Composite PCB device and power supply module

Abstract

The utility model discloses a composite PCB device and a power supply module, and relates to the technical field of printed circuit boards, the composite PCB device comprises a printed circuit board, an aluminum substrate and a heating power device, the printed circuit board is provided with a first printed circuit, and the aluminum substrate is provided with a second printed circuit; the printed circuit board is provided with an accommodating groove corresponding to the heating power device; the heating power device is attached and welded on the second printed circuit of the aluminum substrate; the aluminum substrate and the printed circuit board are arranged in an attached mode, and the heating power device is arranged in the containing groove. The first printed circuit of the printed circuit board is welded with the second printed circuit of the aluminum substrate, so that the heating power device is electrically connected with the first printed circuit of the printed circuit board through the second printed circuit of the aluminum substrate, and therefore, on one hand, the production efficiency can be improved, and the labor cost can be reduced; on the other hand, the heat dissipation efficiency of the heating power device can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, in particular to a composite PCB device and a power module. Background Art

[0002] Printed circuit boards, or PCBs, are core components of electronic devices. At present, some common printed circuit boards, such as power boards, have many power devices, such as MOS tubes. These devices generate a lot of heat when working, and how to dissipate heat reliably is the focus of current research. On the other hand, in the current manufacturing process of power boards, many processes need to be completed by manpower, which is inefficient.

[0003] Problems with the existing technology: 1. There are many processes involving manual participation, such as the insertion of some components and the assembly of the housing, which requires manual work. On the one hand, the efficiency is low, and on the other hand, the labor cost is high. 2. The commonly used heat dissipation solution is to transfer the heat generated by these components to the heat dissipation component through a heat-conducting medium, such as thermal conductive glue, etc. However, the above indirect heat dissipation method is limited by the efficiency of heat conduction, so the heat dissipation efficiency is not high. Utility Model Content

[0004] The embodiment of the utility model provides a composite PCB device and a power module to solve the above-mentioned technical problems.

[0005] In order to solve the above problems, in the first aspect, an embodiment of the utility model proposes a composite PCB device, including a printed circuit board, an aluminum substrate and a heat-generating power device, wherein the printed circuit board is provided with a first printed circuit, and the aluminum substrate is provided with a second printed circuit; the printed circuit board is provided with a receiving groove corresponding to the heat-generating power device; the heat-generating power device is bonded and welded on the second printed circuit of the aluminum substrate; the aluminum substrate and the printed circuit board are bonded and arranged, and the heat-generating power device is arranged in the receiving groove; the first printed circuit of the printed circuit board is welded to the second printed circuit of the aluminum substrate, so that the heat-generating power device is electrically connected to the first printed circuit of the printed circuit board through the second printed circuit of the aluminum substrate.

[0006] A further technical solution is that the heat-generating power device includes a pin, a first soldering pad corresponding to the pin is provided on the second printed circuit of the aluminum substrate, and the pin is soldered to the first soldering pad.

[0007] A further technical solution is that a second pad corresponding to the first pad is provided on the first printed circuit of the printed circuit board, and the first pad is welded to the second pad.

[0008] A further technical solution is that a through hole penetrating the second pad is provided on the printed circuit board, the side wall of the through hole is made of metal, and the first pad is welded to the side wall of the through hole.

[0009] A further technical solution is that there is a gap between the heat-generating power device and the side walls and bottom wall of the containing groove.

[0010] A further technical solution is that the composite PCB device further includes a cover body, and the cover body includes a cover plate and a fixing column arranged on the cover plate;

[0011] The printed circuit board is provided with a first limiting hole corresponding to the fixing column, the aluminum substrate is provided with a second limiting hole corresponding to the fixing column, and the fixing column passes through the first limiting hole and the second limiting hole in sequence.

[0012] A further technical solution is that the composite PCB device further includes a cover body, and the cover body includes a cover plate and a fixing column arranged on the cover plate;

[0013] The aluminum substrate is provided with a second limiting hole corresponding to the fixing column, and the fixing column passes through the second limiting hole.

[0014] A further technical solution is that a limiting portion is provided at one end of the fixing column passing through the aluminum substrate, the size of the limiting portion is larger than the size of the second limiting hole, and the surface of the limiting portion is flush with the surface of the aluminum substrate.

[0015] A further technical solution is that the cover is made of plastic.

[0016] In a second aspect, an embodiment of the present invention provides a power module, comprising the composite PCB device as described in the first aspect.

[0017] Compared with the prior art, the technical effects achieved by the embodiments of the present invention include:

[0018] The technical solution of the embodiment of the utility model, on the one hand, by attaching the heat-generating power device to the aluminum substrate, the aluminum substrate can quickly dissipate the heat generated by the heat-generating power device; at the same time, the heat-generating power device is accommodated by the accommodating groove on the printed circuit board, so that the aluminum substrate can be completely attached to the printed circuit board, reducing the thickness; on the other hand, the manufacturing process of the composite PCB device can be completed by fully automated machines, with fewer processes involving manual participation, high efficiency and effective reduction of labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0021] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0022] Figure 1 An exploded diagram of a composite PCB device proposed in an embodiment of the utility model;

[0023] Figure 2 A schematic diagram of assembling an aluminum substrate and a heat-generating power device of a composite PCB device proposed in an embodiment of the utility model;

[0024] Figure 3 A schematic diagram of assembling a component board and a printed circuit board of a composite PCB device proposed in an embodiment of the utility model;

[0025] Figure 4 A cross-sectional view of a composite PCB device proposed in an embodiment of the utility model;

[0026] Figure 5 An exploded diagram of a composite PCB device proposed in an embodiment of the utility model;

[0027] Figure 6 A schematic diagram of assembling a printed circuit board and an aluminum substrate of a composite PCB device proposed in an embodiment of the utility model;

[0028] Figure 7 A schematic diagram of assembling an aluminum substrate and a cover of a composite PCB device according to an embodiment of the present utility model;

[0029] Figure 8 A cross-sectional view of an aluminum substrate and a cover of a composite PCB device proposed in an embodiment of the utility model before assembly;

[0030] Fig. 9 A cross-sectional view of an assembled aluminum substrate and a cover of a composite PCB device proposed in an embodiment of the utility model;

[0031] Fig.10 A schematic diagram of the structure of an aluminum substrate of a composite PCB device proposed in an embodiment of the utility model;

[0032] Fig.11 An exploded view of a composite PCB device proposed in another embodiment of the utility model;

[0033] Fig.12 A schematic diagram of assembling a printed circuit board and an aluminum substrate of a composite PCB device proposed in another embodiment of the utility model;

[0034] Fig.13 A schematic diagram of assembling an aluminum substrate and a cover of a composite PCB device according to another embodiment of the present invention;

[0035] Fig.14 This is a cross-sectional view of an aluminum substrate and a cover of a composite PCB device before assembly according to another embodiment of the present invention;

[0036] Fig.15 This is a cross-sectional view of an aluminum substrate and a cover body of a composite PCB device after being assembled according to another embodiment of the present invention;

[0037] Fig.16 A schematic diagram of the structure of an aluminum substrate of a composite PCB device proposed in another embodiment of the utility model;

[0038] Fig.17 A schematic diagram of the positional relationship between a through hole and a first pad and a second pad of a printed circuit board of a composite PCB device proposed in an embodiment of the utility model.

[0039] Reference numerals

[0040] Printed circuit board 10, aluminum substrate 20, heat-generating power device 30, cover body 40, accommodating groove 11, second soldering pad 12, first limiting hole 13, through hole 14, pin 31, first soldering pad 21, second limiting hole 22, cover plate 41, fixing column 42, limiting portion 421, side plate 43, first printed circuit 110, second printed circuit 210,. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments. Similar component numbers in the drawings represent similar components. Obviously, the embodiments to be described below are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0042] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0043] It should also be understood that the terms used in this utility model embodiment specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model embodiments. As used in the utility model embodiment specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0044] See also Figure 1-Figure 17 The embodiment of the utility model proposes a composite PCB device, which can be fully automated and has fewer processes involving manual participation, thereby improving production efficiency and reducing labor costs; on the other hand, it can improve the heat dissipation efficiency of the heat-generating power device 30 and ensure reliable heat dissipation. The composite PCB device includes a printed circuit board 10, an aluminum substrate 20, and a heat-generating power device 30, and the specific structure is described as follows:

[0045] The printed circuit board 10, i.e., a PCB board, such as a power board, is a key component in an electronic device. The printed circuit board 10 is provided with a first printed circuit 110. The heat-generating power device 30, which generates heat during operation, such as a MOS tube, is not specifically limited in the present utility model. The aluminum substrate 20, i.e., an aluminum-based printed circuit board, is provided with a second printed circuit 210. The aluminum substrate 20 meets the insulation safety requirements. Specifically, an insulating layer is provided between the second printed circuit 210 of the aluminum substrate and its aluminum plate, thereby achieving reliable insulation.

[0046] In the prior art, the heat-generating power device 30 is directly arranged in the printed circuit board 10. In this way, the heat of the heat-generating power device 30 is not easy to dissipate. In the embodiment of the utility model, the heat-generating power device 30 is not mounted on the printed circuit board 10. Specifically, a receiving groove 11 corresponding to the heat-generating power device 30 is provided in the printed circuit board 10, that is, a receiving groove 11 is provided at a position corresponding to the heat-generating power device 30 in the printed circuit board 10, and the receiving groove 11 is used to accommodate the heat-generating power device 30. The number of the heat-generating power devices 30 may be multiple. Accordingly, the number of the receiving grooves 11 is the same as the number of the heat-generating power devices 30, which is also multiple and corresponds to each of the heat-generating power devices 30 one by one. The multiple heat-generating power devices 30 are arranged in the multiple receiving grooves 11 in a one-to-one correspondence.

[0047] At the same time, the heat-generating power device 30 is welded and bonded to the second printed circuit 210 of the aluminum substrate 20, and the aluminum substrate 20 can quickly dissipate the heat of the heat-generating power device 30, thereby achieving fast and reliable heat dissipation. Further, the aluminum substrate 20 is bonded and arranged with the printed circuit board 10; the heat-generating power device 30 is arranged in the receiving groove 11. Since the receiving groove 11 is provided at the position corresponding to the heat-generating power device 30 in the printed circuit board 10, the heat-generating power device 30 can be placed in the receiving groove 11, so that the aluminum substrate 20 and the printed circuit board 10 can be completely bonded and arranged, thereby effectively reducing the thickness. Further, the first printed circuit 110 of the printed circuit board is welded with the second printed circuit 210 of the aluminum substrate, so that the heat-generating power device is electrically connected to the first printed circuit 110 of the printed circuit board through the second printed circuit 210 of the aluminum substrate, so that the heat-generating power device 30 can be connected to the first printed circuit 110 of the printed circuit board 10. It can be understood that the structures of the first printed circuit 110 and the second printed circuit 210 can be designed by those skilled in the art according to requirements, and the present invention does not specifically limit them.

[0048] The technical solution of the embodiment of the utility model, on the one hand, by attaching the heat-generating power device 30 to the aluminum substrate 20, the aluminum substrate 20 can quickly dissipate the heat generated by the heat-generating power device 30; at the same time, the heat-generating power device 30 is accommodated by the accommodating groove 11 on the printed circuit board 10, so that the aluminum substrate 20 can be completely attached to the printed circuit board 10, reducing the thickness; on the other hand, the manufacturing process of the composite PCB device can be completed by fully automated machines, with fewer processes involving manual participation, high efficiency and effective reduction of labor costs.

[0049] Further, in order to achieve reliable connection between the heat-generating power device 30 and the aluminum substrate 20 and the printed circuit board 10. In the embodiment of the utility model, the heat-generating power device 30 includes a pin 31, and a first pad 21 corresponding to the pin 31 is provided on the second printed circuit 210 of the aluminum substrate 20, and the pin 31 is welded to the first pad 21, for example, by reflow soldering, which is not specifically limited in the utility model. The heat-generating power device 30 can be reliably connected to the aluminum substrate 20 by welding.

[0050] Further, the first printed circuit 110 of the printed circuit board 10 is provided with a second pad 12 corresponding to the first pad 21 (the second pad 12 can be specifically provided around the receiving groove 11), and the first pad 21 and the second pad 12 are welded, for example, by reflow soldering, which is not specifically limited in the present invention. The first printed circuit 110 and the second printed circuit 210 can be reliably connected by welding, so that the heat-generating power device 30 can be electrically connected to the first printed circuit 110 of the printed circuit board 10 through the second printed circuit 210.

[0051] Furthermore, the printed circuit board 10 is provided with a through hole 14 penetrating the second pad 12, the side wall of the through hole 14 is made of metal, and the first pad 21 is welded to the side wall of the through hole 14. The through hole 14 is a metalized hole, and the side wall of the through hole 14 is made of metal, such as copper. The side wall of the through hole 14 is connected to the printed circuit in the printed circuit board 10. The side wall of the through hole 14 is connected to the second pad 12 and is welded to the first pad 21. The printed circuit board 10 may be provided with a multi-layer printed circuit, and the multi-layer printed circuit may be connected through the side wall of the through hole 14.

[0052] Specifically, solder paste is applied on the first solder pad 21 in advance. When the printed circuit board 10 and the aluminum substrate 20 are pressed together, the solder paste can be pressed into the through hole 14. Thereafter, the first solder pad 21 is reliably welded with the second solder pad 12 and the side wall of the through hole 14 by reflow soldering, thereby connecting the heat-generating power device 30 to the circuit inside the printed circuit board 10 and fixing the printed circuit board 10 and the aluminum substrate 20.

[0053] It should be noted that, in order to improve efficiency, in the embodiment of the utility model, the first pad 21 and the pin 31 of the heat-generating power device 30, the first pad 21 and the second pad 12 and the side wall of the through hole 14 are welded at one time through a reflow process.

[0054] It can be understood that the number of the pins 31 can be multiple, and the number of the first pads 21 is the same as the number of the pins 31, and the first pads 21 are soldered one-to-one with the pins 31. The first pads 21 and the second pads 12 can be specifically copper foil pads.

[0055] Furthermore, there is a gap (for example, a gap of 0.5-5 mm) between the heat-generating power device 30 and the side walls and bottom wall of the receiving groove 11. On the one hand, it provides an assembly margin to facilitate the embedding of the heat-generating power device 30 into the receiving groove 11. On the other hand, the air in the gap has a high thermal resistance, which can effectively prevent the heat of the heat-generating power device 30 from being transferred to the printed circuit board 10, and allows most of the heat of the heat-generating power device 30 to be dissipated through the aluminum substrate 20.

[0056] Furthermore, the composite PCB device further includes a cover body 40 , and the cover body 40 includes a cover plate 41 and a fixing column 42 disposed on the cover plate 41 .

[0057] In one embodiment, the printed circuit board 10 is the same size as the aluminum substrate 20. The printed circuit board 10 is provided with a first limiting hole 13 corresponding to the fixing column 42, and the aluminum substrate 20 is provided with a second limiting hole 22 corresponding to the fixing column 42, and the fixing column 42 passes through the first limiting hole 13 and the second limiting hole 22 in sequence.

[0058] Alternatively, in one embodiment, the printed circuit board 10 is smaller than the aluminum substrate 20. The aluminum substrate 20 is provided with a second limiting hole 22 corresponding to the fixing column 42, and the fixing column 42 passes through the second limiting hole 22. It can be understood that the fixing column 42 avoids the printed circuit board 10, so that no hole is required on the printed circuit board 10.

[0059] The cover body 40 plays a role in protecting the printed circuit board 10 . The cover body 40 can be reliably connected to the printed circuit board 10 and the aluminum substrate 20 through the fixing pillars 42 .

[0060] Furthermore, the cover body 40 further includes a side plate 43, which is vertically arranged on the side of the cover plate 41 to protect the side of the printed circuit board 10. There may be multiple side plates 43, for example, in this embodiment, there are two side plates 43.

[0061] Furthermore, a limiting portion 421 is provided at one end of the fixing column 42 passing through the aluminum substrate 20, the size of the limiting portion 421 is larger than the size of the second limiting hole 22, and the surface of the limiting portion 421 is flush with the surface of the aluminum substrate 20. For example, in this example, the limiting portion 421 is formed by hot melting at one end of the fixing column 42, that is, one end of the fixing column 42 passes through the aluminum substrate 20 and is hot melted to obtain the limiting portion 421, and the surface of the limiting portion 421 is flush with the surface of the aluminum substrate 20. Specifically, a groove is provided around the second limiting hole 22 of the aluminum substrate 20, and the limiting portion 421 is formed by hot melting one end of the fixing column 42 passing through the aluminum substrate 20 and then extruding it into the groove. By accommodating the limiting portion 421 in the groove, the limiting portion 421 can be flush with the surface of the aluminum substrate 20, and the limiting portion 421 can be prevented from protruding from the aluminum substrate 20, thereby facilitating the installation of the radiator on the aluminum substrate 20 and further improving the heat dissipation effect.

[0062] The limiting portion 421 may be specifically circular, and in this case, the diameter of the limiting portion 421 is greater than the diameter of the second limiting hole 22 .

[0063] The limit of the stopper 421 can prevent the printed circuit board 10 and the aluminum substrate 20 from falling off the fixing column 42. The cover 40 is made of plastic, which has good thermoplasticity, so that one end of the fixing column 42 can be hot-melted into the limiter 421.

[0064] Furthermore, the central axes of the first limiting hole 13 and the second limiting hole 22 overlap.

[0065] In the embodiment of the utility model, the number of the first limiting holes 13, the second limiting holes 22 and the fixing columns 42 is the same, and they can be multiple, for example, 4 in this example, so as to achieve reliable connection and limiting.

[0066] In one embodiment, the printed circuit board 10 is specifically a power board. The utility model provides a power module, including the composite PCB device provided in any of the above embodiments.

[0067] The embodiment of the utility model also proposes a processing method of the composite PCB device as described in the above embodiment. In this embodiment, the composite PCB device includes a printed circuit board 10, an aluminum substrate 20 and a heat-generating power device 30. The printed circuit board 10 is provided with a receiving groove 11 corresponding to the heat-generating power device 30, and the method includes the following steps:

[0068] S1, attaching the heat generating power device 30 to the second printed circuit 210 of the aluminum substrate 20.

[0069] In a specific implementation, a first pad 21, such as a copper foil pad, is provided on the second printed circuit 210 of the aluminum substrate 20. The heat-generating power device 30 is bonded to the aluminum substrate so that the heat-generating power device 30 is located at a position corresponding to the receiving groove 11 of the printed circuit board 10. Before bonding the heat-generating power device 30, solder paste is applied to the first pad 21 of the aluminum substrate 20 in advance.

[0070] S2, the printed circuit board 10 is bonded to the aluminum substrate 20 so that the heat-generating power device 30 is correspondingly arranged in the accommodating groove 11, and then the heat-generating power device 30 is welded to the second printed circuit 210 of the aluminum substrate 20 and the second printed circuit 210 of the aluminum substrate 20 is welded to the first printed circuit 110 on the printed circuit board 10 at the same time.

[0071] In a specific implementation, a receiving groove 11 for receiving the heat generating power device 30 is pre-opened on the printed circuit board 10, and a first printed circuit 110 of the printed circuit board 10 is provided with a second pad 12, such as a copper foil pad, corresponding to the first pad 21. At the same time, a through hole penetrating the second pad 12 is provided on the printed circuit board.

[0072] During assembly, solder paste is applied to the first pad 21 of the aluminum substrate 20 in advance, and then the heat-generating power device 30 is attached to the aluminum substrate 20, the heat-generating power device 30 is aligned with the receiving groove 11, and the printed circuit board 10 is attached to the aluminum substrate 20, so that the heat-generating power device 30 is correspondingly arranged in the receiving groove 11. At the same time, when the printed circuit board 10 and the aluminum substrate 20 are pressed together, the solder can enter the through hole 14, and then the first pad 21 and the pin 31 of the heat-generating power device 30, the first pad 21 and the second pad 12 and the side wall of the through hole 14 are reliably welded together by reflow soldering, that is, the heat-generating power device 30 is connected to the circuit inside the printed circuit board, and the printed circuit board 10 and the aluminum substrate 20 are fixed.

[0073] Further, it should be noted that in the embodiment of the utility model, other components are also mounted on the upper surface of the printed circuit board 10 (the upper surface refers to the other side opposite to the side bonded with the aluminum substrate), and these components are non-heat-generating components. These non-heat-generating components can be pre-soldered on the printed circuit board 10 before the above step S2, or can be soldered on the printed circuit board 10 after step S2, which is not specifically limited by the utility model; for some components that are not suitable for soldering by reflow soldering, they are soldered to the printed circuit board 10 by post-soldering process.

[0074] Furthermore, in order to achieve reliable protection for the printed circuit board 10, in some embodiments, the composite PCB device further includes a cover body 40, the cover body 40 includes a cover plate 41 and a fixing column 42 disposed on the cover plate 41, and the method further includes the following steps:

[0075] S3, covering the cover body 40 on the aluminum substrate 20, and allowing the fixing pillars 42 to pass through the second limiting holes 22 in sequence.

[0076] In a specific implementation, when the printed circuit board 10 and the aluminum substrate 20 are the same size, the printed circuit board 10 is provided with a first limiting hole 13, the fixing column 42 is aligned with the first limiting hole 13, and enters the first limiting hole 13 and the second limiting hole 22 in sequence, and finally one end of the fixing column 42 passes through the second limiting hole 22.

[0077] When the printed circuit board 10 is smaller than the aluminum substrate 20 , the fixing column 42 is aligned with the second limiting hole 22 and slowly inserted into the second limiting hole 22 , and finally one end of the fixing column 42 is passed out of the second limiting hole 22 .

[0078] S4, hot-melt one end of the fixing column 42 passing through the second limiting hole 22 on the aluminum substrate 20 to form a limiting portion 421.

[0079] In a specific implementation, the cover body 40 is made of plastic with good thermoplasticity, and one end of the fixing column 42 is passed through the second limiting hole 22 on the aluminum substrate 20 and is hot-melted to form a limiting portion 421. The size of the limiting portion 421 is larger than the size of the second limiting hole 22, and the limiting portion 421 can be specifically circular, and the diameter of the limiting portion 421 is larger than the diameter of the second limiting hole 22. The printed circuit board 10 and the aluminum substrate 20 can be prevented from falling off from the fixing column 42 by the restriction of the limiting portion 421.

[0080] Specifically, a groove is provided around the second limiting hole 22 of the aluminum substrate 20, and the limiting portion 421 is formed by hot-melting one end of the fixing column 42 passing through the aluminum substrate 20 and then extruding it into the groove. The limiting portion 421 can be accommodated by the groove so that the limiting portion 421 is flush with the surface of the aluminum substrate 20, and the limiting portion 421 is prevented from protruding from the aluminum substrate 20, thereby facilitating the installation of the heat sink on the aluminum substrate 20 and further improving the heat dissipation effect.

[0081] The steps of the processing method of the composite PCB device can all be completed fully automatically by a machine, and the entire production process has little human involvement, high efficiency and effectively reduces labor costs.

[0082] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0083] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0084] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0085] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0086] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0088] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include these modifications and variations.

[0089] The above is a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A composite PCB device, characterized in that: It includes a printed circuit board, an aluminum substrate and a heat-generating power device, wherein the printed circuit board is provided with a first printed circuit, and the aluminum substrate is provided with a second printed circuit; the printed circuit board is provided with a receiving groove corresponding to the heat-generating power device; the heat-generating power device is bonded and welded on the second printed circuit of the aluminum substrate; the aluminum substrate and the printed circuit board are bonded and arranged, and the heat-generating power device is arranged in the receiving groove; the first printed circuit of the printed circuit board is welded to the second printed circuit of the aluminum substrate, so that the heat-generating power device is electrically connected to the first printed circuit of the printed circuit board through the second printed circuit of the aluminum substrate.

2. The composite PCB device according to claim 1, characterized in that: The heat-generating power device includes a pin, and a first soldering pad corresponding to the pin is provided on the second printed circuit of the aluminum substrate, and the pin is soldered to the first soldering pad.

3. The composite PCB device according to claim 2, characterized in that: A second pad corresponding to the first pad is provided on the first printed circuit of the printed circuit board, and the first pad is welded to the second pad.

4. The composite PCB device according to claim 3, characterized in that: The printed circuit board is provided with a through hole penetrating the second pad, the side wall of the through hole is made of metal, and the first pad is welded to the side wall of the through hole.

5. The composite PCB device according to claim 1, characterized in that: There is a gap between the heat generating power device and the side wall and the bottom wall of the containing groove.

6. The composite PCB device according to claim 1, characterized in that: The composite PCB device further includes a cover body, wherein the cover body includes a cover plate and a fixing column arranged on the cover plate; The printed circuit board is provided with a first limiting hole corresponding to the fixing column, the aluminum substrate is provided with a second limiting hole corresponding to the fixing column, and the fixing column passes through the first limiting hole and the second limiting hole in sequence.

7. The composite PCB device according to claim 1, characterized in that: The composite PCB device further includes a cover body, wherein the cover body includes a cover plate and a fixing column arranged on the cover plate; The aluminum substrate is provided with a second limiting hole corresponding to the fixing column, and the fixing column passes through the second limiting hole.

8. The composite PCB device according to claim 6 or 7, characterized in that: A limiting portion is provided at one end of the fixing column passing through the aluminum substrate. The size of the limiting portion is larger than the size of the second limiting hole. The surface of the limiting portion is flush with the surface of the aluminum substrate.

9. The composite PCB device according to claim 8, characterized in that: The cover is made of plastic.

10. A power module, characterized in that: Comprising a composite PCB device as described in any one of claims 1-9.

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