Lamp holder module
By using ultrasonic welding process in the lamp head module instead of the low-pressure injection molding process and using aluminum substrates to improve heat dissipation performance, the problems of complex processes, high costs and environmental pollution in the existing technology are solved, and a more efficient and safer assembly process is achieved.
Patent Information
- Application Number
- CN202421396695.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-19
AI Technical Summary
The low-pressure injection molding process of existing lamp head modules is complex, has low assembly efficiency, high cost, and the primer process is prone to environmental pollution and threatens the health of staff.
Ultrasonic welding process is used to replace the traditional low-pressure injection molding process, and the entire circle of welding is performed by setting matching welding grooves and welding convex rings on the opposite sides of the shell and the back cover. At the same time, an aluminum substrate is used as a PCB substrate to improve the heat dissipation performance of LED lamp beads.
The process flow is simplified, assembly efficiency is improved, cost is saved, environmental pollution and health threats to staff, and the reliability of the lamp head module is improved.
Smart Images

Figure CN222688037U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of automobiles, in particular to a lamp holder module. Background Art
[0002] Light guide is a transmission medium that can guide light from a light source to the position where it needs to be illuminated. In the automotive field, it is mostly used as an atmosphere light in the automotive interior system and the automotive exterior system. The lamp holder module is the core component used to light up the light guide. The lamp holder module usually includes a housing, a PCBA board and a back cover. Most of the existing structures fasten the housing and the PCBA board with screws, and then perform low-pressure injection molding on the back cover, the housing and the PCBA board as a whole to form the final lamp holder module. However, the overall process of the low-pressure injection molding process is complicated, the assembly efficiency is low, the cost is high, and before low-pressure injection molding, a primer coating process is required on the housing, which is not only easy to cause environmental pollution, but also threatens the health of workers. Utility Model Content
[0003] In view of this, an embodiment of the utility model provides a lamp holder module to solve the technical problems of the existing lamp holder module, such as complex low-pressure injection molding process, low assembly efficiency, high cost, and primer that easily causes environmental pollution and threatens the health of workers.
[0004] The utility model provides a lamp holder module, comprising a housing, a rear cover and a PCBA board, wherein the rear cover is covered on the housing and encloses the housing to form a mounting cavity, and the PCBA board is arranged in the mounting cavity; a light guide connection seat is arranged on the side of the housing away from the rear cover, and an insertion hole for inserting the end of the light guide is opened on the light guide connection seat, and the insertion hole is communicated with the mounting cavity;
[0005] The edges of the shell and the back cover on opposite sides are correspondingly provided with matching welding grooves and welding convex rings, and the welding convex rings are embedded in the welding grooves and are fully welded by ultrasonic welding technology.
[0006] Optionally, the PCBA board includes a PCB substrate and an LED lamp bead and a plug-in assembly arranged on the PCB substrate, the two ends of the LED lamp bead are respectively connected to the plug-in assembly, and two capacitors with different capacitances are connected in parallel between the LED lamp bead and the plug-in assembly; the light-emitting surface of the LED lamp bead faces the insertion hole; a wiring port is provided at one end of the shell close to the plug-in assembly, and a plurality of PIN pins are integrated on the plug-in assembly, and the PIN pins extend into the wiring port.
[0007] Optionally, the PCB substrate adopts an aluminum substrate, a single-layer circuit board structure, and a copper plating thickness of 35 μm.
[0008] Optionally, the PCB substrate is surface treated by a gold plating process, and the gold plating thickness is 0.05 μm.
[0009] Optionally, a cavity wall of the installation cavity is provided with a limiting convex rib, and a limiting groove matching the limiting convex rib is correspondingly provided on the PCBA board.
[0010] Optionally, a snap-fitting protrusion is provided on the outer side wall of the optical waveguide connection seat, an elastic sleeve is sleeved on the end of the optical waveguide, and an elastic buckle that snaps into engagement with the snap-fitting protrusion is provided at one end of the elastic sleeve that faces the optical waveguide connection seat.
[0011] Optionally, a fixing hole is provided on a side of the shell facing away from the back cover.
[0012] Optionally, a heat dissipation protrusion is provided on a side of the back cover facing the installation cavity.
[0013] The utility model embodiment has the following beneficial effects:
[0014] 1. Matching welding grooves and welding convex rings are set on the opposite sides of the shell and the back cover. The welding convex ring is embedded in the welding groove and welded in a whole circle through ultrasonic welding process; the ultrasonic welding process is used to replace the traditional low-pressure injection molding process, which not only simplifies the process flow, improves assembly efficiency, saves primer and mold costs, but also avoids the pollution of the primer process to the environment, optimizes the production environment of employees, and avoids the threat of primer process to the health of workers; at the same time, it can also greatly improve the pulling force between the shell and the back cover to ensure the overall reliability of the lamp head module.
[0015] 2. The PCB substrate of the PCBA board uses an aluminum substrate instead of the traditional FR-4 epoxy resin substrate, which can effectively improve the heat dissipation performance of the LED lamp beads and improve the safety of the lamp head module. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;
[0018] Figure 2 A cross-sectional view of an embodiment of the utility model;
[0019] Figure 3 This is a schematic diagram of the split structure of an embodiment of the utility model;
[0020] Figure 4 This is a schematic diagram of the structure of the back cover in the embodiment of the utility model;
[0021] Figure 5 This is a schematic diagram of the structure of the PCBA board in the embodiment of the utility model;
[0022] Figure 6 This is a circuit schematic diagram of the PCBA board in the embodiment of the utility model;
[0023] Figure 7 It is a schematic diagram of the assembly structure of the embodiment of the utility model and the light guide;
[0024] The numbers in the figure represent:
[0025] 1. Shell; 11. Welding groove; 12. Light guide connection seat; 13. Insertion hole; 14. Wiring port; 15. Snap-on protrusion; 16. Fixing hole;
[0026] 2. Back cover; 21. Heat dissipation protrusion; 22. Welding protrusion;
[0027] 3. PCBA board; 31. Limiting groove; 32. PCB substrate; 33. LED lamp beads; 34. Connector assembly; 35. Capacitor; 36. PIN needle;
[0028] 4. Installation cavity; 41. Limiting ribs;
[0029] 5. Light guide; 51. Elastic sleeve; 52. Elastic buckle. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the utility model, and are not used to limit the utility model.
[0031] See also Figure 1-Figure 3 As shown, the embodiment of the utility model provides a lamp holder module, including a housing 1, a rear cover 2 and a PCBA board 3. The rear cover 2 covers the housing 1 and forms a mounting cavity 4 with the housing 1. The PCBA board 3 is arranged in the mounting cavity 4 as a light source. Furthermore, the embodiment of the utility model is provided with a limiting rib 41 on the cavity wall of the mounting cavity 4, and a limiting groove 31 matching the limiting rib 41 is correspondingly provided on the PCBA board 3, so as to facilitate the installation and positioning of the PCBA board 3. Figure 4As shown, a heat dissipation protrusion 21 is also provided on the side of the back cover 2 facing the installation cavity 4. After the back cover 2 is closed onto the shell 1, the heat dissipation protrusion 21 can abut against the PCBA board 3, so that a certain gap is left between the PCBA board 3 and the back cover 2 to facilitate heat dissipation.
[0032] Matching welding grooves 11 and welding convex rings 22 are correspondingly provided on the edges of the opposite sides of the shell 1 and the back cover 2. The welding convex ring 22 is embedded in the welding groove 11 and welded in a whole circle through an ultrasonic welding process. The ultrasonic welding process is used instead of the traditional low-pressure injection molding process, which not only simplifies the process flow, improves assembly efficiency, saves primer and mold costs, but also avoids the pollution of the primer process to the environment, optimizes the production environment for employees, and avoids the threat of the primer process to the health of workers. At the same time, it can also greatly improve the pulling force between the shell 1 and the back cover 2 to ensure the overall reliability of the lamp holder module.
[0033] A light guide connection seat 12 is disposed on the side of the housing 1 away from the rear cover 2. The light guide connection seat 12 is provided with an insertion hole 13 for inserting the end of the light guide 5. The insertion hole 13 is connected to the installation cavity 4 so that the light emitted by the PCBA board 3 can smoothly enter the light guide 5. Specifically, Figure 5 , Figure 6 As shown, the PCBA board 3 in the embodiment of the utility model includes a PCB substrate 32 and an LED lamp bead 33 and a plug-in assembly 34 arranged on the PCB substrate 32. The two ends of the LED lamp bead 33 are respectively connected to the plug-in assembly 34, and two capacitors 35 with different capacitances are connected in parallel between the LED lamp bead 33 and the plug-in assembly 34. The light-emitting surface of the LED lamp bead 33 faces the insertion hole 13. Therefore, after the light guide 5 is inserted into the insertion hole 13, the light emitted by the LED lamp bead 33 can enter the light guide 5 from the end face of the light guide 5 as much as possible. A wiring port 14 is provided at one end of the housing 1 close to the plug-in assembly 34. A plurality of PIN pins 36 are integrated on the plug-in assembly 34. The PIN pins 36 extend into the wiring port 14 to facilitate wiring.
[0034] Furthermore, the PCB substrate 32 in the embodiment of the utility model adopts an aluminum substrate and a single-layer circuit board structure. For reference, the copper plating thickness is 35μm. Compared with the traditional FR-4 epoxy resin substrate, the aluminum substrate can effectively improve the heat dissipation performance of the LED lamp bead 33, thereby improving the safety of the lamp head module. In order to prevent copper from being oxidized by long-term exposure to air and affecting its conductive function, the PCB substrate 32 can also be surface treated by a gold plating process. For reference, the gold plating thickness is 0.05μm.
[0035] In addition, as an optional assembly method, such as Figure 7As shown, in the embodiment of the utility model, a snap-on protrusion 15 is provided on the outer wall of the light guide connection seat 12, and an elastic sleeve 51 is sleeved on the end of the light guide 5. An elastic buckle 52 is provided at one end of the elastic sleeve 51 facing the light guide connection seat 12, which is snap-fitted with the snap-on protrusion 15; after the light guide 5 is inserted into the insertion hole 13, the light guide connection seat 12 can snap-fit with the elastic sleeve 51 through the snap-on protrusion 15 and the elastic buckle 52, so that the lamp holder module is snap-fitted and installed to the end of the light guide 5 to form a complete light strip. Furthermore, a fixing hole 16 can be provided on the side of the housing 1 away from the rear cover 2 to facilitate the installation and fixing of the entire lamp holder module (for example, the lamp holder module is fixed to the vehicle body by screws).
[0036] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present invention. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A lamp holder module, characterized in that: The invention comprises a housing, a rear cover and a PCBA board, wherein the rear cover is covered on the housing and encloses the housing to form an installation cavity, and the PCBA board is arranged in the installation cavity; a light guide connection seat is arranged on the side of the housing away from the rear cover, and an insertion hole for inserting the end of the light guide is opened on the light guide connection seat, and the insertion hole is connected with the installation cavity; The edges of the shell and the back cover on opposite sides are correspondingly provided with matching welding grooves and welding convex rings, and the welding convex rings are embedded in the welding grooves and are fully welded by ultrasonic welding technology.
2. A lamp holder module according to claim 1, characterized in that: The PCBA board includes a PCB substrate, and an LED lamp bead and a plug-in assembly arranged on the PCB substrate, wherein two ends of the LED lamp bead are respectively connected to the plug-in assembly, and two capacitors with different capacitances are connected in parallel between the LED lamp bead and the plug-in assembly; the light-emitting surface of the LED lamp bead faces the insertion hole; a wiring port is provided at one end of the shell close to the plug-in assembly, and a plurality of PIN pins are integrated on the plug-in assembly, and the PIN pins extend into the wiring port.
3. A lamp holder module according to claim 2, characterized in that: The PCB substrate adopts an aluminum substrate, a single-layer circuit board structure, and a copper plating thickness of 35 μm.
4. A lamp holder module according to claim 3, characterized in that: The PCB substrate is surface treated by a gold plating process, and the gold plating thickness is 0.05 μm.
5. The lamp holder module according to claim 1, characterized in that: A limiting convex rib is provided on the cavity wall of the installation cavity, and a limiting groove matching the limiting convex rib is correspondingly provided on the PCBA board.
6. The lamp holder module according to claim 1, characterized in that: A clamping protrusion is arranged on the outer side wall of the optical guide connection seat, an elastic sleeve is sleeved on the end of the optical guide, and an elastic buckle is arranged on one end of the elastic sleeve facing the optical guide connection seat to clamp with the clamping protrusion.
7. The lamp holder module according to claim 1, characterized in that: A fixing hole is arranged on a side of the housing facing away from the rear cover.
8. The lamp holder module according to claim 1, characterized in that: A heat dissipation protrusion is arranged on one side of the rear cover facing the installation cavity.