Infrared transmitting tube heat dissipation structure

By designing the heat dissipation structure of the infrared emitter and the guide plate rotary part structure, the heat dissipation and installation problems of the high-power infrared emitter are solved, and efficient heat dissipation and correct pin installation are achieved.

CN222655671UActive Publication Date: 2025-03-21JIANGSU RUIBO PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202421287124.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-06
Publication Date
2025-03-21
Estimated Expiration
2034-06-06

AI Technical Summary

Technical Problem

Due to the lack of heat dissipation structure, high-power infrared emitters often face heat dissipation problems, and may cause pin bending when pins are connected to circuit boards, making it difficult to install.

Method used

An infrared emitter tube heat dissipation structure is designed, including the emitter tube main body, support structure and heat dissipation ring. The inner side of the heat dissipation ring is inserted into the infrared tube through an inner heat dissipation block, and the inner heat dissipation block transmits the heat inside the infrared tube to the heat dissipation ring. A number of external heat dissipation blocks are connected to the outside of the heat dissipation ring, increasing the heat dissipation area. Meanwhile, the guide plate and rotary member structure are used to support and position the pins to avoid bending.

Benefits of technology

The infrared emitter tube is efficiently dissipated, avoiding installation problems caused by heat dissipation problems, and ensuring the correct installation and rotation of the pins through the guide plate and rotary member structure.

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Abstract

The utility model discloses an infrared transmitting tube heat dissipation structure, a transmitting tube main body comprises a supporting plate, the middle part of the upper surface of the supporting plate is hollow, the inner side of the hollow part of the supporting plate is fixedly connected with a plurality of outer heat dissipation blocks, and the distances between the adjacent outer heat dissipation blocks are equal. The inner sides of all the outer heat dissipation blocks are jointly and fixedly provided with a heat dissipation ring, the inner side wall of the heat dissipation ring is fixedly connected with the lower end of an infrared tube, the inner side of the heat dissipation ring is fixedly connected with a plurality of inner heat dissipation blocks, the distance between every two adjacent inner heat dissipation blocks is equal, one end of each inner heat dissipation block penetrates into the infrared tube, and the other end of each inner heat dissipation block penetrates into the infrared tube. A gap is reserved between the hollow inner side of the supporting plate and the outer side of the heat dissipation ring, the inner side of the heat dissipation ring is inserted into the infrared tube through an inner heat dissipation block, the inner heat dissipation block can conduct heat in the infrared tube to the heat dissipation ring, in addition, the outer side of the heat dissipation ring is connected with a plurality of outer heat dissipation blocks, the heat dissipation area of the heat dissipation ring is increased through the outer heat dissipation blocks, and the heat dissipation efficiency is improved. And more effective heat dissipation of the infrared lamp tube is realized.
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Description

Technical Field

[0001] The utility model relates to the technical field of infrared emitting tubes, in particular to a heat dissipation structure of an infrared emitting tube. Background Art

[0002] A high-power infrared transmitting tube is an electronic device used to emit high-intensity infrared light. It is often used in long-distance transmission and high-intensity light source requirements. Its operating wavelength is usually between 850nm and 950nm. It is suitable for infrared communications, infrared imaging, sensors and medical equipment. It is usually made of gallium arsenide or indium phosphide materials, has the characteristics of high efficiency, and has pin packaging and surface mounting forms, which are convenient for use on different circuit boards.

[0003] High-power infrared transmitting tubes often face heat dissipation problems due to their high energy output and lack of heat dissipation structure. In addition, when connecting to the circuit board through pins, the pins may be bent due to the tilt of the transmitting tube when inserted downward, making the infrared transmitting tube difficult to install. Therefore, a heat dissipation structure of an infrared transmitting tube is proposed to solve the above problems. Utility Model Content

[0004] The technical problems to be solved by the utility model are as follows: high-power infrared emitting tubes often face heat dissipation problems due to their high energy output and the lack of heat dissipation structure. In addition, when connecting the circuit board through pins, the pins may be bent due to the tilt of the emitting tube when inserted downward, making the infrared emitting tube difficult to install.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] An infrared transmitting tube heat dissipation structure comprises a transmitting tube body, both sides of the transmitting tube body are provided with supporting structures, and the transmitting tube body comprises an infrared tube;

[0007] Also includes:

[0008] The transmitting tube body includes a support plate, the middle part of the upper surface of the support plate is hollowed out, a plurality of external heat dissipation blocks are fixedly connected to the inner side of the support plate located at the hollowed out part, and the spacing between adjacent external heat dissipation blocks is equal, and a heat dissipation ring is fixedly installed on the inner side of all the external heat dissipation blocks;

[0009] The inner wall of the heat dissipation ring is fixedly connected to the lower end of the infrared tube, and a plurality of inner heat dissipation blocks are fixedly connected to the inner side of the heat dissipation ring, and the spacing between adjacent inner heat dissipation blocks is equal, and one end of each inner heat dissipation block penetrates into the infrared tube;

[0010] Wherein, the support plate is located with a gap between the inner side of the hollow and the outer side of the heat dissipation ring.

[0011] As a further solution of the utility model: a heat dissipation base plate is fixedly connected to the inner wall of the support plate and located below the infrared tube, the bottom end of the heat dissipation base plate extends to below the support plate, and pins are symmetrically fixedly connected to the two ends of the bottom of the support plate, and the pins are electrically connected to the infrared tube.

[0012] As a further solution of the utility model: the outer wall of the support plate and both sides close to the pins are fixedly connected with limit rings, and one end of the bottom of the two limit rings is fixedly connected with an extrusion shaft.

[0013] As a further solution of the utility model: the supporting structure includes a guide plate, two of which are provided and are slidably connected to the inner walls of the limiting rings on both sides respectively, a rotating part is movably connected to the lower end of the inner wall of the guide plate, both sides of the rotating part pass through the guide plate, and the outer wall of the rotating part is provided with anti-slip texture.

[0014] As a further solution of the utility model: a limiting groove is provided on the inner wall of the rotating part close to the pin, the inner side of the limiting groove is slidably connected to the surface of the pin, and a removal outlet is provided on the side wall of the rotating part close to the edge of the rotating part, and the length of the removal outlet is greater than the diameter of the pin.

[0015] As a further solution of the utility model: a slot is provided at one end of the lower surface of the rotating member, and the slot is hexagonal as a whole.

[0016] As a further solution of the utility model: the inner wall of the guide plate is slidably connected with a lifting plate located below the rotating part, one end of the lifting plate located below the rotating part is fixedly connected with an insertion shaft, the outer wall of the insertion shaft is snap-connected with the inner side of the slot, the bottom of the lifting plate is fixedly connected with a spring, the bottom of the spring is fixedly connected to the inner wall of the guide plate, one end of the lifting plate extends out of the guide plate and the top is in movably contact with the extrusion shaft.

[0017] Beneficial effects of the utility model:

[0018] (1) The utility model installs a heat dissipation ring on the outer side of the infrared tube, and the inner side of the heat dissipation ring is inserted into the infrared tube through an inner heat dissipation block, and the inner heat dissipation block can conduct the heat inside the infrared tube to the heat dissipation ring. In addition, the outer side of the heat dissipation ring is connected to a plurality of outer heat dissipation blocks, and the outer heat dissipation blocks increase the heat dissipation area of ​​the heat dissipation ring, thereby achieving more effective heat dissipation of the infrared lamp tube;

[0019] (2) Vertical guide plates are provided on both sides of the transmitting tube body. When the infrared tube is inserted into the circuit board through the pins, the guide plates can be supported on the sides to facilitate the operator to insert it vertically. In addition, a rotating part with a limiting groove is provided on the inner wall of the guide plate. The limiting groove can support the inner pins to prevent the pins from bending. When the pins are inserted and positioned, the rotating part can be rotated and pulled out, and then the guide plate can be separated from the transmitting tube body without occupying the circuit board space. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the cross-sectional view of the support plate structure in the utility model from a top view;

[0023] Figure 3 This is a schematic diagram of the structure of the heat dissipation ring in the utility model from a top view;

[0024] Figure 4 This is a schematic diagram of the internal structure of the guide plate in the utility model;

[0025] Figure 5 It is a bottom view structural diagram of the rotating part in the utility model.

[0026] In the figure: 1. transmitting tube body; 101. supporting plate; 102. external heat sink; 103. heat sink ring; 104. internal heat sink; 105. infrared tube; 106. heat sink base; 107. limiting ring; 108. pin; 109. extrusion shaft; 2. supporting structure; 201. guide plate; 202. lifting plate; 203. spring; 204. plug-in shaft; 205. rotating part; 206. limiting groove; 207. removal outlet; 208. slot. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] like Figure 1-5As shown, an infrared transmitting tube heat dissipation structure includes a transmitting tube body 1, support structures 2 are arranged on both sides of the transmitting tube body 1, and the transmitting tube body 1 includes an infrared tube 105; and further includes: wherein the transmitting tube body 1 includes a support plate 101, the middle part of the upper surface of the support plate 101 is hollowed out, and the support plate 101 is located inside the hollow part and is fixedly connected to a plurality of external heat dissipation blocks 102, and the spacing between adjacent external heat dissipation blocks 102 is equal, and a heat dissipation ring 103 is fixedly installed on the inner side of all the external heat dissipation blocks 102; wherein the inner side wall of the heat dissipation ring 103 is fixedly connected to the lower end of the infrared tube 105, and the inner side of the heat dissipation ring 103 is fixedly connected to a plurality of internal heat dissipation blocks 104, and the spacing between adjacent internal heat dissipation blocks 104 is equal, and one end of each internal heat dissipation block 104 penetrates into the interior of the infrared tube 105; wherein a gap is left between the support plate 101 located inside the hollow and the outer side of the heat dissipation ring 103, as shown in FIG. Figure 2 As shown, the heat inside the infrared tube 105 is guided to the heat dissipation ring 103 through the inner heat dissipation block 104, and then the heat inside the heat dissipation ring 103 is guided to the outside with the assistance of the outer heat dissipation block 102;

[0029] The inner wall of the support plate 101 and located below the infrared tube 105 are fixedly connected with a heat dissipation base plate 106, the bottom end of the heat dissipation base plate 106 extends to the bottom of the support plate 101, and the two ends of the bottom of the support plate 101 are symmetrically fixedly connected with pins 108, and the pins 108 are electrically connected to the infrared tube 105. The outer wall of the support plate 101 and both sides close to the pins 108 are fixedly connected with limit rings 107, and one end of the bottom of the two limit rings 107 is fixedly connected with an extrusion shaft 109. Figure 1 As shown, pin 108 is used to insert into a circuit board;

[0030] The support structure 2 includes a guide plate 201, two guide plates 201 are provided and are respectively slidably connected to the inner wall of the limiting ring 107 on both sides. The lower end of the inner wall of the guide plate 201 is movably connected to a rotating member 205. Both sides of the rotating member 205 pass through the guide plate 201, and the outer wall of the rotating member 205 is provided with anti-slip patterns, such as Figure 1 As shown, the anti-slip pattern facilitates the rotation of the rotating member 205;

[0031] A limiting groove 206 is provided on the inner wall of the rotating member 205 near the pin 108, and the inner side of the limiting groove 206 is slidably connected to the surface of the pin 108. A removal port 207 is provided on the side wall of the rotating member 205 near the edge of the rotating member 205, and the length of the removal port 207 is greater than the diameter of the pin 108. Figure 5 As shown, the rotating member 205 as a whole can be separated from the pin 108 by removing the outlet 207;

[0032] A slot 208 is provided at one end of the lower surface of the rotating member 205, and the slot 208 is hexagonal as a whole. A lifting plate 202 is slidably connected to the inner wall of the guide plate 201 and located below the rotating member 205. An end of the lifting plate 202 located below the rotating member 205 is fixedly connected to an insertion shaft 204. The outer wall of the insertion shaft 204 is engaged with the inner side of the slot 208. A spring 203 is fixedly connected to the bottom of the lifting plate 202. The bottom of the spring 203 is fixedly connected to the inner wall of the guide plate 201. One end of the lifting plate 202 extends out of the guide plate 201 and the top is in active contact with the extrusion shaft 109. Figure 4-Figure 5 As shown, after the insertion shaft 204 is inserted into the slot 208 , the rotating member 205 cannot be separated from the guide plate 201 , and the rotation of the rotating member 205 in the guide plate 201 is blocked.

[0033] The working principle of this utility model:

[0034] When installing the launch tube body 1, first insert the guide plates 201 on both sides into the inner side of the limit ring 107, during which the pin 108 passes through the limit groove 206, and then the pin 108 is gradually inserted into the circuit board, and the guide plate 201 is supported on the surface of the circuit board, and the support plate 101 and the limit rings 107 on both sides slide downward relative to the guide plate 201 until the extrusion shaft 109 is released and pushes the lifting plate 202 downward. At this time, the insertion shaft 204 is separated from the slot 208 and the rotating member 205 is unlocked, and the rotating member 205 is rotated inside the limit plate 201. When the removal port 207 rotates to the vicinity of the pin 108, the rotating member 205 is pulled outward to drive the rotating member 205 to separate from the guide plate 201, and finally the guide plates 201 on both sides are pulled upward, and the support plate 101 is pressed down to ensure that it is inserted in place.

[0035] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. An infrared transmitting tube heat dissipation structure, comprising a transmitting tube body (1), support structures (2) being arranged on both sides of the transmitting tube body (1), and the transmitting tube body (1) comprising an infrared tube (105); It is characterized in that Also includes: The transmitting tube body (1) comprises a support plate (101), the middle part of the upper surface of the support plate (101) is hollowed out, a plurality of external heat dissipation blocks (102) are fixedly connected to the inner side of the support plate (101) located at the hollowed-out part, and the spacing between adjacent external heat dissipation blocks (102) is equal, and a heat dissipation ring (103) is fixedly installed on the inner side of all the external heat dissipation blocks (102); The inner wall of the heat dissipation ring (103) is fixedly connected to the lower end of the infrared tube (105); a plurality of inner heat dissipation blocks (104) are fixedly connected to the inner side of the heat dissipation ring (103); adjacent inner heat dissipation blocks (104) are spaced at equal intervals; and one end of each inner heat dissipation block (104) penetrates into the interior of the infrared tube (105); There is a gap between the support plate (101) located inside the hollow portion and the outside of the heat dissipation ring (103).

2. The infrared emitting tube heat dissipation structure according to claim 1, characterized in that: A heat dissipation base plate (106) is fixedly connected to the inner wall of the support plate (101) and located below the infrared tube (105); the bottom end of the heat dissipation base plate (106) extends below the support plate (101); pins (108) are symmetrically fixedly connected to the two ends of the bottom of the support plate (101); the pins (108) are electrically connected to the infrared tube (105).

3. The infrared emitting tube heat dissipation structure according to claim 1, characterized in that: The outer wall of the support plate (101) and both sides close to the pins (108) are fixedly connected to limit rings (107), and one end of the bottom of the two limit rings (107) is fixedly connected to an extrusion shaft (109).

4. The infrared emitting tube heat dissipation structure according to claim 1, characterized in that: The support structure (2) comprises a guide plate (201), wherein two guide plates (201) are provided and are respectively slidably connected to the inner walls of the limiting rings (107) on both sides, and a rotating member (205) is movably connected to the lower end of the inner wall of the guide plate (201), and both sides of the rotating member (205) pass through the guide plate (201), and the outer wall of the rotating member (205) is provided with anti-slip patterns.

5. The infrared emitting tube heat dissipation structure according to claim 4, characterized in that: A limiting groove (206) is provided on the inner wall of one side of the rotating member (205) close to the pin (108), and the inner side of the limiting groove (206) is slidably connected to the surface of the pin (108). A removal opening (207) is provided on the side wall of the rotating member (205) close to the edge of the rotating member (205), and the length of the removal opening (207) is greater than the diameter of the pin (108).

6. The infrared emitting tube heat dissipation structure according to claim 4, characterized in that: A slot (208) is provided at one end of the lower surface of the rotating member (205), and the slot (208) is hexagonal in shape as a whole.

7. The infrared emitting tube heat dissipation structure according to claim 4, characterized in that: A lifting plate (202) is slidably connected to the inner wall of the guide plate (201) and is located below the rotating member (205); one end of the lifting plate (202) located below the rotating member (205) is fixedly connected to an insertion shaft (204); the outer wall of the insertion shaft (204) is snap-connected to the inner side of the slot (208); a spring (203) is fixedly connected to the bottom of the lifting plate (202); the bottom of the spring (203) is fixedly connected to the inner wall of the guide plate (201); one end of the lifting plate (202) extends out of the guide plate (201) and the top is in active contact with the extrusion shaft (109).