Clamping plate

Abstract

The utility model provides a clamping plate, and relates to the technical field of semiconductor packaging. The clamping plate is configured to clamp a metal column and comprises a clamping plate body, a plurality of clamping holes are formed in the clamping plate body, elastic pieces are arranged in the clamping holes, the first ends of the elastic pieces are connected with the inner walls of the clamping holes, and the opposite second ends of the elastic pieces are used for abutting against the metal column so as to fix the metal column in the clamping holes. According to the clamping plate, the multiple clamping holes are formed in the clamping plate body, the elastic pieces are arranged in the clamping holes, and therefore the multiple metal columns can be fixed at the same time. In the semiconductor packaging process, rapid installation and positioning of a plurality of metal columns can be realized, so that the packaging efficiency is effectively improved, and meanwhile, the processing difficulty of the metal columns can be reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a clamping plate. Background Art

[0002] Package on Package (PoP) refers to stacking a high-integration logic package with another matching large-capacity memory package to form a new package. This new high-density packaging form is mainly used in a variety of consumer electronic products such as smart phones, digital cameras, and portable wearable devices.

[0003] In stacked packaging, electrical connection needs to be achieved between the bottom package and the top package. One solution in the prior art is to achieve the connection through a metal column, one end of which is electrically connected to the bottom package and the other end is electrically connected to the top package. When installing the metal column, a large number of metal columns are released on the bottom package by an adsorption device, so that some metal columns with appropriate angles are inserted into the holes of the bottom package and bonded to the bottom of the hole through the solder bonding layer. The metal columns that are not inserted into the holes are re-adsorbed by the adsorption device and then released on the bottom package again. The above steps are repeated until metal columns are inserted into all the holes of the bottom package. This method of installing metal columns is inefficient and will seriously affect the efficiency of stacked packaging. Utility Model Content

[0004] The purpose of the present application is to provide a clamping plate to address the deficiencies in the above-mentioned prior art and solve the problem of low efficiency in installing metal pillars during semiconductor packaging.

[0005] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0006] An embodiment of the present application provides a clamping plate, which is configured to clamp a metal column. The clamping plate includes: a clamping plate body, a plurality of clamping holes are provided on the clamping plate body, and a spring sheet is provided in the clamping hole. The first end of the spring sheet is connected to the inner wall of the clamping hole, and the opposite second end is used to abut against the metal column to fix the metal column in the clamping hole.

[0007] Optionally, the spring pieces include a plurality of spring pieces, and the plurality of spring pieces are evenly distributed along the circumferential direction of the clamping hole.

[0008] Optionally, the position where the spring piece abuts against the metal column is arc-shaped.

[0009] Optionally, the spring piece includes a first straight portion, an inclined portion connected to the first straight portion in sequence, and a second straight portion, the extension direction of the first straight portion and the second straight portion is parallel to the axis of the clamping hole, the inclined portion makes the second straight portion closer to the axis of the clamping hole than the first straight portion, the first straight portion is used to connect to the inner wall of the clamping hole, and the second straight portion is used to abut against the metal column.

[0010] Optionally, the second straight portion wraps around a sidewall of the metal column.

[0011] Optionally, a positioning mark is provided on the surface of the first end of the clamping plate body close to the spring sheet, and the positioning mark is used to position the clamping plate body during stacking packaging.

[0012] Optionally, the surface of the clamping plate body near the first end of the spring sheet is divided into a vacant area and a clamping area surrounding the vacant area, the positioning mark is located at the edge of the vacant area, the clamping hole is located in the clamping area, and multiple clamping holes are arranged in layers around the vacant area.

[0013] Optionally, a surface of the clamping plate body close to the second end of the spring is provided with an avoidance groove, and the avoidance groove is used to avoid the chip of the bottom package body during stacking packaging.

[0014] Optionally, the material of the clamping plate body is a heat conductive material.

[0015] Optionally, the spring sheet is integrally formed with the clamping plate body, or the spring sheet is connected to the inner wall of the clamping hole by welding.

[0016] The beneficial effects of this application include:

[0017] The present application provides a clamping plate configured to clamp a metal column, the clamping plate comprising: a clamping plate body, a plurality of clamping holes provided on the clamping plate body, a spring sheet provided in the clamping hole, a first end of the spring sheet connected to the inner wall of the clamping hole, and an opposite second end used to abut against the metal column to fix the metal column in the clamping hole. The clamping plate is capable of simultaneously fixing a plurality of metal columns by providing a plurality of clamping holes on the clamping plate body and providing a spring sheet in each clamping hole. In the semiconductor packaging process, the rapid installation and positioning of a plurality of metal columns can be achieved, thereby effectively improving the packaging efficiency, and at the same time, the processing difficulty of the metal column can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1A schematic diagram of the structure of the clamping plate provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of a clamping plate fixing a metal column provided in an embodiment of the present application;

[0021] Figure 3 A schematic diagram of a clamping plate provided in an embodiment of the present application being applied to a semiconductor package;

[0022] Figure 4 for Figure 1 Sectional view at AA in the middle;

[0023] Figure 5 for Figure 4 A partial enlarged view of point B in the middle.

[0024] Icons: 100-clamping plate; 110-clamping plate body; 111-first surface; 1111-vacant area; 1112-clamping area; 112-second surface; 1121-avoidance groove; 120-clamping hole; 130-spring; 131-first end; 132-second end; 133-first straight portion; 134-inclined portion; 135-second straight portion; 1351-arc surface; 140-positioning mark; 200-metal column; 300-bottom package; 310-chip; 320-circuit board; 400-top package; T-thickness direction. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. It should be noted that, in the absence of conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0028] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0029] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] Please refer to Figures 1 to 3 The embodiment of the present application provides a clamping plate 100, which is configured to clamp a metal column 200. The metal column 200 can be used to realize the electrical connection between the bottom package 300 and the top package 400 in the stacked package. Specifically, the clamping plate 100 includes: a clamping plate body 110, a plurality of clamping holes 120 are provided on the clamping plate body 110, and a spring 130 is provided in the clamping hole 120. The first end 131 of the spring 130 is connected to the inner wall of the clamping hole 120, and the opposite second end 132 is used to abut against the metal column 200 to fix the metal column 200 in the clamping hole 120.

[0031] The clamping plate body 110 is in the shape of a plate, preferably a rectangle or a square. The clamping plate body 110 has a first surface 111 and a second surface 112 opposite to each other, the clamping hole 120 extends along the thickness direction T of the clamping plate body 110 and penetrates the first surface 111 and the second surface 112 of the clamping plate body 110, and the metal column 200 is located in the clamping hole 120. Generally speaking, stacked packaging requires the use of multiple metal columns 200 at the same time. Therefore, in order to improve the packaging efficiency, the number of clamping holes 120 on the clamping plate body 110 is also multiple, and each clamping hole 120 can accommodate a metal column 200. In practical applications, the number of clamping holes 120 and the position of the clamping holes 120 on the clamping plate body 110 can be determined accordingly according to the number of metal columns 200 required for packaging and the position of the metal columns 200 during packaging.

[0032] The diameter of the clamping hole 120 is slightly larger than the diameter of the metal column 200, so as to facilitate the taking and placing of the metal column 200. At the same time, in order to fix the metal column 200 in the clamping hole 120 and prevent the metal column 200 from falling, each clamping hole 120 is provided with a spring 130 for clamping and fixing the metal column 200. The spring 130 has a first end 131 and a second end 132 opposite to each other, wherein the first end 131 is close to the first surface 111 of the clamping plate body 110, and the second end 132 is close to the second surface 112 of the clamping plate body 110. The first end 131 of the spring 130 is fixedly connected to the inner wall of the clamping hole 120, and the second end 132 is suspended inside the clamping hole 120. The metal column 200 is inserted into the clamping hole 120 from the side of the first surface 111 of the clamping plate body 110 , and the second end 132 of the spring 130 abuts against the metal column 200 , thereby fixing the metal column 200 in the clamping hole 120 . The metal column 200 can move unidirectionally in the clamping hole 120 .

[0033] It should be noted that the spring sheet 130 and the metal column 200 may be in point contact, line contact or surface contact. Preferably, the spring sheet 130 and the metal column 200 are in surface contact, and the surface contact has a larger contact area, which can make the metal column 200 more firmly fixed, and can also prevent the metal column 200 from deflecting inside the clamping hole 120 or the spring sheet 130 from causing damage to the metal column 200.

[0034] When performing stacked packaging, the alignment machine in the prior art can be used to align multiple metal pillars 200 one by one into the clamping holes 120 of the clamping plate body 110. This process can be carried out simultaneously with the preparation of the bottom package 300 and the top package 400, and then the clamping plate 100 fixed with multiple metal pillars 200 is directly moved to the top of the bottom package 300, and the metal pillars 200 and the bottom package 300 are welded and fixed. In this way, semiconductor packaging manufacturing can be facilitated and the packaging efficiency can be effectively improved. After the metal pillars 200 and the bottom package 300 are fixed, if you want to remove the clamping plate 100, you only need to press the spring 130 to separate the clamping plate body 110 from the metal pillars 200. Of course, the clamping plate 100 can also be left directly in the stacked packaging structure without removing it, which can further improve the packaging efficiency. In addition, the lower surface of the metal column 200 is usually fixed to the bottom package 300 by soldering with solder paste. The solder paste welding has a low requirement for the flatness of the lower surface of the metal column 200. After the clamping plate 100 is used, when processing the metal column 200, it is only necessary to ensure the flatness of the upper surface of the metal column 200, which reduces the difficulty of processing the metal column 200. The metal column 200 moves unidirectionally in the clamping hole 120. After the metal column 200 is inserted into the clamping hole 120, it is only necessary to use a part with a plane to simultaneously press multiple metal columns 200 above the first surface 111 of the clamping plate body 110, so that the upper surfaces of the multiple metal columns 200 are located in the same plane. It can be understood that the clamping plate 100 is not only used in stacked packaging, but can also be applied to other semiconductor packaging processes.

[0035] In summary, the clamping plate 100 provided in the embodiment of the present application can simultaneously fix multiple metal pillars 200 by providing multiple clamping holes 120 on the clamping plate body 110 and providing a spring 130 in each clamping hole 120. In the semiconductor packaging process, multiple metal pillars 200 can be quickly installed and positioned, thereby effectively improving the packaging efficiency, and at the same time, the processing difficulty of the metal pillars 200 can be reduced.

[0036] In order to make the metal column 200 more firmly fixed in the clamping hole 120, optionally, please refer to Figure 1 , Figure 4 and Figure 5 The spring pieces 130 include a plurality of spring pieces 130 that are evenly distributed along the circumference of the clamping hole 120. The second ends 132 of the plurality of spring pieces 130 abut against different positions on the side wall of the same metal column 200 at the same time, thereby achieving multi-point fixation around the metal column 200.

[0037] For example, there are four spring pieces 130. The four spring pieces 130 are arranged opposite to each other in pairs, and fix the metal column 200 around the metal column 200, so that the force on the metal column 200 is more uniform.

[0038] Optionally, the position where the spring piece 130 is used to abut against the metal column 200 is arc-shaped. In this way, it is possible to avoid damage to the metal column 200 when the spring piece 130 abuts against the metal column 200.

[0039] Furthermore, the radius of the position of the spring sheet 130 for contacting the metal column 200 is equal to the radius of the metal column 200. In this way, the spring sheet 130 can contact the metal column 200 in the form of wrapping the side wall of the metal column 200, and the contact area between the two is larger, thereby making the metal column 200 more firmly fixed in the clamping hole 120.

[0040] Optionally, see Figure 4 and Figure 5 The spring piece 130 includes a first straight portion 133, an inclined portion 134 and a second straight portion 135 connected to the first straight portion 133 in sequence. The extension direction of the first straight portion 133 and the second straight portion 135 is parallel to the axis of the clamping hole 120. The inclined portion 134 makes the second straight portion 135 closer to the axis of the clamping hole 120 than the first straight portion 133. The first straight portion 133 is used to connect with the inner wall of the clamping hole 120, and the second straight portion 135 is used to abut against the metal column 200.

[0041] The first end 131 of the spring sheet 130 is located on the first straight portion 133, and the second end 132 is located on the second straight portion 135. The first straight portion 133 is provided to facilitate the connection between the spring sheet 130 and the inner wall of the clamping hole 120, so that the connection area between the spring sheet 130 and the inner wall of the clamping hole 120 is larger, thereby preventing the spring sheet 130 from falling after being subjected to the reaction force of the metal column 200. The provision of the inclined portion 134 allows the second straight portion 135 of the spring sheet 130 to extend into the clamping hole 120, thereby abutting against the metal column 200. The second straight portion 135 and the side wall of the metal column 200 both extend along the axial direction of the clamping hole 120. After the two abut, the second straight portion 135 and the metal column 200 are at least in line contact, and the contact area is large, so that the metal column 200 can be fixed more firmly.

[0042] Furthermore, the second straight portion 135 wraps around the sidewall of the metal pillar 200 .

[0043] That is, the surface of the second straight portion 135 facing the metal column 200 is an arc surface 1351, and the radius of the arc surface 1351 is equal to the radius of the side wall of the metal column 200. In this way, when the second straight portion 135 abuts against the metal column 200, the second straight portion 135 can wrap around the side wall of the metal column 200, and the two achieve surface contact. In particular, when multiple spring pieces 130 are arranged in the same clamping hole 120, the second straight portions 135 of the multiple spring pieces 130 surround the metal column 200 and wrap the metal column 200, so that the metal column 200 can be more firmly fixed in the clamping hole 120.

[0044] Optionally, the spring piece 130 is integrally formed with the clamping plate body 110 , and the spring piece 130 is formed while the clamping hole 120 is processed on the clamping plate body 110 , which can improve the processing efficiency of the clamping plate 100 and make the connection between the spring piece 130 and the clamping hole 120 more secure.

[0045] In other embodiments, the spring piece 130 may also be welded to the inner wall of the clamping hole 120 . In other words, the spring piece 130 and the clamping hole 120 are processed separately, and then the spring piece 130 is welded inside the clamping hole 120 .

[0046] Optionally, the first end 131 of the spring sheet 130 is flush with the first surface 111 of the clamping plate body 110, and the second end 132 is flush with the second surface 112 of the clamping plate body 110. Thus, the size of the spring sheet 130 is as large as possible without being exposed from the clamping plate body 110, so as to facilitate the positioning of the spring sheet 130 and the fixing of the metal column 200.

[0047] Please refer to Figure 1 and Figure 3 When performing stacked packaging, the clamping plate 100 needs to carry the metal column 200 so that the metal column 200 is aligned with the solder joint on the bottom package 300. In order to achieve rapid positioning of the clamping plate 100, optionally, the surface of the clamping plate body 110 close to the first end 131 of the spring 130 (i.e., the first surface 111) is provided with a positioning mark 140, and the positioning mark 140 is used to position the clamping plate body 110 during stacked packaging.

[0048] For example, the positioning mark 140 is a groove provided on the first surface 111 of the clamping plate body 110, and the groove is easy to process, and the positioning of the clamping plate 100 can be achieved through the groove. For example, the positioning mark 140 includes two, and the two positioning marks 140 are respectively a triangular groove and a rectangular groove, and the triangular groove and the rectangular groove are distributed along the diagonal line of the first surface 111 of the clamping plate body 110 at intervals.

[0049] Optionally, the surface of the first end 131 of the clamping plate body 110 close to the spring piece 130 (i.e., the first surface 111) is divided into a vacant area 1111 and a clamping area 1112 surrounding the vacant area 1111, the positioning mark 140 is located at the edge of the vacant area 1111, the clamping hole 120 is located in the clamping area 1112, and a plurality of clamping holes 120 are arranged in layers around the vacant area 1111.

[0050] The vacant area 1111 is located in the middle of the clamping plate body 110, and the clamping area 1112 is annular and arranged around the vacant area 1111. No clamping hole 120 is arranged in the vacant area 1111. When stacking packages, the vacant area 1111 corresponds to the position of the chip 310 of the bottom package 300. The clamping area 1112 corresponds to the area on the circuit board 320 of the bottom package 300 where the chip 310 is not arranged. The clamping holes 120 are all distributed in the clamping area 1112 in a manner of surrounding the vacant area 1111 layer by layer, so as to facilitate connection with the circuit board 320 of the bottom package 300.

[0051] For example, Figure 1 As shown, the clamping plate body 110 and the vacant area 1111 are both rectangular, the clamping area 1112 is in a rectangular ring shape, the clamping holes 120 are evenly arranged in two layers around the vacant area 1111, and the multiple clamping holes 120 in each layer are distributed in a rectangular ring shape.

[0052] Optionally, the material of the clamping plate body 110 is a heat conductive material.

[0053] The heat-conducting material can be a metal with good heat-conducting performance, or it can be a material such as epoxy resin. After the stacking package, if the clamping plate 100 is retained in the packaging structure, the heat-conducting clamping plate body 110 can dissipate heat over a large area of ​​the packaging structure, and timely conduct the heat generated when the packaging structure is working, which is conducive to the normal operation of the packaging structure and prolongs the service life of the packaging structure.

[0054] Please refer to Figure 2 and Figure 3 When performing stacking packaging, the surface of the second end 132 of the clamping plate body 110 close to the spring 130 (i.e., the second surface 112) faces the chip 310 of the bottom package 300. In order to avoid interference between the clamping plate 100 and the chip 310 and damage to the chip 310, optionally, the surface of the second end 132 of the clamping plate body 110 close to the spring 130 (i.e., the second surface 112) is provided with an avoidance groove 1121, and the avoidance groove 1121 is used to avoid the chip 310 of the bottom package 300 during stacking packaging.

[0055] Furthermore, the material of the clamping plate body 110 is a heat-conducting material, and the bottom of the avoidance groove 1121 fits with the top of the chip 310 , thereby achieving large-area heat dissipation for the chip 310 .

[0056] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A clamping plate, configured to clamp a metal column, characterized in that: The clamping plate includes: a clamping plate body, a plurality of clamping holes are provided on the clamping plate body, and a spring is provided in the clamping hole. The first end of the spring is connected to the inner wall of the clamping hole, and the opposite second end is used to abut against the metal column to fix the metal column in the clamping hole.

2. The clamping plate according to claim 1, characterized in that The spring pieces include a plurality of spring pieces, and the plurality of spring pieces are evenly distributed along the circumferential direction of the clamping hole.

3. The clamping plate according to claim 1, characterized in that: The position where the spring piece is used to abut against the metal column is arc-shaped.

4. The clamping plate according to claim 1, characterized in that The spring piece includes a first straight portion, an inclined portion and a second straight portion connected in sequence to the first straight portion, the extension directions of the first straight portion and the second straight portion are parallel to the axis of the clamping hole, the inclined portion makes the second straight portion closer to the axis of the clamping hole than the first straight portion, the first straight portion is used to connect to the inner wall of the clamping hole, and the second straight portion is used to abut against the metal column.

5. The clamping plate according to claim 4, characterized in that The second straight portion wraps around a sidewall of the metal column.

6. The clamping plate according to claim 1, characterized in that A positioning mark is provided on the surface of the clamping plate body close to the first end of the spring sheet, and the positioning mark is used to position the clamping plate body during stacking packaging.

7. The clamping plate according to claim 6, characterized in that The surface of the clamping plate body close to the first end of the spring sheet is divided into a vacant area and a clamping area surrounding the vacant area, the positioning mark is located at the edge of the vacant area, the clamping hole is located in the clamping area, and a plurality of the clamping holes are arranged in layers around the vacant area.

8. The clamping plate according to claim 1, characterized in that A surface of the clamping plate body close to the second end of the spring is provided with an escape groove, and the escape groove is used to escape the chip of the bottom package body during stacking packaging.

9. The clamping plate according to claim 1, characterized in that: The material of the clamping plate body is a heat-conducting material.

10. The clamping plate according to claim 1, characterized in that The spring sheet is integrally formed with the clamping plate body, or the spring sheet is welded to the inner wall of the clamping hole.

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