High-precision multilayer circuit board

Abstract

The utility model belongs to the technical field of high-precision circuit boards, in particular to a high-precision multilayer circuit board, which comprises a bottom plate, two vertical plates are fixedly connected to the upper surface of the bottom plate, a plurality of fixing plates are fixedly connected to opposite sides of the two vertical plates, all the fixing plates are arranged in an array in the vertical direction, and the vertical plates are fixedly connected to the bottom plate. The fixing plates on the two vertical plates are symmetrically arranged, and a supporting plate is fixedly connected between the two fixing plates on the same horizontal plane. According to the utility model, the heat dissipation assembly and the heat dissipation fan rotate to dissipate the heat of the high-precision circuit board between the two vertical plates, so that the heat is dissipated from the openings in the two sides of the vertical plates, and rapid heat dissipation is carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of high-precision circuit boards, in particular to a high-precision multilayer circuit board. Background Art

[0002] A multilayer circuit board is a printed circuit board that distributes electrical connections on multiple levels. Its wiring is more complex than that of a single-sided or double-sided circuit board and can significantly reduce the size of the circuit board. Its structure is usually composed of 3 to 16 layers, or even more copper foil layers, and contains holes for completing the connection. In order to avoid blind hole misalignment, the inner wall of the hole is often plated with conductive metal, which is also more challenging in terms of process.

[0003] The existing multi-layer circuit boards have many layers and many electronic components installed inside. When in use, the internal heat generated is large, and the heat generated by the internal electronic components is difficult to dissipate. Therefore, when in use, the temperature of the multi-layer circuit board is easily too high, thereby damaging the multi-layer circuit board. Summary of the invention

[0004] In order to solve the above problems, the utility model proposes a high-precision multi-layer circuit board to more accurately solve the problem that the existing multi-layer circuit board mentioned above has a large number of layers and a large number of electronic components installed inside. When in use, the internal heat generation is large, and the heat generated by the internal electronic components is difficult to be discharged. In this way, the temperature of the multi-layer circuit board is easily too high during use, thereby damaging the multi-layer circuit board.

[0005] The utility model is realized by the following technical solutions:

[0006] The utility model proposes a high-precision multi-layer circuit board, comprising a base plate, the upper surface of the base plate is fixedly connected to two vertical plates, the opposite sides of the two vertical plates are fixedly connected to a plurality of fixed plates, all the fixed plates are arranged in an array in the vertical direction, the fixed plates on the two vertical plates are symmetrically arranged, a support plate is fixedly connected between the two fixed plates on the same horizontal plane, the support plate is used to place the high-precision circuit board, and a heat dissipation component is provided on one side of one of the vertical plates.

[0007] Furthermore, one side of one of the vertical plates is provided with two circular through grooves, and heat dissipation components are placed in the two circular through grooves. The heat dissipation component includes a fixed frame, and the fixed frame is fixed to the side wall of the circular through groove. The inner side of the fixed frame is fixedly connected to a plurality of fixing rods, and all the fixing rods are arranged in a circular array, one end of the fixing rod is fixedly connected to the mounting plate, one side of the mounting plate is fixedly connected to the driving motor, and the main shaft of the driving motor is fixedly connected to the cooling fan.

[0008] Furthermore, the upper surface of the support plate is fixedly connected to four support blocks.

[0009] Furthermore, the sides of all the support plates are fixedly connected to four support plates, and the four support plates are provided with penetrating slide grooves, and the slide grooves are slidably connected to sliding seats, and all the sliding seats are provided with circular through holes.

[0010] Furthermore, all the fixing plates and supporting blocks are made of heat-conducting materials.

[0011] Furthermore, all the fixing plates penetrate the vertical plates on the upper surface of the bottom plate, one side of another vertical plate is fixedly connected to the heat conducting plate, and the fixing plate on one side of the vertical plate is fixedly connected to the heat conducting plate.

[0012] Furthermore, a plurality of heat dissipation fins are fixedly connected to one side of the heat conducting plate.

[0013] Furthermore, the upper surfaces of the two vertical plates are provided with mounting grooves, the mounting grooves are provided with through holes, and the top plate is fixed in the mounting grooves by screws.

[0014] Beneficial effects of the utility model:

[0015] The utility model proposes a high-precision multi-layer circuit board, which dissipates heat for the high-precision circuit board between two vertical plates by setting a heat dissipation component and rotating a heat dissipation fan, so that the heat is dissipated from openings on both sides of the vertical plates. At the same time, the high-precision circuit boards are at different heights and there are distances between them. When the heat dissipation fan rotates, wind can easily pass through the high-precision heat dissipation plates to bring out the heat, thereby quickly dissipating the heat for the high-precision circuit boards.

[0016] A high-precision multi-layer circuit board is provided with a heat conducting plate, a fixing plate and a supporting block located below the circuit board. When the circuit board generates heat, the heat around the circuit board is conducted, and the fixing plate transfers the heat to the heat conducting plate. The heat conducting plate dissipates heat through heat dissipation fins, thereby improving the heat dissipation speed of the heat conducting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a structural schematic diagram of the support plate of the utility model;

[0019] Figure 3 It is a schematic diagram of the vertical plate and the top plate of the utility model;

[0020] Figure 4 It is a schematic structural diagram of the heat dissipation fan of the utility model.

[0021] The accompanying drawings are marked as follows: 1. bottom plate; 2. vertical plate; 3. fixed plate; 4. support plate; 5. heat dissipation assembly; 51. fixed frame; 52. fixed rod; 53. mounting plate; 54. drive motor; 55. cooling fan; 6. support block; 7. support plate; 8. sliding seat; 9. heat conduction plate; 10. cooling fins; 11. top plate. DETAILED DESCRIPTION

[0022] In order to more clearly and completely illustrate the technical solution of the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0023] Please refer to Figure 1-Figure 4 The utility model proposes a high-precision multi-layer circuit board, comprising a bottom plate 1, wherein the upper surface of the bottom plate 1 is fixedly connected to two vertical plates 2, and the opposite sides of the two vertical plates 2 are fixedly connected to multiple fixing plates 3, and all the fixing plates 3 are arranged in an array in the vertical direction, and the fixing plates 3 on the two vertical plates 2 are symmetrically arranged, and a support plate 4 is fixedly connected between the two fixing plates 3 on the same horizontal plane, and the support plate 4 is used to place the high-precision circuit board, and a heat dissipation component 5 is provided on one side of one of the vertical plates 2, and a multi-layer circuit board is placed between the two vertical plates 2, and each layer of printed circuit boards of the multi-layer circuit board is placed on the support plate 4 respectively, and the printed circuit boards are connected to each other, and all the high-precision circuit boards are arranged in a vertical array. When in use, since the high-precision circuit board generates heat, and multiple printed circuit boards are placed between the vertical plates 2, the heat cannot be naturally dissipated. At this time, the heat dissipation can be assisted by the heat dissipation component 5 to avoid excessive temperature and affect the use of the high-precision circuit board. The high-precision circuit board is located between the vertical plates 2, and the vertical plates 2 provide protection for the high-precision circuit board to prevent the high-precision circuit board from being bumped. In the vertical direction, there is a certain distance between the high-precision circuit boards to facilitate heat dissipation.

[0024] In the present embodiment, two circular through grooves are provided on one side of one of the vertical plates 2, and heat dissipation components 5 are placed in both circular through grooves. The heat dissipation component 5 includes a fixing frame 51, which is fixed to the side wall of the circular through groove. A plurality of fixing rods 52 are fixedly connected to the inner side of the fixing frame 51, and all the fixing rods 52 are arranged in a circular array. One end of the fixing rod 52 is fixedly connected to a mounting plate 53, and one side of the mounting plate 53 is fixedly connected to a driving motor 54. The main shaft of the driving motor 54 is fixedly connected to a cooling fan 55. When dissipating heat, the two driving motors 54 drive the cooling fan 55 to rotate, and dissipate the printed circuit board between the two vertical plates 2, and blow the heat so that the heat is dissipated from the openings on both sides of the vertical plates 2. At the same time, the printed circuit boards are at different heights and are spaced apart from each other. When the cooling fan 55 rotates, the wind can easily pass through the high-precision printed circuit board, bring out the heat, and quickly dissipate the heat of the high-precision circuit board.

[0025] In this embodiment, four support blocks 6 are fixedly connected to the upper surface of the support plate 4, and the support blocks 6 lift up the printed circuit board so that there is a certain gap between the high-precision circuit board and the support plate 4. When the cooling fan 55 rotates, wind passes through the gap between the high-precision circuit board and the support plate 4, thereby improving the heat dissipation effect of the cooling fan 55 on the high-precision circuit board.

[0026] In this embodiment, the sides of all the support plates 4 are fixedly connected to four support plates 7, and the four support plates 7 are all provided with a through slide groove, and the slide grooves are all slidably connected to the sliding seats 8. All the sliding seats 8 are provided with circular through holes, and the printed circuit board is provided with a through hole for fixing the circuit board, and this through hole cooperates with the circular through hole on the sliding seat 8. When placing a high-precision printed circuit board, the sliding seats 8 on the four support plates 7 are pushed in turn to align the circular through holes on the sliding seat 8 with the through holes on the circuit board, and then the circuit board is fixed with screws. By setting the sliding seat 8, printed circuit boards of different sizes or shapes can be fixed. It only needs to push the sliding seat 8 to align the circular through holes on the sliding seat 8 with the through holes on the circuit board, which has stronger adaptability.

[0027] In this embodiment, all the materials of the fixing plates 3 and the supporting blocks 6 are heat-conducting materials. When in use, not only the cooling fan 55 is used to cool and dissipate heat, but also the fixing plates 3 and the supporting blocks 6 are located below the circuit board. When the circuit board generates heat, the heat around the circuit board is conducted to increase the efficiency of heat dissipation.

[0028] In this embodiment, all the fixed plates 3 penetrate the vertical plates 2 on the upper surface of the bottom plate 1, and one side of another vertical plate 2 is fixedly connected to the heat conducting plate 9. The fixed plate 3 on one side of the vertical plate 2 is fixedly connected to the heat conducting plate 9. The fixed plate 3 transfers heat to the heat conducting plate 9, and the heat is dissipated through the heat conducting plate 9, thereby reducing the temperature of the heat conducting plate 9 and achieving a cooling effect.

[0029] In this embodiment, a plurality of heat dissipation fins 10 are fixedly connected to one side of the heat conducting plate 9 , and the heat conducting plate 9 dissipates heat through the heat dissipation fins 10 , thereby improving the heat dissipation speed of the heat conducting plate 9 .

[0030] In this embodiment, the upper surfaces of the two vertical plates 2 are provided with mounting grooves, the mounting grooves are provided with through holes, the top plate 11 is fixed in the mounting grooves by screws, and the top plate 11 is fixed above the vertical plates 2 to protect the multiple circuit boards inside from above.

[0031] Working principle: When installing the circuit board, push the sliding seats 8 on the four support plates 7 in turn to align the circular through holes on the sliding seats 8 with the through holes on the circuit board, and then fix the circuit board with screws. When in use, the support block 6 holds up the high-precision circuit board so that there is a certain gap between the high-precision circuit board and the support plate 4. The two driving motors 54 drive the cooling fan 55 to rotate, and dissipate the heat of the high-precision circuit board between the two vertical plates 2, and blow the heat so that the heat is dissipated from the openings on both sides of the vertical plates 2. The wind passes through the gap between the high-precision circuit board and the support plate 4, and the fixed plate 3 conducts the heat around the circuit board. The heat enters the heat conducting plate 9 and is dissipated to the surroundings through the heat dissipation fins 9.

[0032] Of course, the present utility model may have many other implementations. Based on the present implementation, other implementations obtained by ordinary technicians in this field without any creative work are all within the scope of protection of the present utility model.

Claims

1. A high-precision multi-layer circuit board, characterized in that: It includes a base plate, the upper surface of which is fixedly connected to two vertical plates, and the opposite sides of the two vertical plates are fixedly connected to multiple fixed plates, all of the fixed plates are arranged in an array in the vertical direction, the fixed plates on the two vertical plates are symmetrically arranged, and a support plate is fixedly connected between the two fixed plates on the same horizontal plane, and the support plate is used to place high-precision circuit boards, and a heat dissipation component is provided on one side of one of the vertical plates.

2. A high-precision multilayer circuit board according to claim 1, characterized in that: One side of one of the vertical plates is provided with two circular through grooves, and heat dissipation components are placed in the two circular through grooves. The heat dissipation component includes a fixed frame, and the fixed frame is fixed to the side wall of the circular through groove. The inner side of the fixed frame is fixedly connected to a plurality of fixing rods, and all the fixing rods are arranged in a circular array. One end of the fixing rod is fixedly connected to the mounting plate, and one side of the mounting plate is fixedly connected to the driving motor, and the main shaft of the driving motor is fixedly connected to the cooling fan.

3. A high-precision multilayer circuit board according to claim 2, characterized in that: The upper surface of the support plate is fixedly connected to four supporting blocks.

4. A high-precision multilayer circuit board according to claim 1, characterized in that: The sides of all the supporting plates are fixedly connected to four supporting plates, and the four supporting plates are all provided with penetrating sliding grooves, and the sliding grooves are all slidably connected to sliding seats, and all the sliding seats are provided with circular through holes.

5. A high-precision multilayer circuit board according to claim 3, characterized in that: All the fixing plates and supporting blocks are made of heat-conducting materials.

6. A high-precision multilayer circuit board according to claim 1, characterized in that: All the fixing plates penetrate the vertical plates on the upper surface of the bottom plate, one side of another vertical plate is fixedly connected to the heat conducting plate, and the fixing plate on one side of the vertical plate is fixedly connected to the heat conducting plate.

7. A high-precision multilayer circuit board according to claim 6, characterized in that: A plurality of heat dissipation fins are fixedly connected to one side of the heat conducting plate.

8. A high-precision multilayer circuit board according to claim 1, characterized in that: The upper surfaces of the two vertical plates are provided with mounting grooves, the mounting grooves are provided with through holes, and the top plates are fixed in the mounting grooves by screws.

Images