Jet flow device and electroplating equipment

Abstract

The utility model discloses a jet flow device and electroplating equipment. The jet apparatus includes: a jet plate configured to be inserted into a plating bath and positioned between an anode and a plated object, the jet plate having a first surface for facing the anode and a second surface for facing the plated object; the nozzle is arranged on the second surface of the jet flow disc and is configured to spray electroplating liquid medicine onto a plated object; wherein the jet flow disc is provided with a through hole, and the through hole penetrates through the jet flow disc from the first surface to the second surface and is configured to limit convection of electroplating liquid medicine only from the through hole, so that electrons generated in the electroplating process only can be transmitted to a plated object from the through hole. According to the jet flow device and the electroplating equipment, the electroplating uniformity can be conveniently controlled, and particularly, the electroplating uniformity, especially the uniformity in the vertical direction, can be improved.

Description

Technical Field

[0001] The utility model belongs to the field of electroplating equipment, and in particular relates to a jet device and electroplating equipment. Background Art

[0002] In traditional tank electroplating equipment, the object to be plated (cathode) is immersed in the liquid in the electroplating tank, the object to be plated and the anode in the electroplating tank are arranged oppositely and at intervals, an electric field is applied to the two, and a corresponding coating is formed on the surface of the object to be plated under the action of the electric field. For vertical electroplating equipment, the object to be plated is usually suspended in the electroplating tank by a hanger, etc., and the liquid enters from the bottom of the electroplating tank to replenish new liquid, realize liquid circulation, and maintain the cation concentration in the liquid in the electroplating tank stable. However, there is still a concentration difference at different heights in the electroplating tank, resulting in the problem of uneven electroplating, uneven coating thickness on the object to be plated, especially there is a difference in coating thickness at the top and bottom. Or, for the working conditions such as the shape and size of the electroplating pattern required for the object to be plated are not consistent or evenly distributed, it is difficult to meet the electroplating requirements or the electroplating effect is not good.

[0003] The above information disclosed in the Background section is only for enhancement of understanding of the background of the present application and therefore it may contain information that does not constitute the prior art that is already known to a person of ordinary skill in the art. Utility Model Content

[0004] In view of this, the utility model provides a jet device and an electroplating device, which can conveniently control the uniformity of electroplating, and in particular can improve the uniformity of electroplating, especially the uniformity in the vertical direction.

[0005] The utility model adopts the following technical solutions:

[0006] A jet device, comprising:

[0007] A jet plate, which is configured to be inserted into the electroplating tank and located between the anode and the object to be plated, the jet plate having a first surface for facing the anode and a second surface for facing the object to be plated;

[0008] A nozzle, which is disposed on the second surface of the jet disk and is configured to spray the electroplating solution onto the object to be plated;

[0009] Among them, a through hole is opened on the jet disk, and the through hole passes through the jet disk from the first surface to the second surface and is configured to limit the electroplating solution to convect only from the through hole, so that the electrons generated at the anode during the electroplating process can only be transferred from the through hole to the cathode (the object to be plated).

[0010] In a preferred embodiment, the nozzle is detachably arranged on the second surface of the jet disk. Different nozzle sizes and forms can be replaced according to different needs.

[0011] In a preferred embodiment, a plurality of the nozzles are arranged around each of the through holes.

[0012] In a more preferred embodiment, a plurality of the nozzles are arranged in an array, a plurality of the through holes are arranged in an array, the nozzles and the through holes are arranged alternately, or a plurality of the nozzles are arranged around each through hole along its circumferential direction at equal or unequal intervals.

[0013] In a preferred embodiment, the jet device also includes a shielding plate for shielding a portion of the through hole or shielding at least one of the through holes, and a shielding hole is opened on the shielding plate, and the position of the shielding hole corresponds to the position of the through hole; the shielding plate is configured to be placed on the first surface of the jet disk, and the aperture of the shielding hole is smaller than the aperture of the through hole or the through hole is shielded to adjust the size and distribution of the electric field force transmitted from the through hole.

[0014] In a more preferred embodiment, the jet device includes a plurality of shielding plates, the shielding holes of each shielding plate have different apertures, and during electroplating operation, one of the shielding plates is placed on the first surface of the jet disk.

[0015] In a more preferred embodiment, the shutter has a first state of being placed on the first surface of the jet disk and a second state of being detached from the jet disk.

[0016] In a further preferred embodiment, a clamp is provided on the jet disk, a slot is formed between the clamp and the first surface, and the shield is detachably inserted into the slot.

[0017] In a specific and preferred embodiment, the jet disk is vertically arranged, the slots are formed on the left and right sides of the jet disk and extend in the up-down direction, and the shield can be inserted into or out of the slots in the up-down direction.

[0018] In a preferred embodiment, a flow channel through which the liquid medicine can flow is provided in the jet disk, and the flow channel is connected to the nozzle.

[0019] The utility model also adopts the following technical solutions:

[0020] An electroplating device comprises the jet device.

[0021] The utility model adopts the above scheme and has the following advantages:

[0022] The jet device of the utility model is provided with a jet disk between the anode and the object to be plated, and the anode and the object to be plated are separated by the jet disk. The chemical liquid and the electric field can only convect through the through hole of the jet disk, and the chemical liquid is sprayed onto the surface to be plated of the object to be plated in cooperation with the nozzle, so that the electroplating uniformity can be conveniently controlled, and in particular: the electroplating uniformity can be improved, especially the uniformity in the vertical direction, or the electroplating effect that meets the requirements can be obtained, for example, for the object to be plated that needs to have different patterns or unevenly distributed coatings at the same time, a better electroplating effect can be achieved.

[0023] Furthermore, different shielding plates can be placed on the first surface of the jet disk according to different requirements, so that the size of the through hole can be easily adjusted, and the operation and use are relatively convenient.

[0024] Furthermore, the nozzle is detachable, which makes it easy to replace the required nozzle and facilitates maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a schematic side view of an electroplating device according to an embodiment of the utility model.

[0027] Figure 2 It is a front view schematic diagram of an electroplating device according to an embodiment of the utility model.

[0028] Figure 3 It is a top view of a jet device according to an embodiment of the utility model.

[0029] Figure 4 It is a stereoscopic diagram of a jet disk according to an embodiment of the utility model.

[0030] Figure 5 It is a front perspective view of a spray disk according to an embodiment of the utility model.

[0031] Figure 6 It is a cross-sectional view along the vertical direction of a spray disk according to an embodiment of the utility model.

[0032] Figure 7 It is a cross-sectional view along the horizontal direction of a jet disk according to an embodiment of the utility model.

[0033] Figure 8 It is a front view of a shield according to an embodiment of the utility model.

[0034] Fig. 9 This is a structural diagram of a shield plate after being inserted into a slot of a jet disk according to an embodiment of the utility model.

[0035] in:

[0036] 100, electroplating equipment; 10, jet device; 20, electroplating tank; 201, liquid inlet; 30, anode; 40, object to be plated;

[0037] 1. jet disk; 11. first surface; 12. second surface; 121. mounting hole; 13. through hole; 14. flow channel; 141. inlet; 15. clamp; 16. slot;

[0038] 2. Nozzle;

[0039] 3. Shield; 31. Shield hole. DETAILED DESCRIPTION

[0040] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention.

[0041] In this document, the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", etc. are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.

[0042] This embodiment provides an electroplating device and a jet device thereof, which are suitable for electroplating semiconductor wafers, circuit boards, etc. to obtain a metallized surface. Figure 1 and Figure 2 As shown, the electroplating equipment includes the above-mentioned jet device 10, the electroplating tank 20 and the anode 30. The anode 30 is installed in the electroplating tank 20, and the object 40 to be plated is suspended in the electroplating tank 20 by a hanger or the like, and the anode 30 and the object 40 to be plated are arranged at intervals on the left and right; a liquid medicine is passed into the electroplating tank 20, and the liquid medicine contains substances required for electroplating, such as cations to be plated; the anode 30 and the object 40 to be plated are both in contact with the liquid medicine, and are preferably immersed in the liquid medicine. The jet device 10 is inserted into the electroplating tank 20, located between the anode 30 and the object 40 to be plated, and separates the anode 30 and the object 40 to be plated. A liquid inlet 201 is provided at the bottom of the electroplating tank 20 for passing the liquid medicine. Specifically, the liquid inlet 201 is connected to a first liquid inlet pipeline, and a first pump is provided on the first liquid inlet pipeline, and the liquid medicine in the storage tank or storage tank is transported to the electroplating tank 20 through the first liquid inlet pipeline by the first pump.

[0043] Reference Figures 3 to 9 As shown, a jet device 10 of this embodiment includes a jet disk 1 and a nozzle 2. The jet disk 1 is configured to be inserted into the electroplating tank 20 and separate the anode 30 and the object 40 to be plated. The jet disk 1 has a first surface 11 for facing the anode 30 and a second surface 12 for facing the object 40 to be plated. The nozzle 2 is arranged on the second surface 12 of the jet disk 1 and is configured to spray the electroplating solution onto the object 40 to be plated. Further, a through hole 13 is provided on the jet disk 1, and the through hole 13 passes through the jet disk 1 from the first surface 11 to the second surface 12. During the electroplating operation, the jet disk 1 is immersed in the solution in the electroplating tank 20. After power is applied to the anode 30 and the object 40 to be plated, the electric field can only pass through the through hole 13. During the electroplating process, the electrons generated by the anode 30 can only be transferred from the through hole to the object 40 to be plated, and a current path is established through the through hole 13 to form an electroplating electric field. In addition, the solution can only convect through the through hole 13. There is a gap between the nozzle 2 and the surface to be plated of the object 40 to be plated, and the gap is configured so that the chemical solution dispensed by each nozzle 2 can cover the entire surface to be plated as expected.

[0044] Combination Figures 4 to 7 As shown, a plurality of mounting holes 121 are provided on the second surface 12 of the spray plate 1, and the mounting holes 121 and the through holes 131 are arranged alternately. A nozzle 2 is installed in each mounting hole 121.

[0045] The number of through holes 13 and nozzles 2 is multiple, and multiple nozzles 2 are evenly or unevenly arranged around each through hole 13. Further, multiple nozzles 2 are evenly arranged in an array in a vertical plane, and multiple through holes 13 are evenly arranged in an array in a vertical plane, and multiple nozzles 2 are arranged around each through hole 13 along its circumferential direction. In other embodiments, the through holes 13 and nozzles 2 may be unevenly arranged, and multiple nozzles 2 are evenly or unevenly arranged around each through hole 13. The number of nozzles 2 is not limited, and may be 4, 5, or 6, etc.

[0046] like Figure 2 As shown, during electroplating, the object 40 to be plated can perform eccentric rotational motion around a center in a vertical plane, and the center corresponds to the center of the anode 30 (is at the same level and opposite to each other left and right), preferably facing the center of the anode 30. The radius of the rotational motion is greater than the minimum spacing between two adjacent nozzles 2.

[0047] The nozzle 2 is detachably disposed on the second surface 12 of the jet disk 1. For example, the nozzle 2 is connected to the jet disk 1 by threads or buckles. The nozzles 2 of different sizes and forms can be replaced according to actual working conditions, and maintenance and replacement can also be facilitated.

[0048] like Figure 5As shown, a flow channel 14 capable of passing a liquid medicine is provided in the jet disk 1, and the flow channel 14 is connected to each nozzle 2 (specifically, to a mounting hole 121 for mounting the nozzle 2 provided on the second surface 12). The shape of the flow channel 14 is designed according to the position and distribution of the nozzle 2, and the flow channel 14 is formed by a hole provided in the jet disk 1. The flow channel 14 has an inlet 141, which is connected to a second liquid inlet pipeline, and a second pump is provided on the second liquid inlet pipeline. The second pump allows the liquid medicine in the storage tank or storage tank to be transported to the flow channel 14 through the second liquid inlet pipeline, and then to each nozzle 2 through the flow channel 14, and finally sprayed from the nozzle 2 to the surface to be plated of the object 40 to be plated.

[0049] Combination Figure 8 and Fig. 9 As shown, the jet device 10 also includes a shielding plate 3, which is used to shield part of the through holes 13 or part of each through hole 13. The shielding plate 3 is provided with shielding holes 31, and the positions of the shielding holes 31 and the positions of the through holes 13 correspond to each other. In the specific example shown in the accompanying drawings, the number of shielding holes 31 corresponds to the number and position of the through holes 13, and the only difference is that the apertures of the two are different, and the aperture of the shielding holes 31 is smaller than the aperture of the through holes 13. In some other embodiments, the number of shielding holes 31 is less than the number of through holes 13, and part of the through holes 13 is completely shielded (that is, the through holes 13 are closed), and each shielding hole 31 is opposite to and overlaps with one of the through holes 13 to form a current transmission path. The shielding plate 3 is configured to be placed on the first surface 11 of the jet disk 1, and the aperture of the shielding hole 31 is smaller than the aperture of the through hole 13 to adjust the magnitude of the electric field force transmitted from the through hole 13. After the shielding plate 3 is placed on the first surface 11 of the spray disk 1 , the shielding hole 31 and the through hole 13 are connected to each other.

[0050] Furthermore, the jet device 10 includes a plurality of shields 3, and the apertures of the shielding holes 31 of each shield 3 are different. During electroplating, one of the shields 3 is placed on the first surface 11 of the jet disk 1. According to the actual working conditions, a suitable shield 3 can be selected to obtain a suitable electric field force and prepare a desired coating.

[0051] The shield 3 has a first state of being placed on the first surface 11 of the jet disk 1 and a second state of being separated from the jet disk 1, that is, the shield 3 is detachably arranged on the jet disk 1. Specifically, a clamp 15 is arranged on the jet disk 1, and a slot 15 is formed between the clamp 15 and the first surface 11, and the shield 3 is detachably inserted into the slot 15. Further, the jet disk 1 is vertically arranged, and the slot 15 is formed on the left and right sides of the jet disk 1 and extends in the up-down direction, and the shield 3 can be inserted into or separated from the slot 15 in the up-down direction.

[0052] The electroplating method of the above electroplating equipment is as follows:

[0053] The liquid medicine is introduced into the electroplating tank 20; the liquid medicine may be introduced into the electroplating tank 20 through the liquid inlet 201 at the bottom of the electroplating tank 20 and the nozzle 2 of the jet device 10 at the same time, or the liquid medicine may be introduced into the electroplating tank 20 only through the liquid inlet 201 at the bottom of the electroplating tank 20;

[0054] The nozzle 2 is turned on, the anode 30 and the object 40 are energized, and the chemical solution is sprayed onto the surface of the object 40 to be plated through the nozzle 2;

[0055] Before power is supplied, the required shielding plate 3 is placed on the first surface 11 of the jet disk 1 according to the actual working conditions.

[0056] Furthermore, after power is turned on, the object 40 to be plated is controlled to rotate around a center in a vertical plane. The center is at the same level as the center of the anode 30 and is opposite to each other. The radius of the rotation is greater than the minimum distance between two adjacent nozzles 2.

[0057] The jet device 10 and the electroplating equipment have the following advantages: a jet disk 1 is arranged between the anode 30 and the object 40 to be plated, and the anode 30 and the object 40 to be plated are separated by the jet disk 1. The liquid medicine and the electric field can be convected through the through hole 13 of the jet disk 1, and at the same time, the nozzle 2 is used to spray the liquid medicine to the surface to be plated of the object 40 to be plated, so that the uniformity of electroplating can be conveniently controlled, and the uniformity of electroplating is improved, especially the uniformity in the vertical direction; or for the object to be plated that needs to have different patterns or unevenly distributed coatings at the same time, it can have a better electroplating effect. Furthermore, different shields 3 can be placed on the first surface 11 of the jet disk 1 according to different needs, and the size of the through hole 13 can be conveniently adjusted, which is convenient to operate and use. The nozzle 2 is detachable, which can facilitate the replacement of the required nozzle 2 and facilitate maintenance.

[0058] As shown in this specification and claims, the terms "comprises" and "include" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the relevant listed items.

[0059] It is further understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar thereto.

[0060] It should be noted that, unless otherwise specified, when a feature is referred to as being “fixed” or “connected” to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature.

[0061] The above embodiment is only for illustrating the technical concept and features of the utility model, and is a preferred embodiment. Its purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and it cannot be used to limit the protection scope of the utility model. Any equivalent transformation or modification made according to the principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A jet device, characterized in that: include: A jet plate, which is configured to be inserted into the electroplating tank and located between the anode and the object to be plated, the jet plate having a first surface for facing the anode and a second surface for facing the object to be plated; A nozzle, which is disposed on the second surface of the jet disk and is configured to spray the electroplating solution onto the object to be plated; A through hole is provided on the jet disk, which passes through the jet disk from the first surface to the second surface and is configured to limit the electroplating solution to convect only from the through hole, so that the electrons generated during the electroplating process can only be transferred from the through hole to the plated object.

2. The jet device according to claim 1, characterized in that: A plurality of nozzles are arranged around each through hole.

3. The jet device according to claim 2, characterized in that: A plurality of the nozzles are arranged in an array, a plurality of the through holes are arranged in an array, the nozzles and the through holes are arranged alternately, or a plurality of the nozzles are arranged around each through hole along its circumferential direction.

4. The jet device according to claim 1, characterized in that: The jet device also includes a shielding plate for shielding a portion of the through hole or shielding at least one of the through holes, and a shielding hole is opened on the shielding plate, and the position of the shielding hole corresponds to the position of the through hole; the shielding plate is configured to be placed on the first surface of the jet disk, and the aperture of the shielding hole is smaller than the aperture of the through hole or the through hole is shielded to adjust the size and distribution of the electric field force transmitted from the through hole.

5. The jet device according to claim 4, characterized in that: The jet device includes a plurality of shielding plates, each of which has a different aperture or number of shielding holes. During electroplating operation, one of the shielding plates is placed on the first surface of the jet disk.

6. The jet device according to claim 4 or 5, characterized in that: The shutter has a first state placed on a first surface of the jet disk and a second state detached from the jet disk.

7. The jet device according to claim 6, characterized in that: A clamp is provided on the jet disk, a slot is formed between the clamp and the first surface, and the shield is detachably inserted into the slot.

8. The jet device according to claim 7, characterized in that: The jet disk is vertically arranged, the slots are formed on the left and right sides of the jet disk and extend in the up-down direction, and the shield can be inserted into or separated from the slots in the up-down direction.

9. The jet device according to claim 1, characterized in that: A flow channel capable of passing the liquid medicine is arranged in the jet disk, and the flow channel is communicated with the nozzle; the nozzle is detachably arranged on the second surface of the jet disk.

10. An electroplating device, characterized in that: The invention comprises a jet device as claimed in any one of claims 1 to 9.

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