High and low temperature heat flow meter for chip testing

Abstract

The utility model relates to the technical field of heat flow meters, and discloses a high-low temperature heat flow meter for chip testing, which comprises a case and a machine head, the case is provided with a compressed gas inlet, and a refrigerating system for generating low-temperature airflow is arranged in the case; a heater used for generating high-temperature airflow is installed in the machine head, and an airflow spray head is installed at the bottom end of the machine head. The machine further comprises a movable support, the movable support is arranged at the top of the machine box and at least comprises a supporting column, a first movable arm and a second movable arm which are movably connected in sequence, a longitudinal sliding rail is installed at the outer end of the second movable arm, and the machine head is in sliding connection with the longitudinal sliding rail. The utility model has the advantages that: 1, the case is provided with the movable frame capable of moving in multiple dimensions, so that the movement range covered by the machine head is wider; 2, in the longitudinal dimension, a coarse adjusting mechanism and a micro adjusting mechanism are arranged, and the double adjusting mechanisms are matched for use, so that the flexibility is higher;

Description

Technical Field

[0001] The utility model relates to the technical field of heat flow instruments, in particular to a high and low temperature heat flow instrument for chip testing. Background Art

[0002] The heat flow meter provides a fast and accurate temperature environment for chip temperature testing by quickly outputting dry and clean hot and cold cycle impact airflow. It is suitable for simulating chip applications in various temperature tests and adjustments. It is widely used in integrated circuit IC cards, electronic chips, flash memory, power devices, fiber optic transceivers or electronic circuits for high and low temperature cycle tests, high and low temperature impact tests and characteristic analysis.

[0003] During the use of the thermal flow meter, the types of objects to be detected are different, so the position of the airflow nozzle needs to be changed frequently. Although there is an active point between the airflow nozzle and the base of the existing thermal flow meter for position adjustment, there is only one movable arm, and the airflow nozzle can only move on a single plane. The movable space is still insufficient, which affects the use of the equipment. Therefore, the inventor made a new invention. Utility Model Content

[0004] The utility model aims to provide a high and low temperature heat flow instrument for chip testing in view of the deficiencies in the prior art, which has the characteristics of wide nozzle activity range and wide application range.

[0005] To achieve the above-mentioned purpose, the utility model is a high and low temperature heat flow instrument for chip testing, comprising a chassis and a head, the chassis is provided with a compressed gas inlet, a refrigeration system for generating a low-temperature airflow is installed inside the chassis; a heater for generating a high-temperature airflow is installed inside the head, and an airflow nozzle is installed at the bottom of the head; the compressed gas inlet is connected to the refrigeration system and the heater respectively, and the airflow nozzle is used to spray high-temperature or low-temperature airflow; it also includes a movable bracket, which is arranged at the top of the chassis, and the movable bracket at least includes a support column, a first movable arm and a second movable arm which are movably connected in sequence, the outer end of the second movable arm is installed with a longitudinal slide rail, and the head is slidably connected to the longitudinal slide rail.

[0006] Preferably, a lifting hydraulic cylinder is installed inside the chassis, and the lifting hydraulic cylinder is connected to a support column.

[0007] Preferably, the first movable arm and the second movable arm are provided with a semicircular clamp for accommodating the connecting pipe.

[0008] Preferably, a transparent wind cover is installed on the outer peripheral side of the air flow nozzle, and an exhaust port is provided on one side of the transparent wind cover.

[0009] Preferably, a first solenoid valve is provided between the compressed gas inlet and the refrigeration system, and a second solenoid valve is provided between the compressed gas inlet and the heater.

[0010] Preferably, the air flow nozzle is connected with a high-temperature nozzle and a low-temperature nozzle.

[0011] Preferably, a high-temperature probe is provided at the end of the high-temperature nozzle, and a low-temperature probe is provided at the end of the low-temperature nozzle.

[0012] Preferably, a group of handles are symmetrically arranged on the outer wall of the nose.

[0013] Beneficial effects: Compared with the prior art, the utility model is a high and low temperature heat flow meter for chip testing, and the utility model has the following advantages: 1. The chassis is installed with a movable frame that can move in multiple dimensions, and the head covers a wider range of activities; 2. In the longitudinal dimension, a coarse adjustment mechanism and a micro adjustment mechanism are provided, and the combination of the dual adjustment mechanisms is more flexible. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0015] Figure 2 It is a schematic diagram of the back structure of the utility model.

[0016] Figure 3 It is a schematic diagram of the internal structure of the chassis of the present utility model.

[0017] Figure 4 It is a schematic diagram of the internal structure of the machine head of the utility model.

[0018] Figure 5 This is a schematic diagram of the refrigeration system structure of the utility model.

[0019] Figure 6 It is a schematic diagram of the exploded structure of the machine head of the utility model.

[0020] Figure 7 It is a schematic diagram of the airflow generation process of the utility model.

[0021] Reference numerals include:

[0022] Chassis--1, compressed gas inlet--11, refrigeration system--12, lifting hydraulic cylinder--13, machine head--2, heater--21, air flow nozzle--22, movable bracket--3, support column--31, first movable arm--32, second movable arm--33, longitudinal slide rail--34, semicircular clamp--35, transparent wind cover--36, exhaust port--361, high temperature nozzle--37, high temperature probe--371, low temperature nozzle--38, low temperature probe--381, handle--4. DETAILED DESCRIPTION

[0023] The following is combined with Figures 1 to 7The utility model is described in detail.

[0024] The utility model is a high and low temperature heat flow instrument for chip testing, comprising a chassis 1 and a head 2, wherein the chassis 1 is provided with a compressed gas inlet 11, and a refrigeration system 12 for generating a low temperature airflow is installed inside the chassis 1; a heater 21 for generating a high temperature airflow is installed inside the head 2, and an airflow nozzle 22 is installed at the bottom of the head 2; the compressed gas inlet 11 is connected to the refrigeration system 12 and the heater 21 respectively, and the airflow nozzle 22 is used to spray out a high temperature or low temperature airflow. When in use, the chip is placed at the bottom of the airflow nozzle 22, and the extreme airflow performs temperature detection on the chip; to further improve the technical solution, the heat flow instrument also includes a movable bracket 3, which is arranged at the top of the chassis 1, and the movable bracket 3 at least includes a support column 31, a first movable arm 32 and a second movable arm 33 which are movably connected in sequence, and a longitudinal slide rail 34 is installed at the outer end of the second movable arm 33, and the head 2 is slidably connected to the longitudinal slide rail 34. The support column 31 provides support for the first movable arm 32 and the second movable arm 33. The technical solution expands the movable range of the head 2 by superimposing the first movable arm 32 and the second movable arm 33, and at the same time superimposes the longitudinal slide rail 34, so that the head 2 can be moved arbitrarily in the horizontal and vertical planes. The heat flow meter has a wide range of applications and higher flexibility.

[0025] Preferably, a lifting hydraulic cylinder 13 is installed inside the chassis 1, and the lifting hydraulic cylinder 13 is connected to the support column 31. The lifting hydraulic cylinder 13 drives the support column 31 to move up and down so that the entire movable bracket 3 can change the height according to the test requirements to achieve macro adjustment.

[0026] As an embodiment, the first movable arm 32 and the second movable arm 33 are provided with a semicircular clamp 35 for receiving the connecting pipe. The connecting pipe between the machine head 2 and the chassis 1 is relatively long, and the semicircular clamp 35 can effectively prevent the connecting pipe from affecting the test process after receiving it.

[0027] In the present invention, a transparent wind cover 36 is installed on the outer peripheral side of the airflow nozzle 22, and an exhaust port 361 is provided on one side of the transparent wind cover 36. The transparent wind cover 36 can cover the chip under test, separate the chip from the external environment, and prevent the external environment from affecting the chip detection process. The ejected airflow can also be released in time through the exhaust port 361.

[0028] Preferably, a first solenoid valve is provided between the compressed gas inlet 11 and the refrigeration system 12 , and a second solenoid valve is provided between the compressed gas inlet 11 and the heater 21 .

[0029] Preferably, the air flow nozzle 22 is connected to a high temperature nozzle 37 and a low temperature nozzle 38. Figure 7As shown, when the air flow flows into the chassis 1 from the compressed gas inlet 11, the air flow is controlled by the solenoid valve to flow to the heater 21 or the refrigeration system 12, thereby forming corresponding high-temperature or low-temperature air flow to flow into the high-temperature nozzle 37 and the low-temperature nozzle 38.

[0030] In the technical solution, a high temperature probe 371 is provided at the end of the high temperature nozzle 37, and a low temperature probe 381 is provided at the end of the low temperature nozzle 38. The high temperature probe 371 and the low temperature probe 381 are used to accurately measure the temperature of the airflow, to ensure that the ejected airflow is an ideal temperature airflow, thereby ensuring the accuracy of the temperature test results.

[0031] Preferably, a group of handles 4 are symmetrically arranged on the outer wall of the head 2. The handles 4 serve as fulcrums of the head 2, making it easy for the user to grab the head 2 and move the head 2 to a specified position. At the same time, the handles 4 are made of heat-conducting insulating material, which can effectively prevent the temperature of high and low temperature airflows from being transferred to the handles 4.

[0032] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A high and low temperature heat flow instrument for chip testing, comprising a chassis (1) and a head (2), characterized in that: The case (1) is provided with a compressed gas inlet (11), and a refrigeration system (12) for generating a low-temperature airflow is installed inside the case (1); a heater (21) for generating a high-temperature airflow is installed inside the head (2), and an airflow nozzle (22) is installed at the bottom of the head (2); the compressed gas inlet (11) is connected to the refrigeration system (12) and the heater (21) respectively, and the airflow nozzle (22) is used to spray high-temperature or low-temperature airflow; and a movable bracket (3) is also included, the movable bracket (3) is arranged on the top of the case (1), and the movable bracket (3) at least includes a support column (31), a first movable arm (32) and a second movable arm (33) which are movably connected in sequence, and a longitudinal slide rail (34) is installed at the outer end of the second movable arm (33), and the head (2) is slidably connected to the longitudinal slide rail (34).

2. A high and low temperature heat flow instrument for chip testing according to claim 1, characterized in that: A lifting hydraulic cylinder (13) is installed inside the chassis (1), and the lifting hydraulic cylinder (13) is connected to a support column (31).

3. The high and low temperature heat flow instrument for chip testing according to claim 1, characterized in that: The first movable arm (32) and the second movable arm (33) are provided with a semicircular clamp (35) for accommodating a connecting pipe.

4. The high and low temperature heat flow instrument for chip testing according to claim 1, characterized in that: A transparent wind cover (36) is installed on the outer peripheral side of the air flow nozzle (22), and an exhaust port (361) is provided on one side of the transparent wind cover (36).

5. The high and low temperature heat flow instrument for chip testing according to claim 1, characterized in that: A first solenoid valve is provided between the compressed gas inlet (11) and the refrigeration system (12), and a second solenoid valve is provided between the compressed gas inlet (11) and the heater (21).

6. The high and low temperature heat flow instrument for chip testing according to claim 1, characterized in that: The air flow nozzle (22) is connected to a high-temperature nozzle (37) and a low-temperature nozzle (38).

7. A high and low temperature heat flow instrument for chip testing according to claim 6, characterized in that: A high-temperature probe (371) is disposed at the end of the high-temperature nozzle (37), and a low-temperature probe (381) is disposed at the end of the low-temperature nozzle (38).

8. A high and low temperature heat flow instrument for chip testing according to any one of claims 1 to 7, characterized in that: A group of handles (4) are symmetrically arranged on the outer wall of the machine head (2).

Images