Device capable of freely adjusting mold pressing thickness
By setting a variable height pad frame inside the lower mold of the molding device, free adjustment of the mold thickness is achieved, and the problem of difficult adjustment of the mold thickness in the prior art is solved, reducing the cost of mold replacement and improving production efficiency.
Patent Information
- Application Number
- CN202421371323.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-17
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-06-17
AI Technical Summary
In the existing molding packaging process, once the molding thickness is fixed, it is difficult to readjust, resulting in the need to replace the mold when facing different product specifications or customer needs, which increases costs and R&D risks.
A device including an upper mold and a lower mold is designed. A pad frame with variable height is arranged inside the lower mold, and the pad frame is detachably connected to the lower mold. It can replace the pad frame of the corresponding thickness or adjust the pad frame height according to different workpieces to be molded to achieve free adjustment of the mold thickness.
The mold thickness can be adjusted without reopening the mold, which significantly saves costs, improves production efficiency, and meets the diverse needs of Mini LED products.
Smart Images

Figure CN222645096U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of molding, and in particular relates to a device capable of freely adjusting the thickness of molding. Background Art
[0002] With the rapid development of display technology, Mini LED has become an innovative backlight and direct display solution with its high brightness, high contrast, high dynamic range and fine partitioning. Among them, Chip-on-Board (COB) packaging technology has become a mainstream packaging method in the Mini LED industry due to its many advantages.
[0003] The industry has developed two mainstream methods for whole-board packaging after COB product bonding. One is to use dispensing technology, that is, to accurately apply packaging glue in the gaps between pixels, and to build a chip wrapping and protection layer by curing the colloid. This method relies on precise dispensing equipment and colloid formulas. The advantage is that it can achieve localized fine packaging and adapt to Mini LED arrays with complex shapes and high density arrangements. However, the process is relatively complex, and strict requirements are placed on dispensing accuracy, glue quantity control, and curing conditions. In addition, production efficiency is limited by dispensing speed.
[0004] Another method is to perform one-time compression molding of the entire board through a fixed mold cavity. This packaging method is based on the cooperation of the upper and lower mold cavities, and applies pressure to the entire Mini LED substrate after bonding, so that the packaging material (such as silicone, epoxy resin, etc.) pre-filled in the mold cavity is evenly filled into the space around the chip to form a continuous and flat packaging layer. Compression molding has the advantages of simple process, high efficiency, and good packaging consistency. It is especially suitable for large-area, low-complexity Mini LED panel packaging.
[0005] During the molding process, the design and production of the cavity structure have a significant impact on the final packaging effect. The cavity is usually divided into two parts: the upper cavity and the lower cavity. The main functions of the upper cavity include avoiding the air drive surface to ensure that the sensitive drive circuit is not damaged during molding, and through the surface design of the flat lamp board, to ensure that there are no bubbles or gaps between the substrate and the chip surface and the cavity during molding, to ensure good filling of the packaging material. The lower cavity is mainly responsible for controlling the molding thickness. Its depth determines the final thickness of the packaging layer, which directly affects the optical performance, heat dissipation performance and overall thickness control of the Mini LED product.
[0006] However, the existing compression molding process faces a key problem: once the upper and lower mold cavities are opened, the compression molding thickness is fixed. If the compression molding thickness needs to be modified to adapt to different product specifications or customer needs, the mold must be re-opened. The mold manufacturing cost is high, especially for the high-precision molds required for Mini LED packaging, the production cost is often close to 10,000 yuan or even higher. This high mold replacement cost not only limits production flexibility and increases the economic risk of developing new products, but also becomes one of the bottlenecks restricting the further development of Mini LED COB packaging technology in the context of rapid changes in market demand or frequent product iterations.
[0007] Prior art CN 215969737 U discloses a compression molding combination mold, which can adjust the size of the mold cavity by moving part of the side mold through the compression molding combination mold, so as to adapt to the compression molding processing requirements of parts of different sizes, without the need to equip a set of compression molding molds for each size of parts. However, the prior art does not provide any inspiration for directly changing the compression molding thickness.
[0008] Therefore, it is urgent to develop a new packaging device and method that can freely adjust the molding thickness and reduce the mold replacement cost to meet the diversified needs of Mini LED products. Utility Model Content
[0009] A technical problem to be solved by the utility model is to provide a device capable of freely adjusting the mold thickness. When the mold thickness needs to be modified, there is no need to open a new set of molds, which can improve the manufacturing cost and simplify the mold installation process.
[0010] In order to solve the above-mentioned technical problems, the utility model provides, on the one hand, a device capable of freely adjusting the molding thickness, wherein the device comprises an upper mold and a lower mold, which together form a mold cavity when buckled together, and a gasket frame abuts against the peripheral wall of the lower mold, and the gasket frame is detachably connected to the lower mold, wherein: the device is configured to be able to replace the gasket frame of corresponding thickness based on different workpieces to be molded; or the gasket frame is a gasket frame of variable height.
[0011] In some embodiments, the variable height cushion frame includes a bottom frame and a heightening unit; the bottom frame has a stable planar base and a joint surface for supporting and fixing the heightening unit; the heightening unit includes a heightening gasket or a heightening assembly; the heightening gasket is a stacked structure of one or more pieces, and the heightening gasket is connected to the joint surface through a first fixed structure; the heightening assembly includes at least two independent and vertically stackable heightening frames, each heightening frame is provided with a mutually adaptable connection structure, and the heightening assembly is connected to the joint surface through a second fixed structure.
[0012] In some embodiments, the variable height gasket frame further includes one or more first through holes penetrating each height-increasing gasket, and a second through hole adapted to the first through hole is provided on the joint surface, and the first through hole and the second through hole are connected by a first bolt.
[0013] In some embodiments, the heightening frame includes a first heightening frame and a second heightening frame, and the connecting structure between the first heightening frame and the second heightening frame includes one or more first grooves arranged along the bottom vertical edge of the first heightening frame, and one or more first protrusions matching the grooves arranged at the top of the second heightening frame.
[0014] In some embodiments, the first fixing structure includes one or more second protrusions disposed on the bottom edge of the heightened pad connected to the joint surface, and one or more second grooves disposed on the joint surface to fit the second protrusions.
[0015] In some embodiments, a first magnetic region is also provided at the bottom of the heightened gasket adjacent to the bottom frame, the first magnetic region includes a magnetic material, the first fixed structure includes a second magnetic region provided on the top of the joint surface and adapted to and attracted to the first magnetic region, the second magnetic region includes a magnetic material adapted to and able to attract the first magnetic region.
[0016] In some embodiments, the second fixing structure includes one or more third protrusions disposed on the bottom edge of the height-enhancing component connected to the joint surface, and one or more third grooves disposed on the joint surface to fit the third protrusions.
[0017] In some embodiments, the cushion frame further includes a sealing structure, which is disposed at a lower portion of the cushion frame and abuts against the peripheral wall.
[0018] In some embodiments, the upper mold and the lower mold are connected by two oppositely arranged guide columns, a track is provided on the guide column, a slide groove adapted to the track is provided on the side of the upper mold, and the cushion frame is connected to the lower mold by a second bolt.
[0019] In some embodiments, a vacuum adsorption component is disposed at the bottom of the upper mold.
[0020] The beneficial effects of the utility model include at least:
[0021] The device of the utility model realizes flexible adjustment of the molding thickness by setting a cushion frame inside the lower mold of the device, solving the problem that it is difficult to change the molding thickness in traditional molding packaging. When the molding thickness needs to be modified, there is no need to open a new set of molds, which significantly saves costs and further improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 Shows a schematic side cross-sectional view of some molding devices in the prior art;
[0024] Figure 2 It shows the overall side cross-sectional schematic diagram of the device capable of freely adjusting the molding thickness provided in some embodiments of the utility model;
[0025] Figure 3 It shows a schematic cross-sectional view of the lower die side of the device capable of freely adjusting the molding thickness provided in some embodiments of the utility model;
[0026] Figure 4 A schematic side cross-sectional view of the lower mold side wall in some embodiments of the utility model is shown;
[0027] Figure 5 It shows a vertical side cross-sectional view of the entire cushion frame when the cushion frame in some embodiments of the utility model is formed by stacking heightened cushion sheets;
[0028] Figure 6 It shows a vertical side cross-sectional view of the cushion frame as a whole when the cushion frame in some embodiments of the utility model is formed by stacking heightening components;
[0029] Figure 7a A top view of a heightened gasket including a first magnetic region in some embodiments of the present invention is shown;
[0030] Figure 7b A side view of a heightened gasket including a first magnetic region and a second magnetic region in some embodiments of the present invention is shown.
[0031] Description of reference numerals:
[0032] 1. Upper mold; 2. Workpiece; 3. Glue; 4. Lower mold; 401. Part of the side wall; 5. Guide column; 6. Gasket frame; 7. Sealing structure; 601. Bottom frame; 602. Heightening unit; 6020. Heightening gasket; 6021. First fixing structure; 6022. First through hole; 6023. Second through hole; 6024. First bolt; 6025. First heightening frame; 6026. Second heightening frame; 6027. Second fixing structure; 6028. First magnetic region; 6029. Second magnetic region. DETAILED DESCRIPTION
[0033] The following is a further detailed description of the implementation of the utility model in conjunction with the accompanying drawings and examples. The detailed description of the following examples and the accompanying drawings are used to exemplarily illustrate the principles of the utility model, but cannot be used to limit the scope of the utility model. The utility model can be implemented in many different forms and is not limited to the specific embodiments of the utility model in the text, but includes all technical solutions that fall within the scope of the claims.
[0034] The utility model provides these embodiments to make the utility model thorough and complete, and fully express the scope of the utility model to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components described in these embodiments should be interpreted as merely exemplary, rather than as a limitation.
[0035] It should be noted that, in the description of the present invention, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0036] In addition, the use of “include” or “comprises” and other similar words in the present invention means that the elements before the word include the elements listed after the word, and does not exclude the possibility of also including other elements.
[0037] It should also be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.
[0038] All terms used in the present invention have the same meanings as those understood by ordinary technicians in the field to which the present invention belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.
[0039] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.
[0040] like Figure 2 As shown, in some embodiments, the utility model provides a device capable of freely adjusting the molding thickness, the device comprising an upper mold 1 and a lower mold 4 having a cushion frame 6 with a variable height disposed therein (the structure of the lower mold 4 is further shown in Figure 3 As shown in the figure), the upper mold 1 and the lower mold 4 are buckled together to form a mold cavity, and the variable height cushion frame 6 is in contact with the peripheral wall of the lower mold 4, and the variable height cushion frame 6 is detachably connected to the lower mold 4, wherein: the device is configured to be able to replace the cushion frame 6 of corresponding thickness based on different workpieces to be molded; or the cushion frame 6 is a cushion frame of variable height.
[0041] Figure 1 The figure is a schematic side cross-sectional view of some molding devices in the prior art. The improvement of the utility model is to increase the size of the cavity of the lower mold 4 so that the cushion frame 6 can be placed therein. When the molding thickness needs to be changed, the cushion frame 6 that reaches the target height can be directly replaced, or the height of the cushion frame 6 can be directly adjusted, avoiding the need to disassemble the entire mold. The cushion frame 6 included in the device of the utility model is connected to the lower mold 4 in a detachable manner, which is convenient for replacing cushion frames 6 of different thicknesses as needed to achieve free adjustment of the molding thickness. The molding thickness can be adjusted by directly replacing cushion frames 6 of different heights. For example, when a molding thickness of 0.5 mm is required, only a cushion frame 6 of 0.5 mm needs to be replaced and placed in the cavity position of the lower mold 4 to change the molding thickness. The utility model realizes flexible adjustment of the molding thickness and solves the problem that it is difficult to change the molding thickness in traditional molding packaging. When faced with the need to modify the molding thickness, there is no need to open a new set of molds, which significantly saves costs and further improves production efficiency.
[0042] In some embodiments, the device described in the utility model may include a plurality of cushion frames 6 of different thicknesses. According to actual needs (for example, based on different workpieces to be molded), cushion frames 6 of different thicknesses can be selected and placed in the lower mold 4, thereby achieving flexible adjustment of the molding thickness.
[0043] In some embodiments, the device described in the utility model may include, for example, only one cushion frame 6, and the cushion frame 6 is a cushion frame with a variable height. The cushion frame with a variable height may include a bottom frame 601, a height increasing unit 602 (such as Figure 5 and Figure 6 As shown); the bottom frame 601 has a stable flat base and a joint surface for supporting and fixing the heightening unit 602; the heightening unit 602 includes a heightening gasket 6020 ( Figure 5 shown) or heightened components ( Figure 6As shown); the heightening gasket 6020 is a stacked structure of one or more pieces, and the heightening gasket 6020 is connected to the joint surface through a first fixed structure 6021; the heightening component includes at least two independent and vertically stackable heightening frames, each heightening frame is provided with a mutually adaptable connection structure, and the heightening component is connected to the joint surface through a second fixed structure 6027. The utility model can adjust the height of the gasket frame 6 by adjusting the heightening unit 602. The detachable variable height gasket frame design of the utility model can flexibly adjust the molding thickness. It is not necessary to re-open the mold to meet the product specifications or process requirements of different mold thickness requirements, which greatly reduces the film pressing cost. It should be understood that, as needed, the device described in the utility model can include multiple variable height gasket frames.
[0044] In order to ensure that the heightening gasket 6020 does not move during operation, a plurality of heightening gaskets 6020 may be fixed by a first bolt 6024. Specifically, one or more first through holes 6022 (such as Figure 5 As shown in FIG. 6 , a second through hole 6023 adapted to the first through hole 6022 is provided on the joint surface, and the first through hole 6022 and the second through hole 6023 are connected by a first bolt 6024. This can not only ensure that each heightening gasket 6020 does not move, but also ensure that each heightening gasket 6020 can be disassembled as needed.
[0045] like Figure 6 As shown, the heightening frame includes a first heightening frame 6025 and a second heightening frame 6026, and the connection structure between the first heightening frame 6025 and the second heightening frame 6026 includes one or more first grooves arranged along the bottom vertical edge of the first heightening frame 6025, and one or more first protrusions adapted to the grooves arranged on the top of the second heightening frame 6026. The heightening frames are connected by the cooperation of the first grooves and the first protrusions. This design not only realizes the rapid and accurate positioning and assembly between the heightening frames, but also facilitates the flexible adjustment of the number of layers of the heightening frames according to needs, thereby achieving the free adjustment of the molded thickness, and improving the applicability and convenience of operation of the device.
[0046] In order to prevent the heightening gasket 6020 and the bottom frame 601 from shifting during use, the first fixing structure 6021 is set as a concave-convex structure. Specifically, the first fixing structure 6021 includes one or more protrusions arranged on the bottom edge of the heightening gasket 6020 connected to the joint surface, and a groove arranged on the joint surface to match the protrusion. This design not only ensures the stability and reliability of the heightening gasket 6020 during use and prevents displacement due to external forces, but also simplifies the installation and replacement steps of the heightening gasket 6020 and improves the overall stability of the device. In addition, the protrusions and grooves can be set to corresponding wedges as needed to further increase stability.
[0047] In addition, the height-increasing gasket 6020 and the bottom frame 601 can also be connected via a magnetic attraction structure (such as Figure 7a and Figure 7b As shown in the structure of FIG. 6 ), a first magnetic region 6028 is also provided at the bottom of the heightened gasket 6020 adjacent to the bottom frame 601. The first magnetic region 6028 includes a magnetic material, and the first fixing structure 6021 includes a second magnetic region 6029 provided on the top of the joint surface and adapted to and attracted to the magnetic region. The natural attraction of the magnetic material is used to achieve a firm fixation of the heightened gasket 6020, which not only enhances the connection strength between the heightened gasket 6020 and the joint surface of the bottom frame 601, but also eliminates the need for additional mechanical fastening, reduces assembly complexity, and facilitates quick adjustment and maintenance.
[0048] The joint surface of the height-increasing component and the bottom frame 601 is connected by a second fixing structure 6027, which includes one or more protrusions arranged on the bottom edge of the height-increasing component, and a groove arranged on the joint surface to fit the protrusion. The second fixing structure 6027 ensures the accuracy and durability during the height adjustment process, adapts to the requirements of different molding depths, and improves the flexibility and durability of the device.
[0049] The cushion frame 6 also includes a sealing structure 7 (such as Figure 2 As shown in ), the sealing structure 7 is arranged at the lower part of the cushion frame 6 and abuts against the peripheral wall. The sealing structure 7 can be a rubber sealing ring, and its main function is to ensure the sealing of the mold cavity during the molding process. When the upper mold 1 is buckled with the lower mold 4, the sealing structure 7 strictly seals the contact part between the gasket and the lower mold 4. The cushion frame 6 and the peripheral wall are tightly abutted through the sealing structure 7, which effectively prevents leakage problems when the mold is working and prevents the molding material (such as glue 3, resin, etc.) from overflowing the mold cavity during the curing process. The quality and consistency of the molded products are improved, and the sealing and production efficiency of the products are significantly improved.
[0050] The upper die 1 and the lower die 4 are connected by two guide posts 5 arranged opposite to each other, and a track is arranged on the guide post 5, and a slide groove adapted to the track is arranged on the side of the upper die 1. This design ensures the precise alignment and smooth movement of the upper die 1 and the lower die 4, reduces the deviation during the operation, improves the precision and repeatability of the compression molding, simplifies the operation process, and enhances the stability and reliability of the equipment.
[0051] The slide groove of the upper mold 1 cooperates with the track on the guide column 5. The specific process is as follows: when the upper mold 1 is raised or lowered, the slide groove slides along the track, and the lifting and lowering action of the upper mold 1 is mainly powered by an external driving mechanism (such as a hydraulic cylinder, a cylinder, an electric push rod, etc.), and the driving mechanism is fixedly connected to the slide groove of the upper mold 1 through a connecting piece. In some embodiments, the external driving structure is a cylinder. When the upper mold 1 is connected to the cylinder, the cylinder includes a cylinder body, a piston rod, an air inlet and an exhaust port. The air inlet is connected to the air source, and the cylinder body is divided into a rodless cavity and a rod cavity by the piston rod. The air inlet and the exhaust port are arranged in the rodless cavity of the cylinder body. The bottom of the cylinder is connected to the lower mold 4, and the telescopic rod is connected to the slide groove.
[0052] The driving device is powered by an air source (usually compressed air). Valves are installed on the air inlet and exhaust ports of the cylinder, respectively. The valves control the opening and closing of the air inlet and exhaust ports of the cylinder to realize the telescopic movement of the cylinder piston rod. When the valve opens the air inlet of the cylinder, compressed air enters the rodless chamber of the cylinder, pushing the piston rod outward. The piston rod drives the upper mold 1 to slide upward along the track of the guide column 5 through the slide. When the slide reaches the height of the end of the track, the air inlet valve of the cylinder is closed to stop the upper mold 1 from continuing to rise. Similarly, when the upper mold 1 needs to be lowered, the air inlet of the rodless chamber of the cylinder is closed, and the exhaust port is opened at the same time to discharge the compressed air in the rodless chamber. The piston that loses pressure support drives the piston rod to retract inward under the action of the gravity of the cylinder to complete the rise and fall of the upper mold 1.
[0053] The upper mold 1 achieves smooth and precise lifting or lowering action with the help of an external driving mechanism through precise cooperation with the guide column 5, the track, and the slide groove, which not only ensures the precise alignment and guidance of the upper mold 1 and the lower mold 4 during the molding process, but also simplifies the device structure and improves the stability of equipment operation and the convenience of maintenance.
[0054] In order to facilitate the detachability of the cushion frame 6, in some embodiments, the cushion frame 6 is connected to the lower mold 4 by a second bolt, which makes it easier to replace cushion frames 6 of different thicknesses, while also fixing the cushion frame 6 well.
[0055] In order to protect the workpiece 2, in some embodiments, a vacuum adsorption component is provided at the bottom of the upper mold 1. The provision of the vacuum adsorption component can prevent this area from directly participating in the molding process, thereby protecting the driving surface from wear or damage. By means of vacuuming, a negative pressure area is formed on the upper film, and the workpiece 2 is firmly adsorbed on a specific area of the upper mold 1, ensuring that the lamp board remains in a stable state during the molding process, ensuring the molding quality, simplifying the operation process, and improving production efficiency.
[0056] The sealing structure 7 is an elastic sealing ring that can tighten the variable height gasket frame 6. The elastic sealing ring of the utility model has elasticity and resilience, and fits tightly on the contact surface of the variable height gasket frame 6 and the lower mold 4 or other related parts to form an effective sealing barrier. It can prevent the glue 3 material in the mold cavity from leaking during the molding process, and at the same time prevent external air, impurities, etc. from entering the mold cavity during the molding process, ensuring that the curing environment of the glue 3 is clean. In addition, the elastic sealing ring of the utility model can absorb part of the force when under pressure, play a role in buffering and shock absorption, reduce the mechanical impact between the variable height gasket frame 6 and the lower mold 4 during the molding process, help protect the mold structure, extend its service life, and help maintain the smooth progress of the molding process. The elastic sealing ring is a rubber material, such as nitrile rubber, ethylene propylene rubber, silicone rubber, fluororubber or polytetrafluoroethylene.
[0057] The outer contour of the lower mold 4 is not particularly limited as long as the inner wall of the lower mold 4 fits the cushion frame 6. In some embodiments, the side cross-sectional shape of the local 401 of the side wall of the lower mold 4 is any one of a right angle, an oblique angle, a sharp angle or an arc.
[0058] In order to further illustrate the device of the utility model, the following method for using the device of the utility model is provided, and the steps are as follows: (a) using the aforementioned device, the cushion frame 6 is installed inside the lower mold 4; (b) the workpiece 2 is adsorbed on the vacuum adsorption component; (c) glue 3 is added to the inner cavity of the lower mold 4; (d) the upper mold 1 and the lower mold 4 are buckled together; (e) waiting for the glue 3 to solidify; (f) the upper mold 1 is lifted along the guide column 5 to break the vacuum of the vacuum adsorption component; (g) the workpiece 2 is taken out.
[0059] The method for freely adjusting the molding thickness based on the utility model can quickly adjust the product specifications without replacing the entire set of molds, thereby increasing the flexibility of the molding process. By replacing the corresponding height of the cushion frame 6 or setting a corresponding height of the variable height cushion frame, the different heights of the cushion frame 6 can be flexibly achieved. The elastic sealing ring provided under the cushion frame 6 absorbs the stress during the molding process, reducing the direct impact on the lower mold 4. In addition, the vacuum adsorption component in the aforementioned device avoids the hard contact between the workpiece 2 and the mold, which helps to protect the mold and extend its service life.
[0060] The height-variable cushion frame 6 is made of metal or diamond material, or other hard and corrosion-resistant raw materials, such as organic high molecular polymers with high hardness.
[0061] The device of the utility model can be applied in the COB packaging process of mini LED. In the face of the demand for products of different specifications in the field of Mini LED, the method based on the device of the utility model is applied to the COB packaging process of Mini LED, which can quickly adjust the packaging thickness without frequent mold replacement, greatly enhancing the adaptability of the packaging production line, shortening the production cycle of new products, significantly improving the flexibility, quality and efficiency of packaging, and promoting the development of Mini LED technology.
[0062] So far, various embodiments of the present invention have been described in detail. Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.
Claims
1. A device capable of freely adjusting the molding thickness, characterized in that: The device comprises an upper die (1) and a lower die (4) having a cushion frame (6) disposed therein, wherein the upper die (1) and the lower die (4) are buckled together to form a die cavity, the cushion frame (6) abuts against the peripheral wall of the lower die (4), and the cushion frame (6) and the lower die (4) are detachably connected, wherein: the device is configured to be able to replace the cushion frame (6) of corresponding thickness based on different workpieces to be molded; or the cushion frame (6) is a cushion frame of variable height.
2. The device according to claim 1, characterized in that The variable height cushion frame comprises a bottom frame (601) and a height-increasing unit (602); the bottom frame (601) has a stable planar base and a joint surface for supporting and fixing the height-increasing unit (602); the height-increasing unit (602) comprises a height-increasing gasket (6020) or a height-increasing assembly; the height-increasing gasket (6020) is a stacked structure of one or more pieces, and the height-increasing gasket (6020) is connected to the joint surface via a first fixing structure (6021); the height-increasing assembly comprises at least two independent height-increasing frames that can be stacked in a vertical direction, each height-increasing frame is provided with a mutually adaptable connection structure, and the height-increasing assembly is connected to the joint surface via a second fixing structure (6027).
3. The device according to claim 2, characterized in that The variable height gasket frame further comprises one or more first through holes (6022) penetrating each of the height-increasing gaskets (6020), and the joint surface is provided with a second through hole (6023) adapted to the first through hole (6022), and the first through hole (6022) and the second through hole (6023) are connected by a first bolt (6024).
4. The device according to claim 2, characterized in that The height-enhancing frame comprises a first height-enhancing frame (6025) and a second height-enhancing frame (6026), wherein the connection structure between the first height-enhancing frame (6025) and the second height-enhancing frame (6026) comprises one or more first grooves arranged along the bottom vertical edge of the first height-enhancing frame (6025), and one or more first protrusions adapted to the grooves arranged at the top of the second height-enhancing frame (6026).
5. The device according to claim 2, characterized in that The first fixing structure (6021) comprises one or more second protrusions arranged on the bottom edge of the height-enhancing gasket (6020) connected to the joint surface, and one or more second grooves arranged on the joint surface to fit the second protrusions.
6. The device according to claim 2, characterized in that A first magnetic region (6028) is also provided at the bottom of the heightened gasket (6020) adjacent to the bottom frame (601), the first magnetic region (6028) comprising a magnetic material, the first fixed structure (6021) comprising a second magnetic region (6029) arranged at the top of the joint surface and adapted to and attracted to the first magnetic region (6028), the second magnetic region (6029) comprising a magnetic material adapted to and able to attract the first magnetic region (6028).
7. The device according to claim 2, characterized in that The second fixing structure (6027) comprises one or more third protrusions arranged on the bottom edge of the height-enhancing component connected to the joint surface, and one or more third grooves arranged on the joint surface to fit the third protrusions.
8. The device according to claim 1, characterized in that The cushion frame (6) further comprises a sealing structure (7), wherein the sealing structure (7) is arranged at the lower part of the cushion frame (6) and abuts against the peripheral wall.
9. The device according to claim 1, characterized in that The upper die (1) and the lower die (4) are connected via two guide columns (5) arranged opposite to each other, a track is arranged on the guide column (5), a slide groove adapted to the track is arranged on the side of the upper die (1), and the cushion frame (6) is connected to the lower die (4) via a second bolt.
10. The device according to claim 1, characterized in that A vacuum adsorption component is provided at the bottom of the upper mold (1).
Citation Information
Patent Citations
Mould pressing combined mould and composite material bottom plate
CN215969737U