Semiconductor radiator assembly, vehicle-mounted device and vehicle

Abstract

The utility model discloses a semiconductor radiator assembly, a vehicle-mounted device and a vehicle, the semiconductor radiator assembly comprises a circuit board, a chip and an upper cover, the chip is arranged on the circuit board, and the semiconductor radiator assembly further comprises a semiconductor radiator, the semiconductor radiator comprises a radiator body, a radiator wire harness, a radiator wire end connector and a radiator plate end connector, the cold face of the radiator body is attached to a chip, the hot face of the radiator body is arranged on the upper cover, the two ends of the radiator wire harness are connected with the radiator body and the radiator wire end connector respectively, and the radiator wire end connector is connected with the radiator plate end connector. The radiator wire end connector is arranged in the radiator board end connector, and the radiator board end connector is arranged on the circuit board. The semiconductor radiator assembly is high in radiating efficiency, simple in structure, convenient to assemble and low in cost.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor radiators, and specifically to a semiconductor radiator assembly, a semiconductor radiator assembly, a vehicle-mounted device and a vehicle. Background Art

[0002] In the electronic and electrical systems of automobiles or some electronic products, some circuit boards or PCB boards are usually needed to realize signal interaction and some processing functions. Semiconductor chips are generally arranged on the circuit boards. The chips will generate heat during operation and need to be cooled, so a semiconductor heat sink is needed to dissipate the heat of the chips.

[0003] Traditional semiconductor heat sinks are usually made into a module with metal heat sinks, or directly welded to the circuit board, and the cold side of the semiconductor heat sink is attached to the side of the chip away from the circuit board. However, making a semiconductor heat sink and a metal heat sink into a module has the following defects: Due to size limitations, the heat dissipation capacity of the metal heat sink itself is limited. If the semiconductor heat sink is attached to the external metal heat sink shell for heat dissipation, the heat dissipation efficiency will be reduced; the process is complicated and requires multiple additional assembly steps, such as packaging and screw fixing; the cost is high, and the additional assembly materials and complex processes lead to increased costs; the structural weight is increased, and the additional assembly structure leads to an increase in the weight of the entire circuit board and semiconductor heat sink. There are the following defects when the semiconductor heat sink is directly welded to the circuit board: low heat dissipation efficiency, the heat dissipation efficiency of the vias on the back of the circuit board is extremely low, which cannot be compared with the heat dissipation on the front of the heat-generating chip; because an additional heat-conducting medium is required between the semiconductor heat sink and the back of the circuit board, the fixing method becomes complicated, which is easy to cause vibration cracking or poor contact. Utility Model Content

[0004] In order to solve at least one of the problems mentioned in the above background technology, the utility model provides a semiconductor radiator assembly, a vehicle-mounted device and a vehicle, wherein the semiconductor radiator assembly has high heat dissipation efficiency, simple structure, convenient assembly and low cost.

[0005] The specific technical solutions provided by the utility model are as follows:

[0006] In a first aspect, a semiconductor radiator assembly is provided, comprising a circuit board, a chip and an upper cover, wherein the chip is arranged on the circuit board, and further comprising a semiconductor radiator, wherein the semiconductor radiator comprises a radiator body, a radiator wiring harness, a radiator wire end connector and a radiator board end connector, wherein the cold surface of the radiator body is attached to the chip, and the hot surface of the radiator body is arranged on the upper cover, the two ends of the radiator wiring harness are respectively connected to the radiator body and the radiator wire end connector, the radiator wire end connector is arranged in the radiator board end connector, and the radiator board end connector is arranged on the circuit board.

[0007] By means of the above technical scheme, the utility model attaches the cold surface of the radiator body to the chip and sets the hot surface on the upper cover, so that the radiator body cooperates with the upper cover to achieve heat dissipation of the chip, and the heat dissipation efficiency is high. At the same time, the radiator line end connector is arranged in the radiator board end connector. In this way, the installation structure of the semiconductor radiator, the upper cover and the circuit board is simple and easy to assemble. The whole assembly is light in weight and low in cost. At the same time, the semiconductor radiator has high reliability and is easy to replace.

[0008] As a preferred embodiment of the above solution, the heat surface of the radiator body is fixed in a mounting groove on the bottom surface of the upper cover. According to the above solution, fixing the heat surface of the radiator body in the mounting groove is beneficial to saving assembly space.

[0009] As a preferred embodiment of the above scheme, the heat surface of the radiator body is fixed in the installation groove by a thermally conductive adhesive. According to the above scheme, the provision of the thermally conductive adhesive can not only fix the heat surface of the radiator body in the installation groove, but also has a heat conduction function, which can transfer heat from the heat surface of the radiator body to the upper cover, and then achieve heat dissipation through the upper cover.

[0010] As a preferred embodiment of the above solution, the radiator harness is arranged on the upper cover. According to the above solution, the radiator harness is arranged on the upper cover so as to be stored and limited, thereby improving assembly efficiency.

[0011] As a preferred embodiment of the above scheme, the radiator harness is fixed in a positioning groove on the bottom surface of the upper cover. According to the above scheme, by fixing the radiator harness in the positioning groove, the storage efficiency of the radiator harness is further improved, the assembly space is saved, and the fixing effect of the entire semiconductor radiator is improved.

[0012] As a preferred embodiment of the above scheme, the positioning groove includes a first positioning groove and a second positioning groove, the first part of the radiator wiring harness is fixed in the first positioning groove, the second part of the radiator wiring harness is plugged into the second positioning groove, and the second part is close to the radiator wire end connector. According to the above scheme, the cooperation between the first part of the radiator wiring harness and the first positioning groove, and the cooperation between the second part and the second positioning groove enables the radiator wiring harness to be more effectively and stably stored and fixed on the upper cover.

[0013] As a preferred embodiment of the above scheme, the top surface of the upper cover is formed with a first groove and a second groove which are recessed downward, the width of the first groove is greater than the width of the radiator line end connector, the second positioning groove is formed on the inner wall of the first groove, and the second groove is formed with a through groove connected to the circuit board, the through groove is connected to the first groove, and the bottom surface of the second groove is located directly above the radiator board end connector and covers the radiator board end connector. According to the above scheme, the setting of the first groove can not only realize the storage limit of the radiator wiring harness through the second positioning groove, but also after the radiator wiring harness is positioned, the first groove makes it convenient for fingers or tooling to reach in and clamp the radiator wire end connector, so that the radiator wire end connector passes through the through groove of the second groove and then is inserted into the radiator board end connector and is clamped together with the radiator board end connector. The setting of the second groove not only facilitates the radiator wire end connector to pass through and connect with the radiator board end connector through the through groove, but also after the radiator wire end connector and the radiator board end connector are assembled, the bottom surface of the second groove is located directly above the radiator board end connector and covers the radiator board end connector, which can protect the radiator wire end connector and the radiator board end connector and achieve dust prevention at the same time.

[0014] As a preferred embodiment of the above solution, the first part of the radiator harness is fixed in the first positioning groove by dispensing glue or a fastener. According to the above solution, the radiator harness can be conveniently and effectively fixed in the first positioning groove by dispensing glue or adding an additional fastener.

[0015] In a second aspect, a vehicle-mounted device includes the above-mentioned semiconductor radiator assembly and a housing, wherein an upper cover, a circuit board and the housing are fixedly connected by screws, and the circuit board, a chip and a semiconductor radiator are arranged in a cavity formed by the upper cover and the housing.

[0016] By means of the above technical scheme, the utility model first assembles the radiator body, radiator wiring harness and upper cover of the semiconductor radiator together to form the upper cover semi-assembly of the semiconductor radiator, and at this time the radiator wire end connector is on the outside of the upper cover, and the circuit board is also positioned and assembled with the outer shell to form a complete machine, and then the upper cover semi-assembly is assembled with the complete machine. After assembly, the upper cover, the circuit board and the outer shell are fixedly connected by screws, and finally the finger or tooling is extended through the first groove to clamp the radiator wire end connector, so that the radiator wire end connector passes through the through groove of the second groove and extends into the cavity formed by the upper cover and the outer shell, and then the radiator board end connector is inserted and clamped together with the radiator board end connector, thereby completing the assembly of the entire vehicle-mounted device.

[0017] A third aspect provides a vehicle, comprising the above-mentioned vehicle-mounted device.

[0018] By means of the above technical solution, the vehicle-mounted device of the utility model is installed on the vehicle, the circuit board and the chip are responsible for processing the signal, and the semiconductor heat sink cooperates with the upper cover to achieve heat dissipation when the chip is heated, thereby efficiently realizing the signal interaction control of the vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a schematic diagram of the explosion structure of the vehicle-mounted device of the utility model;

[0021] Figure 2 It is a schematic diagram of the three-dimensional structure of the upper cover and part of the semiconductor heat sink of the utility model;

[0022] Figure 3 It is a schematic diagram of the assembly structure of the upper cover and part of the semiconductor radiator of the utility model;

[0023] Figure 4 It is a schematic diagram of a partial top view of the structure of the upper cover of the utility model;

[0024] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure along the AA line;

[0025] Figure 6 It is a schematic cross-sectional view of another part of the vehicle-mounted device of the utility model;

[0026] Figure 7 It is a schematic diagram of the overall structure of the vehicle-mounted device of the utility model. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] The following content is for reference Figures 1 to 7 .

[0029] In the first aspect, the utility model provides a semiconductor radiator assembly, including a circuit board 1, a chip 2 and an upper cover 3. In the present embodiment, the circuit board 1 is a resin circuit board, and the chip 2 is arranged on the circuit board 1, specifically welded on the circuit board 1, and also includes a semiconductor radiator 4, the semiconductor radiator includes a radiator body 41, a radiator wiring harness 42, a radiator wire end connector 43 and a radiator board end connector 44, the cold surface of the radiator body 41 is attached to the chip 2, specifically, in the present embodiment, a tolerance gap is assembled between the chip 2 and the radiator body 41, and the gap is filled with heat dissipation glue 5, which further improves the heat dissipation efficiency of the radiator body 41 to the chip 2, the hot surface of the radiator body 41 is arranged on the upper cover 3, and the two ends of the radiator wiring harness 42 are respectively connected to the radiator body 41 and the radiator wire end connector 43, the radiator wire end connector 43 is arranged in the radiator board end connector 44, the radiator board end connector 44 is arranged on the circuit board 1, and in the present embodiment, the radiator board end connector 44 is welded on the circuit board 1.

[0030] The upper cover 3 in this embodiment is a metal upper cover 3, and the material of the metal upper cover is usually aluminum alloy, magnesium alloy, etc. Different metal materials can be selected according to the heat dissipation requirements. Copper material, VC (vacuum chamber heat sink), heat pipe and other heat dissipation means can also be embedded in the corresponding part of the hot surface of the radiator body according to the heat dissipation needs. At the same time, a plurality of heat dissipation grooves 31 are formed on the top surface of the metal upper cover 3 on the upper side of the radiator body 41. The heat dissipation grooves 31 are evenly arranged and do not penetrate the bottom surface of the metal upper cover 3. The upper cover at the heat dissipation grooves 31 forms heat dissipation fins. The setting of the heat dissipation grooves 31 can increase the heat dissipation area and accelerate the heat dissipation of the chip 2.

[0031] The utility model has the cold surface of the radiator body 41 attached to the chip 2 and the hot surface arranged on the upper cover 3, so that the radiator body 41 cooperates with the upper cover 3 to achieve heat dissipation of the chip 2, and the heat dissipation efficiency is high. At the same time, the radiator line end connector 43 is arranged in the radiator board end connector 44, so that the installation structure of the semiconductor radiator 4 and the upper cover 3 and the circuit board 2 is simple and easy to assemble. The whole assembly is light in weight and low in cost. At the same time, the semiconductor radiator 4 has high reliability and is easy to replace.

[0032] The hot surface of the radiator body 41 is fixed in the mounting groove 32 on the bottom surface of the upper cover 3. Fixing the hot surface of the radiator body 41 in the mounting groove 32 is conducive to saving assembly space. The hot surface of the radiator body 41 is fixed in the mounting groove 32 by the thermal conductive adhesive 6. The provision of the thermal conductive adhesive 6 can not only fix the hot surface of the radiator body 41 in the mounting groove 32, but also has a heat conduction function, which can transfer heat from the hot surface of the radiator body 41 to the upper cover 3, and then achieve heat dissipation through the upper cover 3.

[0033] The radiator harness 42 is arranged on the upper cover 3. By arranging the radiator harness 42 on the upper cover 3, the radiator harness 42 is stored and limited, thereby improving the assembly efficiency. The radiator harness 42 is fixed in the positioning groove on the bottom surface of the upper cover 3. By fixing the radiator harness 42 in the positioning groove, the storage efficiency of the radiator harness 42 is further improved, the assembly space is saved, and the fixing effect of the entire semiconductor radiator 4 is good. The positioning groove includes a first positioning groove 331 and a second positioning groove 332. The first part of the radiator harness 42 (not shown) is fixed in the first positioning groove 331, and the second part of the radiator harness 42 (not shown) is plugged into the second positioning groove 332, and the second part is close to the radiator wire end connector 43. The cooperation between the first part of the radiator harness 42 and the first positioning groove 331, and the cooperation between the second part and the second positioning groove 332 enable the radiator harness 42 to be more effectively and stably stored and fixed on the upper cover 3. The first part of the radiator harness 42 is fixed in the first positioning groove 331 by dispensing glue or a snap-on member (not shown). The radiator harness 42 can be conveniently and effectively fixed in the first positioning groove 331 by dispensing glue or adding an additional snap-on member. In this embodiment, the snap-on member can be a snap-on plastic cover.

[0034] The top surface of the upper cover 3 is formed with a downwardly recessed first groove 34 and a second groove 35, the width of the first groove 34 is greater than the width of the radiator wire end connector 43, so that the radiator wire end connector 43 can be easily inserted into the first groove 34, the second positioning groove 332 is formed on the inner wall of the first groove 34, and the second groove 35 is formed with a through groove 351 connected to the circuit board 1, the through groove 351 is connected to the first groove 34, and the bottom surface of the second groove 35 is located directly above the radiator board end connector 44 and covers the radiator board end connector 44. The setting of the first groove 34 can not only realize the storage limit of the radiator wire harness 42 through the second positioning groove 332, but also after the radiator wire harness 42 is positioned, the first groove 34 is convenient for fingers or tooling to reach in and clamp the radiator wire end connector 43, so that the radiator wire end connector 43 passes through the through groove 351 of the second groove 35 and then is inserted into the radiator board end connector 44 and is clamped together with the radiator board end connector 44. The setting of the second groove 35 not only facilitates the radiator wire end connector 43 to pass through and connect with the radiator board end connector 44 through the through groove 351, but also after the radiator wire end connector 43 and the radiator board end connector 44 are assembled, the bottom surface of the second groove 35 is located directly above the radiator board end connector 44 and covers the radiator board end connector 44, which can protect the radiator wire end connector 43 and the radiator board end connector 44 and achieve dust prevention at the same time. In this embodiment, the depth of the first groove 34 is greater than that of the second groove 35, so that the first groove 34 not only ensures that the radiator wire harness 42 can pass through the second positioning groove 332 thereon, but also ensures that the radiator wire end connector 43 can extend into the lower side of the upper cover 3 through the first groove 34. In this embodiment, the bottom surface of the first groove 34 is also provided with a connecting groove 341 connected to the through groove 351 and the circuit board 1, and the connecting groove 341 is also connected to the second positioning groove 351. The setting of the connecting groove 341 makes it more convenient for the radiator wire end connector 43 to extend into the lower side of the upper cover 3 and connect with the radiator board end connector 44.

[0035] In the second aspect, the utility model provides a vehicle-mounted device. In other embodiments, the vehicle-mounted device can also be an electronic device of other electronic products, which is not limited by the utility model. The vehicle-mounted device of this embodiment can be a vehicle-mounted control host or other vehicle-mounted equipment. Other vehicle-mounted equipment includes information navigation equipment, security monitoring equipment, entertainment and interconnection equipment, charging equipment, etc. The information navigation equipment includes a vehicle-mounted navigator, a driving recorder, a GPS navigator, etc. The security monitoring equipment includes a reversing radar, a reversing image, a driving recorder, etc. The entertainment and interconnection equipment includes a vehicle-mounted audio system, a vehicle-mounted entertainment screen, a vehicle-mounted TV, etc. The charging equipment includes a vehicle-mounted charger, a vehicle-mounted power supply, etc. The vehicle-mounted device includes the above-mentioned semiconductor radiator assembly and a shell 7. In this embodiment, the shell 7 is made of plastic or metal. The upper cover 3, the circuit board 1 and the shell 7 are fixedly connected by screws 8. The circuit board 1, the chip 2 and the semiconductor radiator 4 are arranged in a cavity formed by the upper cover 3 and the shell 7.

[0036] The utility model first assembles the radiator body 41, the radiator wiring harness 42 and the upper cover 3 of the semiconductor radiator 4 to form the upper cover semi-assembly of the semiconductor radiator 4, and at this time the radiator wire end connector 43 is on the outside of the upper cover 3, and the circuit board 1 is also positioned and assembled with the shell 7 to form a complete machine, and then the upper cover semi-assembly is assembled with the complete machine. After assembly, the upper cover 3, the circuit board 1 and the shell 7 are fixedly connected by screws 8, and finally a finger or a tool is inserted through the first groove 34 to clamp the radiator wire end connector 43, so that the radiator wire end connector 43 passes through the through groove 351 of the second groove 35 and extends into the cavity formed by the upper cover 3 and the shell 7, and then the radiator board end connector 44 is inserted and clamped together with the radiator board end connector 44, thereby completing the assembly of the entire vehicle-mounted device.

[0037] After assembly, the bottom surface of the first groove 34 in the vehicle-mounted device is close to the circuit board 1 and has a clearance fit, and the bottom surface of the second groove 35 is close to the radiator board-end connector 44 and has a clearance fit, so as to prevent the upper cover 3 from pressing the circuit board 1 and generating interference stress on the circuit board 1. At the same time, after assembly, part of the circuit board 1 will be exposed at the connecting groove 341 and the through groove 351 of the upper cover 3, and a small dustproof plastic cover (not shown) can be added to this part of the upper cover 3, so that the entire circuit board 1 can be effectively dustproof.

[0038] When the assembled vehicle-mounted device is working, the heat generated by the heating chip 2 is transferred to the cold surface of the radiator body 41 through the heat dissipation glue 5, and then transferred from the hot surface of the radiator body 41 to the metal cover 3 through the thermal conductive adhesive 6. The heat dissipation groove 31 on the outside of the metal cover 3 is exposed to the air, and the natural convection of the air can form a heat dissipation effect, thus forming an effective heat dissipation closed loop, thereby achieving effective heat dissipation of the heating chip 2.

[0039] In a third aspect, the utility model provides a vehicle, comprising the above-mentioned vehicle-mounted device.

[0040] The vehicle-mounted device of the utility model is mounted on a vehicle, the circuit board 1 and the chip 2 are responsible for processing signals, and the semiconductor heat sink 4 cooperates with the upper cover 3 to achieve heat dissipation when the chip 2 is heated, thereby efficiently realizing signal interaction control of the vehicle.

[0041] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0042] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A semiconductor heat sink assembly, comprising a circuit board, a chip and an upper cover, wherein the chip is arranged on the circuit board, characterized in that: It also includes a semiconductor radiator, which includes a radiator body, a radiator wiring harness, a radiator wire end connector and a radiator board end connector. The cold surface of the radiator body is attached to the chip, and the hot surface of the radiator body is arranged on the upper cover. The two ends of the radiator wiring harness are respectively connected to the radiator body and the radiator wire end connector. The radiator wire end connector is arranged in the radiator board end connector, and the radiator board end connector is arranged on the circuit board.

2. The semiconductor heat sink assembly according to claim 1, characterized in that: The heat surface of the radiator body is fixed in the mounting groove of the bottom surface of the upper cover.

3. The semiconductor heat sink assembly according to claim 2, characterized in that: The heat surface of the heat sink body is fixed in the mounting groove by means of heat-conducting adhesive.

4. The semiconductor heat sink assembly according to claim 1, characterized in that: The radiator wiring harness is arranged on the upper cover.

5. The semiconductor heat sink assembly according to claim 4, characterized in that: The radiator wiring harness is fixed in a positioning groove on the bottom surface of the upper cover.

6. The semiconductor heat sink assembly according to claim 5, characterized in that: The positioning groove includes a first positioning groove and a second positioning groove, and the radiator wiring harness includes a first part and a second part, the first part is fixed in the first positioning groove, and the second part is inserted in the second positioning groove, wherein the second part is close to the radiator wire end connector.

7. The semiconductor heat sink assembly according to claim 6, characterized in that: The top surface of the upper cover is formed with a first groove and a second groove which are recessed downwards, the width of the first groove is greater than the width of the radiator line end connector, the second positioning groove is formed on the inner wall of the first groove, and the second groove is formed with a through groove which is connected to the circuit board, the through groove is connected to the first groove, and the bottom surface of the second groove is located directly above the radiator board end connector and covers the radiator board end connector.

8. The semiconductor heat sink assembly according to claim 6, characterized in that: The first part is fixed in the first positioning groove by glue dispensing or a snap fastener.

9. A vehicle-mounted device, characterized in that: It comprises a semiconductor heat sink assembly and a housing as described in any one of claims 1 to 8, wherein the semiconductor heat sink assembly comprises a circuit board, a chip, an upper cover and a semiconductor heat sink, wherein the upper cover, the circuit board and the housing are fixedly connected by screws, and the circuit board, the chip and the semiconductor heat sink are arranged in a cavity formed by the upper cover and the housing.

10. A vehicle, characterized in that: Comprising the vehicle-mounted device as claimed in claim 9.

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