MIC acquisition card

Abstract

The utility model discloses an MIC acquisition card which comprises a circuit board, a processor chip is fixedly installed in the center of the surface of the circuit board, no heating element is arranged within the range of 15 mm around the processor chip, a power module is fixedly installed at the position, close to the edge, of the inner side of the circuit board, and a charging interface is fixedly installed at the edge of the left side of the circuit board. The charging interface is electrically connected with the power module, a network cable interface is fixedly installed on the outer wall of the top of the left end of the circuit board, a communication module is fixedly installed on the top of the circuit board, and the network cable interface is electrically connected with the communication module in a matched mode. And meanwhile, enough heat dissipation space is reserved around the processor chip, and the power supply module and the button which can be independently controlled are arranged in the circuit board to control the output and on-off of the power supply, so that the use stability of the MIC acquisition card is improved, and the MIC acquisition working performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of MIC acquisition cards, in particular to a MIC acquisition card. Background Art

[0002] A MIC acquisition card is a device for collecting microphone signals. It can convert the audio signals input by the microphone into digital signals so that computers or other devices can process, store or transmit them. Existing MIC acquisition cards usually install the electronic components used by the MIC acquisition cards on the surface of a circuit board. Since various electronic components will generate a certain amount of heat during operation, and since the structure of existing MIC acquisition cards is generally compact and the distribution structure is unreasonable, heat accumulation is likely to occur when used for a long time at high frequency. At the same time, traditional MIC acquisition cards generally lack independent power modules to charge them, which makes it easier to cause unstable working current when docking with other devices, making the heat accumulation uncontrollable and inconvenient to improve the stability of the MIC acquisition card. Utility Model Content

[0003] The purpose of the utility model is to provide a MIC acquisition card to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] The MIC acquisition card includes a circuit board, a processor chip is fixedly installed at the center position of the circuit board surface, no heating element is arranged within 15 mm around the processor chip, a power module is fixedly installed near the edge position on the inner side of the circuit board, a charging interface is fixedly installed at the left edge position of the circuit board, the charging interface is electrically connected to the power module, a network cable interface is fixedly installed on the outer wall of the top left end of the circuit board, a communication module is fixedly installed on the top of the circuit board, and the network cable interface is electrically connected to the communication module.

[0006] In a preferred embodiment of the present invention, screw holes are provided at four corners of the circuit board, and the screw holes are used to fix the circuit board by screws.

[0007] In a preferred embodiment of the utility model, heat dissipation holes are evenly opened on the surface of the circuit board, and metal heat dissipation pipes are fixedly installed on the inner walls of the heat dissipation holes, and the metal heat dissipation pipes penetrate the top and bottom inner walls of the circuit board.

[0008] In a preferred implementation manner of the present utility model, a data interface is fixedly installed on the top outer wall of one end of the circuit board away from the network cable interface, and a plurality of the data interfaces are provided, and the distance between adjacent data interfaces is 8 mm.

[0009] In a preferred implementation manner of the present utility model, an SMA connector is fixedly mounted on the top outer wall of the circuit board, a button is fixedly mounted on the top outer wall of the circuit board, and the button is electrically connected to the power module.

[0010] In a preferred embodiment of the present invention, a chip resistor is fixedly mounted on the top outer wall of the circuit board, a plurality of the chip resistors are provided, and a distance between adjacent chip resistors is greater than 4 mm.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention.

[0012] By fixing the processor chip at the top center of the circuit board, leaving enough heat dissipation space around the processor chip, and setting an independently controllable power module and button on the circuit board to control the output and on / off of the power supply, the stability of the MIC acquisition card is improved, and the MIC acquisition performance is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0014] Figure 1 This is a schematic diagram of the top view of the structure of the MIC acquisition card;

[0015] Figure 2 This is a schematic diagram of the upward structure of the MIC acquisition card;

[0016] Figure 3 This is a schematic diagram of the main view structure in the MIC acquisition card;

[0017] Figure 4 This is a side view of the structure of the MIC acquisition card.

[0018] In the figure: circuit board 100, heat dissipation hole 101, chip resistor 102, screw hole 110, processor chip 120, network cable interface 130, communication module 131, charging interface 140, power module 150, data interface 160, button 170, SMA connector 180. DETAILED DESCRIPTION

[0019] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0020] Example 1: Figure 1-4 , including a circuit board 100, a processor chip 120 is fixedly installed at the center position of the surface of the circuit board 100, and no heating elements are arranged within a range 15 around the processor chip 120, a power module 150 is fixedly installed near the edge position on the inner side of the circuit board 100, a charging interface 140 is fixedly installed at the left edge position of the circuit board 100, and the charging interface 140 is electrically connected to the power module 150, a network cable interface 130 is fixedly installed on the outer wall of the top left end of the circuit board 100, and a communication module 131 is fixedly installed on the top of the circuit board 100, and the network cable interface 130 is electrically connected to the communication module 131.

[0021] The specific usage scenario of this embodiment is as follows: by setting the circuit board 100 for the electronic components required in the process of installing the MIC acquisition card, the processor chip 120 is 1130G7, by installing the processor chip 120 on the top outer wall of the circuit board 100, no heating element is set within a range of 15 mm around the processor chip 120, so that the processor chip 120 can leave enough heat dissipation space, so that the processor chip 120 has a good heat dissipation effect, can effectively avoid heat accumulation, and improve the working efficiency of the processor chip 120, and the power module 150 is fixedly installed near the edge position on the inner side of the circuit board 100, so that the MIC acquisition card has the performance of independent power supply, so as to facilitate the integrated installation of the MIC acquisition card and the user's modification and enrichment of the function of the MIC acquisition card, and by setting the communication module 131, the MIC acquisition card can enrich the structure of information interaction and increase the performance of the MIC acquisition card in exchanging data. The communication module 131 is EC200S-CN, which improves the communication effect of the MIC acquisition card.

[0022] Example 2: Figure 1-4 , including a circuit board 100, a processor chip 120 is fixedly installed at the center position of the surface of the circuit board 100, and no heating element is arranged within a range of 15 around the processor chip 120, a power module 150 is fixedly installed near the edge position of the inner side of the circuit board 100, a charging interface 140 is fixedly installed at the left edge position of the circuit board 100, and the charging interface 140 is electrically connected to the power module 150, a network cable interface 130 is fixedly installed on the outer wall of the top left end of the circuit board 100, and a communication module 131 is fixedly installed on the top of the circuit board 100, and the network cable interface 130 is electrically connected to the communication module 131. Screw holes 110 are opened at the four corners of the circuit board 100, and the screw holes 110 are used to fix the circuit board 100 by screws, and heat dissipation holes 101 are evenly opened on the surface of the circuit board 100, and metal heat dissipation pipes are fixedly installed on the inner wall of the heat dissipation holes 101, and the metal heat dissipation pipes run through the top and bottom inner walls of the circuit board 100.

[0023] The specific usage scenario of this embodiment is: by setting the heat dissipation hole 101, the ventilation and heat dissipation effect on the upper and lower surfaces of the circuit board 100 is conveniently improved, the material of the metal heat dissipation pipe is set to metal copper, and the metal heat dissipation pipe is fixedly installed on the inner wall of the heat dissipation hole 101 to enhance the thermal conductivity.

[0024] Example 3: Figure 1-4 , including a circuit board 100, a processor chip 120 is fixedly installed at the center of the surface of the circuit board 100, and no heating element is set within 15 mm around the processor chip 120, a power module 150 is fixedly installed near the edge of the inner side of the circuit board 100, a charging interface 140 is fixedly installed at the left edge of the circuit board 100, and the charging interface 140 is electrically connected to the power module 150, a network cable interface 130 is fixedly installed on the outer wall of the top left end of the circuit board 100, and a communication module 131 is fixedly installed on the top of the circuit board 100, and the network cable interface 130 and the communication module 131 In order to cooperate with the electrical connection, a data interface 160 is fixedly installed on the top outer wall of the circuit board 100 away from the network cable interface 130. There are several data interfaces 160, and the distance between adjacent data interfaces 160 is 8 mm. An SMA connector 180 is fixedly installed on the top outer wall of the circuit board 100. A button 170 is fixedly installed on the top outer wall of the circuit board 100, and the button 170 is electrically connected to the power module 150. There are several chip resistors 102 on the top outer wall of the circuit board 100, and the distance between adjacent chip resistors 102 is greater than 4 mm.

[0025] The specific usage scenario of this embodiment is as follows: by setting the network cable interface 130 to connect the MIC acquisition card to the network signal, the information interaction efficiency of the MIC acquisition card is improved, and the application scope of the MIC acquisition card is expanded; by setting the button 170 to control the on and off of the total circuit of the MIC acquisition card, the convenience of using the MIC acquisition card is improved; by setting the spacing between the chip resistors 102 to be greater than 4 mm, good heat dissipation can be achieved between the chip resistors 102, thereby improving the heat dissipation effect.

[0026] The working principle of the utility model is as follows: a person skilled in the art installs the circuit board 100 in the housing of the MIC acquisition card, fixes the screw holes 110 at the four corners of the circuit board 100 to the housing of the MIC acquisition card by screws, connects the power supply to the power module 150 by plugging the charging cable into the charging interface 140, and realizes information interaction with the MIC acquisition card by connecting the data cable to the data interface 160, and sets a button 170 for independently controlling the power switch of the MIC acquisition card, so that the MIC acquisition card can independently control the switch.

[0027] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A MIC acquisition card, comprising a circuit board (100), wherein a processor chip (120) is fixedly mounted at the center of the surface of the circuit board (100), characterized in that: No heating element is provided within a range of 15 mm around the processor chip (120); a power module (150) is fixedly installed on the inner side of the circuit board (100) near the edge; a charging interface (140) is fixedly installed on the left edge of the circuit board (100); the charging interface (140) is electrically connected to the power module (150); a network cable interface (130) is fixedly installed on the outer wall of the top left end of the circuit board (100); a communication module (131) is fixedly installed on the top of the circuit board (100); the network cable interface (130) is electrically connected to the communication module (131) in coordination.

2. The MIC acquisition card according to claim 1, characterized in that: Screw holes (110) are provided at four corners of the circuit board (100), and the screw holes (110) are used to fix the circuit board (100) by means of screws.

3. The MIC acquisition card according to claim 2, characterized in that: The surface of the circuit board (100) is evenly provided with heat dissipation holes (101), the inner walls of the heat dissipation holes (101) are fixedly mounted with metal heat dissipation pipes, and the metal heat dissipation pipes penetrate the top and bottom inner walls of the circuit board (100).

4. The MIC acquisition card according to claim 1, characterized in that: A data interface (160) is fixedly installed on the top outer wall of one end of the circuit board (100) away from the network cable interface (130), and a plurality of the data interfaces (160) are provided, and the distance between adjacent data interfaces (160) is 8 millimeters.

5. The MIC acquisition card according to claim 4, characterized in that: An SMA connector (180) is fixedly mounted on the top outer wall of the circuit board (100), and a button (170) is fixedly mounted on the top outer wall of the circuit board (100), and the button (170) is electrically connected to the power module (150).

6. The MIC acquisition card according to claim 5, characterized in that: A chip resistor (102) is fixedly mounted on the top outer wall of the circuit board (100), a plurality of the chip resistors (102) are provided, and a distance between adjacent chip resistors (102) is greater than 4 millimeters.

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