Heat dissipation device and electronic equipment

Abstract

The utility model discloses a heat dissipation device and electronic equipment, the heat dissipation device comprises a heat dissipation structure, a top pressing assembly and a connecting structure, the heat dissipation structure comprises a heat dissipation piece, and the heat dissipation piece is used for heat dissipation of a heat source assembly; the jacking assembly is arranged on the side, back on to the heat source assembly, of the heat dissipation piece. The connecting structure is used for connecting the jacking assembly and the heat source assembly so that the jacking assembly can jack the heat dissipation piece in the direction close to the heat source assembly. According to the technical scheme, the attaching effect between the heat dissipation structure and the heat source assembly can be improved, and therefore the heat dissipation effect of the heat dissipation structure on the heat source assembly is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of heat dissipation devices, and in particular, to a heat dissipation device and an electronic device. Background Art

[0002] In electronic equipment, a heat source component is fixed with a heat dissipation structure, which is used to dissipate heat from the heat source component. In related technologies, the heat source component and the heat dissipation structure are connected by fasteners. When the fasteners connect the heat source component and the heat dissipation structure, the fasteners have a small force application area on the heat dissipation structure, which makes the fit between the heat dissipation structure and the heat source component poor, thereby affecting the heat dissipation effect of the heat dissipation structure on the heat source component. Utility Model Content

[0003] In a first aspect, the present application provides a heat dissipation device, which includes a heat dissipation structure, a top pressure assembly and a connecting structure. The heat dissipation structure includes a heat sink, which is used to dissipate heat from a heat source assembly; the top pressure assembly is arranged on a side of the heat sink that is away from the heat source assembly; the connecting structure is used to connect the top pressure assembly and the heat source assembly so that the top pressure assembly presses the heat sink in a direction close to the heat source assembly.

[0004] The heat dissipation device provided in the embodiment of the present application includes a heat dissipation structure, a pressing component and a connection structure, wherein the heat dissipation structure includes a heat sink, and the heat sink can dissipate heat to the heat source component; the pressing component is arranged on the side of the heat sink facing away from the heat source component, and the pressing component and the heat source component are connected by a connection structure, so that the pressing component presses the heat sink in the direction close to the heat source component to improve the fit between the heat sink and the heat source component. Compared with the solution in the related art in which the heat source component and the heat dissipation structure are connected by fasteners, in the heat dissipation device provided in the present application, the heat dissipation device includes a pressing component, and the heat sink is pressed against the heat source component by the pressing component. Since the pressing component has a larger force application area on the heat sink, the fit between the heat sink and the heat source component can be improved, thereby improving the heat dissipation effect of the heat dissipation structure on the heat source component.

[0005] In a possible implementation of the present application, the heat dissipation structure includes a support member, the support member is arranged on the heat dissipation member, and the pressing assembly includes a pressing member, the pressing member and the support member are arranged opposite to each other so that the pressing member presses the heat dissipation member through the support member.

[0006] In a possible implementation of the present application, a pressing surface is provided on the side of the pressing member facing the supporting member, and a supporting concave surface is provided on the side of the supporting member facing the pressing member. The pressing surface and the supporting concave surface are arranged opposite to each other, and the shape of the pressing surface matches the shape of the supporting concave surface.

[0007] In a possible implementation of the present application, the supporting concave surface has a first supporting area and a second supporting area, the first supporting area is arranged in the middle of the supporting member, and the second supporting area is arranged around the edge of the supporting member, and the top pressure surface has a first top pressure area and a second top pressure area, the first top pressure area is arranged opposite to the first supporting area, and the second top pressure area is arranged opposite to the second supporting area.

[0008] In a possible implementation of the present application, the pressing assembly includes an elastic structure, and the elastic structure is arranged between the pressing member and the supporting member, so that the pressing member presses the supporting member through the elastic structure.

[0009] In a possible implementation of the present application, the elastic structure includes a first elastic member and a second elastic member, the first elastic member is arranged corresponding to the middle of the support member, and the second elastic member is arranged corresponding to the edge of the support member.

[0010] In a possible implementation of the present application, the first elastic member is a spring, and a mounting column is provided on one of the pressing member and the supporting member, and the first elastic member is sleeved on the mounting column.

[0011] In a possible implementation of the present application, the connection structure includes a connecting bolt, a first connecting hole is provided on the top pressure component, and a second connecting hole is provided on the heat dissipation structure. The connecting bolt passes through the first connecting hole and the second connecting hole in sequence to be threadedly connected to the heat source component.

[0012] In a possible implementation of the present application, the connection structure further includes a positioning member, which is disposed on the connecting bolt, and the positioning member is used to cooperate with the heat source component in the axial direction of the connecting bolt.

[0013] In a second aspect, the present application provides an electronic device, which includes a heat source component and a heat dissipation device provided in any one of the first aspects, wherein the heat dissipation device is fixed on the heat source component.

[0014] The electronic device provided by the present application, because it includes the heat dissipation device provided by any one of the first aspects, has the same technical effect, that is, the heat dissipation effect of the heat dissipation device on the heat source component can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0016] Figure 2 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of the structure of the elastic structure and the heat dissipation structure on the heat dissipation device provided in an embodiment of the present application;

[0018] Figure 4 for Figure 3 Side view of

[0019] Figure 5 for Figure 3 A top view of

[0020] Figure 6 for Figure 2 Structural schematic diagram of the heat dissipation structure;

[0021] Figure 7 for Figure 2 Structural schematic diagram of the middle top pressure piece;

[0022] Figure 8 for Figure 7 Bottom view of .

[0023] Reference numerals:

[0024] 1-heat source assembly; 2-heat dissipation structure; 21-heat dissipation element; 211-avoidance portion; 22-support element; 221-support concave surface; 2211-first support area; 2212-second support area; 222-mounting column; 223-second connecting hole; 224-fourth connecting hole; 3-pressing assembly; 31-pressing element; 311-pressing surface; 3111-first pressing area; 3112-second pressing area; 312-first matching hole; 313-first connecting hole; 314-third connecting hole; 32-elastic structure; 321-first elastic element; 322-second elastic element; 4-connecting structure; 41-connecting bolt; 42-positioning element; 43-pre-installed bolt. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the specific technical scheme of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0027] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0028] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0029] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0030] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0031] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0032] In electronic equipment, a heat source component is fixed with a heat dissipation structure, which is used to dissipate heat from the heat source component. In related technologies, the heat source component and the heat dissipation structure are connected by fasteners. When the fasteners connect the heat source component and the heat dissipation structure, the fasteners have a small force application area on the heat dissipation structure, which makes the fit between the heat dissipation structure and the heat source component poor, thereby affecting the heat dissipation effect of the heat dissipation structure on the heat source component.

[0033] To this end, an embodiment of the present application provides an electronic device. Here, it needs to be explained that the electronic device mentioned in the embodiment of the present application can be a laptop computer, a tablet, a mobile phone, a computer host such as an all-in-one (All InOne, AIO), a television, or a game console, and the embodiment of the present application does not limit this.

[0034] Reference Figure 1The electronic device provided in the embodiment of the present application includes a heat source component 1 and a heat sink, and the heat sink is fixed on the heat source component 1. When the heat sink is fixed on the heat source component 1, the heat dissipation effect of the heat sink on the heat source component 1 can be improved.

[0035] In the embodiment of the present application, the heat source component 1 generally refers to an electronic device that generates heat during operation. Therefore, the structure of the heat source component 1 has many possibilities. For example, the heat source component 1 can be a graphics processing unit (GPU), a memory, a microprocessor (MPU), a micro control unit (MCU), or a central processing unit (CPU). The embodiment of the present application does not limit this.

[0036] In the embodiment of the present application, the number of heat sinks on the heat source assembly 1 may be various. For example, the number of heat sinks on the heat source assembly 1 may be one, three, or four, and the embodiment of the present application does not limit this. Figure 1 In one possible implementation method provided in the embodiment of the present application, the number of heat dissipation devices on the heat source component 1 is four.

[0037] Reference Figure 1 The embodiment of the present application also provides a heat dissipation device, which includes a heat dissipation structure 2, a top pressure component 3 and a connecting structure 4. The heat dissipation structure 2 includes a heat sink 21, and the heat sink 21 is used to dissipate heat from the heat source component 1; the top pressure component 3 is arranged on the side of the heat sink 21 facing away from the heat source component 1; the connecting structure 4 is used to connect the top pressure component 3 and the heat source component 1 so that the top pressure component 3 presses the heat sink 21 in a direction close to the heat source component 1.

[0038] The heat dissipation device provided in the embodiment of the present application includes a heat dissipation structure 2, a pressing assembly 3 and a connection structure 4, wherein the heat dissipation structure 2 includes a heat sink 21, and the heat sink 21 can dissipate heat for the heat source assembly 1; the pressing assembly 3 is arranged on the side of the heat sink 21 facing away from the heat source assembly 1, and the pressing assembly 3 is connected to the heat source assembly 1 through the connection structure 4, so that the pressing assembly 3 presses the heat sink 21 in the direction close to the heat source assembly 1 to improve the fitting effect between the heat sink 21 and the heat source assembly 1. Compared with the solution in the related art that the heat source assembly 1 and the heat dissipation structure 2 are connected by fasteners, in the heat dissipation device provided in the present application, the heat dissipation device includes a pressing assembly 3, and the heat sink 21 is pressed against the heat source assembly 1 by the pressing assembly 3. Since the pressing assembly 3 has a larger force application area on the heat sink 21, the fitting effect between the heat sink 21 and the heat source assembly 1 can be improved, thereby improving the heat dissipation effect of the heat dissipation structure 2 on the heat source assembly 1.

[0039] In the embodiment of the present application, the function of the pressing component 3 is to press the heat sink 21 toward the direction close to the heat source component 1. Therefore, the pressing component 3 can directly press the heat sink 21 or indirectly press the heat sink 21, and the embodiment of the present application does not limit this.

[0040] In the embodiment of the present application, in order to improve the protection effect of the heat sink 21, the pressing component 3 indirectly presses the heat sink 21. Figure 3 , Figure 4 and Figure 5 The heat dissipation structure 2 includes a support member 22, and the support member 22 is arranged on the heat dissipation member 21. The pressing assembly 3 includes a pressing member 31, and the pressing member 31 is arranged opposite to the support member 22, so that the pressing member 31 presses the heat dissipation member 21 through the support member 22. Here, the heat dissipation structure 2 includes a support member 22, and the pressing assembly 3 includes a pressing member 31. The pressing member 31 presses the heat dissipation member 21 through the support member 22, so that the heat dissipation member 21 does not directly bear the pressing pressure, thereby protecting the heat dissipation member 21 and improving the reliability of the heat dissipation device when in use.

[0041] In the embodiment of the present application, the heat sink 21 is used to dissipate heat from the heat source component 1. Therefore, the structure of the heat sink 21 has many possibilities. For example, the heat sink 21 can be a water cooling plate, a heat pipe, or a graphene heat sink. The embodiment of the present application does not limit this. In one possible implementation provided in the embodiment of the present application, the heat sink 21 is a water cooling plate.

[0042] In the embodiment of the present application, the support member 22 can be integrally provided on the heat sink 21, or can be provided on the heat sink 21 by bonding, clamping, welding or fastener connection, etc., and the embodiment of the present application does not limit this. In one possible implementation method provided in the embodiment of the present application, the support member 22 is fixed to the heat sink 21 by screws.

[0043] In the embodiment of the present application, the structures of the top pressure member 31 and the support member 22 have various possibilities. For example, the top pressure member 31 can be a plate-like structure, a block-like structure, or a frame structure; the support member 22 can also be a plate-like structure, a block-like structure, or a frame structure. The embodiment of the present application does not impose any restrictions on this.

[0044] In the embodiment of the present application, the pressing member 31 has a pressing surface 311 on one side facing the support member 22, and the support member 22 has a supporting concave surface 221 on one side facing the pressing member 31. The pressing surface 311 is arranged opposite to the supporting concave surface 221, and the shape of the pressing surface 311 matches the shape of the supporting concave surface 221. Here, the pressing member 31 has a pressing surface 311, and the support member 22 has a supporting concave surface 221. The shape of the pressing surface 311 matches the shape of the supporting concave surface 221. In this way, when the pressing member 31 presses the support member 22, the pressing surface 311 on the pressing member 31 can extend into the supporting concave surface 221 on the support member 22 to achieve positioning of the pressing member 31. In addition, in the circumferential direction of the support member 22, the edge of the supporting concave surface 221 can provide a limit for the support member 22, thereby improving the reliability of the pressing member 31 and the support member 22 when they are pressed together.

[0045] In the embodiment of the present application, there are many possible locations for the top pressure surface 311 on the top pressure member 31. For example, the top pressure surface 311 can be arranged in a ring shape along the edge of the top pressure member 31, can be arranged near the middle of the top pressure member 31, or can be arranged only on one side of the top pressure member 31. The embodiment of the present application does not limit this. There are many possible locations for the support concave surface 221 on the support member 22. For example, the support concave surface 221 can be arranged in a ring shape along the edge of the support member 22, can be arranged near the middle of the support member 22, or can be arranged only on one side of the support member 22. The embodiment of the present application does not limit this.

[0046] Reference Figure 5 , Figure 6 and Figure 8In the embodiment of the present application, the support concave surface 221 has a first support area 2211 and a second support area 2212, the first support area 2211 is arranged near the middle of the support member 22, and the second support area 2212 is arranged around the edge of the support member 22, and the top pressing surface 311 has a first top pressing area 3111 and a second top pressing area 3112, the first top pressing area 3111 is arranged opposite to the first support area 2211, and the second top pressing area 3112 is arranged opposite to the second support area 2212. Here, the support concave surface 221 has a first support area 2211 and a second support area 2212, and the top pressing surface 311 has a first top pressing area 3111 and a second top pressing area 3112, wherein the first top pressing area 3111 is used for top pressing cooperation with the first support area 2211, and the second top pressing area 3112 is used for top pressing cooperation with the second support area 2212. The first support area 2211 is arranged in the middle of the support member 22, and the second support area 2212 is arranged around the edge of the support member 22. In this way, the first pressing area 3111 can press the middle area of ​​the support member 22, and the second pressing area 3112 can press the edge area of ​​the support member 22, so that the support member 22 is evenly stressed as a whole, which can improve the fitting effect between the heat sink 21 and the heat source component 1, thereby improving the heat dissipation effect of the heat sink 21 on the heat source component 1. It is worth noting that the middle of the support member 22 does not specifically refer to the center of the support member 22, and the area surrounded by the upper edge of the support member 22 can be the middle of the support member 22.

[0047] In the embodiment of the present application, the pressing member 31 can directly press the supporting member 22 or indirectly press the supporting member 22, which is not limited in the embodiment of the present application. Figure 3 , Figure 4 and Figure 5 In an implementable manner provided in an embodiment of the present application, the pressing member 31 indirectly presses the supporting member 22. The pressing assembly 3 includes an elastic structure 32, and the elastic structure 32 is arranged between the pressing member 31 and the supporting member 22, so that the pressing member 31 presses the supporting member 22 through the elastic structure 32. Here, the pressing member 31 presses the supporting member 22 through the elastic structure 32, and the elastic structure 32 can provide a uniform and controllable pressing force to the supporting member 22, so that the supporting member 22 is evenly stressed, thereby improving the fitting effect between the heat sink 21 and the heat source assembly 1. In addition, when the pressing member 31 is impacted by an external force, the elastic member can absorb the energy caused by the impact, thereby protecting the heat dissipation structure 2 and improving the reliability of the heat dissipation device during use.

[0048] In the embodiment of the present application, there are many possible settings for the elastic structure 32. For example, the elastic structure 32 can be set only in the middle of the support member 22, or only in the edge of the support member 22, or in the middle and edge of the support member 22 at the same time. The embodiment of the present application does not limit this.

[0049] In the embodiment of the present application, the elastic structure 32 includes a first elastic member 321 and a second elastic member 322, wherein the first elastic member 321 is arranged corresponding to the middle of the support member 22, and the second elastic member 322 is arranged corresponding to the edge of the support member 22. In this way, the first elastic member 321 can provide a top pressure to the middle of the support member 22, and the second elastic member 322 can provide a top pressure to the edge of the support member 22, further making the force on the support member 22 uniform, thereby improving the fitting effect between the heat sink 21 and the heat source assembly 1.

[0050] In the embodiment of the present application, the first elastic member 321 has various possible structural designs. For example, the first elastic member 321 may be a rubber pad, a spring, or an elastic sheet, which is not limited in the embodiment of the present application. Figure 3 , Figure 5 and Figure 6 In one possible implementation provided in the embodiment of the present application, the first elastic member 321 is a spring, and a mounting column 222 is provided on one of the pressing member 31 and the support member 22, and the first elastic member 321 is mounted on the mounting column 222. The first elastic member 321 is a spring, and the spring has the advantages of strong elasticity and high reliability, which can improve the reliability of the pressing assembly 3 when in use. The first elastic member 321 is mounted on the mounting column 222, which can play a positioning role for the first elastic member 321, preventing the first elastic member 321 from shifting when pressing the support member 22, and further improving the reliability of the pressing assembly 3 when in use.

[0051] Reference Figure 8 In the embodiment of the present application, the top pressure surface 311 may be provided with a first matching hole 312 for the first elastic member 321 to extend into one end of the top pressure surface 311. In this way, relative movement between the top pressure surface 311 and the first elastic member 321 can be avoided, thereby improving the matching reliability between the top pressure surface 311 and the first elastic member 321.

[0052] In the embodiment of the present application, the number of the first elastic members 321 may be various, for example, the number of the first elastic members 321 may be one, three, or four, and the embodiment of the present application does not limit this. In addition, when the number of the first elastic members 321 is greater than or equal to four, the first elastic members 321 may be arranged linearly, in a ring shape, or in a rectangular array, and the embodiment of the present application does not limit this.

[0053] In the embodiment of the present application, the second elastic member 322 has various structural designs. For example, the second elastic member 322 may be a rubber pad, a spring, or an elastic sheet, which is not limited in the embodiment of the present application. Figure 3 and Figure 4 In one possible implementation provided in the embodiment of the present application, the second elastic member 322 is a spring. The spring has the advantages of strong elasticity and high reliability, and can improve the reliability of the top pressing assembly 3 when in use.

[0054] In the embodiment of the present application, a second matching hole may be provided on the top pressing surface 311 for the second elastic member 322 to extend into one end thereof toward the top pressing surface 311. In this way, relative movement between the top pressing surface 311 and the second elastic member 322 can be avoided, thereby improving the matching reliability between the top pressing surface 311 and the second elastic member 322.

[0055] In the embodiment of the present application, the number of the second elastic members 322 may be various, for example, the number of the second elastic members 322 may be one, three, or four, which is not limited in the embodiment of the present application. Figure 3 In an achievable manner provided in the embodiment of the present application, the number of the second elastic members 322 may be four, and the four second elastic members 322 are arranged at intervals along the edge of the support member 22. In this way, the uniformity of the force on the edge of the support member 22 is improved, which is conducive to improving the fitting effect between the heat sink 21 and the heat source assembly 1.

[0056] In the embodiment of the present application, the function of the connection structure 4 is to connect the top pressure component 3 and the heat source component 1. Therefore, the structural design of the connection structure 4 has many possibilities. For example, the connection structure 4 may include a U-shaped clamp block, and the U-shaped clamp block has two parallel clamping plates, and a tightening member is threadedly installed on one of the two clamping plates. When connecting the top pressure component 3 and the heat source component 1, first extend the top pressure component 3 and the heat source component 1 between the two clamping plates of the U-shaped clamp block, and then screw the tightening member so that the tightening member extends between the two clamping plates of the U-shaped clamp block, and tighten the top pressure component 3 and the heat source component 1 through the tightening member, thereby realizing the connection between the top pressure component 3 and the heat source component 1.

[0057] Reference Figure 3 , Figure 6 and Figure 7In the embodiment of the present application, the connection structure 4 includes a connection bolt 41, a first connection hole 313 is provided on the top pressure component 3, and a second connection hole 223 is provided on the heat dissipation structure 2. The connection bolt 41 passes through the first connection hole 313 and the second connection hole 223 in sequence to be threadedly connected with the heat source component 1. Here, the connection bolt 41 passes through the top pressure component 3 and the heat dissipation structure 2 in sequence and is connected to the heat source component 1, so that the top pressure component 3, the heat dissipation structure 2 and the heat source component 1 are connected and fixed together, avoiding relative movement between the heat source component 1 and the heat dissipation device, and ensuring the reliability of the heat dissipation device when in use.

[0058] Reference Figure 3 and Figure 4 In the embodiment of the present application, the second connecting hole 223 is arranged on the support member 22, and the heat sink 21 is provided with an avoidance portion 211. The connecting bolt 41 passes through the first connecting hole 313, the second connecting hole 223 and the avoidance portion 211 in sequence and is threadedly connected to the heat source component 1.

[0059] Reference Figure 3 and Figure 4 In the embodiment of the present application, the connection structure 4 further includes a positioning member 42, which is disposed on the connection bolt 41, and is used to cooperate with the heat source component 1 in the axial direction of the connection bolt 41. Here, when the connection bolt 41 is screwed into the threaded hole on the heat source component 1, the depth of the connection bolt 41 screwed into the threaded hole can be determined by the positioning member 42 to prevent the connection bolt 41 from being excessively screwed into the threaded hole, thereby preventing the pressing component 3 from excessively pressing the heat dissipation structure 2, thereby ensuring the reliability of the heat dissipation device when in use.

[0060] Reference Figure 7 and Figure 8 In the embodiment of the present application, the first connection hole 313 is correspondingly arranged at the edge of the support member 22, so that the connection bolt 41 can pass through the first elastic member 321 while passing through the first connection hole 313. In this way, there is no need to set a fixing structure for the first elastic member 321 separately, which reduces the number of parts in the heat dissipation device and improves the assembly efficiency of the heat dissipation device.

[0061] Reference Figure 2 , Figure 3 and Figure 4 In the embodiment of the present application, the connection structure 4 further includes a pre-installed bolt 43, a third connection hole 314 is provided on the top pressure piece 31, and a fourth connection hole 224 is provided on the support piece 22. When assembling the heat dissipation device, the pre-installed bolt 43 passes through the third connection hole 314 and is threadedly connected with the fourth connection hole 224. In this way, the first spring member and the second spring member can be pre-installed between the top pressure piece 31 and the support piece 22, further improving the assembly efficiency of the heat dissipation device.

[0062] The serial numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments. The above are only preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: include: The heat dissipation structure comprises a heat dissipation element, wherein the heat dissipation element is used to dissipate heat from the heat source component; A top pressure component, the top pressure component is arranged on a side of the heat sink facing away from the heat source component; The connection structure is used to connect the pressing component and the heat source component so that the pressing component presses the heat sink toward the direction close to the heat source component.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation structure includes a support member, and the support member is arranged on the heat dissipation member. The pressing assembly includes a pressing member, and the pressing member is arranged opposite to the support member so that the pressing member presses the heat dissipation member through the support member.

3. The heat dissipation device according to claim 2, characterized in that: The pressing member has a pressing surface on one side facing the supporting member, and the supporting member has a supporting concave surface on one side facing the pressing member. The pressing surface is arranged opposite to the supporting concave surface, and the shape of the pressing surface matches the shape of the supporting concave surface.

4. The heat dissipation device according to claim 3, characterized in that: The supporting concave surface has a first supporting area and a second supporting area, the first supporting area is arranged in the middle of the supporting member, and the second supporting area is arranged around the edge of the supporting member, and the top pressing surface has a first top pressing area and a second top pressing area, the first top pressing area is arranged opposite to the first supporting area, and the second top pressing area is arranged opposite to the second supporting area.

5. The heat dissipation device according to any one of claims 2 to 4, characterized in that: The pressing assembly comprises an elastic structure, and the elastic structure is arranged between the pressing member and the supporting member, so that the pressing member presses the supporting member through the elastic structure.

6. The heat dissipation device according to claim 5, characterized in that: The elastic structure includes a first elastic member and a second elastic member, wherein the first elastic member is arranged corresponding to the middle portion of the support member, and the second elastic member is arranged corresponding to the edge of the support member.

7. The heat dissipation device according to claim 6, characterized in that: The first elastic member is a spring, one of the pressing member and the supporting member is provided with a mounting column, and the first elastic member is sleeved on the mounting column.

8. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The connection structure includes a connection bolt, a first connection hole is provided on the top pressure component, and a second connection hole is provided on the heat dissipation structure. The connection bolt passes through the first connection hole and the second connection hole in sequence to be threadedly connected with the heat source component.

9. The heat dissipation device according to claim 8, characterized in that: The connection structure further comprises a positioning member, which is disposed on the connection bolt and is used for engaging with the heat source component in the axial direction of the connection bolt.

10. An electronic device, characterized in that: include: Heat source components; The heat sink according to any one of claims 1 to 9, wherein the heat sink is fixed to the heat source assembly.

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