Polishing pad and chemical mechanical polishing equipment

By designing the abrasive liquid storage chamber structure and impurity storage chamber structure on the abrasive pad, the hard friction between the wafer and the abrasive pad and the agglomeration of impurity particles during the chemical mechanical polishing process is solved, and the effect of improving product yield and effectively removing impurities is achieved.

CN222644177UActive Publication Date: 2025-03-21SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
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Patent Information

Application Number
CN202420684712.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-03
Publication Date
2025-03-21
Estimated Expiration
2034-04-03

AI Technical Summary

Technical Problem

During the chemical mechanical polishing process, due to centrifugal force and grinding heat generation, hard friction is easily generated between the wafer and the grinding pad, and the agglomeration of abrasive particles leads to scratches in the wafer, affecting the yield.

Method used

An abrasive pad is designed, which includes a grinding liquid storage cavity structure and an impurity storage cavity structure. The abrasive liquid storage chamber structure is formed through the gaps of the sub-grinding convex ribs, which can release the abrasive liquid when the wafer comes into contact with the abrasive pad, wetting the wafer and reducing hard friction. The impurity storage cavity structure is formed by the dorsal gap of the sub-grinding convex ribs, which can collect impurity particles generated by the grinding to avoid contact with the wafer.

Benefits of technology

By increasing the supply of abrasive fluid between the wafer and the abrasive pad, reducing hard friction, and improving product yield. At the same time, it effectively collects and removes impurity particles to prevent their agglomeration and cause wafer scratches.

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Abstract

The utility model provides a grinding pad and chemical mechanical polishing equipment. The grinding pad comprises a base and a plurality of grinding ribs arranged in the radius direction of the base. Each grinding rib comprises two sub-grinding ribs, the two sub-grinding ribs in any grinding rib are oppositely arranged in a spaced mode and define a grinding liquid storage cavity structure with the base, and the two adjacent sub-grinding ribs in the adjacent grinding ribs are oppositely arranged in a spaced mode and define an impurity storage cavity structure with the base; wafer scraping fins used for making contact with a wafer are arranged at the tops of the sub grinding protruding edges, and the wafer scraping fins are extruded by the wafer to extend towards the impurity entering part of the impurity storage cavity structure so as to push impurities into the impurity storage cavity structure. According to the utility model, hard friction between the wafer and the wafer scraping fins is avoided, the product yield is improved, and impurity particles generated by grinding can be pushed and collected in the impurity storage cavity structure, so that the impurity particles generated by grinding are prevented from being in contact with the wafer, and the wafer is prevented from being scratched due to aggregation of the impurity particles.
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