device also includes a blowing nozzle, which is arranged at the front end of the grinding head mounting rod and faces the position where the grinding head body contacts the target wafer.
5. The wafer edge grinding machine according to claim 1, characterized in that: The spring micro-tension mechanism includes a spring and an adjusting screw. The two ends of the spring are clamped and fixed to the grinding head mounting rod and the side area of the grinding head body close to the target wafer; the adjusting screw is used to provide a locking mechanism to fix the compression state of the spring.
6. The wafer edge grinding machine according to claim 1, characterized in that: The material box detection device includes a micro switch and a laser reflection sensor.
7. The wafer edge grinding machine according to claim 1, characterized in that: The wafer edge grinding machine further comprises a wafer centering device, which is arranged at one side of the wafer picking and placing device and is used for centering detection of the wafer picked up by the wafer picking and placing device.
8. The wafer edge grinding machine according to claim 1, characterized in that: The wafer edge grinding machine also includes a fan filter device, which is arranged around the grinding head device and is used to recover metal particles generated by the grinding head device.
9. The wafer edge grinding machine according to claim 1, characterized in that: The wafer edge grinding machine further comprises a control module, and the control module is electrically connected to the material box detection device, the wafer picking and placing device and the rotating device.
10. The wafer edge grinding machine according to claim 9, characterized in that: The control module includes a controller and a touch screen, the controller is electrically connected to the material box detection device, the wafer placement device and the rotating device, and the touch screen is electrically connected to the controller for displaying the status of the wafer edge grinding machine through a graphical user interface of the touch screen.