Clamping plate

Abstract

The utility model provides a clamping plate, and relates to the technical field of semiconductor packaging. The clamping plate is configured to clamp a metal column and comprises a clamping plate body, the clamping plate body is provided with a plurality of clamping holes and a plurality of clamping bodies, the clamping bodies correspond to the clamping holes in a one-to-one mode, the clamping holes are used for containing the metal column, and the clamping bodies are used for fixing the metal column in the clamping holes. According to the clamping plate, the multiple clamping holes are formed in the clamping plate body, the clamping bodies are arranged corresponding to the clamping holes, and therefore the multiple metal columns can be fixed at the same time. In the semiconductor packaging process, rapid installation and positioning of a plurality of metal columns can be realized, so that the packaging efficiency is effectively improved, and meanwhile, the processing difficulty of the metal columns can be reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a clamping plate. Background Art

[0002] Package on Package (PoP) refers to stacking a high-integration logic package with another matching large-capacity memory package to form a new package. This new high-density packaging form is mainly used in a variety of consumer electronic products such as smart phones, digital cameras, and portable wearable devices.

[0003] In stacked packaging, electrical connection needs to be achieved between the bottom package and the top package. One solution in the prior art is to achieve the connection through a metal column, one end of which is electrically connected to the bottom package and the other end is electrically connected to the top package. When installing the metal column, a large number of metal columns are released on the bottom package by an adsorption device, so that some metal columns with appropriate angles are inserted into the holes of the bottom package and bonded to the bottom of the hole through the solder bonding layer. The metal columns that are not inserted into the holes are re-adsorbed by the adsorption device and then released on the bottom package again. The above steps are repeated until metal columns are inserted into all the holes of the bottom package. This method of installing metal columns is inefficient and will seriously affect the efficiency of stacked packaging. Utility Model Content

[0004] The purpose of the present application is to provide a clamping plate to address the deficiencies in the above-mentioned prior art and solve the problem of low efficiency in installing metal pillars during semiconductor packaging.

[0005] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0006] An embodiment of the present application provides a clamping plate, which is configured to clamp a metal column. The clamping plate includes: a clamping plate body, on which a plurality of clamping holes and a plurality of clamping bodies are provided. The clamping bodies correspond one-to-one to the clamping holes. The clamping holes are used to accommodate the metal column, and the clamping bodies are used to fix the metal column in the clamping holes.

[0007] Optionally, the clamping body is a spring sheet, which extends from the clamping plate body around the axis of the clamping hole in a direction away from the clamping plate body; when the spring sheet is in a natural state, the orthographic projection of the spring sheet on the clamping plate body partially overlaps with the orthographic projection of the clamping hole on the clamping plate body; when the spring sheet is in a downwardly pressed state, the orthographic projection of the spring sheet on the clamping plate body and the orthographic projection of the clamping hole on the clamping plate body have no overlapping area.

[0008] Optionally, the spring sheet includes a mounting portion and an extension portion connected to the mounting portion, the mounting portion is in contact with the surface of the clamping plate, and the extension portion extends from the clamping plate body around the axis of the clamping hole in a direction away from the clamping plate body.

[0009] Optionally, when the spring piece is in a natural state or a pressed state, the orthographic projection of the mounting portion on the clamping plate body is separated from the orthographic projection of the clamping hole on the clamping plate body; when the spring piece is in a natural state, the orthographic projection of the extension portion on the clamping plate body partially overlaps with the orthographic projection of the clamping hole on the clamping plate body; when the spring piece is in a pressed state, the orthographic projection of the extension portion on the clamping plate body and the orthographic projection of the clamping hole on the clamping plate body have no overlapping area.

[0010] Optionally, the mounting portion surrounds at least one quarter of the circumference of the clamping hole, and the extending portion surrounds at least one quarter of the circumference of the clamping hole.

[0011] Optionally, a mounting column is provided on the surface of the clamping plate body, a mounting hole matching with the mounting column is provided on the mounting portion, and the mounting portion is plugged and fixed on the mounting column of the clamping plate body through the mounting hole.

[0012] Optionally, a positioning mark is provided on the first surface of the clamping plate body, and the positioning mark is used to position the clamping plate body during stacking packaging.

[0013] Optionally, the first surface is divided into a vacant area and a clamping area surrounding the vacant area, the positioning mark is located at the edge of the vacant area, the clamping hole is located in the clamping area, and a plurality of clamping holes are arranged around the vacant area.

[0014] Optionally, the second surface of the clamping plate body is provided with an avoidance groove, and the avoidance groove is used to avoid the chip of the bottom package during stacking packaging.

[0015] Optionally, the material of the clamping plate body is a heat conductive material.

[0016] The beneficial effects of this application include:

[0017] The present application provides a clamping plate configured to clamp a metal column, the clamping plate comprising: a clamping plate body, a plurality of clamping holes and a plurality of clamping bodies provided on the clamping plate body, the clamping bodies corresponding to the clamping holes one by one, the clamping holes are used to accommodate the metal column, and the clamping bodies are used to fix the metal column in the clamping holes. The clamping plate is capable of simultaneously fixing a plurality of metal columns by providing a plurality of clamping holes on the clamping plate body and providing a clamping body corresponding to each clamping hole. In the semiconductor packaging process, the rapid installation and positioning of a plurality of metal columns can be achieved, thereby effectively improving the packaging efficiency, and at the same time, the processing difficulty of the metal column can also be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 One of the structural schematic diagrams of the clamping plate provided in the embodiment of the present application;

[0020] Figure 2 One of the schematic diagrams of the clamping plate fixing the metal column provided in the embodiment of the present application;

[0021] Figure 3 A schematic diagram of a clamping plate provided in an embodiment of the present application being applied to a semiconductor package;

[0022] Figure 4 A schematic diagram of a spring piece in a clamping plate provided in an embodiment of the present application in a natural state;

[0023] Figure 5 A schematic diagram of a spring sheet in a clamping plate provided in an embodiment of the present application in a downwardly pressed state;

[0024] Figure 6 The second structural schematic diagram of the clamping plate provided in the embodiment of the present application;

[0025] Figure 7 The third structural schematic diagram of the clamping plate provided in the embodiment of the present application;

[0026] Figure 8 The second schematic diagram of the clamping plate fixing the metal column provided in the embodiment of the present application.

[0027] Icons: 100-clamping plate; 110-clamping plate body; 111-first surface; 1111-vacant area; 1112-clamping area; 112-second surface; 1121-avoidance groove; 113-mounting column; 120-clamping hole; 130-clamping body; 131-spring clip; 1311-mounting portion; 1312-extension portion; 140-positioning mark; 200-metal column; 300-bottom package; 310-chip; 320-circuit board; 400-top package; T-thickness direction; P1-orthographic projection of the spring clip on the clamping plate body; P2-orthographic projection of the clamping hole on the clamping plate body. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. It should be noted that, in the absence of conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] Please refer to Figures 1 to 3The embodiment of the present application provides a clamping plate 100, which is configured to clamp a metal column 200. The metal column 200 can be used to realize the electrical connection between the bottom package 300 and the top package 400 in the stacked package. Specifically, the clamping plate 100 includes: a clamping plate body 110, and the clamping plate body 110 is provided with a plurality of clamping holes 120 and a plurality of clamping bodies 130. The clamping bodies 130 correspond to the clamping holes 120 one by one. The clamping holes 120 are used to accommodate the metal columns 200, and the clamping bodies 130 are used to fix the metal columns 200 in the clamping holes 120.

[0034] The clamping plate body 110 is in the shape of a plate, preferably in a rectangular or square shape. The clamping plate body 110 has a first surface 111 and a second surface 112 opposite to each other. When the stacking package is performed, the first surface 111 faces the top package 400, and the second surface 112 faces the bottom package 300. The clamping hole 120 extends along the thickness direction T of the clamping plate body 110 and penetrates the first surface 111 and the second surface 112 of the clamping plate body 110, and the metal column 200 is located in the clamping hole 120. Generally speaking, stacking package requires the use of multiple metal columns 200 at the same time. Therefore, in order to improve the packaging efficiency, the number of clamping holes 120 on the clamping plate body 110 is also multiple, and each clamping hole 120 can accommodate a metal column 200. In practical applications, the number of clamping holes 120 and the position of the clamping holes 120 on the clamping plate body 110 can be determined accordingly according to the number of metal columns 200 required for packaging and the position of the metal columns 200 during packaging.

[0035] The diameter of the clamping hole 120 is equal to or slightly larger than the diameter of the metal column 200, so as to facilitate the removal and placement of the metal column 200. At the same time, in order to fix the metal column 200 in the clamping hole 120 and prevent the metal column 200 from falling, a plurality of clamping bodies 130 are also provided on the clamping plate body 110. The plurality of clamping bodies 130 correspond one-to-one to the plurality of clamping holes 120, and the clamping bodies 130 are used to fix the metal column 200 in the clamping hole 120 corresponding thereto. Figure 1 Only one clamping body 130 is shown in the figure, but in fact, one clamping body 130 is correspondingly provided for each clamping hole 120 .

[0036] It should be noted that, in this embodiment, the position of the clamping body 130 is not limited, and the clamping body 130 can be disposed inside the clamping hole 120 or on the surface of the clamping plate body 110. Similarly, the structure of the clamping body 130 is not limited, as long as it can fix the metal column 200 in the clamping hole 120.

[0037] The clamping body 130 and the metal column 200 may be in point contact, line contact or surface contact. Preferably, the clamping body 130 and the metal column 200 are in surface contact, and the surface contact has a larger contact area, which can make the metal column 200 more firmly fixed, and can also prevent the metal column 200 from deflecting inside the clamping hole 120 or the clamping body 130 from causing damage to the metal column 200.

[0038] When performing stacked packaging, an alignment machine in the prior art can be used to align multiple metal pillars 200 one by one into the clamping holes 120 of the clamping plate body 110. This process can be carried out simultaneously with the preparation of the bottom package 300 and the top package 400, and then the clamping plate 100 fixed with multiple metal pillars 200 is directly moved to the top of the bottom package 300, and the metal pillars 200 and the bottom package 300 are welded and fixed. In this way, semiconductor packaging manufacturing can be facilitated and packaging efficiency can be effectively improved. After the metal pillars 200 are fixed to the bottom package 300, the clamping plate 100 can be removed, or the clamping plate 100 can be left directly in the stacked packaging structure without being removed, which can further improve the packaging efficiency. In addition, the lower surface of the metal column 200 and the bottom package 300 are usually fixed by soldering with solder paste. The solder paste welding has a low requirement for the flatness of the lower surface of the metal column 200. After the clamping plate 100 is used, when processing the metal column 200, it is only necessary to ensure the flatness of the upper surface of the metal column 200, which reduces the processing difficulty of the metal column 200. It can be understood that the clamping plate 100 is not only used in stacked packaging, but also can be applied to other semiconductor packaging processes.

[0039] In summary, the clamping plate 100 provided in the embodiment of the present application can simultaneously fix multiple metal pillars 200 by providing multiple clamping holes 120 on the clamping plate body 110, and providing a clamping body 130 corresponding to each clamping hole 120. In the semiconductor packaging process, multiple metal pillars 200 can be quickly installed and positioned, thereby effectively improving the packaging efficiency, and at the same time, the processing difficulty of the metal pillars 200 can be reduced.

[0040] Optionally, see Figure 2 The clamping body 130 is a spring sheet 131, and the spring sheet 131 extends from the clamping plate body 110 to a direction away from the clamping plate body 110 around the axis of the clamping hole 120; Figure 4 As shown, when the spring piece 131 is in a natural state, the orthographic projection P1 of the spring piece on the clamping plate body partially overlaps with the orthographic projection P2 of the clamping hole on the clamping plate body; Figure 5 As shown, when the spring sheet 131 is in a downwardly pressed state, the orthographic projection P1 of the spring sheet on the clamping plate body and the orthographic projection P2 of the clamping hole on the clamping plate body have no overlapping area.

[0041] The spring piece 131 is arranged outside the clamping hole 120 and on the surface of the clamping plate body 110. Preferably, the spring piece 131 is arranged on the first surface 111 of the clamping plate body 110, so that after the metal column 200 is fixed to the bottom package 300, the spring piece 131 is pressed to remove the clamping plate 100. The spring piece 131 is spiral-shaped. After the metal column 200 is inserted into the clamping hole 120, the spring piece 131 surrounds the side wall of the metal column 200 and abuts against the side wall of the metal column 200, thereby fixing the metal column 200 in the clamping hole 120. After the upper surface of the metal column 200 is pressed, it can move unidirectionally in the clamping hole 120.

[0042] The spring piece 131 has two states, namely a natural state and a pressed state. The natural state means that the spring piece 131 is not affected by any external force except the reaction force applied by the metal column 200; the pressed state means that the end of the spring piece 131 away from the clamping plate body 110 is subjected to external pressing pressure, the spring piece 131 is compressed, and the end of the spring piece 131 away from the clamping plate body 110 moves toward the direction of the clamping plate body 110.

[0043] like Figure 4 As shown, when the spring piece 131 is in a natural state, the spring piece 131 needs to abut against the metal column 200 to fix the metal column 200. At this time, the orthographic projection P1 of the spring piece on the clamping plate body and the orthographic projection P2 of the clamping hole on the clamping plate body partially overlap, so that the inner side of the spring piece 131 (the side facing the clamping hole 120) can contact the metal column 200, and the metal column 200 is prevented from falling by applying pressure to the metal column 200. The principle is equivalent to the inner side of the spring piece 131 reducing the size of the clamping hole 120, thereby cooperating with the clamping hole 120 to clamp the metal column 200. When Figure 5 As shown, when the clamping plate body 110 needs to be separated from the metal column 200, the spring sheet 131 is pressed to put the spring sheet 131 in a downwardly pressed state. At this time, the orthographic projection P1 of the spring sheet on the clamping plate body and the orthographic projection P2 of the clamping hole on the clamping plate body have no overlapping area, but the edges of the orthographic projections of the two can partially overlap. The spring sheet 131 in the downwardly pressed state avoids the clamping hole 120, so that the metal column 200 can be smoothly separated from the clamping plate body 110.

[0044] Optionally, see Figure 6 and Figure 7 The spring piece 131 includes a mounting portion 1311 and an extension portion 1312 connected to the mounting portion 1311. The mounting portion 1311 is in contact with the surface of the clamping plate 100, and the extension portion 1312 extends from the clamping plate body 110 to a direction away from the clamping plate body 110 around the axis of the clamping hole 120.

[0045] The mounting portion 1311 of the spring piece 131 is used to be fixedly connected to the clamping plate body 110, and the extension portion 1312 is used to abut against the metal column 200, thereby fixing the metal column 200 in the clamping hole 120. The mounting portion 1311 fits the surface of the clamping plate 100, which can make the installation of the spring piece 131 more firm and reliable.

[0046] Optionally, a mounting column 113 is provided on the surface of the clamping plate body 110 , a mounting hole matching with the mounting column 113 is provided on the mounting portion 1311 , and the mounting portion 1311 is plugged and fixed on the mounting column 113 of the clamping plate body 110 through the mounting hole.

[0047] For example, the mounting post 113 and the mounting hole are interference fit to fix the spring piece 131. Furthermore, after the mounting portion 1311 is plugged and fixed on the mounting post 113 of the clamping plate body 110 through the mounting hole, the mounting portion 1311 is welded to the mounting plate body, thereby further improving the reliability of the installation of the spring piece 131.

[0048] For example, at least two mounting posts 113 are arranged at intervals on the side of each clamping hole 120, and correspondingly, at least two mounting holes are also arranged on each mounting portion 1311, and the at least two mounting holes correspond to the at least two mounting posts 113. The cooperation of at least two pairs of mounting posts 113 and mounting holes can prevent the spring sheet 131 from rotating, and can also improve the reliability of the installation of the spring sheet 131.

[0049] The mounting portion 1311 of the spring sheet 131 is fixed on the clamping plate body 110 . No matter the spring sheet 131 is in a natural state or a pressed state, the mounting portion 1311 does not move. The state switching of the spring sheet 131 needs to be realized through the extension portion 1312 .

[0050] Optionally, please refer to Figure 4 and Figure 5 When the spring piece 131 is in a natural state or a pressed state, the orthographic projection of the mounting portion 1311 on the clamping plate body 110 is separated from the orthographic projection P2 of the clamping hole on the clamping plate body, thereby preventing the mounting portion 1311 from affecting the installation and removal of the metal column 200.

[0051] like Figure 4 As shown, when the spring piece 131 is in a natural state, the orthographic projection of the extension portion 1312 on the clamping plate body 110 partially overlaps with the orthographic projection P2 of the clamping hole on the clamping plate body, so that the inner side of the extension portion 1312 (the side facing the clamping hole 120) can contact the metal column 200, thereby applying pressure to the metal column 200 to prevent the metal column 200 from falling. Figure 5As shown, when the spring piece 131 is in the downward pressure state, the orthographic projection of the extension portion 1312 on the clamping plate body 110 and the orthographic projection P2 of the clamping hole on the clamping plate body have no overlapping area, but the edges of the orthographic projections of the two can partially overlap. At this time, the extension portion 1312 in the downward pressure state avoids the clamping hole 120, so that the metal column 200 can be smoothly separated from the clamping plate body 110.

[0052] Optionally, see Figure 2 and Figure 6 The mounting portion 1311 surrounds at least one quarter of the circumference of the clamping hole 120 , and the extending portion 1312 surrounds at least one quarter of the circumference of the clamping hole 120 .

[0053] That is, the orthographic projection of the mounting portion 1311 on the clamping plate body 110 corresponds to at least one quarter of the circumference of the clamping hole 120, and the orthographic projection of the extension portion 1312 on the clamping plate body 110 corresponds to at least one quarter of the circumference of the clamping hole 120. This arrangement can increase the reliability of the fixing of the spring 131 and the metal column 200.

[0054] Optionally, see Figure 8 The clamping body 130 is a spring sheet 131, which is arranged in the clamping hole 120. The first end of the spring sheet 131 is connected to the inner wall of the clamping hole 120, and the opposite second end is used to abut against the metal column 200 to fix the metal column 200 in the clamping hole 120.

[0055] The spring piece 131 has a first end and a second end opposite to each other, wherein the first end is close to the first surface 111 of the clamping plate body 110, and the second end is close to the second surface 112 of the clamping plate body 110. The first end of the spring piece 131 is fixedly connected to the inner wall of the clamping hole 120, and the second end is suspended inside the clamping hole 120. After the metal column 200 is inserted into the clamping hole 120, the second end of the spring piece 131 abuts against the metal column 200, thereby fixing the metal column 200 in the clamping hole 120.

[0056] Please refer to Figure 3 and Figure 6 When performing stacking packaging, the clamping plate 100 needs to carry the metal column 200 so that the metal column 200 is aligned with the solder joint on the bottom package 300. In order to achieve rapid positioning of the clamping plate 100, optionally, the first surface 111 of the clamping plate body 110 is provided with a positioning mark 140, and the positioning mark 140 is used to position the clamping plate body 110 during stacking packaging.

[0057] For example, the positioning mark 140 is a groove provided on the first surface 111 of the clamping plate body 110. The groove is easy to process, and the shape of the groove can be used to position the clamping plate 100. For example, the positioning mark 140 includes two, and the two positioning marks 140 are respectively a triangular groove and a rectangular groove, and the triangular groove and the rectangular groove are distributed along the diagonal line of the first surface 111 of the clamping plate body 110 at intervals.

[0058] Optionally, the first surface 111 is divided into a vacant area 1111 and a clamping area 1112 surrounding the vacant area 1111 , the positioning mark 140 is located at the edge of the vacant area 1111 , the clamping hole 120 is located in the clamping area 1112 , and a plurality of clamping holes 120 are arranged around the vacant area 1111 .

[0059] The vacant area 1111 is located in the middle of the clamping plate body 110, and the clamping area 1112 is annular and arranged around the vacant area 1111. No clamping hole 120 is arranged in the vacant area 1111. When stacking the packages, the vacant area 1111 corresponds to the position of the chip 310 of the bottom package 300. The clamping area 1112 corresponds to the area on the circuit board 320 of the bottom package 300 where the chip 310 is not arranged. The clamping holes 120 are all distributed in the clamping area 1112 in a manner of surrounding the vacant area 1111 layer by layer, so as to facilitate connection with the circuit board 320 of the bottom package 300.

[0060] For example, Figure 6 As shown, the clamping plate body 110 and the vacant area 1111 are both rectangular, the clamping area 1112 is rectangular ring-shaped, and the clamping holes 120 are evenly arranged around the vacant area 1111, and multiple clamping holes 120 are distributed in a rectangular ring shape. It can be understood that the clamping holes 120 surrounding the vacant area 1111 can be one layer, two layers, or multiple layers.

[0061] Optionally, the material of the clamping plate body 110 is a heat conductive material.

[0062] The heat-conducting material can be a metal with good heat-conducting performance, or it can be a material such as epoxy resin. After the stacking package, if the clamping plate 100 is retained in the packaging structure, the heat-conducting clamping plate body 110 can dissipate heat over a large area of ​​the packaging structure, and timely conduct the heat generated when the packaging structure is working, which is conducive to the normal operation of the packaging structure and prolongs the service life of the packaging structure.

[0063] Please refer to Figure 2 and Figure 3When performing stacking packaging, the second surface 112 of the clamping plate body 110 faces the chip 310 of the bottom package 300. In order to avoid interference between the clamping plate 100 and the chip 310 and damage to the chip 310, optionally, the second surface 112 of the clamping plate body 110 is provided with an avoidance groove 1121, which is used to avoid the chip 310 of the bottom package 300 during stacking packaging.

[0064] Furthermore, the material of the clamping plate body 110 is a heat-conducting material, and the bottom of the avoidance groove 1121 fits with the top of the chip 310 , thereby achieving large-area heat dissipation for the chip 310 .

[0065] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A clamping plate, configured to clamp a metal column, characterized in that: The clamping plate comprises: a clamping plate body, on which a plurality of clamping holes and a plurality of clamping bodies are arranged, wherein the clamping bodies correspond to the clamping holes one by one, the clamping holes are used to accommodate the metal columns, and the clamping bodies are used to fix the metal columns in the clamping holes.

2. The clamping plate according to claim 1, characterized in that The clamping body is a spring sheet, and the spring sheet extends from the clamping plate body to a direction away from the clamping plate body around the axis of the clamping hole; When the spring sheet is in a natural state, the orthographic projection of the spring sheet on the clamping plate body partially overlaps with the orthographic projection of the clamping hole on the clamping plate body; when the spring sheet is in a pressed state, the orthographic projection of the spring sheet on the clamping plate body and the orthographic projection of the clamping hole on the clamping plate body have no overlapping area.

3. The clamping plate according to claim 2, characterized in that The spring sheet includes a mounting portion and an extension portion connected to the mounting portion, the mounting portion is in contact with the surface of the clamping plate, and the extension portion extends from the clamping plate body in a direction away from the clamping plate body around the axis of the clamping hole.

4. The clamping plate according to claim 3, characterized in that When the spring sheet is in a natural state or a pressed state, the orthographic projection of the mounting portion on the clamping plate body is separated from the orthographic projection of the clamping hole on the clamping plate body; when the spring sheet is in a natural state, the orthographic projection of the extension portion on the clamping plate body partially overlaps with the orthographic projection of the clamping hole on the clamping plate body; when the spring sheet is in a pressed state, the orthographic projection of the extension portion on the clamping plate body and the orthographic projection of the clamping hole on the clamping plate body have no overlapping area.

5. The clamping plate according to claim 3, characterized in that: The mounting portion surrounds at least one quarter of the circumference of the clamping hole, and the extending portion surrounds at least one quarter of the circumference of the clamping hole.

6. The clamping plate according to claim 3, characterized in that: A mounting column is provided on the surface of the clamping plate body, a mounting hole matched with the mounting column is provided on the mounting portion, and the mounting portion is plugged and fixed on the mounting column of the clamping plate body through the mounting hole.

7. The clamping plate according to claim 1, characterized in that A positioning mark is provided on the first surface of the clamping plate body, and the positioning mark is used to position the clamping plate body during stacking packaging.

8. The clamping plate according to claim 7, characterized in that The first surface is divided into a vacant area and a clamping area surrounding the vacant area, the positioning mark is located at the edge of the vacant area, the clamping hole is located in the clamping area, and a plurality of the clamping holes are arranged around the vacant area.

9. The clamping plate according to claim 1, characterized in that: The second surface of the clamping plate body is provided with an avoidance groove, and the avoidance groove is used to avoid the chip of the bottom package during stacking packaging.

10. The clamping plate according to claim 1, characterized in that The material of the clamping plate body is a heat-conducting material.

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