Automatic pulling and pushing mechanism for semiconductor frame material

Abstract

The utility model belongs to the technical field of semiconductors, and relates to an automatic pulling and pushing mechanism for semiconductor frame materials, which comprises a base and an X-axis moving assembly arranged on the base, a Y-axis moving assembly is slidably connected onto the X-axis moving assembly, a Z-axis lifting assembly is slidably connected onto the Y-axis moving assembly, and a Z-axis lifting assembly is slidably connected onto the Z-axis lifting assembly. The left side and the right side of the Z-axis lifting assembly are connected with the material pulling assembly and the material pushing assembly respectively, the material pulling assembly and the material pushing assembly are both parallel to the X-axis moving assembly, and the material pulling assembly comprises a clamping jaw and a driving part used for driving the clamping jaw to work and further comprises a sensor in signal connection with the driving part. The automatic material pulling and pushing mechanism for the semiconductor frame material effectively solves the problem that the frame material is difficult to input and output, is economical, efficient and wide in applicability, can save space and manpower, is matched with the high speed of the semiconductor industry, and has the advantages of being simple in structure, stable, reliable, convenient, effective, high in production efficiency, low in cost and the like.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to an automatic material pulling and pushing mechanism for semiconductor frame materials. Background Art

[0002] In the existing semiconductor frame material mobile transportation, especially in the X-RAY inspection industry, the transportation platform is mostly affected by the inspection area, and the frame materials are of different sizes and cannot be well compatible, resulting in difficulties in the input and output of frame materials. Utility Model Content

[0003] The purpose of the utility model is to solve the defects and shortcomings in the prior art and to design an automatic material pulling and pushing mechanism for semiconductor frame materials which is simple in structure, stable and reliable, and can effectively solve the problem of difficult input and output of frame materials, improve production efficiency, and save manpower and material resources.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an automatic material pulling and pushing mechanism for semiconductor frame materials, including a base, and an X-axis moving component arranged on the base, the X-axis moving component is slidably connected to the Y-axis moving component, the Y-axis moving component is slidably connected to the Z-axis lifting component, and the left and right sides of the Z-axis lifting component are respectively connected to the material pulling component and the material pushing component.

[0005] Preferably, the material pulling assembly and the material pushing assembly are both arranged parallel to the X-axis moving assembly.

[0006] Preferably, the material pulling assembly includes a clamping jaw and a driving member for driving the clamping jaw to work.

[0007] Preferably, the material pulling assembly further comprises a detection sensor, and the sensor is connected to the driving member signal.

[0008] Preferably, the pushing assembly includes a push rod, one end of which is connected to the Z-axis lifting assembly, and the other end of which extends in a direction away from the pulling assembly.

[0009] After adopting the above technical solution, the automatic material pulling and pushing mechanism for semiconductor frame material provided by the utility model has the following beneficial effects:

[0010] The utility model effectively solves the problem of difficult input and output of frame materials, and provides a more economical, efficient and widely applicable automatic material pulling and pushing mechanism for semiconductor frame materials, which can save space and manpower, match the high speed of the semiconductor industry, and has the advantages of simple structure, stable and reliable, convenient and effective, high production efficiency and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1This is a structural schematic diagram of an automatic material pulling and pushing mechanism for semiconductor frame materials of the utility model;

[0012] Figure 2 This is a front view of an automatic material pulling and pushing mechanism for semiconductor frame materials of the utility model;

[0013] Figure 3 The utility model is a top view of an automatic material pulling and pushing mechanism for semiconductor frame materials.

[0014] Among them: base 1, X-axis moving component 2, Y-axis moving component 3, Z-axis lifting component 4, material pulling component 5, and material pushing component 6. DETAILED DESCRIPTION

[0015] The present invention is further described clearly and completely below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0017] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0018] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0019] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0020] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0021] The utility model discloses an automatic material pulling and pushing mechanism for semiconductor frame materials, such as Figure 1-3As shown, it includes a base 1 and an X-axis moving component 2 arranged on the base 1, the X-axis moving component 2 includes a first guide rail arranged along the X-axis direction, a first slider is slidably matched on the first guide rail, and the first slider is connected to a first power component for driving it to move along the first guide rail, and a Y-axis moving component 3 is slidably connected to the X-axis moving component 2. Specifically, the Y-axis moving component 3 is connected to the first slider, and the Y-axis moving component 3 includes a second guide rail arranged along the Y-axis direction, a second slider is slidably matched on the second guide rail, and the second slider is connected to a second power component for driving it to move along the second guide rail. The Z-axis lifting assembly 4 is slidably connected to the axis moving assembly 3. Specifically, the Z-axis lifting assembly 4 is connected to the second slider, and the Z-axis lifting assembly 4 includes a third guide rail arranged along the Z-axis direction, and the third guide rail is slidably fitted with a third slider, and the third slider is connected to a third power assembly for driving it to move up and down along the third guide rail. The left and right sides of the Z-axis lifting assembly 4 are respectively connected to the material pulling assembly 5 and the material pushing assembly 6. Specifically, the material pulling assembly 5 and the material pushing assembly 6 are both connected to the third slider, and the material pulling assembly 5 and the material pushing assembly 6 can realize front and back, left and right, and up and down movements with the cooperation of the first slider, the second slider and the third slider.

[0022] Furthermore, the material pulling assembly 5 and the material pushing assembly 6 are both arranged parallel to the X-axis moving assembly 2. The material pulling assembly 5 includes a clamp and a driving member for driving the clamp to work. The material pulling assembly 5 also includes a detection sensor, and the sensor is connected to the driving member signal. The material pushing assembly 6 includes a push rod, one end of which is connected to the Z-axis lifting assembly 4, and the other end extends in a direction away from the material pulling assembly 5.

[0023] The utility model discloses an automatic material pulling and pushing mechanism for semiconductor frame material. When the process is completed by the front section mechanism, the frame material is located at the material taking position, the X-axis moving component 2 and the Y-axis moving component 3 cooperate to move so that the material pulling component 5 moves to above the material taking position, the clamping claw opens, and the Z-axis lifting component 4 drives the material pulling component 5 to descend to the height of the frame material. The X-axis moving component 2 moves horizontally, and the sensor on the material pulling component 5 detects the frame material, and the clamping claw of the material pulling component 5 touches the edge of one side of the frame material (ensuring that the clamping claw does not touch the semiconductor material of the frame material), the clamping claw closes and clamps the frame material, the X-axis moving component 2 moves, and the material is pulled to the specified position, and then the clamping claw opens, the X-axis moving component 2 moves horizontally to make the clamping claw avoid a certain distance, the Z-axis lifting component 4 drives the material pulling component 5 to rise, and then moves to the safe position through the Y-axis moving component 3 to complete the input;

[0024] When the middle section mechanism completes the process, the frame material is located at the position to be discharged, and the pusher assembly 6 at the safe position is driven by the cooperation of the X-axis moving assembly 2, the Y-axis moving assembly 3 and the Z-axis lifting assembly 4 to move to the corresponding height on the other side of the frame material, and then the X-axis moving assembly 2 is translated, driving the pusher assembly 6 to push the frame material to the next process through the push rod, and finally, the pusher assembly 6 is driven by the cooperation of the X-axis moving assembly 2, the Y-axis moving assembly 3 and the Z-axis lifting assembly 4 to return to the safe position to complete the output.

[0025] To sum up, the utility model provides an automatic pulling and pushing mechanism for semiconductor frame materials, which effectively solves the problem of difficulty in inputting and outputting frame materials, and provides a more economical, efficient and widely applicable automatic pulling and pushing mechanism for semiconductor frame materials. It can save space, save manpower, match the high speed of the semiconductor industry, and has the advantages of simple structure, stable and reliable, convenient and effective, high production efficiency, low cost, etc. It has great market value and deserves wide promotion and application.

[0026] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An automatic material pulling and pushing mechanism for semiconductor frame materials, characterized in that: The invention comprises a base (1), and an X-axis moving assembly (2) arranged on the base (1); a Y-axis moving assembly (3) is slidably connected to the X-axis moving assembly (2); a Z-axis lifting assembly (4) is slidably connected to the Y-axis moving assembly (3); and a material pulling assembly (5) and a material pushing assembly (6) are respectively connected to the left and right sides of the Z-axis lifting assembly (4).

2. The automatic material pulling and pushing mechanism for semiconductor frame materials according to claim 1, characterized in that: The material pulling assembly (5) and the material pushing assembly (6) are both arranged parallel to the X-axis moving assembly (2).

3. The automatic material pulling and pushing mechanism for semiconductor frame materials according to claim 1, characterized in that: The material pulling assembly (5) comprises a clamping jaw and a driving member for driving the clamping jaw to work.

4. The automatic material pulling and pushing mechanism for semiconductor frame materials according to claim 3, characterized in that: The material pulling assembly (5) also includes a detection sensor, and the sensor is connected to the driving member signal.

5. The automatic material pulling and pushing mechanism for semiconductor frame materials according to claim 1, characterized in that: The material pushing assembly (6) comprises a push rod, one end of which is connected to the Z-axis lifting assembly (4), and the other end of which extends in a direction away from the material pulling assembly (5).

Images