Lifting type tank body for wafer flushing

Abstract

The utility model relates to the technical field of wafer cleaning, and discloses a lifting type tank body for wafer flushing, which comprises a bottom plate, a tank body arranged at the center of the upper surface of the bottom plate, a sucker arranged on the bottom surface of the tank body, a rotating device arranged below the sucker, a water outlet arranged on the bottom surface of the tank body, a tank cover arranged above the tank body, and hollow inside of the tank cover and the tank body. A round hole is formed in the upper surface of the tank cover, a jacking rod is arranged behind the tank cover, one end of the jacking rod is fixed to the upper surface of the tank cover, a lifting motor is fixedly arranged at the lower end of the other end, and rotatable spraying devices are arranged on the two sides of the tank body. According to the utility model, the angle of the spraying pipeline is adjusted through the knob, so that the sprayed liquid covers the surface of the wafer in a larger range, and the liquid can be ensured to uniformly cover the whole surface of the wafer by adjusting the spraying angle, so that the cleaning efficiency and uniformity are improved, and the spraying at different angles can better reach the concave-convex part of the surface of the wafer; therefore, surface pollutants can be cleaned more thoroughly.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a lifting tank body used for wafer washing. Background Art

[0002] During the wafer manufacturing process, photoresist is needed to be used as a medium to realize the pattern transfer from the photolithography mask to the wafer. However, during the photolithography process, the excess photoresist of the wafer is thrown out by centrifugal rotation, so there are still some excess colloid particles stuck on the surface of the wafer. Therefore, a wafer degumming and cleaning mechanism is needed, and the existing wafer degumming and cleaning mechanism cannot clean the wafer surface evenly. Therefore, in view of the above problem, a lifting trough for wafer washing is proposed. Utility Model Content

[0003] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a lifting trough body for wafer washing, comprising a bottom plate, a trough body is arranged at the center of the upper surface of the bottom plate, a suction cup is arranged on the bottom surface of the trough body, a rotating device is arranged under the suction cup, a water outlet hole is arranged on the bottom surface of the trough body, a trough cover is arranged above the trough body, the trough cover and the interior of the trough body are both hollow, a circular hole is opened on the upper surface of the trough cover, a lifting rod is arranged behind the trough cover, one end of the lifting rod is fixed on the upper surface of the trough cover, and a lifting motor is fixedly arranged at the lower end of the other end, and a rotatable spray device is arranged on both sides of the trough body.

[0004] Furthermore, the spray device includes a spray pipeline, which is horizontally arranged above the trough cover, and a rotating rod is arranged below the spray pipeline. The upper end of the rotating rod is rotatably connected to the rear end of the spray pipeline, and the lower end penetrates the bottom plate and is connected to the motor. The motor is arranged below the bottom plate, and two photoelectric sensors are arranged between the bottom plate, and the two photoelectric sensors are electrically connected to the motor. A speed measuring plate and a positioning plate are respectively arranged on the inner sides of the two photoelectric sensors, and the positioning plate and the speed measuring plate are arranged on the rotating rod.

[0005] Furthermore, a U-shaped bracket is arranged below the spray pipeline, a U-shaped groove is arranged in the bracket, the spray pipeline is arranged in the U-shaped groove, a knob is arranged for rotation and penetration on the lower surface of the U-shaped groove, and the upper surface of the knob contacts the lower surface of the spray pipeline.

[0006] Furthermore, the center of the groove body is a boss protruding upward.

[0007] Furthermore, the length of the spray pipeline is greater than the radius of the trough body and smaller than the diameter of the trough body, and when the positioning plate is rotated into the photoelectric sensor, the front end of the spray pipeline corresponds to the center position of the suction cup.

[0008] The utility model has the following beneficial effects:

[0009] In the utility model, the angle of the spray pipeline is adjusted by a knob so that the spray liquid covers a larger area of ​​the wafer surface. By adjusting the spray angle, it can be ensured that the liquid can evenly cover the entire wafer surface, thereby improving the cleaning efficiency and uniformity. Spraying at different angles can better reach the concave and convex parts of the wafer surface, thereby more thoroughly cleaning the surface contaminants. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a structural schematic diagram of a lifting tank for wafer washing proposed by the utility model;

[0011] Figure 2 This is a schematic diagram of the location and structure of the spray pipeline and bracket proposed in the utility model;

[0012] Figure 3 This is a schematic diagram of the position and structure of the photoelectric sensor, speed measuring plate and positioning plate proposed by the utility model;

[0013] Figure 4 This is a cross-sectional top view of a lifting trough body for wafer washing proposed by the utility model.

[0014] Legend:

[0015] 1. Bottom plate; 2. Trough body; 3. Suction cup; 4. Water outlet; 5. Trough cover; 6. Round hole; 7. Lifting rod; 8. Lifting motor; 9. Spraying device; 10. Rotating device; 91. Spraying pipeline; 92. Rotating rod; 93. Motor; 94. Photoelectric sensor; 95. Speed ​​measuring plate; 96. Positioning plate; 97. Bracket; 98. U-shaped groove; 99. Knob. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] Reference Figure 1-4As shown, an embodiment of the utility model is as follows: a lifting tank body for wafer washing comprises a bottom plate 1, a tank body 2 is arranged at the center of the upper surface of the bottom plate 1, a suction cup 3 is arranged on the bottom surface of the tank body 2, the suction cup 3 adsorbs the wafer on the surface through vacuum, a rotating device 10 is arranged below the suction cup 3, the rotating device 10 controls the rotation of the suction cup 3 through a motor, the rotating device 10 is a prior art and will not be described in detail hereinafter, a water outlet 4 is arranged on the bottom surface of the tank body 2, a tank cover 5 is arranged above the tank body 2, the tank cover 5 and the tank body 2 are both hollow, and when the wafer is moved along When the suction cup 3 rotates, the slot cover 5 can prevent the medicine from splashing outside. A circular hole 6 is provided on the upper surface of the slot cover 5. The circular hole 6 provides a spraying space for the spray pipeline 91. A lifting rod 7 is arranged behind the slot cover 5. One end of the lifting rod 7 is fixed on the upper surface of the slot cover 5, and a lifting motor 8 is fixed at the lower end of the other end. The lifting motor 8 drives the lifting rod 7 to move and controls the rising and falling of the slot cover 5. The wafer is installed when rising and fits with the slot body 2 when descending. Rotatable spray devices 9 are arranged on both sides of the slot body 2. The spray devices 9 are used to clean the colloidal particles on the surface of the wafer.

[0018] Furthermore, the spray device 9 includes a spray pipeline 91, which is horizontally arranged above the slot cover 5, and a rotating rod 92 is arranged below the spray pipeline 91. The upper end of the rotating rod 92 is rotatably connected to the rear end of the spray pipeline 91, and the lower end penetrates the bottom plate 1 and is connected to the motor 93. The motor 93 is arranged below the bottom plate 1, and two photoelectric sensors 94 are arranged between the bottom plate 1. The two photoelectric sensors 94 are electrically connected to the motor 93. The rotating rod 92 rotates with the motor 93 to drive the spray pipeline 91 to rotate, and moves to the inside of the circular hole 6 to spray the wafer. The speed measuring plates 95 and The positioning plate 96, the positioning plate 96 and the speed measuring plate 95 are arranged on the rotating rod 92, the photoelectric sensor 94 can emit light through the transmitter, and then detect the light reflected by the detection object or the change in the amount of light blocked through the receiver, so as to obtain an output signal and then measure the rotation speed and perform positioning. The photoelectric sensor 94 is a prior art and will not be described in detail below. The speed measuring plate 95 can detect the rotation speed when it rotates through the photoelectric sensor 94, so as to make adjustments. By moving the positioning plate 96 into the light spot sensor, the exact position of the spray pipe 91 can be determined to prevent the spray pipe 91 from not moving to the top of the wafer.

[0019] Furthermore, a U-shaped bracket 97 is arranged below the spray pipeline 91, a U-shaped groove 98 is arranged in the bracket 97, the spray pipeline 91 is arranged in the U-shaped groove 98, a knob 99 is arranged on the lower surface of the U-shaped groove 98 for rotation and penetration, and the upper surface of the knob 99 contacts the lower surface of the spray pipeline 91. By rotating the knob 99, the spray pipeline 91 is rotated up and down around the rear end, and the spray angle of the spray pipeline 91 is adjusted so that the spray liquid covers a larger area of ​​the wafer surface. By adjusting the spray angle, it can be ensured that the liquid can evenly cover the entire wafer surface, thereby improving the cleaning efficiency and uniformity. Spraying at different angles can better reach the concave and convex parts of the wafer surface, thereby more thoroughly cleaning the surface contaminants.

[0020] Furthermore, the center of the trough body 2 is an upwardly protruding boss. The design of the boss can expose the wafer to the spraying liquid more evenly during the spraying process, ensuring that the liquid can evenly cover the wafer surface, improving the cleaning effect and the ability to remove contaminants. The boss can form a certain gap between the back of the wafer and the bottom supporting surface, reducing the contact area between the wafer and the supporting surface, helping to reduce the contact friction between the wafer and the supporting surface, and reducing the risk of mechanical damage or scratches caused thereby.

[0021] Furthermore, the length of the spray pipe 91 is greater than the radius of the trough body 2 and smaller than the diameter of the trough body 2, so as to prevent the spray pipe 91 from being too long or too short when rotating, so that the front end of the spray pipe 91 cannot spray the wafer, thereby failing to effectively clean it. When the positioning plate 96 rotates into the photoelectric sensor 94, the front end of the spray pipe 91 corresponds to the center position of the suction cup 3, so that the spray pipe 91 can effectively clean the wafer over a larger area.

[0022] Working principle: When using the equipment, the staff first controls the lifting motor 8 to move the slot cover 5 upward and leave the slot body 2, then places the wafer on the suction cup 3, and then controls the lifting motor 8 to lower the slot cover 5 and seal it with the slot body 2. At this time, the motor 93 can be controlled to rotate, so that the spray pipe 91 rotates. The rotation speed of the motor 93 is controlled by the photoelectric sensor 94 and the speed measuring plate 95. When the positioning plate 96 moves into the photoelectric sensor 94, the motor 93 stops rotating, and the spray pipe 91 moves to a suitable position for spray cleaning. At the same time, the rotating device 10 drives the suction cup 3 to rotate. When the angle of the spray pipe 91 is not suitable, the knob 99 can be rotated to adjust the angle of the spray wheel pipe to achieve a better cleaning effect.

[0023] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A lifting tank for wafer washing, characterized in that: The invention comprises a bottom plate (1), a trough body (2) is arranged at the center of the upper surface of the bottom plate (1), a suction cup (3) is arranged on the bottom surface of the trough body (2), a rotating device (10) is arranged below the suction cup (3), a water outlet hole (4) is arranged on the bottom surface of the trough body (2), a trough cover (5) is arranged above the trough body (2), the interior of the trough cover (5) and the trough body (2) are both hollow, a circular hole (6) is provided on the upper surface of the trough cover (5), a lifting rod (7) is arranged behind the trough cover (5), one end of the lifting rod (7) is fixed to the upper surface of the trough cover (5), and a lifting motor (8) is fixedly arranged at the lower end of the other end, and a rotatable spray device (9) is arranged on both sides of the trough body (2).

2. The lifting tank for wafer washing according to claim 1, characterized in that: The spray device (9) comprises a spray pipeline (91), the spray pipeline (91) being horizontally arranged above the tank cover (5), a rotating rod (92) being arranged below the spray pipeline (91), the upper end of the rotating rod (92) being rotatably connected to the rear end of the spray pipeline (91), and the lower end of the rotating rod (92) penetrating the bottom plate (1) and being connected to a motor (93), the motor (93) being arranged below the bottom plate (1), and two photoelectric sensors (94) being arranged between the motor (93) and the bottom plate (1), the two photoelectric sensors (94) being electrically connected to the motor (93), a speed measuring plate (95) and a positioning plate (96) being arranged inside the two photoelectric sensors (94), respectively, and the positioning plate (96) and the speed measuring plate (95) being arranged on the rotating rod (92).

3. The lifting tank for wafer washing according to claim 2, characterized in that: A U-shaped bracket (97) is arranged below the spray pipeline (91), a U-shaped groove (98) is arranged in the bracket (97), the spray pipeline (91) is arranged in the U-shaped groove (98), a knob (99) is arranged on the lower surface of the U-shaped groove (98) through which rotation is penetrated, and the upper surface of the knob (99) contacts the lower surface of the spray pipeline (91).

4. The lifting tank for wafer washing according to claim 1, characterized in that: The center of the trough body (2) is a boss that protrudes upwards.

5. The lifting tank for wafer washing according to claim 2, characterized in that: The length of the spray pipeline (91) is greater than the radius of the trough body (2) and less than the diameter of the trough body (2); when the positioning plate (96) rotates into the photoelectric sensor (94), the front end of the spray pipeline (91) corresponds to the center position of the suction cup (3).

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