Circuit board heat dissipation structure

Abstract

The utility model belongs to the technical field of heat dissipation structures, and particularly relates to a circuit board heat dissipation structure. Comprising a fan, a shell, heat dissipation plates, heat conduction copper pipes, semiconductor chilling plates and two-way memory springs, the bottom ends of the heat conduction copper pipes are evenly distributed in an S shape and fixedly connected with the shell through the semiconductor chilling plates arranged on the lower surfaces of the heat conduction copper pipes, a circuit board is arranged on the upper surfaces of the bottom ends of the heat conduction copper pipes, and the heat dissipation plates are connected to the upper ends of the heat conduction copper pipes in a sleeving mode. And a two-way memory spring is arranged between every two adjacent heat dissipation plates. And the fan is arranged on the shell. The circuit board heat dissipation structure has the advantages of low power, low power consumption, simple device, compact structure and damping function, and can adjust the heat dissipation amount according to the internal temperature of the device.

Description

Technical Field

[0001] The utility model belongs to the technical field of vehicle circuit boards, in particular to a circuit board heat dissipation structure. Background Art

[0002] In the field of automotive circuits, circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. However, electronic components and chips generate a lot of heat when working. If they are not cooled, it will affect the use of electronic products and reduce the service life of the circuit boards.

[0003] The automotive circuit board is placed inside the car body, which makes it difficult to discharge heat, thus affecting the service life of the circuit board. In addition, since the voltage of the car power supply is usually low, it is not practical to use high-power heat dissipation equipment. Furthermore, the location of the automotive circuit board inside the car body also means that the design of the heat dissipation equipment must consider the impact of the body movement on its heat dissipation performance. At the same time, the car may be parked outdoors for a long time, which requires the heat dissipation system to be able to adjust the heat dissipation effect of the circuit board according to the changes in the internal ambient temperature. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the shortcomings of the prior art, the utility model provides a circuit board heat dissipation structure, which has the advantages of low power, low power consumption, simple device, compact structure and shock absorption function. It solves the problem that the heat dissipation performance of the vehicle circuit board is poor due to the movement of the vehicle and the heat dissipation cannot be adjusted according to the internal temperature.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose of low power, simple device, shock absorption function, and the ability to adjust the heat dissipation according to the internal temperature of the vehicle, the utility model provides the following technical solutions: a circuit board heat dissipation structure, including a fan, a shell, a heat sink, a heat-conducting copper tube, a semiconductor refrigeration sheet and a two-way memory spring. The bottom end of the heat-conducting copper tube is in an evenly arranged S-shape, and the left and right sides extend outward from the bottom end and extend in the vertical direction. A circuit board is arranged on the upper surface of the bottom end of the heat-conducting copper tube, and the lower surface of the bottom end of the heat-conducting copper tube is fixedly connected to the shell through a semiconductor refrigeration sheet. The multiple heat sinks have through holes for the heat-conducting copper tube to pass through, and the multiple heat sinks are all sleeved above the heat-conducting copper tube. A two-way memory spring is arranged between every two adjacent heat sinks. Multiple fans are fixedly connected to one side of the shell. When working, the heat from the circuit board will be transferred to the heat-conducting copper tube, and the semiconductor cooling plate will also work. The heat-conducting copper tube will transfer part of the heat to the semiconductor cooling plate, and the other part to the heat sink. The fan will continue to work and take away the heat between the heat sinks. When the temperature inside the device is low, the distance between the heat sinks is small, so the heat transfer efficiency is higher, and the heat can be transferred to the heat sink and discharged faster. When the temperature rises, the two-way memory spring will deform due to its own temperature increase, and the length will increase, thereby increasing the distance between the two adjacent heat sinks, thereby increasing the air circulation area and speed, and improving the heat dissipation rate. After the heat dissipation is completed, the length of the two-way memory spring will return to its original state, and the heat dissipation amount will be adjusted without consuming electricity. At the same time, the two-way memory spring can absorb part of the force from the movement of the vehicle, making the entire structure less susceptible to the movement of the vehicle body.

[0008] Preferably, the shell is hollowed out on four sides and open on the top.

[0009] Preferably, the dual-range memory spring is made of CuZnAl alloy.

[0010] Preferably, the fan can be connected to a circuit board as a connector.

[0011] Preferably, the bottom and top ends of the heat-conducting copper tube are both provided with limiting devices to prevent the heat sink from sliding out.

[0012] Preferably, the semiconductor cooling plate can be connected to a circuit board as a connector.

[0013] Preferably, the heat sink has a thickness of no more than 1 mm and is made of copper or graphene.

[0014] Preferably, the interior of the heat-conducting copper tube is hollow and filled with ether as a heat-conducting liquid.

[0015] Preferably, the shell is made of copper, aluminum or other metal materials that are good at heat conduction.

[0016] Preferably, the gap at the bottom end of the heat-conducting copper tube does not exceed 10 mm and the cross-section is a hollow circle.

[0017] Preferably, the length of the two-way memory spring is greater than 2 mm and its inner diameter fits the thermally conductive copper tube.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the utility model provides a circuit board heat dissipation structure, which has the following beneficial effects:

[0020] The circuit board heat dissipation structure has the advantage of adjusting the heat dissipation of the device without consuming electrical energy through the heat dissipation plate, the heat-conducting copper tube and the two-way memory spring. Specifically, when the temperature is low, the spacing between the heat dissipation plates is small, and the heat-conducting copper tube can quickly transfer the heat to the heat dissipation plate for discharge; when the temperature of the heat dissipation plate is high, the two-way memory spring will stretch due to the increase in temperature, increasing the spacing between the heat dissipation plates, thereby increasing the air circulation area and speed in adjacent heat dissipation plates, and improving the heat dissipation. This design has a simple structure and high efficiency. At the same time, through the coordinated use of the heat-conducting copper tube and the two-way memory spring, the device absorbs part of the kinetic energy from the vehicle body, reduces the impact of the vehicle body movement on the heat dissipation effect, and improves the stability and adaptability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0022] Figure 2 It is a right side structural cross-sectional schematic diagram of the utility model;

[0023] Figure 3 It is an isometric structural schematic diagram of the utility model;

[0024] Figure 4 It is a schematic diagram of the cross-section of the structure when viewed from above of the utility model.

[0025] In the figure: 1-circuit board, 2-housing, 21-fan, 3-heat sink, 31-heat-conducting copper tube, 32-semiconductor cooling sheet, 33-two-way memory spring. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-3A circuit board heat dissipation structure includes a fan 21, a housing 2, a heat sink 3, a heat-conducting copper tube 31, a semiconductor cooling sheet 32 ​​and a two-way memory spring 33. The heat-conducting copper tube 31 is hollow inside and is made of red copper. It is filled with ether as a heat-conducting liquid. The purpose of using copper in the heat-conducting element is mainly because it has good thermal conductivity. Copper is an excellent thermal conductive material with high thermal conductivity and high electrical conductivity. This enables copper to quickly transfer heat in the heat-conducting element and improve the heat dissipation efficiency. At the same time, due to the environment inside the vehicle body, this part also needs to have a certain corrosion resistance. Copper has good corrosion resistance to many chemical substances, which enables it to maintain stable thermal conductivity under some harsh environmental conditions. At the same time, there are many bending places in the shape of the heat-conducting copper tube 31. Red copper is easy to process and has good processing performance. It can be easily cut, drilled, bent and other operations, which reduces the manufacturing difficulty and cost and has a high cost performance. Ether is a low-boiling organic solvent with good thermal conductivity. When the device is dissipating heat, the heat-conducting copper tube 31, as the part of the device mainly used for heat transfer, will absorb a lot of heat. In order to effectively dissipate this heat, ether is filled in the heat-conducting copper tube 31, which can increase the heat transfer path and improve the heat dissipation efficiency. The thermal conductivity of ether is much better than that of air, so it can transfer heat from the heating element to the heat sink 3 faster, and then dissipate the heat to the surrounding environment. The bottom of the heat-conducting copper tube 31 is bent in an S shape and evenly arranged, and the adjacent gap between each two sections of the heat-conducting copper tube does not exceed 10mm. The purpose is to ensure that the ether inside the heat-conducting copper tube can absorb more heat. The design of the heat-conducting copper tube 31 bottom is bent in an S shape and evenly arranged, aiming to achieve two main purposes, one is to increase the heat dissipation area, and the S-shaped bending design increases the surface area of ​​the heat-conducting copper tube 31, thereby increasing the contact area with the surrounding air and the heating element. This helps to absorb and transfer heat faster and improve the heat dissipation efficiency. The other is to ensure that the ether flows, and the evenly arranged design ensures that the ether flows smoothly inside the copper tube. Since the adjacent gap between each two sections of the heat-conducting copper tube 31 does not exceed 10 mm, ether can flow smoothly in the heat-conducting copper tube 31, avoiding poor flow or increased thermal resistance caused by too large a gap. This design not only improves the heat dissipation performance of the heat-conducting copper tube 31, but also ensures the smooth flow of ether, thereby achieving more heat absorption while ensuring that the ether inside the heat-conducting copper tube 31 can effectively transfer heat. A circuit board 1 is provided on the upper surface of the bottom of the heat-conducting copper tube, and its bottom lower surface is fixedly connected to the housing 2 through a semiconductor cooling sheet 32.The purpose of this design is to allow the semiconductor refrigeration sheet 32 ​​to cool the heat-conducting copper tube 31 as soon as possible, while avoiding the semiconductor refrigeration sheet 32 ​​from contacting the circuit board 1, because the semiconductor refrigeration sheet 32 ​​cools very quickly, and is prone to produce condensed water in a high humidity environment, which reduces the life of the circuit. The heat-conducting copper tube 31 can play a role in isolating the contact between the two. At the same time, the vehicle power supply is often low in voltage, and the voltage required by the semiconductor refrigeration sheet 32 ​​is low, so it can meet the voltage requirements and save energy. The two sides of the bottom end of the heat-conducting copper tube 31 extend in the vertical direction, and the heat sink 3 is sleeved on the top of the heat-conducting copper tube 31 and evenly arranged. A plurality of two-way memory springs 33 are arranged between every two adjacent heat sinks 3. Ether is an organic solvent with a low boiling point. When ether absorbs heat, the temperature will rise, resulting in a decrease in its density. Due to the density difference, ether will flow from low to high, and at this time, the heat will be preferentially transferred to the top of the heat-conducting copper tube 31, so the heat sink 3 can transfer the heat from the heat-conducting copper tube 31 in time. The cross-sectional area of ​​the heat sink 3 is very small, but the surface area is very large, which enables it to dissipate the internal heat very quickly. The fan 21 is fixedly connected to one side of the inside of the shell 2. The shell 2 is hollowed out around and open at the top. This design is more conducive to the dissipation of heat. The fan 21 and the semiconductor cooling sheet 32 ​​are designed to be plugged into the circuit board 1. Since most of the automobile circuits are plug-in components, the entire device does not need an additional power supply system, but can use the original structure, which improves the adaptability of the device.

[0028] Working principle: When the circuit board 1 starts working, heat will be generated. At this time, part of the heat is dissipated by the fan 21, and the other part is transferred to the heat-conducting copper tube 31 arranged at its bottom through heat transfer. Part of this heat is absorbed by the semiconductor refrigeration sheet 32, and the other part is transferred to the heat sink 3. The surface area of ​​the heat sink 3 is large, so it has good heat dissipation performance. At the same time, the fan will also dissipate the heat on the heat sink 3. When the internal temperature of the device is low, the spacing between the heat sinks 3 is small, so the heat transfer efficiency is higher, and the heat can be transferred to the heat sink 3 and discharged faster. When the temperature rises, the two-way memory spring 33 is deformed due to the increase in its own temperature, and the length increases, thereby increasing the spacing between two adjacent heat sinks 3. Due to the increase in the circulation area and speed of the air, the heat discharge rate is higher. After the heat dissipation is completed, the length of the two-way memory spring 33 will return to its original state, and the heat dissipation amount is adjusted without consuming electrical energy. This design makes the device have a high thermal conductivity when the internal temperature is low, and a high heat dissipation efficiency when the internal temperature of the device is high, without consuming additional energy.

[0029] To summarize, the circuit board heat dissipation structure, through the heat sink 3, the heat-conducting copper tube 31 and the two-way memory spring 33, realizes the adjustment of the heat transfer efficiency and the heat dissipation efficiency of the device according to the temperature inside the device without consuming additional electric energy, and has the advantages of low power, low power consumption, simple device and compact structure. At the same time, the application of the two-way memory spring 33 also enables the device to further have a shock absorbing device, reducing the impact of the heat dissipation device due to movement during the use of the vehicle, and solving the problem that the heat dissipation performance of the vehicle circuit board is poor due to the movement of the vehicle and the heat dissipation cannot be adjusted according to the internal temperature.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board heat dissipation structure, comprising a housing (2), a heat dissipation plate (3), a heat-conducting copper tube (31) and a two-way memory spring (33), characterized in that: The bottom end of the heat-conducting copper tube (31) is evenly arranged in an S shape, with its left and right ends extending in a vertical direction. A semiconductor cooling plate (32) is arranged on its lower surface, and a circuit board (1) is arranged on the upper surface of the bottom end of the heat-conducting copper tube. The multiple heat dissipation plates (3) are sleeved on the upper end of the heat-conducting copper tube (31), and a two-way memory spring (33) is arranged between every two adjacent heat dissipation plates (3). The bottom end of the semiconductor cooling plate (32) is fixedly connected to the shell (2), and multiple fans (21) are arranged inside the shell (2).

2. A circuit board heat dissipation structure according to claim 1, characterized in that: The shell (2) is hollowed out on four sides and has an open top.

3. A circuit board heat dissipation structure according to claim 1, characterized in that: The gap at the bottom end of the heat-conducting copper tube (31) does not exceed 10 mm and the cross-section is a hollow circle.

4. The circuit board heat dissipation structure according to claim 1, characterized in that: The bottom and top ends of the heat-conducting copper tube (31) are both provided with limiting devices to prevent the heat sink (3) from sliding out.

5. The circuit board heat dissipation structure according to claim 1, characterized in that: The interior of the heat-conducting copper tube (31) is hollow and filled with ether as a heat-conducting liquid.

6. The circuit board heat dissipation structure according to claim 1, characterized in that: The heat dissipation plate (3) has a thickness of no more than 1 mm and is made of copper or graphene.

7. The circuit board heat dissipation structure according to claim 1, characterized in that: The length of the two-way memory spring (33) is greater than 2 mm and its inner diameter fits the outer wall of the heat-conducting copper tube (31).

8. The circuit board heat dissipation structure according to claim 1, characterized in that: The dual-range memory spring (33) is made of CuZnAl alloy.

9. The circuit board heat dissipation structure according to claim 1, characterized in that: The semiconductor cooling sheet (32) is connected to the circuit board (1) as a connector.

10. The circuit board heat dissipation structure according to claim 1, characterized in that: The fan (21) is connected to the circuit board (1) as a connector.

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