Structure of planar magnetron sputtering target

By setting steps on the outer ring of the magnetic field module of the magnetron sputtering target and designing a conical insulating spacer, the insulation performance degradation and short circuit problems caused by metal atom deposition on the insulating plate are solved, and stronger insulation effect and stable operation of the equipment are achieved.

CN222665980UActive Publication Date: 2025-03-25SHENZHEN LEIYU TECH CO LTD
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Patent Information

Application Number
CN202420371235.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-28
Publication Date
2025-03-25
Estimated Expiration
2034-02-28

AI Technical Summary

Technical Problem

During magnetron sputtering, the number of metal atoms deposited on the insulating plate will increase, resulting in a degradation of insulation performance, conduction between the electrode module and the power supply ground, causing a short circuit, and causing the equipment to not work normally.

Method used

A planar magnetron sputtering target structure is designed, including a magnetic field module, a fixed base plate and an insulating plate. The magnetic field module is concavely close to one end of the insulating plate to form a step to reduce the deposition of metal atoms on the insulating plate and increase the conduction length between the magnetic field module and the fixed base plate. There is a spacing between the head of the insulating spacer and the magnetic field module. The conical structure is closely connected to the insulating plate to form a sealing area. The buffer groove design prevents the insulating spacer from deforming.

Benefits of technology

By reducing the deposition of metal atoms on the insulating plate, enhancing the insulation effect, effectively preventing creepage, avoiding short circuits, and ensuring the normal operation of the equipment.

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Abstract

The utility model discloses a structure of a planar magnetron sputtering target, which comprises a magnetic field module, a fixed bottom plate and an insulating plate arranged between the magnetic field module and the fixed bottom plate, one end of the magnetic field module close to the insulating plate is concaved inwards to form a step, the magnetic field module, the fixed bottom plate and the insulating plate are connected, and an insulating spacer bush is arranged at the joint of the magnetic field module, the fixed bottom plate and the insulating plate. And a gap is formed between the head of the insulating spacer bush and the magnetic field module. According to the utility model, the outer ring of the magnetic field module is provided with the step which plays a role in shielding the insulating plate, so that the deposition of metal atoms on the insulating plate can be reduced, and the conduction length of the magnetic field module and the fixed bottom plate is increased, thereby reducing the creepage probability; the interval between the head of the insulating spacer bush and the magnetic field module is a reserved space for metal atoms deposited on the insulating plate, and the metal atoms can be deposited in the reserved space and are not attached to the surface of the insulating plate, so that the magnetic field module is prevented from being conducted with the fixed bottom plate, the creepage phenomenon is effectively prevented, and the insulating effect is further enhanced.
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Description

Technical Field

[0001] The utility model relates to the technical field of magnetron sputtering, and more specifically to the structure of a planar magnetron sputtering target. Background Art

[0002] Magnetron sputtering has the characteristics of simple operation, easy and precise control of process parameters and good film quality. It has become one of the most important coating methods in modern times. It is used for surface coating of various materials such as metals, semiconductors and insulators. It has the advantages of easy control of film thickness, large coating area and strong adhesion. Magnetron sputtering introduces a magnetic field on the surface of the target cathode and uses the magnetic field to confine charged particles to increase the plasma density and increase the sputtering rate.

[0003] In magnetron sputtering equipment, the shell is usually connected to the power ground, and the electrode module is connected to the metal target of the cathode. The electrode module and the magnetic field module are interconnected to form a complete magnetron sputtering system. During the magnetron sputtering process of the metal target, the incident ions (Ar+) bombard the target under the action of the electric field, so that the neutral atoms or molecules on the surface of the metal target obtain enough kinetic energy to break away from the surface of the metal target and deposit on the surface of the substrate to form a thin film. The metal atoms on the surface of the metal target will also be deposited on the insulating plate between the shell and the magnetic field module.

[0004] As the magnetron sputtering process progresses, the amount of metal atoms deposited on the insulating plate will gradually increase, the insulating performance of the insulating plate will decrease, and the current will flow from the electrode module to the power ground, causing a short circuit. Once a short circuit occurs, the power supply will not be able to be supplied to the target material normally, causing the magnetron sputtering process to stop and the equipment to fail to work properly. Utility Model Content

[0005] In order to overcome the problem that in the existing magnetron sputtering process, the metal atoms deposited on the insulating plate will increase, the insulation performance will decrease, the electrode module will be conductive with the power ground, causing a short circuit, and the equipment cannot work normally, the utility model provides a planar magnetron sputtering target structure.

[0006] The technical solution of the utility model is as follows:

[0007] A structure of a planar magnetron sputtering target comprises a magnetic field module, a fixed base plate and an insulating plate arranged between the magnetic field module and the fixed base plate, wherein one end of the magnetic field module close to the insulating plate is concave to form a step to reduce the deposition of metal atoms on the insulating plate and increase the conduction length between the magnetic field module and the fixed base plate, the magnetic field module, the fixed base plate and the insulating plate are connected, and an insulating spacer is provided at the connection, and there is a gap between the head of the insulating spacer and the magnetic field module.

[0008] According to the above-mentioned solution of the utility model, the side surface of the magnetic field module is flush with the side surface of the insulating plate, and the side surface of the fixed bottom plate protrudes from the side surface of the insulating plate.

[0009] According to the utility model of the above scheme, the fixed base plate is provided with a plurality of fixed positions, the fixed base plate is connected to the magnetic field module and the insulating plate at the fixed positions by screws, and the insulating spacer is provided at the fixed positions.

[0010] According to the above-mentioned solution of the utility model, the head of the insulating sleeve is a conical structure, and the head of the insulating sleeve extends above the insulating plate, so that after the screw is tightened, a sealing area is formed between the insulating sleeve and the insulating plate.

[0011] According to the above-mentioned solution of the utility model, the apertures of the magnetic field module, the insulating plate and the fixed base plate at the fixed position of the fixed base plate are gradually increased to increase the conduction length between the magnetic field module and the fixed base plate.

[0012] According to the above-mentioned solution of the utility model, one end of the insulating plate close to the magnetic field module is recessed outward at the fixing position to form a groove.

[0013] According to the above-mentioned solution of the utility model, one end of the head of the insulating spacer close to the fixed bottom plate is recessed inward to form a buffer groove.

[0014] According to the above scheme of the utility model, the insulating spacer is in three sections, namely, a head section, a middle section and a tail section, and the outer diameter of the insulating spacer gradually increases from the head section to the tail section. The head section of the insulating spacer is placed in the insulating plate, the middle section and the tail section of the insulating spacer are placed in the fixed bottom plate, and the fixed bottom plate is recessed outward at the fixed position to form a placement groove for placing the tail section of the insulating spacer.

[0015] According to the utility model of the above scheme, the insulating spacer is a hollow structure for the screw to pass through and then be threadedly connected with the magnetic field module.

[0016] According to the utility model of the above scheme, its beneficial effects are as follows:

[0017] 1. The utility model provides a step on the outer circle of the magnetic field module, and the step plays a shielding role on the insulating plate. The right-angled edge of the insulating plate directly below the step is not easy to stick to metal atoms, which can reduce the deposition of metal atoms on the insulating plate. The setting of the step can also increase the length of the insulating plate between the magnetic field module and the fixed base plate, that is, increase the conduction length between the magnetic field module and the fixed base plate, thereby reducing the creepage frequency and further enhancing the insulation effect; there is a gap between the head of the insulating spacer and the magnetic field module of the utility model, and this gap is reserved for the metal atoms deposited on the insulating plate. The metal atoms can be deposited in this reserved space without being attached to the surface of the insulating plate. By optimizing the design of the gap between the insulating spacer and the magnetic field module, the deposition of metal atoms on the insulating plate can be significantly reduced, thereby avoiding the magnetic field module and the fixed base plate from being conducted at a fixed position, and effectively preventing the occurrence of creepage.

[0018] 2. The head of the insulating sleeve of the utility model is designed to be a conical structure, so that after the screw is locked, the head of the insulating sleeve is tightly attached to the side wall of the insulating plate, and a sealing area is formed between the head of the insulating sleeve and the insulating plate. The formation of the sealing area makes it difficult for metal atoms to deposit in the sealing area formed by the head of the insulating sleeve and the insulating plate, which is equivalent to setting a safe area on the insulating plate where metal atoms are difficult to pass, thereby avoiding conduction between the magnetic field module and the fixed base plate at the fixed position, which can effectively prevent the occurrence of creepage.

[0019] 3. The head of the insulating spacer of the utility model is concave at one end close to the fixed bottom plate to form a buffer groove. The buffer groove reserves a certain deformation space for the conical head of the insulating spacer to prevent the head of the insulating spacer from deforming and being squeezed to the middle of the insulating spacer, ensuring that the middle of the insulating spacer is always in close contact with the insulating plate, preventing metal atoms from being deposited on the insulating plate due to the generation of gaps. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is a side view of the utility model;

[0022] Figure 3 It is a cross-sectional view of the utility model.

[0023] In the drawings, the reference numerals are as follows:

[0024] 1. Magnetic field module; 11. Step; 12. Threaded hole; 2. Insulating plate; 21. Groove; 3. Fixed base plate; 31. Placement slot; 4. Screw; 5. Insulating spacer; 51. Buffer slot; 6. Dustproof sheet. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0026] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present utility model are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices. Terms such as "setting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "bottom", etc. are based on the directions or positions shown in the drawings, which are only for the convenience of description and cannot be understood as limitations on the present technical solution.

[0027] like Figure 1-Figure 3 As shown, in this embodiment, a structure of a planar magnetron sputtering target is provided, by setting a step 11 on the outer circle of the magnetic field module 1, the step 11 has a shielding effect on the insulating plate 2, and the right-angle edge of the insulating plate 2 directly below the step 11 is not easy to adhere to metal atoms, which can reduce the deposition of metal atoms on the insulating plate 2. The setting of the step 11 can also increase the length of the insulating plate 2 between the magnetic field module 1 and the fixed base plate 3, that is, increase the conduction length between the magnetic field module 1 and the fixed base plate 3, thereby reducing the creepage frequency and further enhancing the insulation effect.

[0028] Specifically, it includes a magnetic field module 1, a fixed base plate 3, and an insulating plate 2 arranged between the magnetic field module 1 and the fixed base plate 3. One end of the magnetic field module 1 close to the insulating plate 2 is concave to form a step 11 to reduce the deposition of metal atoms on the insulating plate 2 and increase the conduction length between the magnetic field module 1 and the fixed base plate 3.

[0029] In a specific embodiment, the side of the magnetic field module 1 is flush with the side of the insulating plate 2, and the side of the fixed bottom plate 3 protrudes from the side of the insulating plate 2. The side of the fixed bottom plate 3 protrudes from the side of the insulating plate 2 in order to contact the shell to connect to the power ground, ensure the stable transmission of the power supply, and provide good grounding protection for the equipment. The magnetic field module 1 and the insulating plate 2 are separated from the shell by a certain distance, which can prevent the short circuit problem between the power ground and the magnetic field module 1 and the insulating plate 2, and further enhance the insulation performance and stability of the equipment. In other embodiments, the side of the magnetic field module 1 protrudes from the side of the insulating plate 2, but the protruding length is less than the protruding length of the fixed bottom plate 3. This arrangement has a better shielding effect on the insulating plate 2, can further reduce the deposition of metal atoms on the insulating plate 2, and enhance the insulation effect of the insulating plate 2.

[0030] In a specific embodiment, the fixed base plate 3 is provided with a plurality of fixed positions, and the fixed base plate 3 is connected to the magnetic field module 1 and the insulating plate 2 by screws 4 at the fixed positions. The connection by screws 4 is firm and reliable, and can withstand vibration and impact during the sputtering process. An insulating spacer 5 is provided at the fixed position, and the insulating spacer 5 is a hollow structure, through which the screws 4 pass and are threadedly connected to the magnetic field module 1. The use of the insulating spacer 5 prevents the fixed base plate 3 and the magnetic field module 1 from creeping at the fixed position, thereby effectively preventing the occurrence of a short circuit.

[0031] The head of the insulating sleeve 5 is in a conical structure, and the head of the insulating sleeve 5 extends on the insulating plate 2. After the screw 4 is tightened, the head of the insulating sleeve 5 is in close contact with the side wall of the insulating plate 2, and a sealing area is formed between the head of the insulating sleeve 5 and the insulating plate 2. The design of this sealing area makes it difficult for metal atoms to deposit on the sealing area formed by the head of the insulating sleeve 5 and the insulating plate 2, which is equivalent to setting a safe area on the insulating plate 2 where metal atoms are difficult to pass, thereby avoiding the conduction between the magnetic field module 1 and the fixed base plate 3 at the fixed position, which can effectively prevent the occurrence of creepage.

[0032] The head of the insulating sleeve 5 is designed to be a conical structure. The conical design not only increases the close contact area with the insulating plate 2, but also ensures the stability and accuracy of the insulating sleeve 5 during the installation process.

[0033] Preferably, the head of the insulating spacer 5 is concave inwardly near one end of the fixed base plate 3 to form a buffer groove 51. The purpose of the setting is to reserve a certain deformation space for the conical head of the insulating spacer 5. When the head of the insulating spacer 5 is squeezed against the inner wall of the insulating plate 2, the edge of the head of the insulating spacer 5 tends to tilt toward the bottom, and the position of the bottom edge of the head of the insulating spacer 5 is the lowest. The deformed edge of the bottom end of the head of the insulating spacer 5 can be placed in the buffer groove 51 to prevent the head of the insulating spacer 5 from deforming and squeezing to the middle of the insulating spacer 5, so that a gap is generated between the middle of the insulating spacer 5 and the insulating plate 2, resulting in the deposition of metal atoms on the insulating plate 2.

[0034] The design of the buffer groove 51 can effectively prevent the insulating sleeve 5 from deforming when squeezed, ensure that the middle of the insulating sleeve 5 always maintains close contact with the insulating plate 2, and prevent metal atoms from being deposited on the insulating plate 2 due to the formation of gaps.

[0035] Preferably, there is a gap between the head of the insulating spacer 5 and the magnetic field module 1, that is, a certain gap is maintained between the top of the insulating spacer 5 and the magnetic field module 1, and this gap is a reserved space for metal atoms deposited on the insulating plate 2, and the metal atoms can be deposited in this reserved space without being attached to the surface of the insulating plate 2. By optimizing the design of the gap between the insulating spacer 5 and the magnetic field module 1, the deposition of metal atoms on the insulating plate 2 can be significantly reduced, thereby avoiding the magnetic field module 1 and the fixed bottom plate 3 from being turned on at the fixed position, and effectively preventing the occurrence of creepage.

[0036] In a specific embodiment, the apertures of the magnetic field module 1, the insulating plate 2 and the fixed base plate 3 at the fixed position of the fixed base plate 3 are gradually increased to increase the length of the insulating plate 2 at the fixed position between the magnetic field module 1 and the fixed base plate 3 to increase the conduction length between the magnetic field module 1 and the fixed base plate 3, thereby reducing the creepage frequency and further enhancing the overall insulation effect. The opening of the magnetic field module 1 is a threaded hole 12, so that it can be tightly threaded with the screw 4 thread to ensure the stability and reliability of the structure. The opening on the insulating plate 2 is a through hole for the head of the insulating spacer 5 to extend into the opening of the insulating plate 2. The opening on the fixed base plate 3 is a through hole for placing the insulating spacer 5, the head of the screw 4 is placed on the insulating spacer 5 in the fixed base plate 3, and the tail of the screw 4 passes through the inside of the insulating spacer 5 and is connected to the threaded hole 12 on the magnetic field module 1.

[0037] In order to further enhance the insulation effect at the fixed position of the fixed base plate 3, one end of the insulating plate 2 close to the magnetic field module 1 is recessed outward at the fixed position to form a groove 21. The function of the groove 21 is to increase the length of the insulating plate 2 between the magnetic field module 1 and the fixed base plate 3 at the fixed position, so as to increase the conduction length between the magnetic field module 1 and the fixed base plate 3, thereby reducing the creepage frequency and further enhancing the insulation effect.

[0038] In a specific embodiment, the insulating sleeve 5 is in three sections, namely, the head, the middle and the tail, and the segmented design increases the stability of the insulating sleeve 5. The outer diameter of the insulating sleeve 5 gradually increases from the head to the tail to adapt to the increased aperture at the fixed position. Specifically, the head of the insulating sleeve 5 is placed in the insulating plate 2, and the middle and tail of the insulating sleeve 5 are placed in the fixed base plate 3. In order to ensure the stability of the installation of the insulating sleeve 5 at the fixed position, the fixed base plate 3 is recessed outward at the fixed position to form a placement groove 31 for placing the tail of the insulating sleeve 5, ensuring that the insulating sleeve 5 is firmly fixed in the placement groove 31 and is not easy to move.

[0039] The outer diameter of the insulating sleeve 5 matches the diameter of the openings on the insulating plate 2 and the fixed bottom plate 3, and the tail of the insulating sleeve 5 is placed in the placement groove 31 of the fixed bottom plate 3 to form a first block to prevent it from slipping out. The middle of the insulating sleeve 5 abuts against the bottom end of the insulating plate 2 to form a second block, further enhancing the fixing effect of the insulating sleeve 5 and preventing the insulating sleeve 5 from moving at the fixed position of the fixed bottom plate 3.

[0040] The design and fixing method of the insulating spacer 5 significantly improves the stability and reliability of the entire magnetron sputtering planar target, and can effectively prevent the occurrence of short circuits and improve the insulation performance of the equipment.

[0041] Preferably, a dustproof sheet 6 is provided at the bottom end of the insulating sleeve 5 to prevent metal atoms from entering the insulating sleeve 5 .

[0042] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0043] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A planar magnetron sputtering target structure, characterized in that: It includes a magnetic field module, a fixed base plate and an insulating plate arranged between the magnetic field module and the fixed base plate. One end of the magnetic field module close to the insulating plate is concave to form a step to reduce the deposition of metal atoms on the insulating plate and increase the conduction length between the magnetic field module and the fixed base plate. The magnetic field module, the fixed base plate and the insulating plate are connected, and an insulating spacer is provided at the connection, and there is a gap between the head of the insulating spacer and the magnetic field module.

2. The structure of a planar magnetron sputtering target according to claim 1, characterized in that: The side surface of the magnetic field module is flush with the side surface of the insulating plate, and the side surface of the fixed bottom plate protrudes from the side surface of the insulating plate.

3. The structure of a planar magnetron sputtering target according to claim 1, characterized in that: The fixed base plate is provided with a plurality of fixed positions, the fixed base plate is connected with the magnetic field module and the insulating plate at the fixed positions by screws, and the insulating spacer is provided at the fixed positions.

4. The structure of a planar magnetron sputtering target according to claim 3, characterized in that: The head of the insulating sleeve is in a conical structure, and the head of the insulating sleeve extends above the insulating plate, so that after the screw is tightened, a sealing area is formed between the insulating sleeve and the insulating plate.

5. The structure of a planar magnetron sputtering target according to claim 4, characterized in that: The apertures of the magnetic field module, the insulating plate and the fixed base plate at the fixed position of the fixed base plate gradually increase to increase the conduction length between the magnetic field module and the fixed base plate.

6. The structure of a planar magnetron sputtering target according to claim 5, characterized in that: One end of the insulating plate close to the magnetic field module is recessed outward at the fixing position to form a groove.

7. The structure of a planar magnetron sputtering target according to claim 5 or 6, characterized in that: One end of the head of the insulating spacer close to the fixed bottom plate is recessed inward to form a buffer groove.

8. The structure of a planar magnetron sputtering target according to claim 4, characterized in that: The insulating spacer is in three sections, namely, a head section, a middle section and a tail section. The outer diameter of the insulating spacer gradually increases from the head section to the tail section. The head section of the insulating spacer is placed in the insulating plate, the middle section and the tail section of the insulating spacer are placed in the fixed bottom plate, and the fixed bottom plate is recessed outward at the fixed position to form a placement groove for placing the tail section of the insulating spacer.

9. The structure of a planar magnetron sputtering target according to claim 3 or 8, characterized in that: The insulating sleeve is a hollow structure, through which the screw passes and is threadedly connected with the magnetic field module.

Citation Information

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