Flexible circuit board capable of reducing thickness of interface end
By setting pin pin number etching holes and QR code laser areas on the interface end of the flexible circuit board, the problems of increasing thickness and complex process at the interface end are solved, and the effects of thickness reduction, process simplification and cost reduction are achieved.
Patent Information
- Application Number
- CN202420547891.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-03-20
AI Technical Summary
When the existing flexible circuit boards set pin number words on the interface end, the thickness of the interface end increases, the process steps are complicated, which increases production costs and defective yield rates, and reduces product competitiveness.
By setting the pin pin serial number mark etching hole on the second covering film at the interface end, the second copper deposited layer is used to display the pin pin serial number words, and a QR code laser area is set on the upper surface of the connection part. The QR code is generated by ink layers and laser technology of different colors to reduce the silk screen printing process.
The thickness of the interface end is reduced, the production process is simplified, the defective yield and production costs are reduced, and the competitiveness and quality of the product are improved.
Smart Images
Figure CN222674559U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of printed circuit boards, and more specifically to a flexible circuit board with reduced interface end thickness. Background Art
[0002] The materials of the flexible circuit boards of commonly used display modules are generally double-layer adhesive-free substrates, and the interface end needs to be silk-screened with pin number marks, usually in white ink, for easy identification. However, the thickness of the interface end increases accordingly due to the addition of pin number marks at the interface end; and the silk-screening of pin number marks also requires an additional silk-screening process, which increases the number of manufacturing process steps for flexible circuit boards. The increase in the number of manufacturing process steps for flexible circuit boards will also increase the probability of defective products, thereby significantly increasing the production and manufacturing costs of flexible circuit boards, thereby reducing the product competitiveness of flexible circuit boards and failing to meet the growing quality requirements of enterprises. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to set a pin number mark on the interface end while reducing the thickness of the interface end.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] In order to solve the above technical problems, the utility model provides a flexible circuit board with reduced interface end thickness, which includes a main body and a connecting part connected to the main body, the interface end is provided at one end of the connecting part away from the main body, the interface end includes a first covering film, a first copper layer, a first copper foil layer, a substrate layer, a second copper foil layer, a second copper layer and a second covering film which are sequentially stacked from bottom to top, an upper surface of the second covering film is provided with an etching hole for a pin number mark, the etching hole penetrates to the upper surface of the second copper layer, an upper surface of the connecting part is provided with a two-dimensional code laser area, an upper surface of the connecting part located on the two-dimensional code laser area is provided with a first ink layer and a second ink layer arranged on the first ink layer, the second ink layer is formed with a two-dimensional code by laser, and the colors of the first ink layer and the second ink layer are different.
[0006] As a preferred embodiment of the flexible circuit board with reduced interface end thickness provided by the utility model, the thickness of the first ink layer is 30 μm ～ 40μm.
[0007] As a preferred embodiment of the flexible circuit board with reduced interface end thickness provided by the utility model, the thickness of the second ink layer is 10 μm ～ 20μm.
[0008] As a preferred implementation of the flexible circuit board with reduced interface end thickness provided by the utility model, the first ink layer is a black ink layer, and the second ink layer is a white ink layer.
[0009] As a preferred implementation of the flexible circuit board with reduced interface end thickness provided by the utility model, two reinforcing plates staggered from each other are provided on both sides of the connecting portion.
[0010] As a preferred implementation of the flexible circuit board with reduced interface end thickness provided by the utility model, the widths of the two reinforcement plates are different.
[0011] As a preferred implementation of the flexible circuit board with reduced interface end thickness provided by the utility model, the positions of the two reinforcement plates are different.
[0012] As a preferred implementation of the flexible circuit board with reduced interface end thickness provided by the utility model, the material of the reinforcement plate is FR4, PI or stainless steel.
[0013] As a preferred implementation of the flexible circuit board with reduced interface end thickness provided by the utility model, outer surfaces of the two reinforcement plates are both provided with a surface treatment layer for improving surface roughness.
[0014] As a preferred implementation of the flexible circuit board with reduced interface end thickness provided by the utility model, the surface treatment layer is diamond knurling.
[0015] The utility model has the following beneficial effects:
[0016] Since the upper surface of the second covering film is provided with an etching hole for the pin number mark, the etching hole penetrates to the upper surface of the second copper layer, so that the second copper layer can be used to display the pin number mark, which can reduce the thickness of the interface end; and there is no need to add a silk screen printing process, so that the production process steps of the flexible circuit board are reduced. The reduction in the production process steps of the flexible circuit board reduces the probability of defective products, thereby greatly reducing the production and manufacturing costs of the flexible circuit board, thereby improving the product competitiveness of the flexible circuit board, thereby meeting the company's growing quality requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1The utility model provides a structural schematic diagram of a flexible circuit board with reduced interface end thickness.
[0019] Figure 2 for Figure 1 Schematic diagram of the structure of the interface end.
[0020] Figure 3 for Figure 1 Schematic diagram of the structure of the middle connection part.
[0021] Figure 4 A schematic diagram of the structure of another flexible circuit board with reduced interface end thickness provided by the utility model.
[0022] Description of Figure Numbers:
[0023] Body 1; connecting portion 2; interface end 3; first covering film 31; first copper layer 32; first copper foil layer 33; substrate layer 34; second copper foil layer 35; second copper layer 36; second covering film 37; etching hole 38;
[0024] A first ink layer 21; a second ink layer 22;
[0025] Reinforcement plate 4. DETAILED DESCRIPTION
[0026] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0028] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0029] The utility model provides a flexible circuit board with reduced interface end thickness, comprising a main body and a connecting portion connected to the main body, wherein the interface end is provided at one end of the connecting portion away from the main body, wherein the interface end comprises a first covering film, a first copper deposition layer, a first copper foil layer, a substrate layer, a second copper foil layer, a second copper deposition layer and a second covering film which are sequentially stacked from bottom to top, wherein an etching hole for a pin number mark is provided on the upper surface of the second covering film, wherein the etching hole penetrates to the upper surface of the second copper deposition layer, wherein a two-dimensional code laser area is provided on the upper surface of the connecting portion, wherein a first ink layer and a second ink layer provided on the first ink layer are provided on the upper surface of the connecting portion located on the two-dimensional code laser area, wherein a two-dimensional code is formed on the second ink layer by laser, and the first ink layer and the second ink layer have different colors.
[0030] Since the upper surface of the second covering film is provided with an etching hole for the pin number mark, the etching hole penetrates to the upper surface of the second copper layer, so that the second copper layer can be used to display the pin number mark, which can reduce the thickness of the interface end; and there is no need to add a silk screen printing process, so that the production process steps of the flexible circuit board are reduced. The reduction in the production process steps of the flexible circuit board reduces the probability of defective products, thereby greatly reducing the production and manufacturing costs of the flexible circuit board, thereby improving the product competitiveness of the flexible circuit board, thereby meeting the company's growing quality requirements.
[0031] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0032] Example 1
[0033] See also Figures 1 to 3, a flexible circuit board with reduced interface end thickness provided by the utility model, comprising a body 1 and a connecting part 2 connected to the body 1, an interface end 3 is provided at one end of the connecting part 2 away from the body 1, the interface end 3 comprises a first covering film 31, a first copper layer 32, a first copper foil layer 33, a substrate layer 34, a second copper foil layer 35, a second copper layer 36 and a second covering film 37 which are sequentially stacked from bottom to top, an etching hole 38 of a pin number mark is provided on the upper surface of the second covering film 37, the etching hole 38 penetrates to the upper surface of the second copper layer 36, a two-dimensional code laser area is provided on the upper surface of the connecting part 2, a first ink layer 21 and a second ink layer 22 arranged on the first ink layer 21 are provided on the upper surface of the connecting part 2 located on the two-dimensional code laser area, a two-dimensional code is formed on the second ink layer 22 by laser, and the first ink layer 21 and the second ink layer 22 have different colors. Since the upper surface of the second covering film 37 is provided with an etching hole 38 for the pin number mark, the etching hole 38 penetrates to the upper surface of the second copper plating layer 36, so that the second copper plating layer 36 can be used to display the pin number mark, which can reduce the thickness of the interface end 3; and there is no need to add a silk screen printing process, so that the manufacturing process steps of the flexible circuit board are reduced. The reduction in the manufacturing process steps of the flexible circuit board reduces the probability of defective products, thereby greatly reducing the production and manufacturing costs of the flexible circuit board, thereby improving the product competitiveness of the flexible circuit board, thereby meeting the company's growing quality requirements.
[0034] Since two layers of ink are provided, the first ink layer 21 and the second ink layer 22, the surface second ink layer 22 is lased off by laser to expose the bottom first ink layer 21. The places lased by laser are displayed in different colors. The QR code generated in this way has good contrast effect and is easy to scan. At the same time, the QR code will not fall off and be damaged, which prevents the QR code from becoming invalid and greatly reduces labor costs.
[0035] Furthermore, the first ink layer 21 is a black ink layer, and the second ink layer 22 is a white ink layer. The contrast between the black ink layer and the white ink layer is better, and the code is easier to scan.
[0036] Furthermore, the thickness of the first ink layer 21 is 30 μm. ～ 40 μm. The thickness of the second ink layer 22 is 10 μm ～ 20μm. This thickness is the thickness that the commonly used ultraviolet laser can just penetrate, and there is no dust around after the laser irradiation, which has the advantages of high rhythm and efficiency. The reason why the thickness of the lower first ink layer 21 is thicker than the thickness of the upper second ink layer 22 is to avoid laser power energy fluctuations and prevent the first ink layer 21 from being penetrated by the laser and causing damage to the internal layer of the connecting part 2.
[0037] Example 2
[0038] See also Figure 4 As a further optimization scheme of Example 1, in this embodiment, two reinforcing plates 4 are arranged staggered on both sides of the connection part 2. In the design of traditional flexible circuit boards, reinforcing plates 4 are usually not provided or are arranged at the same position and have the same width, resulting in the pressure applied being concentrated on the same straight line when plugging and unplugging the connection part 2, causing a slight break in the line of the connection part 2. Since the two reinforcing plates 4 of the flexible circuit board provided by the utility model are respectively located on both sides of the connection part 2 and staggered, when the connection part 2 is pulled out, the pressure exerted by the reinforcing plates 4 on both sides on the connection part 2 is not on the same line segment, and the stress will not be concentrated on the same straight line when bending, thereby avoiding stress concentration and the problem of easy slight break in the line at the interface end 3, thereby improving the product yield.
[0039] Furthermore, the two reinforcing plates 4 staggered in the present invention may be arranged at two different positions respectively; or the center point may be at the same position, but the widths of the two reinforcing plates 4 are different. As long as the stress of the two reinforcing plates 4 when bent is not concentrated on the same straight line, it can avoid stress concentration and the problem of easy micro-breakage of the line at the interface end 3, thereby improving the product yield. In this embodiment, the reinforcing plates 4 include a first reinforcing plate and a second reinforcing plate, and the widths of each reinforcing plate 4 are different, and the center points thereof are on the same horizontal line, so that the edges of the reinforcing plates 4 are staggered and not concentrated on the same straight line.
[0040] Furthermore, the material of the reinforcing plate 4 is FR4, PI or stainless steel. In other embodiments, if the heat generated by the connecting portion 2 is relatively large, a heat dissipation material with better heat dissipation effect, such as an aluminum foil reinforcing plate 4, may also be used.
[0041] Furthermore, the outer surfaces of the first reinforcement plate and the second reinforcement plate are both provided with a surface treatment layer for increasing the surface roughness, so as to increase the friction between the worker and the first reinforcement plate and the second reinforcement plate, so that the connection part 2 is easy to pull out.
[0042] Furthermore, the surface treatment layer is provided with diamond knurling on the outer surfaces of the first reinforcement plate and the second reinforcement plate, so that the connection part 2 can be pulled out more easily, reducing the risk of the connection part 2 line breaking.
[0043] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0044] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A flexible circuit board with reduced interface end thickness, characterized in that: It includes a main body and a connecting part connected to the main body, an interface end is provided at one end of the connecting part away from the main body, and the interface end includes a first covering film, a first copper deposited layer, a first copper foil layer, a substrate layer, a second copper foil layer, a second copper deposited layer and a second covering film which are stacked in sequence from bottom to top, an etching hole of a pin number mark is provided on the upper surface of the second covering film, and the etching hole penetrates to the upper surface of the second copper deposited layer, a two-dimensional code laser area is provided on the upper surface of the connecting part, a first ink layer and a second ink layer arranged on the first ink layer are provided on the upper surface of the connecting part located on the two-dimensional code laser area, a two-dimensional code is formed on the second ink layer by laser, and the first ink layer and the second ink layer have different colors.
2. The flexible circuit board with reduced interface end thickness according to claim 1, characterized in that: The thickness of the first ink layer is 30 μm ～ 40μm.
3. The flexible circuit board with reduced interface end thickness according to claim 1, characterized in that: The thickness of the second ink layer is 10 μm ～ 20μm.
4. The flexible circuit board with reduced interface end thickness according to claim 1, characterized in that: The first ink layer is a black ink layer, and the second ink layer is a white ink layer.
5. The flexible circuit board with reduced interface end thickness according to claim 1, characterized in that: Two reinforcing plates staggered with each other are arranged on both sides of the connecting portion.
6. The flexible circuit board with reduced interface end thickness according to claim 5, characterized in that: The widths of the two reinforcing plates are different.
7. The flexible circuit board with reduced interface end thickness according to claim 5, characterized in that: The positions of the two reinforcing plates are different.
8. The flexible circuit board with reduced interface end thickness according to claim 5, characterized in that: The reinforcement plate is made of FR4, PI or stainless steel.
9. The flexible circuit board with reduced interface end thickness according to claim 5, characterized in that: The outer surfaces of the two reinforcing plates are both provided with a surface treatment layer for improving the surface roughness.
10. The flexible circuit board with reduced interface end thickness according to claim 9, characterized in that: The surface treatment layer is diamond knurled.