Wafer brush auxiliary calibration device

Abstract

The utility model provides a wafer brush auxiliary calibration device, which comprises a device main body, a first auxiliary brush, a second auxiliary brush and a calibration mechanism, and is characterized in that the device main body at least comprises a first side wall and a second side wall which are oppositely arranged, and the first side wall is provided with a first driving part and a second driving part which are arranged at an interval; a first driven part and a second driven part which are arranged at an interval are arranged on the second side wall; two ends of the first auxiliary brush are respectively mounted on the first driving part and the first driven part; two ends of the second auxiliary brush are respectively mounted on the second driving part and the second driven part; the calibration mechanism is clamped and fixed at a preset position on the device main body, the calibration mechanism at least comprises a fixed support and at least one auxiliary positioning unit arranged on the fixed support, a first clamping groove and a second clamping groove which are oppositely arranged are formed in the auxiliary positioning unit, and the first clamping groove and the second clamping groove are matched with the first auxiliary brush and the second auxiliary brush respectively. According to the wafer brush auxiliary device, the calibration technology is simplified, and the wafer processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer brush auxiliary calibration device. Background Art

[0002] Wafer brushes are commonly used consumables in the cleaning unit of chemical mechanical polishing equipment. They play an important role in removing particles from the surface of the wafer. In the wafer cleaning device, in order to ensure the cleaning effect of the wafer, wafer brushes are usually set on both sides of the wafer. The wafer brushes are generally cylindrical in structure. The wafer brushes are driven by a rotating motor on the box to brush the surface of the wafer. However, the angle and alignment between the two wafer brushes will affect the rotation speed of the wafer and the amount of defects on the wafer surface.

[0003] At present, the mainstream chemical mechanical polishing equipment generally uses an auxiliary brush that can represent the wafer brush as the adjustment tool for the centering and angle of the wafer brush in the equipment, such as Figure 1 As shown in FIG. 1 , it is a schematic diagram of the structure of the auxiliary brush, including the auxiliary brush 01, the first protrusion 011 and the second protrusion 012. However, when the existing auxiliary brush is used as an adjustment tool for centering and angle adjustment, it is also necessary to take a wafer and place it on the gasket on the speed measuring wheel and the driving wheel, such as Figure 2 As shown, it is a schematic diagram of placing the wafer on the tachometer wheel and the drive wheel, including wafer 02, drive wheel 03 and tachometer wheel 04, and loosening the four screws of the angle adjustment plate, repeatedly turning the coupling or adjusting the motor drive belt, and repeatedly verifying with the wafer and feeler gauge to finally achieve the required alignment and angle. It cannot be done in one step, and the gaskets that the wafer contacts are all V-shaped rubber materials, which are prone to offset during the adjustment process. The calibration process is complicated and greatly increases the adjustment time, and the process efficiency is low.

[0004] In view of this, there is an urgent need for a wafer brush auxiliary calibration device that can shorten the calibration time of a wafer brush in a wafer cleaning device and simplify the calibration process. Utility Model Content

[0005] In view of the shortcomings of the prior art mentioned above, the purpose of the present utility model is to provide a wafer brush auxiliary calibration device, which is used to solve the problem that the calibration time of the wafer brush in the wafer cleaning device in the prior art is long and the calibration process is complicated, resulting in low process efficiency.

[0006] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a wafer brush auxiliary calibration device, comprising:

[0007] The device body at least comprises a first side wall and a second side wall which are arranged opposite to each other, wherein the first side wall is provided with a first driving part and a second driving part which are arranged at intervals, and the second side wall is provided with a first driven part and a second driven part which are arranged at intervals;

[0008] A first auxiliary brush, two ends of which are respectively mounted on the first driving part and the first driven part;

[0009] A second auxiliary brush, two ends of which are respectively mounted on the second driving part and the second driven part;

[0010] A calibration mechanism is fixed at a preset position on the device body, and the calibration mechanism at least includes a fixed bracket and at least one auxiliary positioning unit arranged on the fixed bracket. The auxiliary positioning unit is provided with a first card slot and a second card slot arranged opposite to each other, and the first card slot and the second card slot are respectively matched with the first auxiliary brush and the second auxiliary brush.

[0011] Optionally, the device body is further provided with a first angle adjustment plate located at the first driving part for adjusting the position of the first driving part, and a second angle adjustment plate located at the second driving part for adjusting the position of the second driving part.

[0012] Optionally, a coupling for driving the first auxiliary brush and the second auxiliary brush to move is further provided in the device body.

[0013] Optionally, the fixed bracket includes at least a first bracket with two ends respectively clamped on the first side wall and the second side wall.

[0014] Optionally, the fixed bracket also includes a second bracket that intersects with the first bracket at the center of the first bracket and is fixed to the device body.

[0015] Optionally, a projection of a clamping position of the first bracket on the first side wall is located between the first driving portion and the second driving portion, and a projection of a clamping position of the first bracket on the second side wall is located between the first driven portion and the second driven portion.

[0016] Optionally, two auxiliary positioning units are provided in the calibration mechanism, the two auxiliary positioning units are arranged opposite to each other on the first bracket, and the two auxiliary positioning units are respectively spaced apart from two ends of the first bracket by a first preset distance.

[0017] Optionally, the auxiliary positioning unit includes a fixed portion and a contact portion connected to each other, the fixed portion is fixedly connected to the fixed bracket, the first card slot and the second card slot constitute the contact portion, and the contact portion is fixedly connected to the fixed portion.

[0018] Optionally, the first auxiliary brush is further provided with a first protrusion and a second protrusion which are arranged opposite to each other and are respectively spaced apart from the two ends of the first auxiliary brush by a second preset distance; the second auxiliary brush is further provided with a third protrusion and a fourth protrusion which are arranged opposite to each other and are respectively spaced apart from the two ends of the second auxiliary brush by a third preset distance.

[0019] Optionally, when the first protrusion contacts the third protrusion, the distance between the second protrusion and the fourth protrusion ranges from 0.18 mm to 0.22 mm.

[0020] As described above, the wafer brush auxiliary calibration device of the utility model has the following beneficial effects: the first auxiliary brush, the second auxiliary brush and the calibration mechanism are used as calibration tools for the wafer brush, and the auxiliary positioning unit provided with the first card slot and the second card slot is arranged in the calibration mechanism, and the first card slot and the second card slot are respectively matched with the first auxiliary brush and the second auxiliary brush, by respectively installing the two ends of the first auxiliary brush on the first driving part and the first driven part, and installing the two ends of the second auxiliary brush on the second driving part and the second driven part, and fixing the calibration mechanism to a preset position on the device body through the fixed bracket, so that the first card slot and the second card slot are respectively matched with the first auxiliary brush and the second auxiliary brush, the auxiliary calibration of the centering and angle of the wafer brush can be realized, compared with the traditional adjustment method, the calibration process is simplified, the calibration time is shortened, and the wafer brush auxiliary calibration device is applied to semiconductor process equipment to improve the semiconductor processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of an auxiliary brush in the prior art.

[0022] Figure 2 It is a schematic diagram showing a wafer placed on a tachometer wheel and a driving wheel in the prior art.

[0023] Figure 3 Shown is a top view of the wafer brush auxiliary calibration device of the present invention.

[0024] Figure 4 Shown is a front view of the calibration mechanism of the wafer brush auxiliary calibration device of the present invention.

[0025] Figure 5 Shown is a top view of the calibration mechanism of the wafer brush auxiliary calibration device of the present invention.

[0026] Figure 6 Shown is a side view of the calibration mechanism of the wafer brush auxiliary calibration device of the present invention.

[0027] Figure 7 Shown is a top view of the first auxiliary brush and the second auxiliary brush of the wafer brush auxiliary calibration device of the present invention installed on the device body.

[0028] Figure 8 Shown is a top view of the first auxiliary brush and the second auxiliary brush after calibration of the wafer brush auxiliary calibration device of the present invention.

[0029] Component number description

[0030] 01 Auxiliary brush

[0031] 011 First protrusion

[0032] 012 Second protrusion

[0033] 02 Wafer

[0034] 03 Driving wheel

[0035] 04 Speed ​​wheel

[0036] 1 Device body

[0037] 11 First side wall

[0038] 12 Second side wall

[0039] 13. First drive unit

[0040] 14 Second drive unit

[0041] 15 First follower

[0042] 16 Second follower

[0043] 17 Third side wall

[0044] 18 Fourth side wall

[0045] 2 First auxiliary brush

[0046] 21 first protrusion

[0047] 22 Second protrusion

[0048] 3 First auxiliary brush

[0049] 31 first protrusion

[0050] 32 Second protrusion

[0051] 4 Calibration Agency

[0052] 41 Fixing bracket

[0053] 411 First Bracket

[0054] 411a First fixing part

[0055] 411b Second fixing part

[0056] 412 Second bracket

[0057] 412a Third fixing part

[0058] 412b Fourth fixing portion

[0059] 42 Auxiliary positioning unit

[0060] 421 First card slot

[0061] 422 Second card slot

[0062] 423 Fixed part

[0063] 424 Contact Department DETAILED DESCRIPTION

[0064] The following is a description of the implementation of the present invention by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0065] See also Figures 1 to 8 It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change in the proportion relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the utility model without affecting the effects and purposes that can be achieved by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the utility model without substantially changing the technical content.

[0066] Embodiment 1

[0067] This embodiment provides a wafer brush auxiliary calibration device, such as Figure 3As shown, it is a top view of the wafer brush auxiliary calibration device, including: a device body 1, a first auxiliary brush 2, a second auxiliary brush 3 and a calibration mechanism 4, wherein the device body 1 at least includes a first side wall 11 and a second side wall 12 arranged oppositely, the first side wall 11 is provided with a first driving part 13 and a second driving part 14 arranged at intervals, and the second side wall 12 is provided with a first driven part 15 and a second driven part 16 arranged at intervals; the first auxiliary brush 2 is respectively mounted on the first driving part 13 and the first driven part 15 at two ends; the second auxiliary brush 3 is respectively mounted on the second driving part 14 and the second driven part 16 at two ends; the calibration mechanism 4 is fixed at a preset position on the device body 1, the calibration mechanism 4 at least includes a fixed bracket 41 and at least one auxiliary positioning unit 42 arranged on the fixed bracket 41, the auxiliary positioning unit 42 is provided with a first card slot 421 and a second card slot 422 arranged oppositely, the first card slot 421 and the second card slot 422 are respectively matched with the first auxiliary brush 2 and the second auxiliary brush 3.

[0068] Specifically, the device body 1 is a commonly used device for wafer cleaning in semiconductor processing equipment, and the model can be selected according to actual conditions and is not limited here.

[0069] Specifically, the two ends of the two wafer brushes in the actual wafer cleaning device are respectively connected to the first driving part 13 and the first driven part 15 or the second driving part 14 and the first driven part 16, and the first driving part 13 drives the first driven part 15 to move, and the second driving part 14 drives the second driven part 16 to move, so that the corresponding wafer brushes rotate around their own axes. Therefore, in the process of centering and calibrating the angle of the wafer brush, the position of the wafer brush can be calibrated by determining the positions of the first driving part 13 and the first driven part 15 or the second driving part 14 and the second driven part 16 at the two ends of different wafer brushes.

[0070] As an example, the device body 1 is also provided with a first angle adjustment plate (not shown) located at the first drive part 13 for adjusting the angle of the first drive part 13, and a second angle adjustment plate (not shown) located at the second drive part 14 for adjusting the angle of the second drive part 14.

[0071] Specifically, the first angle adjustment plate is provided with a first adjustment screw (not shown in the figure); the second angle adjustment plate is provided with a second adjustment screw (not shown in the figure).

[0072] Specifically, by tightening or loosening the first adjusting screw, the first angle adjustment plate can be fixed or pushed, thereby adjusting the position of the first driving unit 13; by tightening or loosening the second adjusting screw, the second angle adjustment plate can be fixed or pushed, thereby adjusting the position of the second driving unit 14.

[0073] Specifically, the first angle adjustment plate may also be located at the first driven part 15, or may also be located at the first driving part 13 and the first driven part 15 at the same time; the second angle adjustment plate may also be located at the second driven part 14, or may also be located at the second driving part 14 and the second driven part 16 at the same time, which can be selected according to actual conditions.

[0074] As an example, the device body 1 is further provided with a coupling (not shown) for driving the first auxiliary brush 2 and the second auxiliary brush 3 to move. In this embodiment, the coupling is located between the first driving part 13 and the second driving part 14 .

[0075] As an example, Figure 4-Figure 5 , which are a front view and a top view of the calibration mechanism 4 , respectively, the fixing bracket 41 includes a first bracket 411 whose two ends are respectively fixed to the first side wall 11 and the second side wall 12 .

[0076] Specifically, a first fixing portion 411a and a second fixing portion 411b are respectively provided at two ends of the first bracket 411, and the first bracket 411 is respectively fixed to the first side wall 11 and the second side wall 12 through the first fixing portion 411a and the second fixing portion 411b.

[0077] As an example, the projection of the clamping position of the first bracket 411 on the first side wall 11 is located between the first driving part 13 and the second driving part 14 , and the clamping position of the first bracket 111 on the second side wall 12 is located between the first driven part 15 and the second driven part 16 .

[0078] As an example, the fixing bracket 41 further includes a second bracket 412 which intersects with the first bracket 411 at the center of the first bracket 411 and is fixed to the device body 1 .

[0079] Specifically, two ends of the second bracket 412 are respectively fixed on the third side wall 17 and the fourth side wall 18 which are oppositely arranged.

[0080] Specifically, the third side wall 17 and the fourth side wall 18 are respectively disposed perpendicular to the first side wall 11 and the second side wall 12 .

[0081] Specifically, the second bracket 412 is provided with a third fixing portion 412a and a second fixing portion 412b at both ends thereof, and the first bracket 411 is fixed to the third side wall 17 and the fourth side wall 18 via the first fixing portion 412a and the second fixing portion 412b respectively.

[0082] Specifically, the first bracket 411 and the second bracket 412 are arranged to cross each other vertically.

[0083] Specifically, the auxiliary positioning unit 42 can be disposed on the first bracket 411 or on the second bracket 412 , and the selection can be made according to actual conditions.

[0084] As an example, the first auxiliary brush 2 is further provided with a first protrusion 21 and a second protrusion 22 which are arranged opposite to each other and are respectively spaced apart from the two ends of the first auxiliary brush 2 by a second preset distance; the second auxiliary brush 3 is further provided with a third protrusion 31 and a fourth protrusion 32 which are arranged opposite to each other and are respectively spaced apart from the two ends of the second auxiliary brush 3 by a third preset distance.

[0085] As an example, two auxiliary positioning units 42 are provided in the calibration mechanism 4 , and the two auxiliary positioning units 42 are arranged opposite to each other on the first bracket 411 , and the two auxiliary positioning units 42 are respectively spaced apart from two ends of the first bracket 411 by a first preset distance.

[0086] Specifically, under the condition that the performance of the wafer brush assisted calibration device is met, the first preset distance can be selected according to actual conditions and is not limited here.

[0087] Specifically, when two auxiliary positioning units 42 are provided in the calibration mechanism 4, when the calibration mechanism 4 is fixed on the device body 1, the surfaces of the first protrusion 21 and the third protrusion 31 away from the driving part are in contact with the auxiliary positioning unit 42 close to the first side wall 11, and the surfaces of the second protrusion 22 and the fourth protrusion 32 away from the driven part are in contact with the auxiliary positioning unit 42 close to the first side wall 11.

[0088] Specifically, the auxiliary positioning unit 42 is located between the first auxiliary brush 2 and the second auxiliary brush 3 .

[0089] As an example, Figure 6 As shown, it is a side view of the calibration mechanism 4, the auxiliary positioning unit 42 includes a fixed portion 423 and a contact portion 424 that are connected to each other, the fixed portion 423 is fixedly connected to the fixed bracket 41, the first card slot 421 and the second card slot 422 constitute the contact portion 424, and the contact portion 424 is fixedly connected to the fixed portion 423.

[0090] As an example, when the first protrusion 21 contacts the third protrusion 31, the distance between the second protrusion 22 and the fourth protrusion 32 is in the range of 0.18 mm to 0.22 mm. That is, in this embodiment, after the first auxiliary brush 2 and the second auxiliary brush 3 are adjusted by the calibration mechanism, when the first protrusion 21 contacts the third protrusion 31, the distance between the second protrusion 22 and the fourth protrusion 32 is 0.2 mm, which completes the auxiliary calibration of the wafer brush.

[0091] Specifically, Figure 7 , Figure 3 and Figure 8 The figures are respectively a top view of the first auxiliary brush 2 and the second auxiliary brush 3 installed on the device body 1, a top view of the wafer brush auxiliary calibration device, and a top view of the first auxiliary brush 2 and the second auxiliary brush 3 after calibration. In the process of auxiliary calibration of the wafer brush, the device body 1 is powered off and moisturizing is turned off, the original wafer brush is removed, the two ends of the first auxiliary brush 2 are respectively installed on the first driving part 13 and the first driven part 15, the two ends of the second auxiliary brush 3 are respectively installed on the second driving part 14 and the second driven part 16, the calibration mechanism 4 is clamped at a preset position on the device body 1, at this time the auxiliary positioning unit 42 is located between the first auxiliary brush 2 and the second auxiliary brush 3, the coupling is rotated, and the first adjusting screw and the second adjusting screw are loosened, and the first angle adjustment plate and the second angle adjustment plate are pushed. The plate is used to make the first protrusion 21 away from the surface of the first driving part 13 and the third protrusion 31 away from the surface of the second driving part 14, the second protrusion 22 away from the first driven part 15 and the fourth protrusion 32 away from the second driven part 16 respectively contact the auxiliary positioning unit 42, that is, the first card slot 421 and the second card slot 422 are completely fitted with the first auxiliary brush 2 and the second auxiliary brush 3 respectively, and the first adjusting screw and the second adjusting screw are fixed; the coupling is rotated to separate the first auxiliary brush 2 and the second auxiliary brush 3 from the calibration mechanism 4, and the calibration mechanism 4 is removed, and the coupling is rotated to make the first protrusion 21 contact with the third protrusion 31, and a feeler gauge is used to verify whether the distance between the second protrusion and the fourth protrusion 32 is 0.2 mm, that is, the centering and angle auxiliary calibration of the wafer brush are completed.

[0092] Specifically, the calibration mechanism 4 is also provided with an adjustment portion (not shown) for adjusting the distance between the second protrusion 22 and the fourth protrusion 32. The adjustment portion is used to achieve calibration results of different distances between the second protrusion 22 and the fourth protrusion 32 when the first protrusion 21 is in contact with the third protrusion 31.

[0093] Specifically, when the calibration mechanism 4 is used to adjust the first auxiliary brush 2 and the second auxiliary brush 3, other auxiliary positioning units 42 of different numbers and positions can be set in the calibration mechanism 4 to achieve calibration results in which different distances are presented between the third protrusion 22 and the fourth protrusion 32 when the first protrusion 21 contacts the third protrusion 31, so as to meet different production and processing requirements.

[0094] The wafer brush auxiliary calibration device of this embodiment adopts the first auxiliary brush 2, the second auxiliary brush 3 and the calibration mechanism 4 as the calibration tooling of the wafer brush, and the auxiliary positioning unit 42 with the first card slot 421 and the second card slot 422 is arranged in the calibration mechanism 4, and the first card slot 421 and the second card slot 422 are respectively matched with the first auxiliary brush 2 and the second auxiliary brush 3, by installing the two ends of the first auxiliary brush 2 on the first driving part 13 and the first driven part 15, and installing the two ends of the second auxiliary brush 3 on the second driving part 14 and the second driven part 16, the calibration mechanism 4 is clamped on the device body 1, so that the first card slot 421 and the second card slot 422 are respectively matched with the first auxiliary brush 2 and the second auxiliary brush 3, so that the centering and angle auxiliary calibration of the wafer brush can be realized. Compared with the traditional adjustment method, the calibration process is simplified, the calibration time is shortened, and the wafer processing efficiency is improved.

[0095] Embodiment 2

[0096] This embodiment provides a semiconductor process equipment, including the wafer brush auxiliary calibration device as described in the first embodiment.

[0097] Specifically, the two ends of the first auxiliary brush 2 in the wafer brush auxiliary calibration device are respectively installed on the first driving part 13 and the first driven part 15 of the device body 1, and the two ends of the second auxiliary brush 3 are respectively installed on the second driving part 14 and the second driven part 16. The calibration mechanism 4 is fixed to the device body 1 through the fixed bracket 41, and the first card slot 421 and the second card slot 422 on the auxiliary positioning unit 42 in the calibration mechanism 4 are fully fitted with the first auxiliary brush 2 and the second auxiliary brush 3 respectively, so as to realize the auxiliary calibration of the centering and angle of the wafer brush in the semiconductor process equipment.

[0098] The semiconductor process equipment of this embodiment uses the wafer brush auxiliary calibration device as described in Example 1 to assist in calibrating the wafer brush in the semiconductor process equipment, thereby simplifying the calibration process of the wafer brush and improving semiconductor processing efficiency.

[0099] In summary, the wafer brush auxiliary calibration device of the utility model adopts the first auxiliary brush and the second auxiliary brush with the calibration mechanism as the calibration tooling of the wafer brush, and an auxiliary positioning unit with a first card slot and a second card slot is provided in the calibration mechanism, and the first card slot and the second card slot are respectively matched with the first auxiliary brush and the second auxiliary brush, by installing the two ends of the first auxiliary brush on the first driving part and the first driven part, and installing the two ends of the second auxiliary brush on the second driving part and the second driven part, the calibration mechanism is clamped on the device body, so that the first card slot and the second card slot are respectively matched with the first auxiliary brush and the second auxiliary brush, and the auxiliary calibration of the centering and angle of the wafer brush can be realized. Compared with the traditional adjustment method, the calibration process is simplified, the calibration time is shortened, and it is applied to semiconductor processing equipment to improve the semiconductor processing efficiency. Therefore, the utility model effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0100] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer brush auxiliary calibration device, characterized in that: include: The device body at least comprises a first side wall and a second side wall which are arranged opposite to each other, wherein the first side wall is provided with a first driving part and a second driving part which are arranged at intervals, and the second side wall is provided with a first driven part and a second driven part which are arranged at intervals; A first auxiliary brush, two ends of which are respectively mounted on the first driving part and the first driven part; A second auxiliary brush, two ends of which are respectively mounted on the second driving part and the second driven part; A calibration mechanism is fixed at a preset position on the device body, and the calibration mechanism at least includes a fixed bracket and at least one auxiliary positioning unit arranged on the fixed bracket. The auxiliary positioning unit is provided with a first card slot and a second card slot arranged opposite to each other, and the first card slot and the second card slot are respectively matched with the first auxiliary brush and the second auxiliary brush.

2. The wafer brush auxiliary calibration device according to claim 1, characterized in that: The device body is also provided with a first angle adjustment plate located at the first driving part for adjusting the position of the first driving part, and a second angle adjustment plate located at the second driving part for adjusting the position of the second driving part.

3. The wafer brush auxiliary calibration device according to claim 1, characterized in that: The device body is also provided with a coupling for driving the first auxiliary brush and the second auxiliary brush to move.

4. The wafer brush auxiliary calibration device according to claim 1, characterized in that: The fixing bracket comprises a first bracket with two ends respectively fixed on the first side wall and the second side wall.

5. The wafer brush auxiliary calibration device according to claim 4, characterized in that: The fixing bracket also includes a second bracket which intersects with the first bracket at the center of the first bracket and is fixed on the device body.

6. The wafer brush auxiliary calibration device according to claim 4, characterized in that: The projection of the clamping position of the first bracket on the first side wall is located between the first driving part and the second driving part, and the projection of the clamping position of the first bracket on the second side wall is located between the first driven part and the second driven part.

7. The wafer brush auxiliary calibration device according to claim 4, characterized in that: The calibration mechanism is provided with two auxiliary positioning units, the two auxiliary positioning units are arranged opposite to each other on the first bracket, and the two auxiliary positioning units are respectively spaced apart from two ends of the first bracket by a first preset distance.

8. The wafer brush auxiliary calibration device according to claim 1, characterized in that: The auxiliary positioning unit includes a fixed portion and a contact portion connected to each other, the fixed portion is fixedly connected to the fixed bracket, the first card slot and the second card slot constitute the contact portion, and the contact portion is fixedly connected to the fixed portion.

9. The wafer brush auxiliary calibration device according to claim 1, characterized in that: The first auxiliary brush is also provided with a first protrusion and a second protrusion which are arranged opposite to each other and are respectively spaced apart from the two ends of the first auxiliary brush by a second preset distance; the second auxiliary brush is also provided with a third protrusion and a fourth protrusion which are arranged opposite to each other and are respectively spaced apart from the two ends of the second auxiliary brush by a third preset distance.

10. The wafer brush assisted calibration device according to claim 9, characterized in that: When the first protrusion contacts the third protrusion, the distance between the second protrusion and the fourth protrusion is in the range of 0.18 mm to 0.22 mm.

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