Electronic device

Abstract

The embodiment of the utility model discloses electronic equipment. The electronic equipment comprises a middle frame, a panel assembly and a first circuit board, the panel assembly comprises a display panel and a flexible circuit board, the flexible circuit board is located on the back face of the display panel and connected with the display panel, and the side, away from the display panel, of the flexible circuit board is connected with a first device; the display panel and the first circuit board are positioned on two opposite sides of the middle frame; the middle frame is provided with a first avoiding hole, and the first device is located in the first avoiding hole. The display panel and the first circuit board are arranged on the two sides of the middle frame, and the situation that first devices on the flexible circuit board and devices on the first circuit board occupy space mutually is avoided. The first device is arranged in the first avoiding hole, so that the flexible circuit board can be closer to the middle frame, the distance between the first device and the first circuit board can be set to be smaller than the thickness of the middle frame, and the thickness of the electronic equipment can be further reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment manufacturing, and in particular to an electronic equipment. Background Art

[0002] With the development of electronic technology, electronic equipment has become more and more widely used and has become one of the important tools in people's daily work and life.

[0003] There are many devices inside electronic devices, and as their functions develop further, the number of devices inside electronic devices may continue to increase. The increase in the number of devices usually means that more space is needed for their arrangement. In order to make electronic devices more convenient to carry and use, people usually prefer to design electronic devices as thin as possible. The thinner the electronic device, the more crowded the devices inside the electronic device are, and the less space is available for the arrangement of the devices. Utility Model Content

[0004] The embodiment of the present application provides an electronic device that can overcome the problems in the related art. The technical solution is as follows:

[0005] An embodiment of the present application provides an electronic device, which includes a middle frame, a panel assembly and a first circuit board; the panel assembly includes a display panel and a flexible circuit board, the flexible circuit board is located on the back of the display panel and is connected to the display panel, and a first device is connected to the side of the flexible circuit board away from the display panel; the display panel and the first circuit board are located on opposite sides of the middle frame; the middle frame has a first avoidance hole, and the first device is located in the first avoidance hole.

[0006] Based on the above features, the display panel and the first circuit board are arranged on both sides of the middle frame, which prevents the first device on the flexible circuit board and the device on the first circuit board from occupying each other's space. The first device is arranged in the first avoidance hole, so that the flexible circuit board can be closer to the middle frame, and the distance between the first device and the first circuit board can be set to a level smaller than the thickness of the middle frame, which is conducive to further reducing the thickness of the electronic device.

[0007] In some examples, a second device is connected to a side of the first circuit board close to the middle frame, and the second device is staggered with the first device. That is, the orthographic projection of the second device on the surface of the first circuit board does not overlap with the orthographic projection of the first device on the first circuit board. Based on the above features, it is possible to avoid the first device and the second device from overlapping and increasing the thickness of the electronic device.

[0008] In some examples, a first avoidance groove is formed on a side of the first circuit board close to the middle frame, and the first component is located in the first avoidance groove.

[0009] In some other examples, the first circuit board has a second avoidance hole, and the first component is located in the second avoidance hole.

[0010] Providing a first avoidance groove or a second avoidance hole on the first circuit board at a position directly opposite to the first device to accommodate a portion of the first device helps to further reduce the thickness of the electronic device.

[0011] In some examples, the electronic device further includes a reinforcing sheet, the reinforcing sheet is at least partially located in the second avoidance hole, and the reinforcing sheet is connected to the first circuit board. By arranging the reinforcing sheet in the second avoidance hole, the strength loss of the first circuit board caused by the second avoidance hole can be compensated.

[0012] In some examples, the thickness of the reinforcing sheet is smaller than the thickness of the first circuit board to leave more space for accommodating the first device.

[0013] In some examples, the first device is a system-in-package device. The system-in-package device occupies less space on the surface of the flexible circuit board, so that the area of ​​the first circuit board where the device cannot be arranged is also smaller, which is conducive to increasing the space utilization rate of the first circuit board surface.

[0014] In some examples, a third device is connected to a side of the first circuit board away from the display panel. Devices are arranged on both sides of the first circuit board, so that the surface of the first circuit board is fully utilized.

[0015] In some examples, the electronic device further includes a fourth device, the fourth device is located on a side of the first circuit board away from the display panel and in contact with the first circuit board, and the height of the fourth device protruding from the first circuit board is greater than the height of the third device protruding from the first circuit board. Based on the above features, the space between adjacent third devices is utilized, and the fourth device can also provide certain support to the first circuit board.

[0016] In some examples, the fourth device at least partially overlaps with the first device. That is, the orthographic projection of the fourth device on the first circuit board is at least partially located within the orthographic projection of the first device on the first circuit board. There may be some interference between the fourth device and the second device, and based on the above characteristics, it is helpful to reduce the interference between the fourth device and the second device.

[0017] As an example, the fourth device is a camera module.

[0018] Based on the above features, the side of the camera module away from the lens is usually relatively flat. The relatively flat surface of the camera module is used to contact the first circuit board, so that the first circuit board and the camera module are more stable.

[0019] In some examples, the flexible circuit board is bent to a side of the middle frame away from the display panel and is connected to the first circuit board.

[0020] Based on the above features, the bendability of the flexible circuit board is utilized to bend the flexible circuit board to connect the panel assembly and the first circuit board together. The structure is compact, signals are directly exchanged between the panel assembly and the first circuit board, and the signal transmission path is short.

[0021] As an example, the flexible circuit board is connected to the side of the first circuit board away from the middle frame through a connector. The connector is easy to use and occupies a small space. Moreover, the connector is arranged on the side of the first circuit board away from the middle frame, which makes it easier to disassemble and assemble the flexible circuit board and the first circuit board.

[0022] In some examples, a fifth device is further connected to a side of the flexible circuit board away from the display panel, the middle frame further has a third avoidance hole, and the fifth device is located in the third avoidance hole.

[0023] Based on the above features, an avoidance hole is also provided in the middle frame for the fifth device connected to the flexible circuit board, which is beneficial to further reduce the thickness of the electronic device.

[0024] In some examples, the electronic device further includes a second circuit board, the second circuit board is located on a side of the middle frame away from the display panel and is spaced apart from the first circuit board, and the second circuit board has one of the following:

[0025] A second avoidance groove is located on a side of the second circuit board close to the middle frame, and the fifth component is located in the second avoidance groove;

[0026] A fourth avoidance hole, and the fifth component is located in the fourth avoidance hole.

[0027] Based on the above features, similar to the principle of the first avoidance groove and the second avoidance hole, providing the second avoidance groove or the fourth avoidance hole is also helpful to further reduce the thickness of the electronic device.

[0028] In some examples, the electronic device further includes a hinge, the middle frame includes a first middle frame and a second middle frame, the first middle frame and the second middle frame are connected by the hinge; the flexible circuit board and the first circuit board are both located in the first middle frame.

[0029] Based on the above features, a first avoidance hole is set in the first middle frame of the middle frame, and the first device is arranged in the first avoidance hole, which is beneficial to reducing the thickness of the part of the electronic device where the first middle frame is located, thereby reducing the overall thickness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the structure of an electronic device;

[0031] Figure 2 yes Figure 1 Schematic diagram of section Ⅰ-Ⅰ in FIG.

[0032] Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0033] Figure 4 yes Figure 3 Schematic diagram of the II-II section;

[0034] Figure 5 It is a structural schematic diagram of a panel assembly provided in an embodiment of the present application;

[0035] Figure 6 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0036] Figure 7 It is a structural schematic diagram of a panel assembly provided in an embodiment of the present application;

[0037] Figure 8 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application;

[0038] Fig. 9 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application;

[0039] Fig.10 It is a structural schematic diagram of a flexible circuit board provided in an embodiment of the present application;

[0040] Fig.11 It is a structural schematic diagram of a flexible circuit board provided in an embodiment of the present application;

[0041] Fig.12 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application;

[0042] Fig.13 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application;

[0043] Fig.14 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application;

[0044] Fig.15 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application;

[0045] Fig.16 It is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application.

[0046] Legend

[0047] 10, middle frame 10a, recessed portion 10b, first avoidance hole 10c, third avoidance hole

[0048] 11. partition 12. frame 101. first middle frame 102. second middle frame 103. hinge

[0049] 20. Panel assembly 21. Display panel 22. Flexible circuit board 23. Printed circuit board

[0050] 220, device 221, device 223, connector 231, first circuit board

[0051] 232, second circuit board 233, third circuit board 234, fourth circuit board 211, bending portion

[0052] 212, connecting portion 213, anisotropic conductive adhesive 2111, display driver chip 221, first device 2312, second device 2313, third device 2314, fourth device 222, fifth device

[0053] 231b, second avoidance hole 214, first part 215, second part 216, bent part

[0054] 235, shaft-penetrating flexible circuit board 231a, first avoidance groove 2311, reinforcing sheet

[0055] 231c, second avoidance groove 231d, fourth avoidance hole 31, first battery 32, second battery DETAILED DESCRIPTION

[0056] The terms used in the implementation mode of the present application are only used to explain the embodiments of the present application, and are not intended to limit the present application. Unless otherwise defined, the technical terms or scientific terms used in the implementation mode of the present application should be the common meanings understood by people with ordinary skills in the field to which the present application belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limit, but indicate that there is at least one. Words such as "include" or "include" and similar words mean that the elements or objects appearing in front of "include" or "include" include the elements or objects listed after "include" or "include" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0057] Figure 1 The structure diagram of an electronic device is a schematic diagram of a structure of an electronic device, which can be a foldable electronic device or a non-foldable electronic device. Figure 1 As shown, the electronic device includes a middle frame 10, a display panel 21, a flexible circuit board 22 and a printed circuit board 23. The display panel 21 has a front side and a back side, wherein the front side is a side of the display panel 21 for displaying images, and the back side is a side opposite to the front side.

[0058] There are various stacking orders of the display panel 21 , the printed circuit board 23 and the middle frame 10 . For example, the display panel 21 and the printed circuit board 23 can be located on the same side of the middle frame 10 , or can be located on both sides of the middle frame 10 .

[0059] Figure 2 yes Figure 1 Schematic diagram of the Ⅰ-Ⅰ section in the figure. Figure 2As shown, in this example, the display panel 21 and the printed circuit board 23 are located on opposite sides of the middle frame 10, and the back of the display panel 21 faces the middle frame 10. The flexible circuit board 22 is connected to the display panel 21, and the flexible circuit board 22 is located between the back of the display panel 21 and the middle frame 10. Devices 220 are connected to the side of the flexible circuit board 22 close to the printed circuit board 23 and the side of the printed circuit board 23 close to the flexible circuit board 22. The device 220 connected to the flexible circuit board 22 protrudes from the surface of the flexible circuit board 22. In order to reduce the thickness of the electronic device, the middle frame 10 is provided with a recessed portion 10a, and the device 220 on the surface of the flexible circuit board 22 is located in the recessed portion 10a. Although the provision of the recessed portion 10a helps to reduce the thickness of the electronic device, it is still not enough to meet the requirements for thickness.

[0060] The embodiment of the present application provides an electronic device, which may be, but is not limited to, a mobile phone, a tablet computer, a PDA, a laptop computer, a display, or a wearable device. The electronic device may be a foldable electronic device or a non-foldable electronic device. The embodiment of the present application first takes a non-foldable mobile phone as an example to illustrate the electronic device provided by the embodiment of the present application.

[0061] Figure 3 Schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 3 As shown, the electronic device includes a middle frame 10 , a panel assembly 20 and a first circuit board 231 .

[0062] The middle frame 10 includes a frame body 12 and a partition portion 11 located inside the frame body 12, and the edge of the partition portion 11 is connected to the inner side wall of the frame body 12. All or part of the side edges of the partition portion 11 can be connected to the frame body 12. For example, the partition portion 11 is rectangular, and two opposite side edges of the partition portion 11 are connected to the frame body 12. The panel assembly 20 and the first circuit board 231 are both installed in the middle frame 10.

[0063] Figure 4 yes Figure 3 Schematic diagram of the II-II section. Figure 4 As shown, the panel assembly 20 includes a display panel 21 and a flexible circuit board 22, wherein the flexible circuit board 22 is located on the back of the display panel 21 and is connected to the display panel 21. A first device 221 is connected to a side of the flexible circuit board 22 away from the display panel 21. The display panel 21 and the first circuit board 231 are located on opposite sides of the middle frame 10. The middle frame 10 has a first avoidance hole 10b, and the first device 221 is located in the first avoidance hole 10b.

[0064] The first avoidance hole 10 b may be located at the partition portion 11 of the middle frame 10 . The partition portion 11 separates the display panel 21 and the first circuit board 231 .

[0065] In the embodiment of the present application, by arranging the display panel 21 and the first circuit board 231 on opposite sides of the middle frame 10, it is possible to avoid the first device 221 on the flexible circuit board 22 and the device on the first circuit board 231 from occupying each other's space. By providing the first avoidance hole 10b in the middle frame 10, the first device 221 is arranged in the first avoidance hole 10b, so that the distance between the first device 221 and the first circuit board 231 can break through the thickness limit of the partition part 11 of the middle frame 10, so that the distance between the first device 221 and the first circuit board 231 can even be smaller than the thickness of the partition part 11 of the middle frame 10, which is conducive to further reducing the thickness of the electronic device.

[0066] As an example, Figure 3 In the embodiment, the display panel 21 is rectangular, and the flexible circuit board 22 is connected to a shorter side of the display panel 21. In some other possible implementations, the flexible circuit board 22 may also be connected to a longer side of the display panel 21.

[0067] For example, Figure 5 Schematic diagram of the structure of a panel assembly provided in an embodiment of the present application. Figure 5 As shown, in the panel assembly 20 , the flexible circuit board 22 is connected to a longer side of the display panel 21 .

[0068] The edge of the display panel 21 has a bending portion 211 and a connecting portion 212, and the bending portion 211 is located between the connecting portion 212 and the main body of the display panel 21, and is connected to the main body of the display panel 21 and the connecting portion 212. The flexible circuit board 22 can be bound to the binding area located at the edge of the connecting portion 212. Binding refers to connection through ACF (Anisotropic Conductive Film, anisotropic conductive adhesive) 213, using temperature, pressure, time and other conditions. A display driver chip (Display Driver IC, DDIC) 2111 can also be connected to the connecting portion 212.

[0069] like Figure 4 As shown, a second device 2312 is connected to a side of the first circuit board 231 close to the middle frame 10 , and the second device 2312 and the first device 221 are staggered.

[0070] The staggered distribution here means that the orthographic projection of the second device 2312 on the surface of the first circuit board 231 and the orthographic projection of the first device 221 on the first circuit board 231 are staggered and do not overlap each other.

[0071] By staggering the first device 221 and the second device 2312 , it is avoided that the first device 221 and the second device 2312 overlap and increase the thickness of the electronic device.

[0072] like Figure 4 As shown, a third device 2313 is connected to a side of the first circuit board 231 away from the display panel 21 .

[0073] Components are arranged on both sides of the first circuit board 231 so that the surface of the first circuit board 231 can be more fully utilized.

[0074] In some examples, the electronic device may further include a fourth device 2314 , which is located on a side of the first circuit board 231 away from the display panel 21 and in contact with the first circuit board 231 .

[0075] The fourth device 2314 may be a device connected to the first circuit board 231 through a connector. In addition to the devices distributed on the surface of the circuit board or the flexible circuit board, there are usually some independent devices arranged inside the electronic device, such as a camera module, a fingerprint recognition module, a speaker module, a motor, etc. These devices are not directly fixed on the circuit board, but are connected to the circuit board through a connector.

[0076] A plurality of third devices 2313 are usually distributed on the surface of the first circuit board 231, and the third devices 2313 are protruding from the surface of the first circuit board 231. Between adjacent third devices 2313, the space between the first circuit board 231 and the plane where the side of the third device 2313 away from the first circuit board 231 is located is not fully utilized. In the embodiment of the present application, by arranging the fourth device 2314 on the side of the first circuit board 231 away from the display panel 21 and in contact with the first circuit board 231, the space between adjacent third devices 2313 is utilized, and the fourth device 2314 can also be used to provide certain support to the first circuit board 231.

[0077] As an example, the height of the fourth component 2314 protruding from the first circuit board 231 is greater than the height of the third component 2313 protruding from the first circuit board 231 .

[0078] The fourth device 2314 having a thickness greater than that of the third device 2313 is arranged on a side of the first circuit board 231 away from the display panel 21, so that the distance from the side of the fourth device 2314 away from the first circuit board 231 to the first circuit board 231 is greater than the distance from the side of the third device 2313 away from the first circuit board 231 to the first circuit board 231. This can provide certain protection for the third device 2313 and reduce the risk of the third device 2313 being squeezed and injured by other components inside the electronic device.

[0079] like Figure 4 As shown, the fourth device 2314 at least partially overlaps with the first device 221 .

[0080] The at least partial overlap referred to here means that the orthographic projection of the fourth device 2314 on the first circuit board 231 at least partially overlaps with the orthographic projection of the first device 221 on the first circuit board 231, that is, the orthographic projection of the fourth device 2314 on the first circuit board 231 is at least partially located within the orthographic projection of the first device 221 on the first circuit board 231.

[0081] Exemplarily, the orthographic projection of the first component 221 on the first circuit board 231 is located within the orthographic projection of the fourth component 2314 on the first circuit board 231 .

[0082] Since the second device 2312 and the first device 221 are staggered, there is no device distribution in the area on the first circuit board 231 that is directly opposite to the first device 221. The fourth device 2314 at least partially overlaps with the first device 221, that is, the fourth device 2314 at least partially overlaps with the area where no device is distributed. Some devices in the electronic device may cause certain interference with each other when working. This arrangement in the embodiment of the present application helps to reduce the interference between the fourth device 2314 and part of the second device 2312.

[0083] As an example, the fourth device 2314 is a camera module. For example, the fourth device 2314 may be a rear camera of an electronic device. The lens of the camera module may be located on a side of the camera module away from the first circuit board 231.

[0084] Since one side of the camera module has a lens and the side away from the lens is usually flatter, the flatter surface of the camera module can be used to contact the first circuit board 231, making the first circuit board 231 and the camera module more stable.

[0085] Electronic devices usually have more than one circuit board inside, e.g. Figure 3 As shown, the electronic device further includes a second circuit board 232. In the embodiment of the present application, the first circuit board 231 may be a main board in the electronic device, and the second circuit board 232 may be a sub-board in the electronic device. The first circuit board 231 and the second circuit board 232 are located on the same side of the partition portion 11 of the middle frame 10, that is, the second circuit board 232 is also located on the side of the middle frame 10 away from the display panel 21. The second circuit board 232 is arranged at an interval from the first circuit board 231, and the space between the second circuit board 232 and the first circuit board 231 can be used to arrange the battery.

[0086] More than one device may be connected to the surface of the flexible circuit board 22. For example Figure 3 or Figure 5 As shown, a fifth device 222 is further connected to a side of the flexible circuit board 22 away from the display panel 21 .

[0087] like Figure 3 As shown, the middle frame 10 may have a third avoidance hole 10c, and the fifth component 222 may be located in the third avoidance hole 10c. For different electronic devices, the position of the fifth component 222 may also be different, and the position of the third avoidance hole 10c may also be different. In this example, only Figure 3 The third avoidance hole 10c has a similar effect to the first avoidance hole 10b, so that the distance between the fifth device 222 and the second circuit board 232 can be smaller than the thickness of the partition part 11 of the middle frame 10, which is conducive to further reducing the thickness of the electronic device.

[0088] For a non-foldable electronic device, the flexible circuit board 22 of the display panel 21 may be connected to the first circuit board 231 .

[0089] Exemplarily, the flexible circuit board 22 is bent to a side of the middle frame 10 away from the display panel 21 , and is connected to the first circuit board 231 .

[0090] In a non-foldable electronic device, the flexible circuit board 22 is bent from one side of the middle frame 10 to the other side to be connected to the first circuit board 231 as the main board by utilizing the bendable property of the flexible circuit board.

[0091] In some examples, the flexible circuit board 22 is connected to a side of the first circuit board 231 away from the middle frame 10 through a connector 223 .

[0092] The connector 223 is used to connect the flexible circuit board 22 and the first circuit board 231, which is not only convenient for assembly and disassembly but also occupies little space.

[0093] Exemplarily, the connector 223 may be a board-to-board (BTB) connector.

[0094] The connector 223 may be located at an edge of the first circuit board 231 to facilitate the connection of the flexible circuit board 22 .

[0095] For foldable electronic devices, take foldable mobile phones as an example. Figure 6 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. Figure 6 At least the panel assembly 20 is omitted. Figure 6 As shown, the electronic device includes a middle frame 10, a panel assembly 20 and a plurality of circuit boards. The middle frame 10 includes a first middle frame 101 and a second middle frame 102, and the first middle frame 101 and the second middle frame 102 both include a partition portion 11 and a frame body 12 located at the edge of the partition portion 11. The first middle frame 101 and the second middle frame 102 are connected by a hinge 103, so that the first middle frame 101 and the second middle frame 102 can be relatively opened and closed.

[0096] In the embodiments of the present application, only a bifold electronic device is used as an example for explanation. A bifold electronic device refers to an electronic device having one hinge, and the electronic device includes two parts connected by the hinge. The technical solution provided in the embodiments of the present application is also applicable to trifold or multi-fold electronic devices. A trifold electronic device refers to an electronic device having two hinges, and the electronic device includes three parts connected by two hinges. Similarly, a multi-fold electronic device refers to an electronic device having more hinges.

[0097] The plurality of circuit boards include a first circuit board 231, a second circuit board 232, a third circuit board 233 and a fourth circuit board 234. The first circuit board 231 and the second circuit board 232 are located in the first middle frame 101, and the third circuit board 233 and the fourth circuit board 234 are located in the second middle frame 102. The first circuit board 231 and the third circuit board 233 are connected by a through-axis flexible circuit board 235. Exemplarily, one of the first circuit board 231 and the third circuit board 233 may be a main board, and the main board may be provided with a system on chip (System on Chip; SOC), and the other may be a sub-main board, and the second circuit board 232 and the fourth circuit board 234 may both be sub-boards.

[0098] The first battery 31 is arranged between the first circuit board 231 and the second circuit board 232 , and the second battery 32 is arranged between the third circuit board 233 and the fourth circuit board 234 .

[0099] Figure 7 Schematic diagram of the structure of a panel assembly provided in an embodiment of the present application. Figure 7 As shown, the panel assembly 20 includes a display panel 21 and a flexible circuit board 22. The display panel 21 is a flexible display panel, including a first portion 214, a second portion 215 and a bending portion 216, wherein the bending portion 216 is located between the first portion 214 and the second portion 215, and the first portion 214 and the second portion 215 are connected to the middle frame 10, and the bending portion 216 can be bent during the opening and closing process of the first middle frame 101 and the second middle frame 102.

[0100] Figure 8 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application, such as Figure 8 As shown, in this example, the third circuit board 233 may be a main board provided with a SOC, and the flexible circuit board 22 extends from the first middle frame 101 through the hinge 103 to the second middle frame 102 and is connected to the third circuit board 233 located in the second middle frame 102 .

[0101] The flexible circuit board 22 and the third circuit board 233 may be connected via a connector, and illustratively, may be connected via a board-to-board connector.

[0102] In the electronic device, by providing the first avoidance hole 10b in the first middle frame 101 of the middle frame 10, the first device 221 is arranged in the first avoidance hole 10b, which is beneficial to reducing the thickness of the part where the first middle frame 101 is located in the two parts of the electronic device that can be relatively opened and closed.

[0103] Usually, the number of components on the secondary board will be smaller than the number of components on the primary board. In this example, the first circuit board 231 is a secondary board, and the devices distributed on its surface are fewer than those on the third circuit board 233. Even if the first device 221 occupies part of the space on the surface of the first circuit board 231, there is still enough space on the surface of the first circuit board 231 to arrange the second device 2312.

[0104] In some other possible implementations, if the third circuit board 233 is a main board provided with a SOC, the flexible circuit board 22 may also be connected to the first circuit board 231 as a sub-main board. Since the first circuit board 231 and the third circuit board 233 are connected through the through-axis flexible circuit board 235, the flexible circuit board 22 is connected to the first circuit board 231 as a sub-main board, and the panel assembly 20 and the main board can also transmit signals through the through-axis flexible circuit board 235. In addition, the flexible circuit board 22 is connected to the first circuit board 231 to prevent the flexible circuit board 22 from passing through the hinge 103, which helps to extend the service life of the flexible circuit board 22.

[0105] Fig. 9 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application, such as Fig. 9 As shown, in this example, the first circuit board 231 may be a main board provided with a SOC, and the flexible circuit board 22 is connected to the first circuit board 231 .

[0106] Since the flexible circuit board 22 and the first circuit board 231 are both located in the first middle frame 101, the flexible circuit board 22 is connected to the first circuit board 231, and the flexible circuit board 22 does not need to pass through the hinge 103, which helps to shorten the length of the flexible circuit board 22 and prolong the service life of the flexible circuit board 22. In addition, compared with the signal transmission between the panel assembly 20 and the mainboard by means of the through-axis flexible circuit board 235, the flexible circuit board 22 is directly connected to the first circuit board 231 as the mainboard, and the signal transmission path between the panel assembly 20 and the mainboard is shorter. For example, the signal transmission path of the mobile industry processor interface (MIPI) can be shortened. Since there is no signal transmission by means of the through-axis flexible circuit board 235, there is no need to add a transmission line in the through-axis flexible circuit board 235, and there is no need to increase the width of the through-axis flexible circuit board 235. The width of the through-axis flexible circuit board 235 refers to the size of the through-axis flexible circuit board 235 in the axial direction of the hinge 103.

[0107] Fig.10 Schematic diagram of a flexible circuit board provided in an embodiment of the present application. Fig.10 In some examples, the first device 221 is a discrete device, and a plurality of first devices 221 are distributed on the surface of the flexible circuit board 22. Among the plurality of first devices 221, at least several first devices 221 are clustered and distributed, and the clustered and distributed several first devices 221 are located in the same first avoidance hole 10b.

[0108] Fig.11 Schematic diagram of a flexible circuit board provided in an embodiment of the present application. Fig.11 In some other examples, the first device 221 is a system-in-package device.

[0109] In terms of function, a system-level package device is equivalent to multiple discrete devices, and the area occupied by a system-level package device on the surface of the flexible circuit board 22 is smaller than the area occupied by multiple discrete devices on the surface of the flexible circuit board 22, which not only allows the surface of the flexible circuit board 22 to have space for arranging more devices to achieve more functions. Even if no additional devices are added to the surface of the flexible circuit board 22, the area where the first circuit board 231 is directly opposite to the first device 221 and the area where the device cannot be arranged is also smaller, thereby increasing the area of ​​the area where the device can be arranged on the surface of the first circuit board 231 and increasing the space utilization rate of the surface of the first circuit board 231.

[0110] The system-level package device may include a single-sided system-level package device and a double-sided system-level package device, and the system-level package device includes a package substrate and components located on the surface of the package substrate. In the single-sided system-level package device, the components are located on one side of the package substrate, and in the double-sided system-level package device, the components are located on both sides of the package substrate. When the single-sided system-level package device and the double-sided system-level package device having the same function are set on a flexible circuit board, the double-sided system-level package device occupies a smaller area.

[0111] For example, multiple discrete components are distributed on the surface of the flexible circuit board 22, which requires about 216 mm 2 The area of ​​the flexible circuit board 22 only needs to occupy about 137mm by using a single-sided system-level packaging device that can achieve the same function. 2 The first circuit board 231 faces the first device 221, and the area where the device cannot be arranged is also reduced to about 137mm 2 Accordingly, the area of ​​the surface of the first circuit board 231 where components can be arranged increases by about 79 mm 2 The double-sided system-level package device that can achieve the same function only needs to occupy about 90mm on the surface of the flexible circuit board 22. 2The first circuit board 231 faces the first device 221, and the area where the device cannot be arranged is also reduced to about 90mm 2 Accordingly, the area of ​​the surface of the first circuit board 231 where components can be arranged increases by about 110 mm. 2 .

[0112] like Fig.11 As shown, the fifth device 222 may also be a system-in-package device.

[0113] Fig.12 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application. Fig.12 As shown, in the electronic device, a first circuit board 231 has a first avoidance groove 231 a on one side close to the middle frame 10 , and the first device 221 is located in the first avoidance groove 231 a .

[0114] By providing the first avoidance groove 231 a at a position on the first circuit board 231 directly facing the first device 221 , it helps to further reduce the thickness of the electronic device.

[0115] Compared with discrete devices, the thickness of the system-level package device is greater and the height protruding from the flexible circuit board 22 is higher. The greater thickness of the system-level package device is not conducive to reducing the thickness of the electronic device. In the example where the first device 221 is a system-level package device, by providing the first avoidance groove 231a, a portion of the first device 221 can extend into the first avoidance groove 231a, which can avoid the thickness of the electronic device being increased due to the greater thickness of the system-level package device.

[0116] Fig.13 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application. Fig.13 As shown, in the electronic device, the first circuit board 231 has a second avoidance hole 231 b, and the first component 221 is located in the second avoidance hole 231 b.

[0117] By providing the second avoidance hole 231 b at a position on the first circuit board 231 directly facing the first device 221 , it helps to further reduce the thickness of the electronic device.

[0118] Compared with the first avoidance groove 231a, the second avoidance hole 231b can provide a larger space to accommodate the first device 221. Especially for double-sided system-level package devices, the thickness is greater than that of single-sided system-level package devices. The use of the first avoidance groove 231a may still increase the thickness of the electronic device. The second avoidance hole 231b can provide a larger space to accommodate the double-sided system-level package device.

[0119] Fig.14 is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application. Fig.13The example shown is Fig.14 As shown, the electronic device further includes a reinforcing sheet 2311. The reinforcing sheet 2311 is at least partially located in the second avoidance hole 231b, and the reinforcing sheet 2311 is connected to the first circuit board 231.

[0120] The second avoidance hole 231 b provided on the surface of the first circuit board 231 will reduce the structural strength of the first circuit board 231 to a certain extent. By providing a reinforcing sheet 2311 in the second avoidance hole 231 b , the strength loss of the first circuit board 231 can be compensated.

[0121] In addition, the reinforcing sheet 2311 can also provide protection. When the display panel 21 is pressed, the display panel 21 will be deformed. Since the flexible circuit board 22 lacks support at the first avoidance hole 10b, when the display panel 21 is pressed, the first device 221 may extend out of the second avoidance hole 231b and squeeze the device inside the electronic device, which is located on the side of the first circuit board 231 away from the display panel 21. This may cause damage to the first device 221 and the device squeezed by the first device 221. The reinforcing sheet 2311 separates the first device 221 and the device located on the side of the first circuit board 231 away from the display panel 21, thereby avoiding squeezing.

[0122] In some examples, the thickness of the reinforcing sheet 2311 is less than the thickness of the first circuit board 231. The reinforcing sheet 2311 is set to be relatively thin to leave more space for the first device 221.

[0123] In addition, the reinforcing sheet 2311 can also be reused as a shielding layer, that is, the reinforcing sheet 2311 is made of a material with functions such as shielding electromagnetic signals. This can also reduce or even avoid mutual interference between the first device 221 and the device located on the side of the first circuit board 231 away from the display panel 21.

[0124] Exemplarily, the reinforcing sheet 2311 may be a metal sheet, such as a stainless steel metal sheet, an aluminum metal sheet, or an aluminum alloy metal sheet. The surface of the metal sheet may be coated with a functional coating, such as an electromagnetic wave shielding coating.

[0125] In some examples, an edge of the reinforcing sheet 2311 may be bonded to the first circuit board 231 .

[0126] In other examples, the reinforcing sheet 2311 may also be snap-fitted into the second avoidance hole 231b, that is, the portion of the reinforcing sheet 2311 located in the second avoidance hole 231b forms an interference fit with the second avoidance hole 231b.

[0127] The side of the reinforcing sheet 2311 away from the first device 221 may be located inside the second avoidance hole 231 b , or outside the second avoidance hole 231 b , or may be flush with the side of the first circuit board 231 away from the first device 221 .

[0128] Although Figures 9 to 14 In the example shown, a foldable electronic device is used as an example for explanation, but the arrangement of the first avoidance groove 231a and the second avoidance hole 231b is also applicable to non-foldable electronic devices, for example, Figure 3-4 In the example shown.

[0129] The fifth device 222 corresponding to the flexible circuit board 22 may also be provided with an avoidance groove or avoidance hole. Fig.15 2 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application. The cross section is located at the fifth device 222. Fig.15 As shown, the second circuit board 232 is located on a side of the middle frame 10 away from the display panel 21, and the second circuit board 232 has a second avoidance groove 231c, which is located on a side of the second circuit board 232 close to the middle frame 10, and the fifth device 222 is located in the second avoidance groove 231c.

[0130] Fig.16 2 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application. The cross section is located at the fifth device 222. In this example, the second circuit board 232 has a fourth avoidance hole 231d, and the fifth device 222 is located in the fourth avoidance hole 231d.

[0131] The above description is only an embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An electronic device, characterized in that: It comprises a middle frame (10), a panel assembly (20) and a first circuit board (231); The panel assembly (20) comprises a display panel (21) and a flexible circuit board (22), wherein the flexible circuit board (22) is located on the back side of the display panel (21) and is connected to the display panel (21), and a first device (221) is connected to a side of the flexible circuit board (22) away from the display panel (21); The display panel (21) and the first circuit board (231) are located on opposite sides of the middle frame (10); The middle frame (10) has a first avoidance hole (10b), and the first component (221) is located in the first avoidance hole (10b).

2. The electronic device according to claim 1, characterized in that: A second device (2312) is connected to a side of the first circuit board (231) close to the middle frame (10), and the second device (2312) and the first device (221) are staggered.

3. The electronic device according to claim 1, characterized in that: A first avoidance groove (231a) is provided on a side of the first circuit board (231) close to the middle frame (10), and the first component (221) is located in the first avoidance groove (231a).

4. The electronic device according to claim 1, characterized in that: The first circuit board (231) has a second avoidance hole (231b), and the first component (221) is located in the second avoidance hole (231b).

5. The electronic device according to claim 4, characterized in that: It also comprises a reinforcing sheet (2311), wherein the reinforcing sheet (2311) is at least partially located in the second avoidance hole (231b), and the reinforcing sheet (2311) is connected to the first circuit board (231).

6. The electronic device according to claim 5, characterized in that: The thickness of the reinforcing sheet (2311) is smaller than the thickness of the first circuit board (231).

7. The electronic device according to any one of claims 1 to 6, characterized in that: The first device (221) is a system-in-package device.

8. The electronic device according to any one of claims 1 to 7, characterized in that: A third device (2313) is connected to a side of the first circuit board (231) away from the display panel (21).

9. The electronic device according to claim 8, characterized in that: The invention also includes a fourth device (2314), which is located on a side of the first circuit board (231) away from the display panel (21) and in contact with the first circuit board (231), and the height of the fourth device (2314) protruding from the first circuit board (231) is greater than the height of the third device (2313) protruding from the first circuit board (231).

10. The electronic device according to claim 9, characterized in that: The fourth device (2314) at least partially overlaps with the first device (221).

11. The electronic device according to claim 9 or 10, characterized in that: The fourth device (2314) is a camera module.

12. The electronic device according to any one of claims 1 to 11, characterized in that: The flexible circuit board (22) is bent to a side of the middle frame (10) away from the display panel (21), and is connected to the first circuit board (231).

13. The electronic device according to claim 12, characterized in that: The flexible circuit board (22) is connected to a side of the first circuit board (231) away from the middle frame (10) via a connector (223).

14. The electronic device according to any one of claims 1 to 13, characterized in that: A fifth device (222) is also connected to a side of the flexible circuit board (22) away from the display panel (21); the middle frame (10) also has a third avoidance hole (10c); and the fifth device (222) is located in the third avoidance hole (10c).

15. The electronic device according to claim 14, characterized in that: The device further comprises a second circuit board (232), the second circuit board (232) being located on a side of the middle frame (10) away from the display panel (21) and spaced apart from the first circuit board (231), the second circuit board (232) having one of the following: A second avoidance groove (231c) is located on a side of the second circuit board (232) close to the middle frame (10), and the fifth component (222) is located in the second avoidance groove (231c); A fourth avoidance hole (231d), and the fifth component (222) is located in the fourth avoidance hole (231d).

16. The electronic device according to any one of claims 1 to 15, characterized in that: It also includes a hinge (103), wherein the middle frame (10) includes a first middle frame (101) and a second middle frame (102), and the first middle frame (101) and the second middle frame (102) are connected via the hinge (103); The flexible circuit board (22) and the first circuit board (231) are both located in the first middle frame (101).

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