Three-dimensional heat-conducting uniform-temperature plate

Abstract

The utility model discloses a three-dimensional heat conduction uniform temperature plate which comprises a heat conduction plate, a fin plate and a hot connection structure. The fin plate is connected to the heat conduction plate and has heat conduction capability; the cross section of the heat conducting plate and the cross section of the fin plate are two different planes which are mutually staggered; the hot connection structure is arranged between the heat conduction plate and the fin plate, and the fin plate is connected to the heat conduction plate through the hot connection structure; the hot connection structure is connected with the interiors of the heat conduction plate and the fin plate and enables heat transfer paths communicating with each other to be formed between the heat conduction plate and the fin plate. As the fin plate and the heat conducting plate are located in the two staggered planes, the fin plate and the heat conducting plate cannot be spliced in the same plane in the length direction but can extend in the different directions in the staggered mode, and the problem that the overall size in the same direction is too large can be avoided; therefore, the vapor chamber can have higher heat conduction and heat dissipation capabilities in a limited area, so that the performance of the vapor chamber is improved.

Description

Technical Field

[0001] The utility model relates to the field of heat conduction, in particular to a three-dimensional heat conduction temperature averaging plate. Background Art

[0002] As we all know, in radiators, a temperature spreader is often used as a heat conducting element to conduct heat. The thermal conductivity of the current temperature spreader mostly depends on its area and the amount of thermal conductive structures such as the internal capillary structure. In order to pursue better thermal conductivity, the temperature spreader usually requires a larger heat dissipation area, and a larger heat dissipation area brings the need for overall area expansion, which will undoubtedly cause the temperature spreader to require a larger floor space during installation and use, and bring corresponding installation, placement and use inconveniences. Therefore, the current temperature spreader is difficult to resolve the contradiction between area and performance. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a three-dimensional heat conduction temperature averaging plate, which can bring greater heat conduction and heat dissipation capabilities in a limited footprint.

[0004] According to the three-dimensional heat-conducting temperature-averaging plate of the first aspect embodiment of the utility model, it includes: a heat-conducting plate, a fin plate and a thermal connection structure; the fin plate is connected to the heat-conducting plate, and the fin plate has heat-conducting ability; the cross-section of the heat-conducting plate and the cross-section of the fin plate are two different planes that are staggered with each other; the thermal connection structure is arranged between the heat-conducting plate and the fin plate, and the fin plate is connected to the heat-conducting plate through the thermal connection structure; the thermal connection structure connects the inside of the heat-conducting plate and the fin plate and forms a mutually connected heat transfer path between the heat-conducting plate and the fin plate.

[0005] The three-dimensional heat conduction temperature plate according to the embodiment of the utility model has at least the following beneficial effects: after the heat conduction plate is connected to the radiator, the heat can flow into the heat conduction plate and dissipate heat through the heat conduction plate. During the heat dissipation process, the heat conduction plate can cooperate with the fin plate to form a long heat transfer path that is interconnected, so that the heat can be gradually dissipated in the longer heat transfer path, thereby achieving a better heat dissipation effect.

[0006] Since the fin plate and the heat conducting plate are located in two intersecting planes, the two will not be spliced ​​with each other in length on the same plane, but will be staggered and extended in different directions, thereby avoiding the problem of the overall size being too large in the same direction while increasing the heat transfer path through the fin plate. This allows the temperature spreader to have higher thermal conductivity and heat dissipation capabilities within a limited area, thereby improving the performance of the temperature spreader.

[0007] According to some embodiments of the present invention, the thermal connection structure includes a copper powder column disposed in the heat conducting plate, and a portion of the fin plate extends into the heat conducting plate and is connected to the copper powder column.

[0008] According to some embodiments of the present invention, a boss portion is provided on the top of the copper powder column, a bottom of the copper powder column is fixed in the heat conducting plate, and the boss portion extends into the fin plate.

[0009] According to some embodiments of the present invention, the fin plate includes a front plate and a rear plate connected to each other, a gap is provided between the front plate and the rear plate, and the boss portion passes through the gap and extends between the front plate and the rear plate.

[0010] According to some embodiments of the present invention, the front plate and / or the rear plate are provided with a plurality of first heat-conducting columns, and two ends of the first heat-conducting columns are respectively in contact with the front plate and the rear plate and can conduct heat.

[0011] According to some embodiments of the present invention, the heat conducting plate comprises a top plate and a bottom plate, the copper powder column is installed between the top plate and the bottom plate and clamped in place by the two; a portion of the fin plate passes through the top plate and extends between the top plate and the bottom plate.

[0012] According to some embodiments of the utility model, the top plate is provided with a strip hole, the fin plate passes through the strip hole and extends between the top plate and the bottom plate, and the fin plate is welded and fixed to the top plate.

[0013] According to some embodiments of the utility model, a mounting step is provided at the end of the fin plate, the bottom of the mounting step extends into the strip-shaped hole, and the top of the mounting step overlaps the top of the strip-shaped hole.

[0014] According to some embodiments of the present invention, the top plate and / or the bottom plate are provided with a plurality of second heat-conducting columns, and two ends of the second heat-conducting columns are respectively in contact with the top plate and the bottom plate and can conduct heat.

[0015] According to some embodiments of the present invention, a liquid filling port is provided on the side of the heat conducting plate, and the liquid filling port is connected to the interior of the heat conducting plate.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 A schematic diagram of a three-dimensional heat-conducting temperature-averaging plate according to an embodiment of the present utility model;

[0019] Figure 2 for Figure 1 A schematic diagram of the decomposition of a three-dimensional heat conductive temperature vapor chamber is shown;

[0020] Figure 3 for Figure 2 An enlarged schematic diagram of A is shown;

[0021] Figure 4 for Figure 1 A schematic diagram of a top plate of a three-dimensional heat conductive temperature homogenizing plate is shown;

[0022] Figure 5 for Figure 1 Schematic diagram of the copper powder column of the three-dimensional thermal conductive temperature plate.

[0023] Reference numerals: heat conducting plate 100; strip hole 110; top plate 130; bottom plate 150; second heat conducting column 170; liquid filling port 190; fin plate 200; front plate 230; rear plate 250; mounting step 255; first heat conducting column 270; thermal connection structure 500; copper powder column 550; boss portion 570; DETAILED DESCRIPTION

[0024] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0025] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0027] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0028] Reference Figure 1 A three-dimensional heat conduction temperature plate, comprising: a heat conduction plate 100, a fin plate 200 and a thermal connection structure 500; the fin plate 200 is connected to the heat conduction plate 100, and the fin plate 200 has heat conduction capability; the cross section of the heat conduction plate 100 and the cross section of the fin plate 200 are two different planes interlaced with each other; the thermal connection structure 500 is arranged between the heat conduction plate 100 and the fin plate 200, and the fin plate 200 is connected to the heat conduction plate 100 through the thermal connection structure 500; the thermal connection structure 500 connects the inside of the heat conduction plate 100 and the fin plate 200 and forms a mutually connected heat transfer path between the heat conduction plate 100 and the fin plate 200. After the heat conduction plate 100 is connected to the radiator, heat can flow into the heat conduction plate 100 and dissipate heat through the heat conduction plate 100. During the heat dissipation process, the heat conducting plate 100 can cooperate with the fin plate 200 to form a long heat transfer path that is interconnected, so that the heat can be gradually dissipated in the longer heat transfer path, thereby achieving a better heat dissipation effect. Since the fin plate 200 and the heat conducting plate 100 are located in two mutually staggered planes, the two will not be spliced ​​together in length on the same plane, but will be staggered and extended in different directions, thereby avoiding the problem of the overall size being too large in the same direction while increasing the heat transfer path through the fin plate 200, thereby enabling the temperature equalizer to have a higher thermal conductivity and heat dissipation capacity within a limited area, thereby improving the performance of the temperature equalizer.

[0029] In certain embodiments, reference Figure 2 , the thermal connection structure 500 includes a copper powder column 550 disposed in the heat conducting plate 100, and a portion of the fin plate 200 extends into the heat conducting plate 100 and is connected to the copper powder column 550. The copper powder column 550 disposed in the heat conducting plate 100 can form a variety of capillary structures inside the heat conducting plate 100, so that the thermal conductivity of the heat conducting plate 100 can be enhanced through the capillary structure, so that the temperature averaging plate can achieve a better thermal conductivity and heat dissipation effect. A portion of the fin plate 200 extends into the heat conducting plate 100, and the heat in the heat conducting plate 100 can be transferred to the fin plate 200 through this portion, so the heat can also be dissipated in the fin plate 200. Since the fin plate 200 and the heat conducting plate 100 have already performed heat transfer and heat dissipation, the overall thermal conductivity and heat dissipation effect of the temperature averaging plate can be effectively increased, and the performance of components such as radiators can be smoothly improved.

[0030] It is conceivable that the thermal connection structure 500 may also be composed of other components, such as a copper tube for heat conduction is provided in the heat conducting plate 100, and the copper tube extends to the fin plate 200 for heat conduction. Therefore, the specific implementation of the thermal connection structure 500 is not unique, but can be adjusted accordingly according to actual conditions, and is not limited here.

[0031] In certain embodiments, reference Figure 5 , a boss portion 570 is provided on the top of the copper powder column 550, the bottom of the copper powder column 550 is fixed in the heat conducting plate 100, and the boss portion 570 extends into the fin plate 200. The boss portion 570 can form a connection position for connecting the fin plate 200 on the top of the copper powder column 550, so that the fin plate 200 extending into the heat conducting plate 100 can be accurately and stably connected to the copper powder column 550, thereby effectively avoiding the problem of connection errors and looseness after connection between the two.

[0032] In certain embodiments, reference Figure 2 The fin plate 200 includes a front plate 230 and a rear plate 250 connected to each other, with a gap between the front plate 230 and the rear plate 250, and the boss portion 570 passes through the gap and extends between the front plate 230 and the rear plate 250. The front plate 230 and the rear plate 250 can cooperate to form a gap for heat to enter, so that the heat of the heat conducting plate 100 can be smoothly conducted into the fin plate 200 through the copper powder column 550. In addition, the distinction between the front plate 230 and the rear plate 250 can also facilitate the processing of the inside of the fin plate 200, thereby ensuring that the inside of the fin plate 200 can smoothly form a heat conduction structure.

[0033] Specifically, the front plate 230 and the rear plate 250 are symmetrically arranged and connected by welding. Of course, the fin plate 200 can also be an integrally formed structure, or connected by other means such as adhesive. The specific implementation method can be adjusted accordingly according to actual needs and is not limited here.

[0034] In certain embodiments, reference Figure 2 The front plate 230 and / or the rear plate 250 are provided with a plurality of first heat-conducting columns 270, and the two ends of the first heat-conducting columns 270 are respectively in contact with the front plate 230 and the rear plate 250 and can conduct heat. The first heat-conducting columns 270 can effectively increase the amount of the capillary structure between the front plate 230 and the rear plate 250, thereby effectively improving the heat conduction and heat dissipation performance of the fin plate 200 by increasing the amount of the capillary structure, thereby providing a better heat conduction and heat dissipation capability for the overall temperature vapor chamber.

[0035] Specifically, the first heat-conducting column 270 is disposed on the rear plate 250 and extends to contact the front plate 230. Of course, the first heat-conducting column 270 may be a separate entity and its two ends may contact the front plate 230 and the rear plate 250 respectively, or the first heat-conducting column 270 may be disposed on the front plate 230 and contact the rear plate 250. The specific implementation method may be adjusted accordingly according to actual needs and is not limited here.

[0036] Furthermore, the first heat-conducting column 270 has the following functions: First, it is used to improve the strength of the heat spreader: the interior of the heat spreader cavity is close to a vacuum. If there is no support inside the cavity, the surface of the heat spreader will sink inward. After adding the first heat-conducting column 270 for support, the strength can be greatly improved. Secondly, the first heat-conducting column 270 is used for the exchange of heat transfer medium: during the molding process of the heat spreader, a layer of capillary structure will be generated on the surface of the first heat-conducting column 270. After the two first heat-conducting columns 270 are butt-connected, the heat transfer medium can be exchanged between the front plate / rear plate through the capillary structure located on the first heat-conducting column 270.

[0037] In certain embodiments, reference Figure 2 The heat conducting plate 100 includes a top plate 130 and a bottom plate 150, and the copper powder column 550 is installed between the top plate 130 and the bottom plate 150 and is clamped and positioned by the two. A portion of the fin plate 200 passes through the top plate 130 and extends between the top plate 130 and the bottom plate 150. The top plate 130 and the bottom plate 150 can cooperate to clamp and fix the copper powder column 550, so that the copper powder column 550 can be more accurately positioned and connected to the fin plate 200. In addition, the distinction between the top plate 130 and the bottom plate 150 makes it easier to form the heat conduction structure between the two.

[0038] In certain embodiments, reference Figure 4 , the top plate 130 is provided with a strip hole 110, the fin plate 200 passes through the strip hole 110 and extends between the top plate 130 and the bottom plate 150, and the fin plate 200 is welded and fixed to the top plate 130. The strip hole 110 can be used to relatively position the top plate 130 and the fin plate 200, so that the fin plate 200 can be accurately installed on the heat conducting plate 100 and connected to the copper powder column 550. After the fin plate 200 is connected to the heat conducting plate 100 through the strip hole 110, the fin plate 200 and the heat conducting plate 100 can be relatively connected and fixed by welding, so that the temperature averaging plate is formed as a whole, and then the temperature averaging plate can smoothly perform heat conduction and heat dissipation work.

[0039] In certain embodiments, reference Figure 3The end of the fin plate 200 is provided with a mounting step 255, the bottom of the mounting step 255 extends into the strip hole 110, and the top of the mounting step 255 overlaps the top of the strip hole 110. The mounting step 255 can effectively provide an overlap point between the fin plate 200 and the top plate 130, so that the fin plate 200 and the top plate 130 will obtain the peripheral positioning effect from the strip hole 110 and the end positioning effect from the mounting step 255, so that the installation and positioning between the fin plate 200 and the top plate 130 become more accurate and reliable, thereby effectively improving the stability of the formed uniform temperature plate.

[0040] In certain embodiments, reference Figure 2 The top plate 130 and / or the bottom plate 150 are provided with a plurality of second heat-conducting columns 170, and the two ends of the second heat-conducting columns 170 are respectively in contact with the top plate 130 and the bottom plate 150 and can conduct heat. The second heat-conducting columns 170 can effectively increase the amount of the capillary structure between the top plate 130 and the bottom plate 150, thereby effectively improving the heat conduction and heat dissipation performance of the fin plate 200 by increasing the amount of the capillary structure, thereby providing a better heat conduction and heat dissipation capability for the overall temperature vapor chamber.

[0041] Specifically, the second heat-conducting column 170 is disposed on the bottom plate 150 and extends to contact the top plate 130. Of course, the first heat-conducting column 270 may be a separate entity and its two ends may contact the top plate 130 and the bottom plate 150 respectively, or the first heat-conducting column 270 may be disposed on the top plate 130 and contact the bottom plate 150. The specific implementation method may be adjusted accordingly according to actual needs and is not limited here.

[0042] Furthermore, the second heat-conducting column 170 has the following functions: First, it is used to improve the strength of the heat spreader: the interior of the heat spreader cavity is close to a vacuum. If there is no support inside the cavity, the surface of the heat spreader will sink inward. After adding the second heat-conducting column 170 for support, the strength can be greatly improved. Secondly, the second heat-conducting column 170 is used for the exchange of heat transfer medium: during the molding process of the heat spreader, a layer of capillary structure will be generated on the surface of the second heat-conducting column 170. After the two second heat-conducting columns 170 are butt-connected, the heat transfer medium can be exchanged between the front plate / rear plate through the capillary structure located on the second heat-conducting column 170.

[0043] In certain embodiments, reference Figure 1 The side of the heat conducting plate 100 is provided with a liquid filling port 190, which is connected to the inside of the heat conducting plate 100. After the heat spreader is sealed, the heat transfer medium can be injected into the cavity of the heat spreader through the liquid filling port 190, and finally the liquid filling port 190 is sealed and the excess part is cut off, so as to effectively obtain a finished heat spreader.

[0044] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A three-dimensional heat conduction uniform temperature plate, characterized in that: include: Heat conducting plate (100); A fin plate (200) is connected to the heat conducting plate (100), and the fin plate (200) has heat conducting capability; a cross section of the heat conducting plate (100) and a cross section of the fin plate (200) are two different planes interlaced with each other; A thermal connection structure (500) is arranged between the heat conducting plate (100) and the fin plate (200), and the fin plate (200) is connected to the heat conducting plate (100) through the thermal connection structure (500); the thermal connection structure (500) connects the heat conducting plate (100) and the inside of the fin plate (200) and forms a mutually connected heat transfer path between the heat conducting plate (100) and the fin plate (200).

2. The three-dimensional heat conductive temperature homogenizing plate according to claim 1, characterized in that: The thermal connection structure (500) comprises a copper powder column (550) disposed in the heat conducting plate (100), and a portion of the fin plate (200) extends into the heat conducting plate (100) and is connected to the copper powder column (550).

3. The three-dimensional heat conductive temperature homogenizing plate according to claim 2, characterized in that: A boss portion (570) is provided at the top of the copper powder column (550), the bottom of the copper powder column (550) is fixed in the heat conduction plate (100), and the boss portion (570) extends into the fin plate (200).

4. The three-dimensional heat conductive temperature homogenizing plate according to claim 3, characterized in that: The fin plate (200) comprises a front plate (230) and a rear plate (250) which are connected to each other, a gap is provided between the front plate (230) and the rear plate (250), and the boss portion (570) passes through the gap and extends between the front plate (230) and the rear plate (250).

5. The three-dimensional heat conductive temperature homogenizing plate according to claim 4, characterized in that: The front plate (230) and / or the rear plate (250) are provided with a plurality of first heat-conducting columns (270), and two ends of the first heat-conducting columns (270) are in contact with the front plate (230) and the rear plate (250) respectively.

6. The three-dimensional heat conductive temperature homogenizing plate according to claim 2, characterized in that: The heat conducting plate (100) comprises a top plate (130) and a bottom plate (150); the copper powder column (550) is installed between the top plate (130) and the bottom plate (150) and is clamped and positioned by the two; a portion of the fin plate (200) passes through the top plate (130) and extends between the top plate (130) and the bottom plate (150).

7. The three-dimensional heat conductive temperature homogenizing plate according to claim 6, characterized in that: The top plate (130) is provided with a strip-shaped hole (110), the fin plate (200) passes through the strip-shaped hole (110) and extends between the top plate (130) and the bottom plate (150), and the fin plate (200) is fixed to the top plate (130) by welding.

8. The three-dimensional heat conductive temperature homogenizing plate according to claim 7, characterized in that: An installation step (255) is provided at the end of the fin plate (200), the bottom of the installation step (255) extends into the strip-shaped hole (110), and the top of the installation step (255) overlaps the top of the strip-shaped hole (110).

9. The three-dimensional heat conductive temperature homogenizing plate according to claim 6, characterized in that: The top plate (130) and / or the bottom plate (150) are provided with a plurality of second heat-conducting columns (170), and two ends of the second heat-conducting columns (170) are in contact with the top plate (130) and the bottom plate (150) respectively.

10. The three-dimensional heat conductive temperature homogenizing plate according to claim 1, characterized in that: A liquid filling port (190) is provided on the side of the heat conducting plate (100), and the liquid filling port (190) is connected to the interior of the heat conducting plate (100).

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