Laminating device for circuit copper substrate production

Abstract

The utility model discloses a laminating device for circuit copper substrate production, and relates to the technical field of substrate laminating. The device comprises a rack, the rack is provided with a placing table, a transverse limiting piece and a longitudinal limiting piece, the placing table is provided with a fixing piece used for fixing or unfixing a substrate, and the transverse limiting piece and the longitudinal limiting piece are used for transversely limiting the substrate and longitudinally limiting the substrate respectively; the lifting frame is arranged on the rack in a sliding manner, and a mounting roller used for mounting coiled copper foil is rotationally arranged on the lifting frame; the pressing and holding piece and the shearing piece are both arranged on the lifting frame, the pressing and holding piece is used for pressing and holding or releasing pressing and holding of the copper foil, and the shearing piece is used for shearing off the copper foil; and the fixing part is arranged on the lifting frame in a sliding manner and is used for fixing or unfixing the copper foil. When the automatic slicing device is used, automatic slicing of the copper foil and automatic attaching of the copper foil to the substrate can be achieved, the manual participation amount is reduced, operation is convenient, meanwhile, the production efficiency is improved, and therefore the automatic slicing device is more practical.

Description

Technical Field

[0001] The present application relates to the technical field of substrate bonding, and in particular to a bonding device for producing circuit copper substrates. Background Art

[0002] A circuit board is a support for electronic components and provides electrical connections between circuit components. It is usually composed of a substrate, metal wires, solder joints, and various electronic components. A circuit copper substrate is a common type of circuit board. Copper is used as the substrate material and has good thermal conductivity and electrical conductivity. It can effectively transfer heat to heat dissipation components, thereby improving the heat dissipation efficiency of electronic equipment. During the production process of the circuit copper substrate, it is necessary to laminate copper foil on the surface of the substrate to form a prefabricated substrate, which is then laminated using a laminating device. In the prior art, when laminating copper foil on the surface of the substrate, the rolled copper foil is usually sliced ​​manually and then the copper foil is covered on the substrate to achieve electrostatic adsorption lamination. Manual operation is not only troublesome but also reduces production efficiency. Therefore, a laminating device for producing circuit copper substrates is proposed. Utility Model Content

[0003] The purpose of the present application is to solve the technical problem that when bonding copper foil to the surface of a substrate, the rolled copper foil is usually cut into slices manually and then the copper foil is covered on the substrate to achieve electrostatic adsorption bonding. The manual operation is not only troublesome but also reduces the production efficiency. The present application provides a bonding device for the production of circuit copper substrates.

[0004] In order to achieve the above-mentioned purpose, this application specifically adopts the following technical solutions:

[0005] A bonding device for producing a circuit copper substrate, comprising:

[0006] A frame, on which a placing table, a transverse limiting member and a longitudinal limiting member are arranged, wherein the placing table is provided with a fixing member for fixing or releasing the substrate, and the transverse limiting member and the longitudinal limiting member are respectively used for limiting the substrate transversely and longitudinally;

[0007] A lifting frame is slidably arranged on the frame, and a mounting roller for mounting the rolled copper foil is rotatably arranged on the lifting frame;

[0008] The pressing piece and the shearing piece are both arranged on the lifting frame, the pressing piece is used to press or release the copper foil, and the shearing piece is used to cut the copper foil;

[0009] The fixing part is slidably arranged on the lifting frame and is used for fixing or releasing the copper foil.

[0010] Furthermore, the transverse limiting member includes forward and reverse screw rods rotatably arranged on the frame, two transverse limiting plates are slidably arranged on the frame and the two are respectively threadedly matched with the forward and reverse thread segments of the forward and reverse screw rods, and a plurality of rollers are rotatably arranged on the transverse limiting plates.

[0011] Furthermore, the longitudinal limiting member includes a forward and reverse screw rod rotatably arranged on the frame, and two longitudinal limiting plates are slidably arranged on the frame and the two plates are respectively threadedly matched with the forward and reverse thread segments of the forward and reverse screw rod.

[0012] Furthermore, the fixing member includes an adsorption groove and a through groove both opened on the placement table, the adsorption groove and the through groove are connected through a plurality of through holes, and a vacuum pump connected to the through groove is arranged on the placement table.

[0013] Furthermore, the adsorption groove includes a plurality of annular grooves forming a concentric circle structure, and two adjacent annular grooves are connected by a plurality of strip grooves.

[0014] Furthermore, the pressing member includes a bottom plate arranged on a lifting frame, and a pressing frame corresponding to the bottom plate is slidably arranged on the lifting frame.

[0015] Furthermore, the shearing piece includes a frame arranged on a lifting frame, a slider is slidably arranged on the frame, two shearing handles are coaxially hinged on the slider, two sliding grooves are symmetrically provided on the frame, and the free ends of the two shearing handles are respectively slidably matched with the two sliding grooves.

[0016] Furthermore, the fixing part comprises a fixing frame slidably arranged on the frame, a fixing pressure plate is slidably arranged on the fixing frame and a return spring is arranged between the two, an electromagnet is arranged on the fixing frame, and the fixing pressure plate cooperates magnetically with the electromagnet.

[0017] The beneficial effects of this application are as follows:

[0018] When the present application is in use, the automatic slicing of the copper foil and the automatic lamination of the copper foil on the substrate can be realized, which reduces the amount of manual participation, facilitates the operation and improves the production efficiency, and is therefore more practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional diagram of the structure of this application;

[0020] Figure 2 This is a three-dimensional diagram of the structure of the transverse limiter of the present application;

[0021] Figure 3 It is a three-dimensional diagram of the longitudinal limiter structure of the present application;

[0022] Figure 4 It is a three-dimensional diagram of the structure of the placement table of this application;

[0023] Figure 5 This application Figure 4 A three-dimensional cross-sectional view of

[0024] Figure 6 It is a three-dimensional diagram of the lifting frame structure of the present application;

[0025] Figure 7 This is a three-dimensional diagram of the structure of the pressing member of the present application;

[0026] Figure 8 It is an exploded stereogram of the shearing piece structure of the present application;

[0027] Fig. 9 It is a three-dimensional diagram of the fixing part structure of this application.

[0028] Figure numerals: 1. Frame; 2. Placement table; 3. Lifting frame; 4. Mounting roller; 5. Forward and reverse screw rods; 6. Horizontal limit plate; 7. Roller; 8. Forward and reverse screw rods; 9. Longitudinal limit plate; 10. Adsorption groove; 11. Through groove; 12. Through hole; 13. Vacuum pump; 14. Bottom plate; 15. Pressing frame; 16. Frame; 17. Slider; 18. Shear handle; 19. Slide groove; 20. Fixed frame; 21. Fixed pressure plate; 22. Reset spring; 23. Electromagnet. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0030] like Figure 1-Figure 6 As shown, an embodiment of the present application provides a bonding device for producing a circuit copper substrate, comprising:

[0031] A frame 1 is provided with a placing table 2, a transverse limiting member and a longitudinal limiting member, the placing table 2 is fixedly arranged on the frame 1, a fixing member for fixing or releasing the substrate is provided on the placing table 2, and the transverse limiting member and the longitudinal limiting member are used for limiting the substrate transversely and longitudinally respectively;

[0032] A lifting frame 3 is slidably arranged on the frame 1, the lifting frame 3 slides in a vertical direction, and a mounting roller 4 for mounting the rolled copper foil is rotatably arranged on the lifting frame 3, and the mounting roller 4 is in a horizontal direction;

[0033] The pressing member and the shearing member are both arranged on the lifting frame 3. The pressing member is used to press or release the copper foil, and the shearing member is used to shear the copper foil.

[0034] A fixing part, slidably disposed on the lifting frame 3, used to fix or release the copper foil, and the fixing part slides in a horizontal direction;

[0035] In the initial state, the lifting frame 3 is away from the placement table 2, and the fixing part is in contact with the holding part. Before use, the rolled copper foil is horizontally installed on the installation roller 4, the copper foil is held by the holding part, and the free end of the copper foil is fixed by the fixing part. When in use, the substrate is horizontally placed on the placement table 2, and the substrate is horizontally limited by the horizontal limiter, and the substrate is longitudinally limited by the longitudinal limiter, so as to straighten the substrate, fix the substrate by the fixing part, and then release the horizontal and longitudinal limits of the substrate by the horizontal limiter and the longitudinal limiter respectively, and the copper foil is fixed by the holding part. Release the pressure, drive the fixing part to slide away from the pressing part, drive the copper foil to move together, and then press the copper foil through the pressing part, drive the lifting frame 3 to slide down to the placement table 2 until the copper foil covers the substrate, and then cut the copper foil through the shearing part, release the copper foil through the fixing part, and the copper foil and the substrate are electrostatically adsorbed and bonded, and finally drive the lifting frame 3 to slide upward to the initial position, drive the fixing part to slide to the initial position, fix the free end of the copper foil through the fixing part, release the substrate through the fixing part, and remove the substrate from the placement table 2, and a single operation can be completed;

[0036] In summary, when used, the present application can realize automatic slicing of copper foil and automatic lamination of copper foil sheets on a substrate, thereby reducing manual involvement, facilitating operation and improving production efficiency, and is therefore more practical.

[0037] like Figure 2 As shown, in some embodiments, the transverse limiting member includes a positive and negative screw rod 5 rotatably arranged on the frame 1, the positive and negative screw rod 5 is in a horizontal direction, two transverse limiting plates 6 are slidably arranged on the frame 1 and the two are respectively threadedly matched with the positive and negative thread segments of the positive and negative screw rod 5, the transverse limiting plate 6 is in a vertical direction and slides in a horizontal direction, and a plurality of rollers 7 are rotatably arranged on the transverse limiting plate 6, and the plurality of rollers 7 are all in a horizontal direction and are distributed in an array in the horizontal direction;

[0038] With reference to the above, in the initial state, the two lateral limit plates 6 are far away from each other. When in use, the forward and reverse screw rods 5 are driven to rotate forward, and the two lateral limit plates 6 are synchronously slid in reverse directions due to the action of the forward and reverse threads until they are close to each other, until the multiple rollers 7 on the two are respectively rolled and overlapped with the opposite sides of the substrate, so that the lateral limit of the substrate can be achieved. Conversely, the forward and reverse screw rods 5 are driven to reverse, and the two lateral limit plates 6 are synchronously slid in reverse directions due to the action of the forward and reverse threads until they are far away from each other, so that the lateral limit of the substrate can be released. By setting the rollers 7, the situation in which the substrate cannot move due to excessive friction when the substrate is limited by the longitudinal limit member can be avoided.

[0039] like Figure 3As shown, in some embodiments, the longitudinal limiter includes a forward and reverse screw 8 rotatably arranged on the frame 1, the forward and reverse screw 8 is in a horizontal direction, and two longitudinal limit plates 9 are slidably arranged on the frame 1 and the two are respectively threadedly matched with the forward and reverse thread segments of the forward and reverse screw 8, and the longitudinal limit plates 9 are in a vertical direction and slide in a horizontal direction;

[0040] Referring to the above, in the initial state, the two longitudinal limit plates 9 are far away from each other. When in use, the forward and reverse screws 8 are driven to rotate forward, and the two longitudinal limit plates 9 are synchronously slid in reverse due to the action of the forward and reverse threads until they are close to each other, until they respectively contact and overlap with the opposite sides of the substrate, thereby realizing the longitudinal limitation of the substrate. Conversely, the forward and reverse screws 8 are driven to rotate reversely, and the two longitudinal limit plates 9 are synchronously slid in reverse due to the action of the forward and reverse threads until they are far away from each other, thereby releasing the longitudinal limitation of the substrate.

[0041] like Figure 4-Figure 5 As shown, in some embodiments, the fixing member includes an adsorption groove 10 and a through groove 11 both provided on the placement table 2, the adsorption groove 10 and the through groove 11 are spaced apart from each other, the adsorption groove 10 and the through groove 11 are connected through a plurality of through holes 12, the plurality of through holes 12 are vertically oriented and distributed in a circular array, a vacuum pump 13 connected to the through groove 11 is provided on the placement table 2, and the vacuum pump 13 is fixed on the placement table 2;

[0042] Referring to the above, when in use, the vacuum pump 13 is turned on, and the air in the adsorption groove 10, multiple through holes 12 and the through groove 11 is sucked out in turn to form a negative pressure environment, thereby adsorbing and fixing the substrate on the placement table 2. Conversely, air is sent into the through groove 11 through the vacuum pump 13, and the negative pressure environment is released, so that the substrate on the placement table 2 can be removed to achieve the release of the substrate.

[0043] like Figure 4 As shown, in some embodiments, the adsorption groove 10 includes a plurality of annular grooves forming a concentric circle structure, and two adjacent annular grooves are connected by a plurality of strip grooves;

[0044] With reference to the above, when the substrate is fixed by adsorption, the adsorption area with the substrate can be increased by setting the shape of the adsorption groove 10, thereby improving the fixing strength.

[0045] like Figure 7 As shown, in some embodiments, the pressing member includes a bottom plate 14 arranged on the lifting frame 3, the bottom plate 14 is fixed on the lifting frame 3, and a pressing frame 15 corresponding to the bottom plate 14 is slidably arranged on the lifting frame 3, and the pressing frame 15 slides in the vertical direction;

[0046] Referring to the above, in the initial state, the pressing frame 15 is away from the bottom plate 14. Before use, the free end of the copper foil is passed through between the bottom plate 14 and the pressing frame 15 and fixed by the fixing part, and the pressing frame 15 is driven to slide downward to approach the bottom plate 14 until the bottom plate 14 and the pressing frame 15 are respectively in contact with and overlap the opposite sides of the copper foil, so that the copper foil can be pressed. Conversely, the pressing frame 15 is driven to slide upward to the initial position to release the copper foil.

[0047] like Figure 8 As shown, in some embodiments, the shearing member includes a frame 16 arranged on the lifting frame 3, the frame 16 is fixed on the lifting frame 3, a slider 17 is slidably arranged on the frame 16, the slider 17 slides in the horizontal direction, two shearing handles 18 are coaxially hinged on the slider 17, the two shearing handles 18 are both in the vertical direction and symmetrically distributed, the two shearing handles 18 and the slider 17 together form a scissors structure, the frame 16 is symmetrically provided with two slide grooves 19, the slide grooves 19 are composed of a connected straight groove and an inclined groove, and the free ends of the two shearing handles 18 are respectively slidably matched with the two slide grooves 19;

[0048] Referring to the above, in the initial state, the two shearing handles 18 are completely received in the frame 16 and are in an open state, the slider 17 is located in the initial position, the free ends of the two shearing handles 18 are far away from each other and are respectively located in the two straight grooves. When in use, the slider 17 is driven to slide to the extreme position, driving the two shearing handles 18 to move together to extend out of the frame 16, and the two shearing handles 18 are respectively located on the opposite sides of the copper foil. During this process, the free ends of the two shearing handles 18 slide into the two oblique grooves respectively, and through the transition effect of the oblique grooves, the two shearing handles 18 rotate synchronously in the opposite direction to the closed state, that is, the free ends of the two shearing handles 18 are close to each other, thereby cutting the copper foil. Conversely, the slider 17 is driven to slide to the initial position, driving the two shearing handles 18 to move together to be completely received in the frame 16. During this process, the free ends of the two shearing handles 18 slide into the two straight grooves respectively, and through the transition effect of the oblique grooves, the two shearing handles 18 rotate synchronously in the opposite direction to the open state, that is, the free ends of the two shearing handles 18 are far away from each other.

[0049] like Fig. 9 As shown, in some embodiments, the fixing part includes a fixing frame 20 slidably arranged on the frame 1, the fixing frame 20 slides in the horizontal direction, a fixing plate 21 is slidably arranged on the fixing frame 20, and a return spring 22 is arranged between the two, the fixing plate 21 slides in the vertical direction, the return spring 22 is in the vertical direction and the two ends are respectively fixedly connected to the fixing plate 21 and the fixing frame 20, an electromagnet 23 is arranged on the fixing frame 20, and the fixing plate 21 and the electromagnet 23 are magnetically matched;

[0050] Referring to the above, in the initial state, the fixed pressure plate 21 is away from the electromagnet 23, the reset spring 22 is in a natural state, and the electromagnet 23 is in a power-off state. Before use, the free end of the copper foil is located between the fixed pressure plate 21 and the fixed frame 20, and the electromagnet 23 is energized. The electromagnet 23 generates magnetism and drives the fixed pressure plate 21 to slide downward until the free end of the copper foil is fixed and the reset spring 22 is squeezed. Conversely, the electromagnet 23 is powered off, the magnetism of the electromagnet 23 disappears, the reset spring 22 is reset to the natural state, and the fixed pressure plate 21 slides upward to the initial position, thereby releasing the copper foil.

[0051] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding device for producing a circuit copper substrate, characterized in that: include: A frame (1) is provided with a placement table (2), a transverse limiting member and a longitudinal limiting member, wherein the placement table (2) is provided with a fixing member for fixing or releasing the substrate, and the transverse limiting member and the longitudinal limiting member are used to limit the substrate transversely and longitudinally respectively; A lifting frame (3) is slidably arranged on the frame (1), and a mounting roller (4) for mounting the rolled copper foil is rotatably arranged on the lifting frame (3); The pressing piece and the shearing piece are both arranged on the lifting frame (3); the pressing piece is used to press or release the copper foil, and the shearing piece is used to shear the copper foil; The fixing part is slidably arranged on the lifting frame (3) and is used to fix or release the copper foil.

2. The bonding device for producing a circuit copper substrate according to claim 1, characterized in that: The transverse limiting member comprises a forward and reverse screw rod (5) rotatably arranged on the frame (1); two transverse limiting plates (6) are slidably arranged on the frame (1) and the two plates are respectively threadedly engaged with the forward and reverse thread segments of the forward and reverse screw rod (5); and a plurality of rollers (7) are rotatably arranged on the transverse limiting plates (6).

3. The bonding device for producing a circuit copper substrate according to claim 1, characterized in that: The longitudinal limiting member comprises a forward and reverse screw rod (8) rotatably arranged on the frame (1), and two longitudinal limiting plates (9) are slidably arranged on the frame (1) and are respectively threadably engaged with the forward and reverse thread segments of the forward and reverse screw rod (8).

4. The bonding device for producing a circuit copper substrate according to claim 1, characterized in that: The fixing member comprises an adsorption groove (10) and a through groove (11) both of which are provided on the placement table (2); the adsorption groove (10) and the through groove (11) are connected via a plurality of through holes (12); and a vacuum pump (13) connected to the through groove (11) is provided on the placement table (2).

5. The bonding device for producing a circuit copper substrate according to claim 4, characterized in that: The adsorption groove (10) comprises a plurality of annular grooves forming a concentric circle structure, and two adjacent annular grooves are connected via a plurality of strip grooves.

6. The bonding device for producing a circuit copper substrate according to claim 1, characterized in that: The pressing member comprises a bottom plate (14) arranged on the lifting frame (3), and a pressing frame (15) corresponding to the bottom plate (14) is slidably arranged on the lifting frame (3).

7. The bonding device for producing a circuit copper substrate according to claim 1, characterized in that: The shearing piece comprises a frame (16) arranged on a lifting frame (3), a slider (17) being slidably arranged on the frame (16), two shearing handles (18) being coaxially hinged on the slider (17), two sliding grooves (19) being symmetrically provided on the frame (16), and free ends of the two shearing handles (18) being slidably engaged with the two sliding grooves (19) respectively.

8. The bonding device for producing a circuit copper substrate according to claim 1, characterized in that: The fixing portion comprises a fixing frame (20) slidably arranged on the frame (1), a fixing pressure plate (21) slidably arranged on the fixing frame (20) and a return spring (22) arranged between the fixing frame (20), an electromagnet (23) arranged on the fixing frame (20), and the fixing pressure plate (21) and the electromagnet (23) are magnetically matched.

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