Heat dissipation structure for LED lamp strip

Abstract

The utility model discloses a heat dissipation structure for a light-emitting diode (LED) lamp strip, which is used for the LED lamp strip with a shell. The heat dissipation structure comprises an I-shaped heat dissipation sheet arranged on the lower portion of the shell, a protrusion arranged at the position, close to the side face, of the bottom of an inner cavity of the shell, a through hole formed in a substrate and a heat dissipation patch arranged below the substrate. According to the heat dissipation structure for the LED lamp strip, the base plate and the shell are separated, the cavity is formed in the shell, heat dissipation is facilitated, the heat dissipation capacity is improved by arranging the discontinuous heat dissipation fins, meanwhile, holes do not need to be formed in the shell, the protection effect of the shell is not affected, and meanwhile due to the adoption of discontinuous arrangement, the heat dissipation efficiency is improved. And the influence on the bending performance of the LED lamp strip is small.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp accessories, in particular to a heat dissipation structure for an LED light strip. Background Art

[0002] LEDs, especially high-power LEDs, generate a lot of heat during operation. If the heat cannot be dissipated in a timely and effective manner, the LED will overheat, thus affecting its life and performance. The heat dissipation structure can effectively help the LED dissipate heat and improve its service life and performance. Currently commonly used heat dissipation structures such as heat sinks, heat fins, and heat pipes are not suitable for light strips. In addition, most LED light strips are flexible structures, and the heat dissipation structure should minimize the impact on the bending performance of the LED light strip. In addition, while improving the heat dissipation capacity, some solutions are achieved by opening holes in the outer shell, and the holes in the outer shell will affect the protection of the internal substrate and LED patches. Utility Model Content

[0003] The purpose of the utility model is to provide a heat dissipation structure for an LED light strip to solve the problems existing in the prior art.

[0004] In order to achieve the above-mentioned purpose, the technical solution of the utility model provides a heat dissipation structure for an LED light strip, which is used for an LED light strip with a shell, wherein the LED light strip includes a substrate, an LED patch, and a shell, wherein the patch is arranged on the substrate, and the substrate and the LED patch are arranged in an internal cavity of the shell, and is characterized in that the heat dissipation structure includes an I-shaped heat sink, which is arranged at the lower part of the shell, and includes an upper surface, a lower surface, and an intermediate connecting plate, wherein the upper surface and the lower surface are respectively located on the upper and lower sides of the bottom surface of the lower shell, and the intermediate connecting plate passes through the two ends of the bottom surface of the shell and is respectively connected to the upper surface and the lower surface.

[0005] Preferably, the I-shaped heat sinks are arranged discontinuously, including multiple groups of I-shaped heat sinks.

[0006] Preferably, in the length direction of the light strip, the size of the top and bottom of the I-shaped heat sink is smaller than or equal to the size of the LED patch, and the I-shaped heat sink is located on the corresponding lower shell of the LED patch.

[0007] Preferably, the heat dissipation structure further comprises a protrusion arranged at the bottom of the inner cavity of the shell near the side surface, and both sides of the substrate are arranged on the protrusion to form a cavity between the substrate and the inner cavity wall of the shell.

[0008] Preferably, the heat dissipation structure further includes a through hole arranged on the substrate.

[0009] Preferably, the heat dissipation structure further includes a heat dissipation patch arranged below the substrate.

[0010] The utility model provides a heat dissipation structure for an LED light strip, which is beneficial to heat dissipation by separating a substrate from an outer shell to form a cavity in the outer shell. By arranging intermittent heat sinks, while improving the heat dissipation capacity, it is not necessary to open holes in the outer shell, and the protective effect of the outer shell is not affected. At the same time, due to the intermittent arrangement, the bending performance of the LED light strip is less affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic cross-sectional view of the utility model in the width direction.

[0012] Figure 2 It is a schematic cross-sectional view along the length direction of the utility model.

[0013] Figure 3 It is a partial three-dimensional schematic diagram of the utility model in the length direction. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0015] As attached Figure 1-3 As shown, the utility model relates to a heat dissipation structure for an LED light strip, which is used for an LED light strip with a shell. The LED light strip includes a substrate 1, an LED patch 10, and a shell 2. The LED patch 10 is arranged on the substrate 1, and the substrate 1 and the LED patch 10 are arranged in the internal cavity of the shell 2.

[0016] The cross section of the inner cavity of the shell 2 is rectangular, and a protrusion 20 is provided near the side of the bottom of the inner cavity of the shell 2. Both sides of the substrate 1 are provided on the protrusion 20, thereby achieving separation of the bottom of the substrate 1 from the bottom surface of the shell 2.

[0017] The housing 2 includes a lower housing 21 and an upper housing 22, both of which are U-shaped structures. During manufacturing, the substrate 1 is first placed in the lower housing 21, and then the upper housing 22 is fixedly connected to the opening of the lower housing 21. The connecting wire can be fixed to the connection position of the lower housing 21 and the upper housing 22. The lower housing 21 and the upper housing 22 can be connected by heating and melting. (Attached Figure 2 , 3 The upper shell 22 is not included.

[0018] Furthermore, the substrate 1 is provided with a through hole 11, which is conducive to achieving the connection between the upper and lower cavities of the substrate. A heat dissipation patch 12 is provided on the lower side of the substrate 1.

[0019] The substrate 1 can be a hard or flexible circuit board (in the length direction).

[0020] Furthermore, when the substrate 1 is a flexible circuit board, an I-shaped heat sink 23 is provided on the housing 2 corresponding to the position of the LED patch 10, specifically on the lower shell 21. The I-shaped heat sink 23 is made of metal material and includes an upper surface 231, a lower surface 232, and an intermediate connecting plate 233. The intermediate connecting plate 233 is located between the upper surface 231 and the lower surface 232. In the length direction of the light strip, the size of the upper surface 231 and the lower surface 232 is less than or equal to the size of the LED patch 10. Since the LED patch 10 will not bend and deform when the light strip is bent, the intermittently arranged I-shaped heat sink 23 has less influence on the bending performance of the light strip. The upper surface 231 and the lower surface 232 are respectively located on the upper and lower sides of the bottom surface of the lower shell 21, and the intermediate connecting plate 233 passes through the lower shell 21. In manufacturing, the I-shaped heat sink 23 can be embedded when the lower shell 21 is formed.

[0021] The specific material selection of the heat sink 12 and the I-shaped heat sink 23 is common knowledge in the field and can be adaptively selected according to product pricing conditions. They can be aluminum metal materials or other materials.

[0022] It should be noted that, unless otherwise clearly specified and limited, the terms such as "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

Claims

1. A heat dissipation structure for an LED light strip, used for an LED light strip with a shell, the LED light strip comprises a substrate, an LED patch, and a shell, the patch is arranged on the substrate, and the substrate and the LED patch are arranged in an internal cavity of the shell, characterized in that: The heat dissipation structure includes an I-shaped heat sink, which is arranged at the lower part of the shell and includes an upper part, a lower part, and a middle connecting plate. The upper part and the lower part are respectively located on the upper and lower sides of the bottom surface of the lower shell, and the middle connecting plate passes through the two ends of the bottom surface of the shell and is respectively connected to the upper part and the lower part.

2. According to claim 1, a heat dissipation structure for an LED light strip, characterized in that: The I-shaped heat sinks are arranged discontinuously and include a plurality of groups of I-shaped heat sinks.

3. According to claim 2, a heat dissipation structure for an LED light strip, characterized in that: In the length direction of the light strip, the sizes of the upper and lower sides of the I-shaped heat sink are smaller than or equal to the size of the LED patch, and the I-shaped heat sink is located on the corresponding lower shell of the LED patch.

4. The heat dissipation structure for an LED light strip according to claim 1, characterized in that: The heat dissipation structure further comprises a protrusion arranged at the bottom of the inner cavity of the shell near the side surface, and the two sides of the substrate are arranged on the protrusion to form a cavity between the substrate and the inner cavity wall of the shell.

5. The heat dissipation structure for an LED light strip according to claim 1, characterized in that: The heat dissipation structure further includes a through hole arranged on the substrate.

6. The heat dissipation structure for an LED light strip according to claim 1, characterized in that: The heat dissipation structure also includes a heat dissipation patch arranged below the substrate.

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