Display card heat dissipation device

Abstract

The utility model relates to the technical field of display card heat dissipation, in particular to a display card heat dissipation device which is arranged below a shell assembly and comprises a vapor chamber, a main heat dissipation piece arranged above the vapor chamber and an auxiliary heat dissipation piece, and a plurality of heat conduction assemblies distributed at intervals are arranged between the main heat dissipation piece and the auxiliary heat dissipation piece. Wherein the heat conduction assembly comprises a plurality of heat pipes which are distributed in a stacked mode, the structural design that the multiple heat pipes are stacked and distributed at intervals is adopted, the heat dissipation mode that the multiple heat pipes are stacked can be achieved, and therefore the heat dissipation effect can be greatly improved; and secondly, the heat of the vapor chamber is transferred to the auxiliary heat dissipation piece by adopting the plurality of heat pipes, so that the main heat dissipation piece and the auxiliary heat dissipation piece are cooled at the same time, the heat dissipation area can be effectively increased, the heat dissipation effect on the core area of the display card is improved, the overall structural design is simple, and the heat dissipation requirement of the high-power display card is met.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of graphics cards, in particular to a heat dissipation device for graphics cards. Background Art

[0002] Some existing electronic components or power modules generate a lot of heat when working. If they are not cooled in time, it will directly affect the normal operation of electronic equipment. For example, for graphics cards, the quality of heat dissipation directly affects the processing effect of the graphics card. If the temperature of the graphics card is too high, it is easy to cause screen distortion, especially when running games with high load, so the heat dissipation of the graphics card is very important.

[0003] Most of the current graphics card cooling devices use a fan combined with fins to dissipate heat. For example, Chinese patent announcement number "CN2773904Y" discloses a heat pipe radiator, which includes a base with an opening; a heat conducting plate arranged on the opening, the heat conducting plate is U-shaped and has a receiving portion thereon; a heat sink arranged on the base; and at least one heat pipe, having a heating end and a cooling end, the heating end being arranged on the heat conducting plate.

[0004] Since most of the current heat pipes are distributed in a single row, with the adaptation to large mainstream games, the heat dissipation of the core part of the graphics card is gradually increasing. The current single-row heat pipe heat dissipation method has limited thermal conductivity and is gradually unable to meet the existing heat dissipation needs. Utility Model Content

[0005] The purpose of the utility model is to solve the above-mentioned shortcomings in the prior art and to propose a graphics card heat dissipation device.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A graphics card heat dissipation device is designed, which is arranged below a housing component, and includes a heat spreader and a main heat sink arranged above the heat spreader, and also includes an auxiliary heat sink, wherein a plurality of heat-conducting components distributed at intervals are arranged between the main heat sink and the auxiliary heat sink;

[0008] The heat-conducting component includes a plurality of heat pipes distributed in layers, and a limiting structure for positioning the plurality of heat-conducting components is also provided on the main heat sink.

[0009] Furthermore, the heat pipe includes a proximal end and a distal end, a bending portion is provided between the proximal end and the distal end, the proximal ends are stacked and contacted in sequence, and the distal ends are varied in distance via the bending portion to form an interval stacked structure.

[0010] Furthermore, the proximal end is an end close to the main heat sink, and the distal end is an end close to the auxiliary heat sink, wherein the cross-section of the heat pipe is a flat structure.

[0011] Furthermore, the main heat sink and the auxiliary heat sink have the same structure, and are both composed of a plurality of heat sink fins connected in sequence.

[0012] Furthermore, the limiting structure is a receiving groove opened on the end surface of the main heat sink, and the proximal stacked parts of the plurality of heat pipes are fixed in the receiving groove.

[0013] Furthermore, the heat spreader has a cavity, the cavity is filled with a heat dissipation medium, and the heat pipe is connected to the cavity.

[0014] Furthermore, the distal ends of the plurality of heat pipes are distributed in a matrix structure on the auxiliary heat sink.

[0015] The utility model proposes a graphics card cooling device, which has the following beneficial effects: the utility model adopts a structural design in which multiple heat pipes are stacked and distributed at intervals, so that a heat dissipation method of multiple heat pipes stacked can be realized, which can greatly improve the heat dissipation effect; secondly, the utility model adopts multiple heat pipes to transfer the heat of the heat spreader to the auxiliary heat sink, so as to achieve simultaneous cooling of the main heat sink and the auxiliary heat sink, which can effectively increase the heat dissipation area and improve the heat dissipation effect of the core area of ​​the graphics card; the overall structural design is simple and meets the heat dissipation requirements of high-power graphics cards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of the explosion structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the auxiliary heat sink of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the limiting structure of the utility model.

[0020] In the figure: 1. heat sink; 2. main heat sink; 3. auxiliary heat sink; 4. heat conduction component; 41. heat pipe; 5. limiting structure; 6. shell component. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] Reference Figure 1-4 It is an embodiment of the utility model. Specifically, it discloses a graphics card heat dissipation device, which is arranged below a housing component 6. The housing component 6 described in this embodiment includes an upper cover of the graphics card and a fan arranged in the upper cover. The heat on the surface of the device is cooled by the fan to achieve cooling of the core area of ​​the graphics card. Further, the device described in the embodiment of the utility model includes a heat spreader 1 and a main heat sink 2 arranged above the heat spreader 1, and also includes an auxiliary heat sink 3. A plurality of heat-conducting components 4 distributed at intervals are arranged between the main heat sink 2 and the auxiliary heat sink 3;

[0023] The heat-conducting component 4 includes a plurality of heat pipes 41 distributed in layers, and a limiting structure 5 for positioning the plurality of heat-conducting components 4 is also provided on the main heat sink 2 .

[0024] In some embodiments, the heat pipe 41 in the utility model includes a proximal end and a distal end, a bending portion is arranged between the proximal end and the distal end, the proximal ends are stacked and contacted in sequence, and the distal ends are varied in distance through the bending portion to form an interval stacked structure, that is, in this embodiment, one end of the multiple heat pipes 41 in each of the heat-conducting components 4 is in close contact and stacked, and the distal ends are interval stacked, and the heat of the heat spreader 1 is transferred to the auxiliary heat sink 3 through the multiple distal ends to achieve simultaneous cooling of the main heat sink 2 and the auxiliary heat sink 3, which can effectively increase the heat dissipation area and enhance the heat dissipation effect of the core area of ​​the graphics card.

[0025] Specifically, the distal ends of the plurality of heat pipes 41 are distributed in a matrix structure on the auxiliary heat sink 3 . The matrix distribution design structure can realize uniform heat conduction in the auxiliary heat sink 3 to achieve an optimal heat dissipation effect.

[0026] On the basis of the above-mentioned embodiment, the proximal end in the utility model is an end close to the main heat sink 2, and the distal end is an end close to the auxiliary heat sink 3, wherein the cross-section of the heat pipe 41 is a flat structure. Preferably, in the present embodiment, the cross-section of the heat pipe 41 is set to a square structure, and the design purpose of this structure is to facilitate adaptive contact with the following accommodating groove.

[0027] In more detail, the main heat sink 2 and the auxiliary heat sink 3 described in this embodiment have the same structure, and are both composed of a plurality of heat sink fins connected in sequence. The structure of the heat sink fins can be implemented by bolting and the like, which is a conventional method used by technicians in the field and will not be elaborated here.

[0028] Furthermore, the limiting structure 5 in the present embodiment is a receiving groove provided on the end surface of the main heat sink 2, and the proximal stacked parts of the plurality of heat pipes 41 are fixed in the receiving groove. That is to say, in the present embodiment of the utility model, by adopting the design of multiple receiving grooves, the proximal ends of the heat pipes 41 are fixed after being snap-connected with the proximal ends of the plurality of stacked heat pipes 41. The purpose of this design is to prevent the heat pipes 41 from moving horizontally to the left and right. In addition, the receiving groove in the present embodiment is configured as a square groove, and the heat pipe 41 is configured as a square tube. The connection between the two can be fixed by welding to achieve a stable support connection for the heat pipe 41.

[0029] It should be noted that in the embodiment of the utility model, the heat spreader 1 has a cavity, the cavity is filled with a heat dissipation medium, and the heat pipe 41 is connected to the cavity. Specifically, the heat dissipation medium in this embodiment is set to alcohol.

[0030] In summary, the utility model adopts a structural design in which multiple heat pipes 41 are stacked and distributed at intervals, so that a heat dissipation method of multiple heat pipes 41 stacked can be realized, which can greatly improve the heat dissipation effect. Secondly, the utility model adopts multiple heat pipes 41 to transfer the heat of the heat spreader 1 to the auxiliary heat sink 3, so as to achieve simultaneous cooling of the main heat sink 2 and the auxiliary heat sink 3, which can effectively increase the heat dissipation area and improve the heat dissipation effect of the core area of ​​the graphics card. The overall structural design is simple and meets the heat dissipation requirements of high-power graphics cards.

[0031] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A graphics card heat dissipation device, arranged below a housing assembly (6), comprising a heat spreader (1) and a main heat dissipation element (2) arranged above the heat spreader (1), characterized in that: It also comprises an auxiliary heat sink (3), and a plurality of heat-conducting components (4) distributed at intervals are arranged between the main heat sink (2) and the auxiliary heat sink (3); The heat-conducting component (4) comprises a plurality of heat pipes (41) distributed in a stacked manner, and a limiting structure (5) for positioning the plurality of heat-conducting components (4) is also provided on the main heat sink (2).

2. A graphics card heat dissipation device according to claim 1, characterized in that: The heat pipe (41) comprises a proximal end and a distal end, a bending portion is provided between the proximal end and the distal end, the proximal ends are stacked and contacted in sequence, and the distal ends are varied in distance via the bending portion to form an interval stacking structure.

3. A graphics card heat dissipation device according to claim 2, characterized in that: The proximal end is an end close to the main heat sink (2), and the distal end is an end close to the auxiliary heat sink (3), wherein the cross section of the heat pipe (41) is a flat structure.

4. A graphics card heat dissipation device according to claim 2, characterized in that: The main heat sink (2) and the auxiliary heat sink (3) have the same structure, and are both composed of a plurality of heat sink fins connected in sequence.

5. A graphics card heat dissipation device according to claim 4, characterized in that: The limiting structure (5) is a receiving groove provided on the end surface of the main heat sink (2), and the proximal stacked portions of the plurality of heat pipes (41) are fixed in the receiving groove.

6. A graphics card heat dissipation device according to claim 1, characterized in that: The heat spreader (1) has a cavity, in which a heat dissipation medium is filled, and the heat pipe (41) is connected to the cavity.

7. A graphics card heat dissipation device according to claim 2, characterized in that: The distal ends of the plurality of heat pipes (41) are distributed on the auxiliary heat sink (3) in a matrix structure.

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