Multi-chip packaging structure based on TSV

Abstract

The utility model discloses a TSV-based multi-chip packaging structure, which relates to the technical field of chip packaging and comprises a bottom box, a first partition plate, a second partition plate and a heat dissipation structure, the upper surface of the bottom box is fixedly connected with a cover plate, one end of the bottom box is internally provided with the first partition plate, and the other end of the bottom box is internally provided with the second partition plate. A first chip, a second chip and a third chip are arranged between the first partition plate and the second partition plate, and the sides, away from each other, of the first partition plate and the second partition plate are each provided with a set of heat dissipation structures. The first heat conduction silica gel rod, the second heat conduction silica gel rod and the third heat conduction silica gel rod are used as media to be transmitted to the heat dissipation fins, meanwhile, air enters and exits the bottom box from the heat dissipation holes in the outer surfaces of the two sides of the two ends of the bottom box, heat adsorbed by the heat dissipation fins is dissipated when the air enters and exits the bottom box, and the service life of a chip is effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a multi-chip packaging structure based on TSV. Background Art

[0002] Chip packaging is an important step in the semiconductor manufacturing process, which involves protecting the manufactured integrated circuit (IC) chip in a housing or package to facilitate its installation and use. This process not only protects the chip from physical damage and environmental impact, but also provides the necessary electrical connections. The multi-chip package (MCP) structure based on TSV (Through-Silicon Via) has been improved in recent years to solve its inherent challenges and further improve performance and reliability.

[0003] After searching, it was found that the Chinese patent with application number 201921210552.X disclosed a multi-chip packaging structure based on TSV, including an interconnection structure; a first chip, arranged on the interconnection structure; an adapter plate, arranged on the interconnection structure, the adapter plate and the first chip are located on the same side of the interconnection structure, and the thickness of the adapter plate is greater than the first chip; the second chip, the second chip is arranged on the adapter plate and arranged opposite to the interconnection structure; and a packaging layer. By setting the interconnection structure and the adapter plate, the adapter plate has a certain thickness, and the second chip is mounted on the adapter plate, so that the first chip and the second chip can be on two planes at different heights, thereby realizing three-dimensional packaging between multiple chips. Compared with the prior art, in the packaging structure provided by the utility model, the sum of the sizes of the first chip and the second chip does not have to be limited to the size of the plane size of the interconnection structure, thereby expanding the diversified development of the chip packaging structure.

[0004] The above utility model has the following problems:

[0005] 1. Heat is concentrated in the multi-chip stacking structure, and traditional heat dissipation methods may not be sufficient to effectively dissipate heat. If the chip is not cooled in time, it will cause damage to the chip and reduce the service life of the chip.

[0006] 2. The difference in thermal expansion coefficients of different materials will cause thermomechanical stress, leading to interface failure between TSV and surrounding materials, reducing the service life of the chip.

[0007] Therefore, those skilled in the art provide a multi-chip packaging structure based on TSV to solve the problems raised in the above background technology. Utility Model Content

[0008] The purpose of the utility model is to provide a multi-chip packaging structure based on TSV to solve the problems raised in the above background technology.

[0009] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0010] A multi-chip packaging structure based on TSV includes a base box, a first partition, a second partition and a heat dissipation structure, wherein a cover plate is fixedly connected to the upper surface of the base box, a first partition is arranged inside one end of the base box, and a second partition is arranged inside the other end of the base box, a first chip, a second chip and a third chip are arranged between the first partition and the second partition, and a group of heat dissipation structures are respectively arranged on the side away from each other of the first partition and the second partition, and the heat dissipation structure includes a first thermally conductive silicone rod, a second thermally conductive silicone rod, a third thermally conductive silicone rod and heat dissipation fins, and the first thermally conductive silicone rod, the second thermally conductive silicone rod and the third thermally conductive silicone rod are respectively arranged in two groups, and a plurality of groups of heat dissipation fins are fixedly connected to the outer surfaces of one end of the two groups of the first thermally conductive silicone rod, the second thermally conductive silicone rod and the third thermally conductive silicone rod.

[0011] As a further solution of the utility model: four groups of first shock-absorbing rubber pads are fixedly connected to the lower surface of the cover plate.

[0012] As a further solution of the utility model: four groups of second shock-absorbing rubber pads are fixedly connected to the bottom of the bottom box, and a plurality of groups of heat dissipation holes are respectively opened on the outer surfaces of both sides of the two ends of the bottom box.

[0013] As a further solution of the utility model: the first partition is fixedly connected to the inner wall of the bottom box, six groups of through holes are opened on the side surface of the first partition, and the first rubber ring is fixedly connected inside the six groups of through holes on the side surface of the first partition.

[0014] As a further solution of the utility model: the second partition is fixedly connected to the inner wall of the bottom box, six groups of through holes are opened on the side surface of the second partition, and a second rubber ring is fixedly connected inside the six groups of through holes on the side surface of the second partition.

[0015] As a further solution of the utility model: one end of the two groups of first thermally conductive silicone rods in the two groups of heat dissipation structures respectively passes through the first rubber ring and the second rubber ring to extend to the lower surface of the first chip, one end of the two groups of second thermally conductive silicone rods in the two groups of heat dissipation structures respectively passes through the first rubber ring and the second rubber ring to extend to the lower surface of the second chip, and one end of the two groups of third thermally conductive silicone rods in the two groups of heat dissipation structures respectively passes through the first rubber ring and the second rubber ring to extend to the lower surface of the third chip.

[0016] As a further solution of the utility model: the upper surface of the first chip is attached to the lower surfaces of four groups of first shock-absorbing rubber pads, the lower surface of the first chip is fixedly connected to the four groups of buffer rubber pads, and the lower surfaces of the four groups of buffer rubber pads are fixedly connected to the upper surface of the second chip.

[0017] As a further solution of the utility model: the lower surface of the third chip is attached to the upper surfaces of four groups of second shock-absorbing rubber pads, the upper surface of the third chip is fixedly connected to the four groups of buffer rubber pads, and the upper surfaces of the four groups of buffer rubber pads are fixedly connected to the lower surface of the second chip.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] 1. By providing a heat dissipation structure, when the first chip, the second chip and the third chip are working, heat is generated, and the heat is transferred to the first thermally conductive silicone rod, the second thermally conductive silicone rod and the third thermally conductive silicone rod, and then transferred to the heat dissipation fins through the first thermally conductive silicone rod, the second thermally conductive silicone rod and the third thermally conductive silicone rod as a medium, and the heat dissipation fins increase the contact area with the air. At the same time, the air enters and exits the bottom box from the heat dissipation holes on the outer surfaces of both ends of the bottom box. When the air enters and exits the bottom box, the heat absorbed by the heat dissipation fins is dissipated, thereby avoiding long-term high temperature of the chip and effectively improving the service life of the chip;

[0020] 2. By providing a first shock-absorbing rubber pad, a second shock-absorbing rubber pad and a buffer rubber pad, when the first chip, the second chip and the third chip generate thermal mechanical stress during operation and approach each other, the first shock-absorbing rubber pad plays a role of buffering the first chip and the cover plate to prevent hard contact between the first chip and the cover plate; the buffer rubber pads on the upper and lower surfaces of the second chip play a role of energy absorption and buffering to prevent hard contact between the second chip and the first chip and the third chip; the second shock-absorbing rubber pad plays a role of buffering between the third chip and the bottom box to prevent hard contact between the third chip and the bottom box, thereby avoiding interface failure between TSV and surrounding materials and effectively improving the service life of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a multi-chip packaging structure based on TSV.

[0022] Figure 2 The figure is a schematic diagram of the decomposed structure of a multi-chip packaging structure based on TSV.

[0023] Figure 3 The present invention is a schematic diagram of the decomposed structure of a heat dissipation structure, a first chip, a second chip and a third chip in a multi-chip packaging structure based on TSV.

[0024] Figure 4 The figure is a schematic diagram of the decomposed structure of the first partition plate and the heat dissipation structure in a multi-chip packaging structure based on TSV.

[0025] Figure 5 The figure is a schematic diagram of the decomposed structure of the second partition plate and the heat dissipation structure in a multi-chip packaging structure based on TSV.

[0026] In the figure: 1. bottom box; 2. cover plate; 3. first partition plate; 4. second partition plate; 5. heat dissipation structure; 6. first chip; 7. second chip; 8. third chip; 9. first thermally conductive silicone rod; 10. second thermally conductive silicone rod; 11. third thermally conductive silicone rod; 12. heat dissipation fin; 13. first shock-absorbing rubber pad; 14. second shock-absorbing rubber pad; 15. first rubber ring; 16. second rubber ring; 17. buffer rubber pad. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Example 1

[0029] Reference Figure 1-Figure 5 The embodiment provides a multi-chip packaging structure based on TSV, including a bottom box 1, a first partition 3, a second partition 4 and a heat dissipation structure 5. The upper surface of the bottom box 1 is fixedly connected with a cover plate 2, and the cover plate 2 is convenient for protecting the internal structure of the bottom box 1. The first partition 3 is arranged inside one end of the bottom box 1, and the second partition 4 is arranged inside the other end of the bottom box 1. A first chip 6, a second chip 7 and a third chip 8 are arranged between the first partition 3 and the second partition 4. A group of heat dissipation structures 5 are respectively arranged on the side away from each other of the first partition 3 and the second partition 4. The first partition 3 and the second partition 4 isolate the two groups of heat dissipation structures 5 from the first chip 6, the second chip 7 and the third chip 8. Chip 8, to prevent the dust in the external air from affecting the first chip 6, the second chip 7 and the third chip 8 when the heat dissipation structure 5 is in use, the heat dissipation structure 5 includes a first thermally conductive silicone rod 9, a second thermally conductive silicone rod 10, a third thermally conductive silicone rod 11 and heat dissipation fins 12, the first thermally conductive silicone rod 9, the second thermally conductive silicone rod 10 and the third thermally conductive silicone rod 11 are respectively provided with two groups, and the outer surfaces of one ends of the two groups of first thermally conductive silicone rods 9, the second thermally conductive silicone rods 10 and the third thermally conductive silicone rods 11 are fixedly connected with a plurality of groups of heat dissipation fins 12, and the first thermally conductive silicone rods 9, the second thermally conductive silicone rods 10 and the third thermally conductive silicone rods 11 are thermally conductive insulating materials.

[0030] Among them, a plurality of heat dissipation holes are respectively provided on the outer surfaces of both ends of the bottom box 1, and air enters and exits the bottom box 1 from the heat dissipation holes on the outer surfaces of both ends of the bottom box 1, and the heat absorbed by the heat dissipation fins 12 is dissipated when the air enters and exits the bottom box 1. One end of the two groups of first heat-conducting silicone rods 9 in the two groups of heat dissipation structures 5 respectively passes through the first rubber ring 15 and the second rubber ring 16 to extend to the lower surface of the first chip 6, one end of the two groups of second heat-conducting silicone rods 10 in the two groups of heat dissipation structures 5 respectively passes through the first rubber ring 15 and the second rubber ring 16 to extend to the lower surface of the second chip 7, and one end of the two groups of third heat-conducting silicone rods 11 in the two groups of heat dissipation structures 5 respectively passes through the first rubber ring 15 and the second rubber ring 16 to extend to the lower surface of the third chip 8. When the first chip 6, the second chip 7 and the third chip 8 are not hindered from working, the first heat-conducting silicone rod 9, the second heat-conducting silicone rod 10 and the third heat-conducting silicone rod 11 absorb the heat generated when the first chip 6, the second chip 7 and the third chip 8 are working and transfer the heat to the heat dissipation fins 12.

[0031] The working principle of this embodiment is as follows:

[0032] When the first chip 6, the second chip 7 and the third chip 8 are working, heat is generated, and the heat is transferred to the first thermally conductive silicone rod 9, the second thermally conductive silicone rod 10 and the third thermally conductive silicone rod 11, and is transferred to the heat dissipation fins 12 through the first thermally conductive silicone rod 9, the second thermally conductive silicone rod 10 and the third thermally conductive silicone rod 11 as the medium. The heat dissipation fins 12 increase the contact area with the air. At the same time, the air enters and exits the bottom box 1 from the heat dissipation holes on the outer surfaces at both ends of the bottom box 1, and the heat absorbed by the heat dissipation fins 12 is dissipated when the air enters and exits the bottom box 1.

[0033] Example 2

[0034] Refer to the figure Figure 2-Figure 5 This embodiment is based on the previous embodiment, and is different from the previous embodiment in that:

[0035] Among them, four groups of first shock-absorbing rubber pads 13 are fixedly connected to the lower surface of the cover plate 2, and the first shock-absorbing rubber pads 13 play a role of energy absorption and buffering.

[0036] Among them, four groups of second shock-absorbing rubber pads 14 are fixedly connected to the bottom of the bottom box 1, and the second shock-absorbing rubber pads 14 play a role of energy absorption and buffering.

[0037] Among them, the first partition 3 is fixedly connected to the inner wall of the bottom box 1, and six groups of through holes are opened on the side surface of the first partition 3. The first rubber ring 15 is fixedly connected inside the six groups of through holes on the side surface of the first partition 3. The first rubber ring 15 plays a role in sealing the through holes on the side surface of the first partition 3.

[0038] Among them, the second partition 4 is fixedly connected to the inner wall of the bottom box 1, and six groups of through holes are opened on the side surface of the second partition 4. The second rubber ring 16 is fixedly connected inside the six groups of through holes on the side surface of the second partition 4. The second rubber ring 16 plays a role in sealing the through holes on the side surface of the second partition 4.

[0039] Among them, the upper surface of the first chip 6 is attached to the lower surfaces of four groups of first shock-absorbing rubber pads 13, and the first shock-absorbing rubber pads 13 play a role in buffering the first chip 6 and the cover plate 2 to prevent hard contact between the first chip 6 and the cover plate 2. Four groups of buffer rubber pads 17 are fixedly connected to the lower surface of the first chip 6, and the lower surfaces of the four groups of buffer rubber pads 17 are fixedly connected to the upper surface of the second chip 7, and the buffer rubber pads 17 play a role in energy absorption and buffering.

[0040] Among them, the lower surface of the third chip 8 is attached to the upper surface of four groups of second shock-absorbing rubber pads 14, and the second shock-absorbing rubber pads 14 play a role of buffering between the third chip 8 and the bottom box 1 to prevent hard contact between the third chip 8 and the bottom box 1. The lower surface of the first chip 6 is fixedly connected to the buffer rubber pad 17, and the lower surface of the buffer rubber pad 17 is fixedly connected to the upper surface of the second chip 7, and the buffer rubber pad 17 plays a role of energy absorption and buffering.

[0041] The working principle of this embodiment is as follows:

[0042] When the first chip 6, the second chip 7 and the third chip 8 generate thermal mechanical stress during operation and approach each other, the first shock-absorbing rubber pad 13 plays a role of buffering the first chip 6 and the cover plate 2 to prevent hard contact between the first chip 6 and the cover plate 2. The buffer rubber pads 17 on the upper and lower surfaces of the second chip 7 play a role of energy absorption and buffering to prevent hard contact between the second chip 7 and the first chip 6 and the third chip 8. The second shock-absorbing rubber pad 14 plays a role of buffering the third chip 8 and the bottom box 1 to prevent hard contact between the third chip 8 and the bottom box 1.

[0043] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0044] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A multi-chip packaging structure based on TSV, comprising a base box (1), a first partition (3), a second partition (4) and a heat dissipation structure (5), characterized in that: The upper surface of the bottom box (1) is fixedly connected with a cover plate (2); a first partition plate (3) is arranged inside one end of the bottom box (1); a second partition plate (4) is arranged inside the other end of the bottom box (1); a first chip (6), a second chip (7) and a third chip (8) are arranged between the first partition plate (3) and the second partition plate (4); a group of heat dissipation structures (5) are respectively arranged on the side away from each other of the first partition plate (3) and the second partition plate (4); the heat dissipation structure (5) comprises a first heat-conducting silicone rod (9), a second heat-conducting silicone rod (10), a third heat-conducting silicone rod (11) and heat dissipation fins (12); two groups of the first heat-conducting silicone rod (9), the second heat-conducting silicone rod (10) and the third heat-conducting silicone rod (11) are respectively arranged; and a plurality of groups of heat dissipation fins (12) are fixedly connected to the outer surfaces of one end of the two groups of the first heat-conducting silicone rod (9), the second heat-conducting silicone rod (10) and the third heat-conducting silicone rod (11).

2. The multi-chip packaging structure based on TSV according to claim 1, characterized in that: Four groups of first shock-absorbing rubber pads (13) are fixedly connected to the lower surface of the cover plate (2).

3. The multi-chip packaging structure based on TSV according to claim 1, characterized in that: Four groups of second shock-absorbing rubber pads (14) are fixedly connected to the inner bottom of the bottom box (1), and a plurality of groups of heat dissipation holes are respectively provided on the outer surfaces of both ends of the bottom box (1).

4. The multi-chip packaging structure based on TSV according to claim 1, characterized in that: The first partition plate (3) is fixedly connected to the inner wall of the bottom box (1), and six groups of through holes are opened on the side surface of the first partition plate (3). First rubber rings (15) are fixedly connected inside the six groups of through holes on the side surface of the first partition plate (3).

5. The multi-chip packaging structure based on TSV according to claim 1, characterized in that: The second partition plate (4) is fixedly connected to the inner wall of the bottom box (1), and six groups of through holes are opened on the side surface of the second partition plate (4). A second rubber ring (16) is fixedly connected inside the six groups of through holes on the side surface of the second partition plate (4).

6. The multi-chip packaging structure based on TSV according to claim 1, characterized in that: One end of the two groups of first heat-conducting silicone rods (9) in the two groups of heat-dissipating structures (5) respectively passes through the first rubber ring (15) and the second rubber ring (16) to extend to the lower surface of the first chip (6); one end of the two groups of second heat-conducting silicone rods (10) in the two groups of heat-dissipating structures (5) respectively passes through the first rubber ring (15) and the second rubber ring (16) to extend to the lower surface of the second chip (7); and one end of the two groups of third heat-conducting silicone rods (11) in the two groups of heat-dissipating structures (5) respectively passes through the first rubber ring (15) and the second rubber ring (16) to extend to the lower surface of the third chip (8).

7. The multi-chip packaging structure based on TSV according to claim 1, characterized in that: The upper surface of the first chip (6) is attached to the lower surfaces of four groups of first shock-absorbing rubber pads (13), the lower surface of the first chip (6) is fixedly connected to the four groups of buffer rubber pads (17), and the lower surfaces of the four groups of buffer rubber pads (17) are fixedly connected to the upper surface of the second chip (7).

8. The multi-chip packaging structure based on TSV according to claim 1, characterized in that: The lower surface of the third chip (8) is attached to the upper surfaces of the four groups of second shock-absorbing rubber pads (14); the upper surface of the third chip (8) is fixedly connected to the four groups of buffer rubber pads (17); and the upper surfaces of the four groups of buffer rubber pads (17) are fixedly connected to the lower surface of the second chip (7).

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