Three-dimensional scanner

Abstract

The utility model discloses a three-dimensional scanner. The three-dimensional scanner comprises a photoelectric support, a laser emitting assembly and an acquisition module. The front end of the photoelectric support is provided with a first mounting hole, a second mounting hole and a third mounting hole, and the rear end is provided with a first mounting cavity. The laser emission assembly comprises a speckle laser emission module, a line laser emission module and an installation support, the installation support is installed in the first installation cavity, and the speckle laser emission module and the line laser emission module are installed on the installation support and are exposed through the first installation hole and the second installation hole respectively; the speckle laser emission module and the line laser emission module are respectively used for emitting speckle laser and line laser to a target; the acquisition module is mounted in the third mounting hole and is used for acquiring speckle laser and line laser reflected by the target; the mainboard is installed at the rear end of the photoelectric support and is electrically connected with the speckle laser emission module, the line laser emission module and the acquisition module. The three-dimensional scanner integrates two scanning modes of line scanning and speckle scanning.

Description

Technical Field

[0001] The present application relates to the technical field of three-dimensional scanning, and more specifically, to a three-dimensional scanner. Background Art

[0002] Optical 3D scanners use optical imaging technology to obtain the 3D shape and data of the scanned object, and have been widely used in many fields such as industrial product inspection, reverse engineering, simulation, and cultural relic protection. Optical 3D scanners are generally divided into speckle laser 3D scanners and line laser 3D scanners. Speckle laser 3D scanners and line laser 3D scanners have different scanning accuracies and can be used in different application scenarios (such as scanning objects of different sizes, etc.).

[0003] A 3D scanner cannot be compatible with both line laser scanning and speckle laser scanning. Different 3D scanners are required for different application scenarios, resulting in high usage costs. Summary of the invention

[0004] The embodiment of the present application provides a three-dimensional scanner, aiming to solve the technical problem of how to integrate two scanning modes, line laser scanning and speckle laser scanning, into a three-dimensional scanner.

[0005] The three-dimensional scanner of the embodiment of the present application includes a photoelectric bracket, a laser emitting assembly and a collection module, the photoelectric bracket is provided with a first mounting hole, a second mounting hole and a third mounting hole at the front end, and a first mounting cavity communicated with the second mounting hole and the third mounting hole at the rear end; the laser emitting assembly includes a speckle laser emitting module, a line laser emitting module and a mounting bracket, the mounting bracket is installed in the first mounting cavity, the speckle laser emitting module and the line laser emitting module are installed on the mounting bracket and exposed through the first mounting hole and the second mounting hole respectively, the speckle laser emitting module and the line laser emitting module are respectively used to emit speckle laser and line laser to the target; the collection module is installed in the third mounting hole, and is used to collect the speckle laser and line laser reflected back by the target; the main board is installed at the rear end of the photoelectric bracket, and is electrically connected to the speckle laser emitting module, the line laser emitting module and the collection module.

[0006] In some embodiments, the three-dimensional scanner also includes a connection interface, and the three-dimensional scanner is communicatively connected to a host computer via the connection interface. A processing chip is provided on the main board, and the processing chip is electrically connected to the speckle laser emission module, the line laser emission module, the acquisition module and the connection interface. The processing chip is used to: control the speckle laser emission module, the line laser emission module and the acquisition module, receive image data acquired by the acquisition module, calculate a depth image of the target based on the image data, and / or output the image data to the host computer via the connection interface.

[0007] In some embodiments, the laser emission assembly further comprises a light source circuit board, which is fixed to the rear end of the mounting bracket and is electrically connected to the speckle laser emission module and the line laser emission module. In some embodiments, the light source circuit board is provided with a first avoidance hole corresponding to the line laser emission module, and the line laser emission module is provided with the first avoidance hole.

[0008] In some embodiments, the mounting bracket includes a first mounting portion and a second mounting portion located on one side of the first mounting portion, a second mounting cavity is formed at the rear end of the first mounting portion, a first exposure hole communicating with the second mounting cavity is provided at the front end, the line laser emission module is installed in the second mounting cavity and exposed through the first exposure hole, and the speckle laser emission module is installed on the second mounting portion. In some embodiments, the laser emission assembly also includes a first adapter bracket, the first adapter bracket is fixed to the second mounting portion, the first adapter bracket is provided with a first mounting groove, and the speckle laser emission module is fixed in the first mounting groove.

[0009] In some embodiments, the acquisition module includes a camera bracket, a lens and a camera circuit board. The rear end of the photoelectric bracket is provided with a third mounting cavity communicated with the first mounting hole. The lens is installed at the front end of the camera bracket, the camera circuit board is installed at the rear end of the camera bracket, and the camera bracket is installed in the third mounting cavity. In some embodiments, there are two acquisition modules, the laser emission assembly is located between the two acquisition modules, and the two acquisition modules are inclined toward the front end of the laser emission assembly. In some embodiments, the photoelectric bracket includes a main body and ends connected to both ends of the main body, the main body is formed with a first mounting cavity, a first mounting hole and a second mounting hole, and the ends are formed with a third mounting hole. In some embodiments, the two ends are inclined toward the center of the front end of the main body and form an angle with the main body.

[0010] In some embodiments, a plurality of heat dissipation teeth are formed at the front end of the optoelectronic support; and / or a heat-conducting boss is formed at the rear end of the optoelectronic support, and the heat-conducting boss contacts the processing chip on the mainboard.

[0011] In some embodiments, the three-dimensional scanner further includes a front shell and a rear shell, the front shell and the rear shell are enclosed to form a receiving cavity, and the photoelectric bracket is fixed on the front shell or the rear shell and received in the receiving cavity.

[0012] In some embodiments, the three-dimensional scanner also includes a fan assembly, a second mounting slot and an air inlet communicating with the second mounting slot are provided in the front shell on one side of the photoelectric bracket, an air outlet is provided in the front shell on the other side of the photoelectric bracket, and the fan assembly is installed in the second mounting slot; and / or, the three-dimensional scanner also includes a fill light assembly, the fill light assembly includes a fill light circuit board and multiple fill lights arranged on the fill light circuit board, the fill light circuit board is provided with a second avoidance hole, the multiple fill lights surround the second avoidance hole, the fill light circuit board is fixed to the front end of the photoelectric bracket, and the acquisition module is passed through the second avoidance hole; and / or, the three-dimensional scanner also includes a button assembly, the button assembly includes a button circuit board, a button bracket and a button, the button bracket is fixed on the inner side of the rear shell, and the button The key circuit board is fixed to the rear end of the key bracket and is electrically connected to the mainboard, the key is arranged on the key bracket and in contact with the key circuit board, and the key extends out of the rear shell through the key hole at the rear end of the rear shell; and / or, the three-dimensional scanner also includes an interface component, the interface component includes an interface circuit board and a connection interface, the interface circuit board is fixed in the rear shell and is electrically connected to the mainboard, the connection interface is arranged on the interface circuit board and exposed through the interface hole on the rear shell; and / or, the three-dimensional scanner also includes a handpiece, the handpiece is sleeved on the rear end of the rear shell, and a handpiece is provided with a handheld structure; and / or, the three-dimensional scanner also includes a plurality of support members, at least some of the plurality of support members are arranged at the bottom end of the rear shell, so that there is a gap between the bottom of the rear shell and the placement surface of the three-dimensional scanner.

[0013] In the three-dimensional scanner provided in the embodiment of the present application, the laser emitting component fixes the speckle laser emitting module and the line laser emitting module on the mounting bracket, and the laser emitting component is fixed on the photoelectric bracket through the mounting bracket. The acquisition module and the laser emitting component are positioned through the photoelectric bracket to ensure the accuracy of the three-dimensional scanner. The acquisition module can collect the reflected speckle laser and line laser. Therefore, the three-dimensional scanner integrates two scanning modes, line scanning and speckle scanning. Therefore, a three-dimensional scanner can be applied to different working scenarios, such as scanning both large objects and small objects, and the application of three-dimensional scanners is more extensive.

[0014] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a schematic diagram of the three-dimensional structure of a three-dimensional scanner according to an embodiment of the present application;

[0017] Figure 2is a schematic diagram of the exploded structure of a three-dimensional scanner according to an embodiment of the present application;

[0018] Figure 3 is a schematic cross-sectional structure diagram of a three-dimensional scanner according to an embodiment of the present application;

[0019] Figure 4 is a schematic diagram of the three-dimensional structure of a three-dimensional scanner according to an embodiment of the present application;

[0020] Figure 5 is a schematic diagram of the exploded structure of a three-dimensional scanner according to an embodiment of the present application;

[0021] Figure 6 It is a schematic diagram of the cross-sectional structure of a three-dimensional scanner according to an embodiment of the present application.

[0022] Description of main component symbols:

[0023] Photoelectric bracket 10, main body 11, end 12, boss 13, heat-conducting boss 14, heat dissipation teeth 15, laser emitting assembly 20, speckle laser emitting module 21, line laser emitting module 22, mounting bracket 23, first adapter bracket 24, light source circuit board 25, acquisition module 30, lens 31, camera bracket 32, camera circuit board 33, main board 40, texture camera module 50, second adapter bracket 51, front shell 60, second mounting slot 61, air inlet 62, air outlet 63, rear shell 70, fan assembly 81, fill light assembly 82, fill light circuit board 821, fill light 822, button assembly 83, button circuit board 831, button bracket 832, button 833, interface assembly 84, interface circuit board 841, connection interface 842, handpiece 85, support piece 86, glass cover 87. DETAILED DESCRIPTION

[0024] The following further describes the embodiments of the present application in conjunction with the accompanying drawings. The same or similar reference numerals in the accompanying drawings represent the same or similar elements or elements with the same or similar functions.

[0025] In addition, the embodiments of the present application described below in conjunction with the drawings are exemplary and are only used to explain the embodiments of the present application and should not be construed as limiting the present application.

[0026] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0027] See also Figure 1 and Figure 2 The embodiment of the present application provides a three-dimensional scanner, which includes an optoelectronic support 10, a laser emitting assembly 20, a collection module 30 and a main board 40. The optoelectronic support 10 has a first mounting hole, a second mounting hole and a third mounting hole at the front end, and a first mounting cavity communicating with the first mounting hole and the second mounting hole at the rear end; the laser emitting assembly 20 includes a speckle laser emitting module 21, a line laser emitting module 22 and a mounting support 23, the mounting support 23 is mounted in the first mounting cavity, the speckle laser emitting module 21 and the line laser emitting module 22 are mounted on the mounting support 23 and exposed through the first mounting hole and the second mounting hole respectively, the speckle laser emitting module 21 and the line laser emitting module 22 are used to emit speckle laser and line laser to the target respectively; the collection module 30 is installed in the third mounting hole, and is used to collect the speckle laser and line laser reflected back by the target; the main board 40 is installed at the rear end of the optoelectronic support 10, and is electrically connected to the speckle laser emitting module 21, the line laser emitting module 22 and the collection module 30.

[0028] In the three-dimensional scanner provided in the embodiment of the present application, the laser emitting component 20 fixes the speckle laser emitting module 21 and the line laser emitting module 22 on the mounting bracket 23, and the laser emitting component 20 is fixed on the photoelectric bracket 10 through the mounting bracket 23. The acquisition module 30 and the laser emitting component 20 are positioned by the photoelectric bracket 10 to ensure the accuracy of the three-dimensional scanner. The acquisition module 30 can collect the reflected speckle laser and line laser. Therefore, the three-dimensional scanner integrates two scanning modes, line scanning and speckle scanning, and thus a three-dimensional scanner can be applied to different working scenarios, such as scanning both large objects and small objects, and the application of three-dimensional scanners is more extensive.

[0029] The three-dimensional scanner has two scanning modes, namely, a speckle scanning mode and a line scanning mode, to correspond to different working scenes respectively. For example, the speckle scanning mode can correspond to scenes of large objects and medium and long distances, and the line scanning mode can correspond to scenes of small objects and close distances. The three-dimensional scanner may also include a connection interface 842, through which the three-dimensional scanner may communicate with the host computer to receive instructions from the host computer (such as speckle scanning instructions, line scanning instructions, etc.) and output scanning data to the host computer. A processing chip is provided on the main board 40, and the processing chip is electrically connected to the laser emission module 21, the line laser emission module 22, the acquisition module 30 and the connection interface 842. The processing chip may output control signals to the speckle laser emission module 21, the line laser emission module 22 and the acquisition module 30 to realize speckle scanning and line scanning. In the speckle scanning mode, the processing chip can control the speckle laser emission module 21 and the acquisition module 30 to start synchronously. The speckle laser emission module 21 emits speckle laser to the target, and the acquisition module 30 collects the speckle laser reflected by the target to generate a speckle image and transmits it to the processing chip. The processing chip can calculate the depth image of the target based on the speckle image and / or output the speckle image to the host computer that communicates with the three-dimensional scanner through the connection interface 842. In the line scanning mode, the processing chip can control the line laser emission module 22 and the acquisition module 30 to start synchronously. The line laser emission module 22 emits a line laser to the target, and the acquisition module 30 collects the line laser reflected by the target to generate a line laser image and transmit it to the main board 40. The processing chip can calculate the depth image of the target based on the line laser image and / or output the line laser image to the host computer through the connection interface 842. The processing chip can also output other image data (such as a depth image) and other working data to the host computer through the connection interface 842. The processing chip can also further generate a point cloud image based on the depth image and transmit the point cloud image to the host computer. In such a case, Figure 1 In the illustrated embodiment, the number of acquisition modules 30 may be two, forming a binocular imaging system, and the processing chip may calculate the depth image of the target based on the speckle images or line laser images acquired by the two acquisition modules 30 and / or output the image data acquired by the two acquisition modules 30 to a host computer.

[0030] like Figures 1 to 3 As shown, the photoelectric bracket 10 includes a main body 11 and end portions 12 connected to both ends of the main body 11. The front end of the main body 11 is provided with a first mounting hole and a second mounting hole, and the rear end is provided with a first mounting cavity communicated with the first mounting hole and the second mounting hole. The mounting bracket 23 is fixedly installed in the first mounting cavity, and the front ends of the two end portions 12 are provided with third through holes. The two acquisition modules 30 are respectively installed in the third mounting holes of the two end portions 12. Therefore, the distance between the two acquisition modules 30 (i.e., the baseline distance) is large, so that the three-dimensional scanner has a higher scanning accuracy.

[0031] The rear end of the photoelectric bracket 10 may be provided with a boss 13, and the main board 40 is fixed on the boss 13. The boss 13 allows a gap between the main board 40 and the photoelectric bracket 10 to prevent the photoelectric bracket 10 from crushing the electronic components on the main board 40 when impacted. A processing chip is provided on the side of the main board 40 opposite to the photoelectric bracket 10, and a heat-conducting boss 14 may be provided at the rear end of the photoelectric bracket 10. The heat-conducting boss 14 contacts the processing chip, which may be direct contact or indirect contact through thermal grease, so that the heat generated by the processing chip can be timely conducted to the photoelectric bracket 10 through the heat-conducting boss 14, so that the temperature of the processing chip will not be too high, and the stability of the processing chip during operation is ensured. The front end of the photoelectric bracket 10 may be formed with heat dissipation teeth 15 to achieve weight reduction and increase the heat dissipation area, so that the heat dissipation performance of the photoelectric bracket 10 is better and the weight is lighter; wherein, the heat dissipation teeth 15 may be distributed on the main body 11 at both ends of the laser emitting assembly 20, and multiple heat dissipation teeth 15 may be distributed in a horizontal or vertical interval.

[0032] like Figures 1 to 3 As shown, the mounting bracket 23 includes a first mounting portion and a second mounting portion located on one side of the first mounting portion. The back of the first mounting portion is provided with a second mounting cavity, and the front portion is provided with a first exposure hole communicating with the second mounting cavity. The line laser emission module 22 is installed in the second mounting cavity and exposed through the first exposure hole. When there are multiple line laser emission modules 22, there can be multiple second mounting cavities adjacent to each other. The speckle laser emission module 21 is installed on the second mounting portion. Thus, the speckle laser emission module 21 and the line laser emission module 22 can be arranged in the horizontal direction with the acquisition module 30.

[0033] In some embodiments, the laser emission assembly 20 further includes a first adapter bracket 24, a first mounting groove is provided at the front end of the first adapter bracket 24, the speckle laser emission module 21 is fixed in the first mounting groove of the first adapter bracket 24, and the first adapter bracket 24 is fixed on the second part and is located in the second mounting hole. In other embodiments, the speckle laser emission module 21 can also be directly installed on the second mounting portion, for example, a mounting groove is provided on the second mounting portion, and the speckle laser emission module 21 is fixed in the mounting groove. The number of the speckle laser emission modules 21 can be one or more, for example, one, two, three or more, and when there are multiple speckle laser emission modules 21, multiple speckle laser emission modules 21 can be arranged adjacent to each other.

[0034] In some embodiments, Figure 3As shown, the laser emitting assembly 20 further includes a light source circuit board 25, which is fixed to the rear end of the mounting bracket 23 and is electrically connected to the speckle laser emitting module 21 and the line laser emitting module 22. The light source circuit board 25 is also electrically connected to the main board 40, that is, the speckle laser emitting module 21 and the line laser emitting module 22 are electrically connected to the main board 40 through the light source circuit board 25. Since the length of the line laser emitting module 22 in the Z direction is relatively long, the light source circuit board 25 is provided with a first avoidance hole for avoiding the line laser emitting module 22, and the line laser emitting module 22 is penetrated with the first avoidance hole to reduce the thickness of the laser emitting assembly 20, thereby compressing the thickness of the three-dimensional scanner.

[0035] like Figures 1 to 3 As shown, the acquisition module 30 can be a camera module capable of acquiring line lasers and speckle lasers. The acquisition module 30 includes a lens 31, a camera bracket 32 ​​and a camera circuit board 33. The camera circuit board 33 is fixed at the rear end of the camera bracket 32 ​​and is electrically connected to the main board 40. The lens 31 is installed at the front end of the camera bracket 32. The camera bracket 32 ​​is installed in the second installation cavity and fixed at the rear end or the installation cavity of the photoelectric bracket 10. Because if the acquisition module 30 is fixed to the photoelectric bracket 10 through the camera circuit board 33, the camera circuit board 33 may be deformed and damaged or the accuracy may be affected due to the relatively poor deformation resistance of the camera circuit board 33. However, when the acquisition module 30 is fixed to the photoelectric bracket 10 through the camera bracket 32, when the three-dimensional scanner is impacted, the impact is borne by the camera bracket 32 ​​after it is transmitted to the photoelectric bracket 10. The camera bracket 32 ​​has high hardness and strength and is not easily deformed, so that the camera circuit board 33 is not easily deformed, which can ensure the stability of the acquisition module 30.

[0036] In some embodiments, the laser emission assembly 20 is located between two acquisition modules 30, and the two acquisition modules 30 are tilted toward the front end of the laser emission assembly 20. Thus, compared with the parallel arrangement of the optical axes of the two acquisition modules 30, this embodiment can increase the overlapping area of ​​the field of view of the two acquisition modules 30, that is, increase the effective scanning area during the scanning process and thus improve the scanning efficiency of the three-dimensional scanner. Among them, the third mounting hole can be tilted to tilt the acquisition module 30, or the acquisition module 30 can be tilted by setting a tilting block, and so on. These methods are not listed here one by one. Figures 1 to 3 In the illustrated embodiment, the two end portions 12 are inclined toward the front end of the main body 11 and form an angle with the main body 11 , thereby causing the two collection modules 30 to be inclined toward the laser emitting assembly 20 .

[0037] In some embodiments, the three-dimensional scanner may further include a texture camera module 50, which is fixed to the front side of the optoelectronic support 10 and electrically connected to the main board 40. The texture camera module 50 is used to collect texture images to obtain the real texture information of the target during three-dimensional scanning. The three-dimensional scanner may also include a second adapter bracket 51, on which the texture camera module 50 may be fixed, and the second adapter bracket 51 is fixed to the front side of the optoelectronic support 10. In other embodiments, the texture camera module 50 may also be directly fixed to the optoelectronic support 10, for example, a mounting hole is provided on the optoelectronic support 10, and the texture camera module 50 may be fixed in the mounting hole. The texture camera module 50 may also be tilted toward the center of the optoelectronic support 10 so that the texture camera module 50 and the acquisition module 30 have a larger overlapping field of view. In one embodiment, the texture camera module 50 is a color camera module. The processing chip may also be used to control the texture camera module 50, and may also receive the texture image collected by the texture camera module 50 and transmit it to the host computer.

[0038] like Figures 4 to 6 As shown, the three-dimensional scanner also includes a front shell 60 and a rear shell 70, which enclose a receiving cavity, and the photoelectric bracket 10 is fixed on the front shell 60 or the rear shell 70 and received in the receiving cavity. The front shell 60 and the rear shell 70 can protect the components on each module and the main board 40. Among them, the front shell 60 and the rear shell 70 can be connected by buckles or screws, or by a double fastening method of buckles + screws. The front shell 60 can be provided with a second exposure hole corresponding to each module to expose each module to avoid blocking the field of view of each module.

[0039] In some embodiments, the three-dimensional scanner further includes a fan assembly 81, a second mounting groove 61 and an air inlet 62 communicating with the second mounting groove 61 are provided in the front shell 60 on one side of the photoelectric bracket 10, an air outlet 63 is provided in the front shell 60 on the other side of the photoelectric bracket 10, and the fan assembly 81 is installed in the second mounting groove 61. The fan assembly 81 is electrically connected to the mainboard 40, and can generate airflow when the fan assembly 81 rotates, and cold air enters from the air inlet 62 to blow away the heat generated by the mainboard 40 and the photoelectric bracket 10, and hot air flows out from the air outlet 63, thereby achieving heat dissipation of the mainboard 40 and the photoelectric bracket 10.

[0040] In some embodiments, the three-dimensional scanner further includes a fill light assembly 82, the fill light assembly 82 includes a fill light circuit board 821 and a plurality of fill light lamps 822 arranged on the fill light circuit board 821, the fill light circuit board 821 is provided with a second avoidance hole, the plurality of fill light lamps 822 surround the second avoidance hole, the fill light circuit board 821 is fixed to the front end of the photoelectric bracket 10 and is electrically connected to the main board 40, and the collection module 30 is arranged through the second avoidance hole. Each fill light lamp 822 can project white light and / or a beam of a specific wavelength, the specific wavelength includes a wavelength corresponding to a line laser and a speckle laser, so as to illuminate the marking point and / or the target attached to the target, and the front shell 60 is provided with a plurality of third exposure holes corresponding to the plurality of fill light lamps 822, so as to ensure that the beams emitted by the fill light lamps 822 can be irradiated out. At the same time, the plurality of fill light lamps 822 are arranged around the collection module 30, so that the beams collected by the collection module 30 can be more uniform. The fill light 822 can work synchronously with the acquisition module 30 and project a light beam of a specific wavelength, and can also work synchronously with the texture camera module 50 and project white light.

[0041] In some embodiments, the three-dimensional scanner further includes a key assembly 83, which is used to control the three-dimensional scanner. The key assembly 83 includes a key circuit board 831, a key bracket 832 and a key 833. The key bracket 832 is fixed to the inner side of the rear shell 70, the key circuit board 831 is fixed to the rear end of the key bracket 832 and is electrically connected to the main board 40, the key 833 is arranged on the key bracket 832 and contacts the key circuit board 831, and the key 833 extends out of the rear shell 70 through the key 833 hole at the rear end of the rear shell 70. The functions of the key 833 include but are not limited to adjusting the exposure time, field of view angle, driving current of the line laser emission module 22 and the speckle laser emission module 21, start and stop of scanning, etc. of the acquisition module 30, and the number of the keys 833 can be one or more. The key assembly 83 may also include a light guide column, which is electrically connected to the key circuit board 831. The light guide column may be set on one of the keys 833 or exist alone. The light guide column is exposed on the rear shell 70 and may display different colors to indicate different meanings, such as scanning distance too far, scanning distance too close, abnormality, etc. In other embodiments, the key assembly 83 may also be arranged at other locations, such as the top or side of the rear shell 70.

[0042] In some embodiments, the three-dimensional scanner also includes an interface component 84, which is used to connect to a terminal device such as a host computer to power the three-dimensional scanner, control the three-dimensional scanner, and output the data collected by the three-dimensional scanner to the host computer. The interface component 84 includes an interface circuit board 841 and a connection interface 842. The interface circuit board 841 is fixed in the rear shell 70 and is electrically connected to the main board 40. The connection interface 842 is arranged on the interface circuit board 841 and is electrically connected to the processing chip, and is exposed through the interface hole on the rear shell 70. Among them, when the interface component 84 and the button component 83 are provided, the interface component 84 and the button component 83 can be respectively arranged near the two ends of the inner side of the rear shell 70 to make the structure of the three-dimensional scanner more compact. In other embodiments, the connection interface 842 can also be directly arranged on the main board 40.

[0043] In some embodiments, the 3D scanner further includes a hand piece 85, which is sleeved on the rear end of the rear shell 70. The hand piece 85 is provided with a hand-held structure to facilitate the user to hold the 3D scanner and improve the user experience; the hand-held structure may include protrusions, ribs, etc., and the hand piece 85 may also be provided with a texture to increase the texture and friction when held. In other embodiments, the hand-held structure may also be directly formed on the rear shell 70, which is not limited here.

[0044] In some embodiments, the three-dimensional scanner further includes a plurality of support members 86, at least two of which are disposed at the bottom of the rear shell 70, so that there is a gap between the bottom of the rear shell 70 and the table on which the three-dimensional scanner is placed, so that the rear shell 70 is not easily scratched. At least two support members 86 may also be disposed on the top of the rear shell 70, so that when the three-dimensional scanner is placed upside down, the top of the rear shell 70 is not easily scratched. The support members 86 may be snap-fitted with the rear shell 70, and the support members 86 may be made of a flexible material, so that there is a certain amount of buffering and vibration reduction when the three-dimensional scanner is placed, thereby reducing the impact.

[0045] In some embodiments, the 3D scanner further includes a glass cover 87, which can be disposed on the front side of the front housing 60 to protect each module, shield each exposure hole and connection hole, etc., to prevent dust, liquid, etc. from entering the interior of the 3D scanner through the exposure hole, and to make the appearance more beautiful. The front housing 60 can be provided with a third mounting groove, and the glass cover 87 can be fixed in the third mounting groove by means of adhesive or the like.

[0046] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, unless otherwise clearly and specifically defined.

[0048] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A three-dimensional scanner, characterized in that: include: The photoelectric bracket has a first mounting hole, a second mounting hole and a third mounting hole at the front end, and a first mounting cavity communicating with the second mounting hole and the third mounting hole at the rear end; A laser emission assembly, comprising a speckle laser emission module, a line laser emission module and a mounting bracket, wherein the mounting bracket is mounted in the first mounting cavity, the speckle laser emission module and the line laser emission module are mounted on the mounting bracket and exposed through the first mounting hole and the second mounting hole respectively, and the speckle laser emission module and the line laser emission module are used to emit speckle laser and line laser to a target respectively; A collection module, installed in the third installation hole, for collecting the speckle laser and the line laser reflected back by the target; The main board is installed at the rear end of the photoelectric bracket and is electrically connected to the speckle laser emission module, the line laser emission module and the acquisition module.

2. The three-dimensional scanner according to claim 1, characterized in that: The three-dimensional scanner also includes a connection interface, and the three-dimensional scanner is communicatively connected to a host computer through the connection interface. A processing chip is provided on the main board, and the processing chip is electrically connected to the speckle laser emission module, the line laser emission module, the acquisition module and the connection interface. The processing chip is used to: control the speckle laser emission module, the line laser emission module and the acquisition module, receive image data acquired by the acquisition module, calculate a depth graph of a target based on the image data and / or output the image data to the host computer through the connection interface.

3. The three-dimensional scanner according to claim 1 or 2, characterized in that: The laser emitting assembly also includes a light source circuit board, which is fixed to the rear end of the mounting bracket and is electrically connected to the speckle laser emitting module and the line laser emitting module.

4. The three-dimensional scanner according to claim 3, characterized in that: The light source circuit board is provided with a first avoidance hole corresponding to the line laser emission module, and the line laser emission module passes through the first avoidance hole.

5. The three-dimensional scanner according to claim 1 or 2, characterized in that: The mounting bracket includes a first mounting portion and a second mounting portion located on one side of the first mounting portion, a second mounting cavity is formed at the rear end of the first mounting portion, and a first exposure hole communicating with the second mounting cavity is provided at the front end, the line laser emission module is installed in the second mounting cavity and exposed through the first exposure hole, and the speckle laser emission module is installed on the second mounting portion.

6. The three-dimensional scanner according to claim 5, characterized in that: The laser emitting assembly further includes a first adapter bracket, the first adapter bracket is fixed on the second mounting portion, the first adapter bracket is provided with a first mounting groove, and the speckle laser emitting module is fixed in the first mounting groove.

7. The three-dimensional scanner according to claim 1 or 2, characterized in that: The acquisition module includes a camera bracket, a lens and a camera circuit board. The rear end of the photoelectric bracket is provided with a third mounting cavity communicated with the first mounting hole. The lens is installed at the front end of the camera bracket, the camera circuit board is installed at the rear end of the camera bracket, and the camera bracket is installed in the third mounting cavity.

8. The three-dimensional scanner according to claim 1 or 2, characterized in that: There are two collection modules, and the laser emitting assembly is located between the two collection modules. The two collection modules are inclined toward the front end of the laser emitting assembly.

9. The three-dimensional scanner according to claim 1 or 2, characterized in that: The photoelectric bracket includes a main body and ends connected to both ends of the main body, the main body is formed with the first mounting cavity, the first mounting hole and the second mounting hole, and the end is formed with the third mounting hole.

10. The three-dimensional scanner according to claim 9, characterized in that: The two end portions are inclined toward the center of the front end of the main body and form an angle with the main body.

11. The three-dimensional scanner according to claim 1 or 2, characterized in that: A plurality of heat dissipation teeth are formed at the front end of the photoelectric support; and / or, A heat-conducting boss is formed at the rear end of the photoelectric bracket, and the heat-conducting boss is in contact with the processing chip on the mainboard.

12. The three-dimensional scanner according to claim 1 or 2, characterized in that: The three-dimensional scanner further comprises a front shell and a rear shell, wherein the front shell and the rear shell are enclosed to form a receiving cavity, and the photoelectric bracket is fixed on the front shell or the rear shell and received in the receiving cavity.

13. The three-dimensional scanner according to claim 11, characterized in that: The three-dimensional scanner further includes a fan assembly, a second mounting groove and an air inlet communicating with the second mounting groove are provided in the front shell on one side of the photoelectric bracket, an air outlet is provided in the front shell on the other side of the photoelectric bracket, and the fan assembly is installed in the second mounting groove; and / or, The three-dimensional scanner further includes a fill light assembly, the fill light assembly includes a fill light circuit board and a plurality of fill lights arranged on the fill light circuit board, the fill light circuit board is provided with a second avoidance hole, the plurality of fill lights surround the second avoidance hole, the fill light circuit board is fixed to the front end of the photoelectric bracket, and the acquisition module is passed through the second avoidance hole; and / or, The three-dimensional scanner further includes a key assembly, the key assembly includes a key circuit board, a key bracket and a key, the key bracket is fixed to the inner side of the rear shell, the key circuit board is fixed to the rear end of the key bracket and is electrically connected to the mainboard, the key is arranged on the key bracket and contacts the key circuit board, and the key extends out of the rear shell through a key hole at the rear end of the rear shell; and / or, The three-dimensional scanner further includes an interface component, the interface component includes an interface circuit board and a connection interface, the interface circuit board is fixed in the rear shell and electrically connected to the main board, the connection interface is arranged on the interface circuit board and exposed through an interface hole on the rear shell; and / or, The three-dimensional scanner further comprises a hand piece, the hand piece is sleeved on the rear end of the rear shell, and a hand-held structure is provided on the hand piece; and / or, The three-dimensional scanner further comprises a plurality of supporting members, at least two of which are arranged at the bottom end of the rear shell, so that there is a gap between the bottom of the rear shell and the placement table of the three-dimensional scanner.

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