Electric connector

Abstract

The utility model discloses an electric connector, which comprises a circuit board and a cable, the circuit board is provided with a signal guide connection part exposed on the outer surface of the circuit board and a grounding groove concavely arranged inwards from the outer surface of the circuit board, the signal guide connection part and the grounding groove are arranged in a row along the left-right direction, and conductive layers are uniformly distributed on the inner circumferential wall of the grounding groove; the cable comprises a signal conductor and a grounding conductor, the signal conductor comprises a signal conduction part in contact with the signal conduction part, the grounding conductor comprises a grounding conduction part arranged in the grounding groove, the signal conduction part and the grounding conduction part are arranged in the left-right direction, and the grounding conduction part is conducted with the conductive layer; viewed from the left-right direction, the projections of the signal conduction part and the grounding conduction part are staggered, so that the opposite area between the signal conduction part and the grounding conduction part is reduced, the induction is increased, the impedance is increased, and the impedance matching is realized; meanwhile, signals, diverged in the left-right direction in the circuit board, of the signal guide connection part can be shielded by the conductive layer, so that crosstalk is reduced.

Description

[Technical field]

[0001] The utility model relates to an electric connector, in particular to an electric connector capable of realizing impedance matching and reducing crosstalk. [Background technology]

[0002] A commonly used electrical connector, such as Chinese patent CN206650244U, includes a circuit board and a connecting wire component. The circuit board includes an upper circuit layer, a lower circuit layer and a shielding layer. The outer surface of the upper circuit layer has an upper contact and a grounding conductive contact. The connecting wire component includes an upper conductive wire group. The upper conductive wire group includes an upper core wire exposed portion and a grounding wire. The upper core wire exposed portion is electrically connected to the upper contact, and the grounding wire is connected to the grounding conductive contact. The inventor of the present application found that the upper core wire exposed portion and the grounding wire are arranged horizontally and side by side and are both made of metal materials. The two metal materials are close to each other and the projections of the two along their arrangement direction completely overlap, so that the area where the upper core wire exposed portion and the grounding wire are connected to the upper contact and the grounding conductive contact respectively presents capacitive, and the low impedance of this area is not conducive to impedance matching.

[0003] At the same time, the shielding layer is set between the upper circuit layer and the lower circuit layer, and the shielding layer is set parallel to the circuit board, while the signal is diffused in all directions. The existing shielding layer can shield the signal in the up and down directions, but cannot shield the signal in the left and right directions, so crosstalk is easy to occur.

[0004] Therefore, it is necessary to provide a new electrical connector to solve the above problems. [Contents of the utility model]

[0005] The invention aims to provide an electrical connector, wherein a signal conducting part contacts a signal conducting part exposed on the outer surface of a circuit board, a ground conducting part is placed in a grounding groove and is connected to a conductive layer, and the projections of the signal conducting part and the ground conducting part are misaligned when viewed from the left and right directions, thereby reducing the facing area between the signal conducting part and the ground conducting part, so as to increase the impedance and achieve impedance matching; the inner peripheral wall of the grounding groove is evenly provided with a conductive layer, and the signal emitted by the signal conducting part to the left and right directions inside the circuit board can be shielded by the conductive layer, so as to reduce crosstalk.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An electrical connector, characterized in that it includes: a circuit board; the circuit board is provided with a signal conducting portion exposed on its outer surface and a grounding groove recessed inward from its outer surface, the signal conducting portion and the grounding groove are arranged in a row along the left-right direction, and the inner peripheral wall of the grounding groove is evenly provided with a conductive layer; a cable, which includes a signal conductor and a grounding conductor, the signal conductor includes a signal conducting portion contacting the signal conducting portion, the grounding conductor includes a grounding conducting portion disposed in the grounding groove, the signal conducting portion and the grounding conducting portion are arranged along the left-right direction, and the grounding conducting portion is conductively connected to the conductive layer; when viewed from the left-right direction, the projections of the signal conducting portion and the grounding conducting portion are misaligned.

[0008] Furthermore, the circuit board includes a first recessed portion and a second recessed portion formed inwardly from the same board surface, and an intermediate portion located between the first recessed portion and the second recessed portion, and the bottom surfaces of the first recessed portion and the second recessed portion are located in the same horizontal plane; the circuit board is provided with a signal contact portion exposed at the bottom surface of the second recessed portion, and a bridge portion connecting the signal conducting portion and the signal contact portion, the signal conducting portion is exposed at the bottom surface of the first recessed portion, and when viewed from the left and right directions, the signal conducting portion, the bridge portion and the signal contact portion are located in the same horizontal plane, the signal contact portion is the input end or output end of the signal transmitted on the circuit board, and the signal conducting portion is the output end or input end of the signal transmitted on the circuit board.

[0009] Furthermore, viewed from the top and bottom directions, the width of the bridge portion is smaller than the width of the signal contact portion, the bridge portion is at least partially disposed in the middle portion, and a shielding layer is disposed between the outer surface of the middle portion and the bridge portion along the top and bottom directions.

[0010] Further, the circuit board includes a first portion, a second portion and a middle portion located between the first portion and the second portion; viewed from the left and right directions, the length of the first portion is smaller than the length of the middle portion, and the length of the middle portion is smaller than the length of the second portion.

[0011] Furthermore, the grounding groove runs through the circuit board from top to bottom, and the circuit board includes an upper circuit layer and a lower circuit layer. The upper circuit layer is provided with a signal conducting portion exposed on its outer surface, and the lower circuit layer is provided with a signal conducting portion exposed on its outer surface, and the signal conducting portion of the upper circuit layer and the signal conducting portion of the lower circuit layer are arranged correspondingly; the cables include an upper row of cables and a lower row of cables, and the grounding conducting portion of the upper row of cables and the grounding conducting portion of the lower row of cables are arranged correspondingly and are placed in the same grounding groove to conduct with the conductive layer.

[0012] Furthermore, a gap is provided between the ground conductive part and the conductive layer along the front-back direction, and solder is provided in the gap, and the solder connects the ground conductive part and the conductive layer.

[0013] Furthermore, a shielding layer is provided in the circuit board, a grounding hole is provided in the shielding layer, and a conductive layer is arranged on the inner peripheral wall of the grounding hole.

[0014] Furthermore, the circuit board includes a first part, a second part and an intermediate part located between the first part and the second part, a first through hole arranged inside the intermediate part and a second through hole arranged inside the second part, and a shielding layer spanning the first part, the intermediate part and the second part; along the up and down direction, the first part is recessed inward to form the grounding groove, and the second part is provided with a grounding contact part exposed on its outer surface; along the up and down direction, the first through hole is connected to the shielding layer, one side of the second through hole is connected to the grounding contact part and the other side is connected to the shielding layer, and the conductive layer is connected to the shielding layer.

[0015] Furthermore, a shielding layer is provided in the middle portion, and along the up-down direction, the shielding layer is located between the outer surface of the middle portion and the ground connection portion, and one side of the first through hole is connected to the shielding layer and the other side is connected to the shielding layer.

[0016] Furthermore, the grounding conductor includes a bent portion connected to the grounding conductive portion, the bent portion is partially disposed in the grounding groove, and along the up and down direction, the outer peripheral surface of the grounding conductive portion is lower than the outer surface of the circuit board.

[0017] Compared with the prior art, the technical solution of the utility model has the following beneficial effects:

[0018] The signal conducting part is in contact with the signal conducting part exposed on the outer surface of the circuit board, and the ground conducting part is placed in the grounding groove and is connected to the conductive layer. The projections of the signal conducting part and the ground conducting part are misaligned when viewed from the left and right directions, thereby reducing the area directly facing each other between the signal conducting part and the ground conducting part, increasing the inductance to increase the impedance, and achieving impedance matching. The ground conducting part is placed in the grounding groove, and there is no shielding of the ground conducting part beside the signal conducting part, that is, in the left and right directions. However, the inner peripheral wall of the grounding groove is evenly provided with a conductive layer, and the signal emitted by the signal conducting part to the left and right directions inside the circuit board can be shielded by the conductive layer to reduce crosstalk.

Brief Description of the Drawings

[0019] Figure 1 It is a three-dimensional diagram of the electrical connector of the utility model;

[0020] Figure 2 A three-dimensional diagram of a circuit board of the utility model;

[0021] Figure 3 A partial diagram of the electrical connector of the utility model;

[0022] Figure 4 It is a cross-sectional view of the electrical connector of the utility model;

[0023] Figure 5 for Figure 4 A partial enlarged view of the middle A area;

[0024] Figure 6 It is a side view of the electrical connector of the utility model without the plastic of the circuit board;

[0025] Figure 7 A three-dimensional view of the electrical connector of the utility model with the circuit board plastic removed from another angle;

[0026] Figure 8 It is a three-dimensional diagram of the shielding layer and the conductive layer of the electrical connector of the utility model;

[0027] Fig. 9 The following are simulation results of the effects of the first and second electrical connector models on impedance respectively.

[0028] Description of the accompanying drawings for the specific implementation:

[0029] Electrical connector 100 Cable 10 Signal conductor 11 Signal transmission unit 111 Ground conductor 12 Ground conducting portion 121 Bending portion 122 Upper cable\lower cable 10' Circuit board 20 Upper circuit layer\lower circuit layer 20' Part 121 first recess 211 Signal connection portion 212 Grounding slot 213 Conductive layer 214 Part 22 Second recess 221 Signal contact part 222 Ground contact portion 223 Middle part 23 Bridge portion 231 Shielding layer 24 Shielding layer 25 Grounding hole 251 First through hole 26 The second through hole 27 Solder 28 Left and right direction X Front and rear direction Y Up and down direction Z [Specific implementation method]

[0030] like Figures 1 to 8 As shown, the electrical connector 100 of the utility model includes a cable 10 and a circuit board 20. The cable 10 includes a signal conductor 11 and a ground conductor 12. The signal conductor 11 includes a signal conducting portion 111. The ground conductor 12 includes a ground conducting portion 121 and a bending portion 122 connected to the ground conducting portion 121. The signal conducting portion 111 and the ground conducting portion 121 are arranged along the left-right direction X. In this embodiment, the upper and lower surfaces of the circuit board 20 can be connected, so the cables 10 are provided with two identical rows, including an upper row of cables 10' and a lower row of cables 10'. In other embodiments, the electrical connector 100 can be provided with only one row of cables 10.

[0031] like Figure 2As shown, the circuit board 20 includes a first recess 211 and a second recess 221 formed by recessing inward from the same board surface, and an intermediate portion 23 located between the first recess 211 and the second recess 221. The bottom surfaces of the first recess 211 and the second recess 221 are located in the same horizontal plane. In this embodiment, the first recess 211 and the second recess 221 are formed by cutting off part of the circuit board 20. In other embodiments, it includes but is not limited to forming the first recess 211 and the second recess 221 by cutting off part of the circuit board 20. Along the front-to-back direction Y, the circuit board 20 includes a first portion 21 and a second portion 22, and the intermediate portion 23 is located between the first portion 21 and the second portion 22; along the up-down direction Z, the outer surface of the first portion 21 is the bottom surface of the first recess 211, and the outer surface of the second portion 22 is the bottom surface of the second recess 221; from the left-right direction X, the length of the first portion 21 is less than the length of the intermediate portion 23, and the length of the intermediate portion 23 is less than the length of the second portion 22. In order to minimize the transmission of signals in the air medium, the length of the intermediate portion 23 needs to be as long as possible. In this embodiment, the first part 21 will contact the cable 10, and the second part 22 will contact the docking part (not shown) of the docking connector, because the first part 21 is welded with the cable 10, and the second part 22 is abutted with the docking part (not shown). To ensure the working function of the docking part, the second part 22 is longer, and has a fixed standard length when welded with the cable 10. In addition, the more exposed conductors of the cable 10, the more electromagnetic waves are radiated, which will affect the signal integrity, so the length of the first part 21 is shorter. In other embodiments, as long as the first part 21 and the cable 10 can be connected, other connection methods can be used, not limited to welding.

[0032] like Figure 3 and Figure 4As shown, the first part 21 is provided with a signal conducting part 212 exposed on its outer surface and a grounding groove 213 recessed inward from its outer surface, the signal conducting part 212 and the grounding groove 213 are arranged in a row along the left-right direction X, and the inner peripheral wall of the grounding groove 213 is evenly provided with a conductive layer 214. The signal conducting part 111 contacts the signal conducting part 212, and the grounding conducting part 121 is placed in the grounding groove 213 and is connected to the conductive layer 214. In this embodiment, the signal conducting part 111 and the signal conducting part 212 are welded together by solder 28. In other embodiments, as long as the signal conducting part 111 and the signal conducting part 212 can be in contact and connected, other connection methods can be used, including but not limited to welding. In this embodiment, the signal conducting part 111 and the grounding conducting part 121 are both made of metal. The large area of ​​the two metal components facing each other makes the area where the two metal components are located appear capacitive, and the impedance is low when it appears capacitive. The staggered arrangement of the signal conducting part 111 and the ground conducting part 121 can reduce the area facing each other, increase the inductance in the area to increase the impedance and achieve impedance matching. When viewed from the left-right direction X, the projections of the signal conducting part 111 and the ground conducting part 121 are staggered, thereby reducing the area facing each other between the signal conducting part 111 and the ground conducting part 121. The ground conducting part 121 is placed in the grounding groove 213, and there is no shielding of the ground conducting part 121 beside the signal conducting part 111, that is, in the left-right direction X. However, the inner peripheral wall of the grounding groove 213 is evenly provided with a conductive layer 214, and the signal emitted by the signal conducting part 212 in the left-right direction X inside the circuit board 20 can be shielded by the conductive layer 214 to reduce crosstalk.

[0033] like Figure 4, the bent portion 122 is partially placed in the grounding groove 213. In this embodiment, the grounding conductive portion 121 is connected to the circuit board 20 by welding. Along the up-down direction Z, the outer peripheral surface of the grounding conductive portion 121 is lower than the outer surface of the circuit board 20, that is, the outer peripheral surface of the grounding conductive portion 121 is lower than the outer surface of the first portion 21, so that the solder can easily enter the grounding groove 213 and weld with the grounding conductive portion 121. In this embodiment, along the front-back direction Y, there is a gap between the grounding conductive portion 121 and the conductive layer 214, and solder (not shown) is arranged in the gap, and the solder connects the grounding conductive portion 121 and the conductive layer 214. The setting of the gap makes it easy for the solder to enter the grounding groove 213, realize the connection between the grounding conductive portion 121 and the conductive layer 214, and makes it difficult for the grounding conductive portion 121 to escape from the grounding groove 213. It should be noted that, in this embodiment, the raw materials of the solder welded between the signal conducting portion 111 and the signal conducting portion 212 and the solder welded between the ground conducting portion 121 and the conductive layer 214 are the same, except that the solder in the gap between the ground conducting portion 121 and the conductive layer 214 is not shown. In other embodiments, the solder may not be provided in the gap between the ground conducting portion 121 and the conductive layer 214 along the front-to-back direction Y, as long as the ground conducting portion 121 and the conductive layer 214 can be connected, including but not limited to using welding and other methods.

[0034] like Figure 3 and Figure 6 As shown, the second portion 22 is provided with a signal contact portion 222 exposed on its outer surface, that is, the signal contact portion 222 is exposed on the bottom surface of the second recess 221. The circuit board 20 is also provided with a bridge portion 231 connecting the signal contact portion 222 and the signal conductive portion 212, and the bridge portion 231 is partially or completely arranged in the middle portion 23. The signal of the circuit board 20 is transmitted through the signal contact portion 222, the signal conductive portion 212 and the bridge portion 231. At the same time, the circuit board 20 is recessed with the first recess 211 and the second recess 221, so that when the signal is transmitted to the position of the middle portion 23, it is transmitted inside the circuit board 20, thereby reducing the interference of the air medium on the signal transmission. When viewed from the left-right direction X, the signal conducting portion 212, the bridging portion 231 and the signal contact portion 222 are located on the same horizontal plane. In the present embodiment, the signal contact portion 222 is the input end of the signal transmitted on the circuit board 20, and the signal conducting portion 212 is the output end of the signal transmitted on the circuit board 20; in other embodiments, the signal contact portion 222 may be the output end of the signal transmitted on the circuit board 20, and the signal conducting portion 212 may correspond to the input end of the signal transmitted on the circuit board 20; that is, the input end and the output end of the signal transmitted on the circuit board 20 are located on the same horizontal plane, and the signal transmission path is straight, thereby avoiding impedance mutation.

[0035] like Figures 3 to 7As shown, when viewed from the up-down direction Z, the width of the bridge portion 231 is smaller than the width of the signal contact portion 222. In this embodiment, the signal contact portion 222 is exposed to the air, and the signal contact portion 222 will dock with the docking portion (not shown) of the docking connector, and the impedance of the area where the signal contact portion 222 is located is high. The bridge portion 231 is partially or entirely disposed in the middle portion 23, and the middle portion 23 includes plastic, and the dielectric constant of the plastic is greater than the dielectric constant of air, so the impedance of the area where the bridge portion 231 is located is lower than the impedance of the area where the signal contact portion 222 is located. In order to achieve impedance matching of the areas where the signal contact portion 222 and the bridge portion 231 are located, the width of the bridge portion 231 is narrowed to be smaller than the width of the signal contact portion 222, so as to increase the inductance of the area where the bridge portion 231 is located, thereby increasing the impedance. A shielding layer 24 is provided in the middle portion 23. Along the up-down direction Z, a shielding layer 24 is provided between the outer surface of the middle portion 23 and the bridging portion 231. In this embodiment, the outer surface of the middle portion 23 is an insulating material, and the shielding layer 24 is made of metal to increase metal shielding and reduce crosstalk.

[0036] like Figure 4 As shown, in this embodiment, the grounding groove 213 runs through the circuit board 20 from top to bottom, which is simpler to manufacture and less difficult to process. The inner wall of the grounding groove 213 is evenly distributed with a conductive layer 214. The circuit board 20 includes an upper circuit layer 20' and a lower circuit layer 20'. The upper circuit layer 20' and the lower circuit layer 20' are configured in the same manner. The upper circuit layer 20' is provided with a signal conductive portion 212 exposed on its outer surface and a grounding groove 213 recessed inwardly from its outer surface. The lower circuit layer 20' is provided with a signal conductive portion 212 exposed on its outer surface and a grounding groove 213 recessed inwardly from its outer surface. The signal conducting portion 212 of the circuit board 20' is arranged correspondingly to the signal conducting portion 212 of the lower circuit layer 20', and the grounding groove 213 of the upper circuit layer 20' is arranged correspondingly to the grounding groove 213 of the lower circuit layer 20'; the grounding conducting portion 121 of the upper row of cables 10' and the grounding conducting portion 121 of the lower row of cables 10' are arranged correspondingly and placed in the same grounding groove 213 to be connected with the conductive layer 214, so as to facilitate the common grounding of the upper circuit layer 20' and the lower circuit layer 20'. In other embodiments, the circuit board 20 can be provided with a signal conducting portion 212 and a grounding groove 213 formed inwardly from the board surface only on one board surface, and the grounding groove 213 can be a blind groove.

[0037] like Figure 4 , Figures 7 and 8As shown, a shielding layer 25 is provided in the circuit board 20, and a grounding hole 251 is provided in the shielding layer 25, and a conductive layer 214 is arranged on the inner peripheral wall of the grounding hole 251. In this embodiment, the grounding groove 213 is formed by directly punching on the circuit board 20, and the conductive layer 214 is brushed in the groove after the grounding groove 213 is formed, so that the inner peripheral wall of the grounding hole 251 is provided with the conductive layer 214. In other embodiments, the conductive layer 214 is applied to the grounding groove 213 in a manner including but not limited to brushing, electroplating, etc.

[0038] like Figures 4 to 6 As shown, the circuit board 20 includes a first through hole 26 disposed inside the middle part 23 and a second through hole 27 disposed inside the second part 22, and a shielding layer 25 spanning the first part 21, the middle part 23 and the second part 22; along the up-down direction Z, the second part 22 is provided with a grounding contact portion 223 exposed on its outer surface, that is, the grounding contact portion 223 is exposed on the bottom surface of the second recess 221; along the up-down direction Z, the first through hole 26 is connected to the shielding layer 25, the second through hole 27 is connected to the grounding contact portion 223 on one side and the shielding layer 25 on the other side, and the conductive layer 214 is connected to the shielding layer 25 to form a three-stage grounding, and the noise is transmitted to the shielding layer 25 for grounding. In this embodiment, three different grounding methods are provided in the circuit board 20, but ultimately all the noise is transmitted to the shielding layer 25 for common grounding. The signal diverges in all directions, and the first through hole 26 is connected to the shielding layer 24 on one side and the shielding layer 25 on the other side, so that the signal diverging in the up-down direction Z can be shielded by the shielding layer 24 and the shielding layer 25.

[0039] In addition, the inventor of the present application has conducted simulation analysis on two electrical connector models, the first electrical connector model is the electrical connector described in the background art, and the second electrical connector is the electrical connector described in the present application. Fig. 9 The following are simulation results of the effects of the first and second electrical connector models on impedance respectively. Fig. 9 In the figure, m1 represents the first area of ​​the second type of electrical connector, i.e., the welding area, and m2 represents the first area of ​​the first type of electrical connector, i.e., the welding area. According to the simulation results, it can be known that the present application can increase the impedance in the first area through the design of "the grounding conductive part 121 is placed in the grounding groove 213 and is connected to the conductive layer 214, so that the projections of the signal conductive part 111 and the grounding conductive part 121 are misaligned when viewed from the left and right direction X", so as to facilitate impedance matching. In this embodiment, the impedance increase is specifically reflected in that at the same horizontal axis position, the vertical axis value at m1 is approximately 85 ohms, and the vertical axis value at m2 is approximately 79 ohms, that is, the ohmic value of m1 is increased by approximately 6 ohms relative to the ohmic value of m2. In other embodiments, the impedance increase can be other values.

[0040] In summary, the electrical connector 100 of the present invention has the following effects:

[0041] (1) The signal conducting part 111 contacts the signal conducting part 212 exposed on the outer surface of the circuit board 20, and the ground conducting part 121 is placed in the grounding groove 213 and is connected to the conductive layer 214. The projections of the signal conducting part 111 and the ground conducting part 121 are misaligned when viewed from the left-right direction X, thereby reducing the area directly facing the signal conducting part 111 and the ground conducting part 121, increasing the inductance to increase the impedance, and achieving impedance matching. The ground conducting part 121 is placed in the grounding groove 213, and there is no shielding of the ground conducting part 121 beside the signal conducting part 111, that is, in the left-right direction X. However, the inner peripheral wall of the grounding groove 213 is evenly provided with the conductive layer 214, and the signal emitted by the signal conducting part 212 in the left-right direction X inside the circuit board 20 can be shielded by the conductive layer 214 to reduce crosstalk.

[0042] (2) When viewed from the up-down direction Z, the width of the bridge portion 231 is smaller than the width of the signal contact portion 222. The signal contact portion 222 is exposed to the air, and the signal contact portion 222 will dock with the docking portion (not shown) of the docking connector, and the impedance of the area where the signal contact portion 222 is located is high. The bridge portion 231 is partially or entirely disposed in the middle portion 23, and the middle portion 23 includes plastic. The dielectric constant of the plastic is greater than the dielectric constant of air, so the impedance of the area where the bridge portion 231 is located is lower than the impedance of the area where the signal contact portion 222 is located. In order to achieve impedance matching of the areas where the signal contact portion 222 and the bridge portion 231 are located, the width of the bridge portion 231 is narrowed to be smaller than the width of the signal contact portion 222, so as to increase the inductance of the area where the bridge portion 231 is located, thereby increasing the impedance. A shielding layer 24 is disposed in the middle portion 23 . Along the up-down direction Z, a shielding layer 24 is disposed between the outer surface of the middle portion 23 and the bridge portion 231 . In this embodiment, the shielding layer 24 is made of metal to increase metal shielding and reduce crosstalk.

[0043] (3) The circuit board 20 includes a first through hole 26 disposed inside the middle portion 23 and a second through hole 27 disposed inside the second portion 22, and a shielding layer 25 spanning the first portion 21, the middle portion 23 and the second portion 22; along the vertical direction Z, the second portion 22 is provided with a grounding contact portion 223 exposed on its outer surface, that is, the grounding contact portion 223 is exposed on the bottom surface of the second recess 221; along the vertical direction Z, the first through hole 26 is connected to the shielding layer 25, one side of the second through hole 27 is connected to the grounding contact portion 223 and the other side is connected to the shielding layer 25, and the conductive layer 214 is connected to the shielding layer 25, so as to form a three-stage grounding, and the noise is transmitted to the shielding layer 25 for grounding. The signal is diffused in all directions, one side of the first through hole 26 is connected to the shielding layer 24 and the other side is connected to the shielding layer 25, so that the signal diffused in the vertical direction Z can be shielded by the shielding layer 24 and the shielding layer 25.

[0044] (4) Along the up-down direction Z, the outer peripheral surface of the grounding conductive part 121 is lower than the outer surface of the circuit board 20, so that the solder can easily enter the grounding groove 213 and solder with the grounding conductive part 121. Along the front-back direction Y, there is a gap between the grounding conductive part 121 and the conductive layer 214, and solder (not shown) is arranged in the gap, and the solder connects the grounding conductive part 121 and the conductive layer 214. The setting of the gap makes it easy for the solder to enter the grounding groove 213 to achieve the connection between the grounding conductive part 121 and the conductive layer 214, and makes it difficult for the grounding conductive part 121 to fall out of the grounding groove 213.

[0045] The above detailed description is only an explanation of the preferred embodiment of the utility model, and does not limit the patent scope of the utility model. Therefore, all equivalent technical changes made by using the description and illustrations of this creation are included in the patent scope of this creation.

Claims

1. An electrical connector, characterized in that: include: Circuit boards; The circuit board is provided with a signal conducting portion exposed on its outer surface and a grounding groove recessed inward from its outer surface, the signal conducting portion and the grounding groove are arranged in a row along the left-right direction, and the inner peripheral wall of the grounding groove is uniformly provided with a conductive layer; A cable, comprising a signal conductor and a ground conductor, wherein the signal conductor comprises a signal conducting portion in contact with the signal conducting portion, the ground conductor comprises a ground conducting portion disposed in a grounding groove, the signal conducting portion and the ground conducting portion are arranged in a left-right direction, and the ground conducting portion is in conduction with the conductive layer; Viewed from the left and right directions, the projections of the signal conducting portion and the ground conducting portion are misaligned.

2. The electrical connector according to claim 1, wherein: The circuit board includes a first recess and a second recess formed inwardly from the same board surface, and an intermediate portion located between the first recess and the second recess, and the bottom surfaces of the first recess and the second recess are located in the same horizontal plane; the circuit board is provided with a signal contact portion exposed at the bottom surface of the second recess, and a bridge portion connecting the signal conducting portion and the signal contact portion, the signal conducting portion is exposed at the bottom surface of the first recess, and the signal conducting portion, the bridge portion and the signal contact portion are located in the same horizontal plane when viewed from the left and right directions, the signal contact portion is an input end or an output end for signal transmission on the circuit board, and the signal conducting portion is an output end or an input end for signal transmission on the circuit board.

3. The electrical connector according to claim 2, wherein: Viewed from the top and bottom, the width of the bridge portion is smaller than that of the signal contact portion. The bridge portion is at least partially disposed in the middle portion. Along the top and bottom directions, a shielding layer is disposed between the outer surface of the middle portion and the bridge portion.

4. The electrical connector according to claim 1, wherein: The circuit board includes a first portion, a second portion and a middle portion located between the first portion and the second portion; viewed from the left and right directions, the length of the first portion is shorter than the length of the middle portion, and the length of the middle portion is shorter than the length of the second portion.

5. The electrical connector according to claim 1, wherein: The grounding groove runs through the circuit board from top to bottom. The circuit board includes an upper circuit layer and a lower circuit layer. The upper circuit layer is provided with a signal conducting portion exposed on its outer surface. The lower circuit layer is provided with a signal conducting portion exposed on its outer surface. The signal conducting portion of the upper circuit layer and the signal conducting portion of the lower circuit layer are arranged correspondingly. The cables include an upper row of cables and a lower row of cables. The grounding conducting portion of the upper row of cables and the grounding conducting portion of the lower row of cables are arranged correspondingly and are placed in the same grounding groove to conduct with the conductive layer.

6. The electrical connector according to claim 1, wherein: A gap is provided between the ground conductive part and the conductive layer along the front-back direction. Solder is provided in the gap. The solder connects the ground conductive part and the conductive layer.

7. The electrical connector according to claim 1, wherein: A shielding layer is arranged in the circuit board, a grounding hole is arranged in the shielding layer, and a conductive layer is arranged on the inner peripheral wall of the grounding hole.

8. The electrical connector according to claim 1, wherein: The circuit board includes a first part, a second part and an intermediate part between the first part and the second part, a first through hole arranged inside the intermediate part and a second through hole arranged inside the second part, and a shielding layer spanning the first part, the intermediate part and the second part; along the up-down direction, the first part is recessed inward to form the grounding groove, and the second part is provided with a grounding contact part exposed on its outer surface; along the up-down direction, the first through hole is connected to the shielding layer, one side of the second through hole is connected to the grounding contact part and the other side is connected to the shielding layer, and the conductive layer is connected to the shielding layer.

9. The electrical connector according to claim 8, characterized in that: A shielding layer is arranged in the middle part. Along the up-down direction, the shielding layer is located between the outer surface of the middle part and the ground connection part. One side of the first through hole is connected to the shielding layer and the other side is connected to the shielding layer.

10. The electrical connector according to claim 1, wherein: The ground conductor comprises a bending portion connected to the ground conducting portion, the bending portion is partially disposed in the grounding groove, and along the up-down direction, the outer peripheral surface of the ground conducting portion is lower than the outer surface of the circuit board.

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