Circuit board and electronic equipment

Abstract

The embodiment of the utility model provides a circuit board and an electronic device. The circuit board comprises a first conductive layer; a first ground layer under the first conductive layer; the first transmission layer is provided with a first input end and is positioned below the first grounding layer; the second grounding layer is positioned below the first transmission layer; the second transmission layer is provided with a second input end and is positioned below the second grounding layer; the voltage layer is located below the second transmission layer; the third transmission layer is provided with a third input end and is positioned below the voltage layer; the fourth transmission layer is provided with a fourth input end and is positioned below the third transmission layer; the third grounding layer is positioned below the fourth transmission layer and is attached to the fourth transmission layer; wherein all the layers are copper foil layers, and every two adjacent layers are connected through an insulating medium layer. The circuit board provided by the utility model is low in preparation cost and can improve the signal transmission speed.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of intelligent devices, and in particular to a circuit board and an electronic device. Background Art

[0002] In current electronic devices, the structure of the electronic mainboard is complex, and the preparation cost is high, the production time is long, and the carbon emission is high. In addition, the electronic mainboard in the existing equipment is limited by the structure and material, resulting in poor signal transmission speed. Utility Model Content

[0003] The utility model provides a circuit board with low preparation cost and capable of improving signal transmission speed, and an electronic device having the circuit board.

[0004] In order to solve the above technical problems, the present utility model provides a circuit board, including:

[0005] a first conductive layer;

[0006] A first grounding layer, located below the first conductive layer and in contact with the first conductive layer;

[0007] A first transmission layer having a first input end, wherein the first transmission layer is located below the first ground layer and is in contact with the first ground layer;

[0008] a second grounding layer, located below the first transmission layer and in contact with the first transmission layer;

[0009] A second transmission layer having a second input end, wherein the second transmission layer is located below the second ground layer and is in contact with the second ground layer;

[0010] a voltage layer, located below the second transmission layer and in contact with the second transmission layer;

[0011] A third transmission layer having a third input end, wherein the third transmission layer is located below the voltage layer and is in contact with the voltage layer;

[0012] a fourth transmission layer having a fourth input end, wherein the fourth transmission layer is located below the third transmission layer and is in contact with the third transmission layer;

[0013] A third grounding layer is located below the fourth transmission layer and is in contact with the fourth transmission layer;

[0014] Among them, the above-mentioned layers are all copper foil layers, and two adjacent layers are connected by an insulating dielectric layer.

[0015] In some embodiments, the insulating dielectric layer is formed of a glue-containing material.

[0016] In some embodiments, the thickness of the insulating dielectric layer is between 2.187 and 5.788 mils, and the thickness is inversely proportional to the dielectric damage factor.

[0017] In some embodiments, the insulating dielectric layer has a glue content of 66-75%, and the glue content is inversely proportional to the dielectric loss factor.

[0018] In some embodiments, the roughness of the copper foil layer is between 0.32 um and 2.846 um, and the roughness is proportional to the dielectric loss factor.

[0019] In some embodiments, each of the transmission layers is provided with circuits, and the line width of the circuits is between 2.6 and 5.9 mils.

[0020] In some embodiments, the line pitch of the lines is between 4.1 and 12.8 mils.

[0021] In some embodiments, the signal length of the signal transmitted in the line is between 1000 and 6783 mils.

[0022] In some embodiments, the fourth transmission layer is a double-layer structure, and the two layers are connected by a core layer.

[0023] Another embodiment of the present invention also provides an electronic device, including the circuit board as described above.

[0024] Based on the disclosure of the above embodiments, it can be known that the beneficial effects of the embodiments of the utility model include setting a first conductive layer, a first grounding layer located below the first conductive layer and in contact with the first conductive layer, a first transmission layer having a first input terminal and located below the first grounding layer, a second grounding layer located below the first transmission layer and in contact with the first transmission layer, a second transmission layer having a second input terminal and located below the second grounding layer, a voltage layer located below the second transmission layer and in contact with the second transmission layer, a third transmission layer having a third input terminal and located below the voltage layer, a fourth transmission layer having a fourth input terminal and located below the third transmission layer, and a third grounding layer located below the fourth transmission layer and in contact with the fourth transmission layer, wherein the above layers are all copper foil layers, and adjacent two layers are connected by an insulating medium layer, thereby forming a circuit board with a clear structure, short preparation time, reduced carbon emission, and the ability to improve signal transmission speed.

[0025] Other features and advantages of the utility model will be described in the subsequent description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings.

[0026] The technical solution of the utility model is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a schematic diagram of the structure of the circuit board in the embodiment of the utility model.

[0029] Reference numerals:

[0030] 1-first conductive layer; 2-first grounding layer; 3-first transmission layer; 4-second grounding layer; 5-second transmission layer; 6-voltage layer; 7-third transmission layer; 8-fourth transmission layer; 9-third grounding layer; 10-insulating dielectric layer. DETAILED DESCRIPTION

[0031] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings, but are not intended to limit the present invention.

[0032] It should be understood that various modifications may be made to the embodiments disclosed herein. Therefore, the following description should not be considered as limiting, but merely as an example of an embodiment. Other modifications within the scope and spirit of the present disclosure will occur to those skilled in the art.

[0033] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the general description of the present disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the present disclosure.

[0034] These and other characteristics of the invention will become apparent from the following description of a preferred form of embodiment given as a non-limiting example, with reference to the accompanying drawings.

[0035] It should also be understood that although the present invention has been described with reference to some specific examples, those skilled in the art will be able to realize many other equivalent forms of the present invention that have the features described in the claims and are therefore within the scope of protection defined thereby.

[0036] The above and other aspects, features and advantages of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0037] Specific embodiments of the present disclosure are described hereinafter with reference to the accompanying drawings; however, it should be understood that the disclosed embodiments are merely examples of the present disclosure, which may be implemented in a variety of ways. Well-known and / or repeated functions and structures are not described in detail to avoid obscuring the present disclosure with unnecessary or redundant details. Therefore, the specific structural and functional details disclosed herein are not intended to be limiting, but merely serve as a basis and representative basis for the claims to teach those skilled in the art to use the present disclosure in a variety of ways with substantially any suitable detailed structure.

[0038] This specification may use the phrases "in one embodiment," "in another embodiment," "in a further embodiment," or "in other embodiments," all of which may refer to one or more of the same or different embodiments according to the present disclosure.

[0039] Below, the embodiments of the utility model are described in detail with reference to the accompanying drawings.

[0040] like Figure 1 As shown, the utility model is a circuit board, comprising:

[0041] A first conductive layer 1;

[0042] A first grounding layer 2, located below the first conductive layer 1 and in contact with the first conductive layer 1;

[0043] A first transmission layer 3 having a first input end, wherein the first transmission layer 3 is located below the first ground layer 2 and is in contact with the first ground layer 2;

[0044] A second grounding layer 4 is located below the first transmission layer 3 and is in contact with the first transmission layer 3;

[0045] A second transmission layer 5 having a second input end, wherein the second transmission layer 5 is located below the second grounding layer 4 and is in contact with the second grounding layer 4;

[0046] a voltage layer 6, located below the second transmission layer 5 and in contact with the second transmission layer 5;

[0047] A third transmission layer 7 having a third input end, wherein the third transmission layer 7 is located below the voltage layer 6 and is in contact with the voltage layer 6;

[0048] a fourth transmission layer 8 having a fourth input end, wherein the fourth transmission layer 8 is located below the third transmission layer 7 and is in contact with the third transmission layer 7;

[0049] A third grounding layer 9 is located below the fourth transmission layer 8 and is in contact with the fourth transmission layer 8;

[0050] The above layers are all copper foil layers, and two adjacent layers are connected by an insulating dielectric layer 10 .

[0051] Based on the contents of the above embodiments, it can be known that in this embodiment, a first conductive layer 1, a first grounding layer 2 located below the first conductive layer 1 and in contact with the first conductive layer 1, a first transmission layer 3 having a first input terminal and located below the first grounding layer 2, a second grounding layer 4 located below the first transmission layer 3 and in contact with the first transmission layer 3, a second transmission layer 5 having a second input terminal and located below the second grounding layer 4, a voltage layer 6 located below the second transmission layer 5 and in contact with the second transmission layer 5, a third transmission layer 7 having a third input terminal and located below the voltage layer 6, a fourth transmission layer 8 having a fourth input terminal and located below the third transmission layer 7, and a third grounding layer 9 located below the fourth transmission layer 8 and in contact with the fourth transmission layer 8 are provided, wherein the above layers are all copper foil layers, and two adjacent layers are connected by an insulating dielectric layer 10, thereby forming a circuit board with a clear structure, short preparation time, reduced carbon emission, and capable of improving signal transmission speed.

[0052] Specifically, the insulating dielectric layer 10 in this embodiment is formed of a glue-containing material.

[0053] As an optional embodiment, the thickness of the insulating dielectric layer 10 is between 2.187 and 2.21 mils, and the thickness is inversely proportional to the dielectric damage factor (Df value).

[0054] In some embodiments, the insulating dielectric layer 10 has a glue content of 66-75%, and the glue content is inversely proportional to the dielectric loss factor.

[0055] In other embodiments, the roughness of the copper foil layer is between 0.32um and 2.846um, and the roughness is proportional to the dielectric loss factor. Because the roughness of the copper foil layer is a way to control signal attenuation, it is caused by the skin effect of the signal. The greater the roughness of the copper foil layer, the more obvious the distortion of the signal transmission. Although the roughness of the copper foil has no direct relationship with Df, it still affects signal attenuation. Therefore, in this embodiment, the roughness of the copper foil layer is controlled when designing and preparing the circuit board to minimize the impact on the Df value.

[0056] In addition, the signal length of the signal transmitted in the line is between 1000 and 6783 mils. Because the longer the signal length, the greater the attenuation of the Df value, so the signal length of the transmitted signal needs to be avoided as much as possible to reduce the loss.

[0057] Specifically, each of the transmission layers in this embodiment is provided with a line, and the line width of the line is between 2.6 and 5.9 mils, which varies according to the signal impedance. The line width refers to the width of the line itself. The line spacing of the line is between 4.1 and 12.8 mils, which varies according to the signal impedance, and the line spacing refers to the distance between two adjacent lines. For the adjustment of the line width and line spacing, one can be adjusted or both can be adjusted to ensure that the Df value meets the requirements.

[0058] Since the degree of curvature of the line signal winding will also affect the signal length, it will also indirectly affect the Df value in practical applications. Therefore, in order to limit the signal length of the transmission signal and avoid the attenuation of the Df value due to signal problems, the scheme of this embodiment will not only limit the signal length, but also limit the degree of twists and turns of the line. For example, if the line is a wavy curve, the number of waves can be reduced, and the degree of twists and turns can be reduced based on this, that is, the length of the wavy line can be shortened, thereby reducing the degree of twists and turns and ensuring that the signal length is within the required range.

[0059] As another optional embodiment, the fourth transmission layer 8 is a double-layer structure, and the two layers are connected by a core layer. By setting the transmission layer as a double-layer structure, the number of transmission lines can be increased, and the circuit board can have better signal transmission capability.

[0060] The top layer and bottom layer of the circuit board are also provided with substrates respectively, and the specific material of the substrates is uncertain.

[0061] Another embodiment of the present invention also provides an electronic device, including the circuit board as described in any one of the embodiments above.

[0062] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A circuit board, characterized in that: include: a first conductive layer; A first grounding layer, located below the first conductive layer and in contact with the first conductive layer; A first transmission layer having a first input end, wherein the first transmission layer is located below the first ground layer and is in contact with the first ground layer; a second grounding layer, located below the first transmission layer and in contact with the first transmission layer; A second transmission layer having a second input end, wherein the second transmission layer is located below the second ground layer and is in contact with the second ground layer; a voltage layer, located below the second transmission layer and in contact with the second transmission layer; A third transmission layer having a third input end, wherein the third transmission layer is located below the voltage layer and is in contact with the voltage layer; a fourth transmission layer having a fourth input end, wherein the fourth transmission layer is located below the third transmission layer and is in contact with the third transmission layer; A third grounding layer is located below the fourth transmission layer and is in contact with the fourth transmission layer; Among them, the above-mentioned layers are all copper foil layers, and two adjacent layers are connected by an insulating dielectric layer.

2. The circuit board according to claim 1, characterized in that: The insulating medium layer is formed of a glue-containing material.

3. The circuit board according to claim 2, characterized in that: The thickness of the insulating dielectric layer is between 2.187 and 5.788 mils, and the thickness is inversely proportional to the dielectric damage factor.

4. The circuit board according to claim 1, characterized in that: The roughness of the copper foil layer is between 0.32um and 2.846um, and the roughness is proportional to the dielectric loss factor.

5. The circuit board according to claim 1, characterized in that: Each transmission layer is provided with a circuit, and the line width of the circuit is between 2.6 and 5.9 mils.

6. The circuit board according to claim 5, characterized in that: The line pitch of the circuit is between 4.1 and 12.8 mils.

7. The circuit board according to claim 5, characterized in that: The signal length of the signal transmitted in the line is between 1000 and 6783 mils.

8. The circuit board according to claim 1, characterized in that: The fourth transmission layer is a double-layer structure, and the two layers are connected by a core layer.

9. An electronic device, characterized in that: Comprising the circuit board as claimed in any one of claims 1 to 8.

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