Coaxial laser with refrigeration function

Abstract

The coaxial laser comprises a laser body, a tube core and a pin, the tube core and the pin are arranged on the two sides, close to each other, of the laser body, an installation groove surrounding the outer side of the tube core is formed in the outer side of the laser body, a temperature conduction structure is installed in the installation groove, and a refrigeration assembly is arranged on the outer side of the temperature conduction structure. According to the utility model, the temperature conducting module and the temperature conducting layer are matched with the semiconductor chilling plate and the temperature sensor, the temperature sensor can control the starting of the semiconductor chilling plate by sensing the temperature of the tube core, and the temperature conducting module is not only attached to the mounting groove to form sealing, but also connected with the temperature conducting layer to play a role; the sealed mounting groove can prevent normal-temperature air from entering the interior so as to prevent the normal-temperature air from being in contact with the low-temperature temperature conduction module and the low-temperature temperature conduction layer to be liquefied to generate water drops which affect the structure in the laser body, and the semiconductor chilling plate achieves the cooling and temperature control effects on the tube core through transmission of the temperature conduction module and the temperature conduction layer.

Description

Technical Field

[0001] The utility model relates to the technical field of coaxial lasers, in particular to a coaxial laser with refrigeration. Background Art

[0002] A coaxial laser is a laser that uses a coaxial electrical circuit structure to achieve laser gain. It uses a laser beam to propagate in a concentric and coaxial space electromagnetic field to form a laser gain medium to achieve laser gain amplification. The coaxial laser uses a coaxial electrical circuit structure to directly place the laser beam in the electric field, reducing the conduction loss between the crystal and optical components, and can improve the power density and stability of the laser beam.

[0003] The emission wavelength of a coaxial laser is related to the operating temperature of the tube core. When the coaxial laser works for a long time, the temperature will rise, affecting the stability of the wavelength emission. The emission wavelength may drift and cannot meet the application conditions and requirements of the laser operating in a wide temperature range, which is very inconvenient. Utility Model Content

[0004] Based on the above description, the utility model provides a coaxial laser with cooling to solve the problem that the core of the coaxial laser works for a long time and the temperature is easily increased, thereby causing the wavelength to be unstable.

[0005] The utility model solves the above-mentioned technical problem with the following technical solution: a coaxial laser with cooling, comprising a laser body and a tube core and pins arranged on both sides of the laser body close to each other, the outer side of the laser body is provided with a mounting groove surrounding the outer side of the tube core, a temperature conducting structure is installed in the mounting groove, a cooling assembly is arranged on the outer side of the temperature conducting structure, and a temperature sensor connected to the cooling assembly is installed on the outer side of the tube core.

[0006] On the basis of the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the tube core is arranged in the center of the laser body and extends to the outside of the laser body, the pin is arranged on a side of the laser body close to the tube core, and the mounting groove is opened in the center of the outside of the laser body.

[0008] Furthermore, one end of the mounting groove close to the center of the laser body is U-shaped and surrounds the outer side of the tube core, and a plane groove is formed on the side of the surface of the tube core away from the center of the laser body.

[0009] Furthermore, the thermal conduction structure is composed of a thermal conduction layer, a thermal conduction module and a boss. The thermal conduction layer is installed on the outside of the tube core, and the thermal conduction module is installed on the outside of the thermal conduction layer and fits with the arc surface of the inner wall of the mounting groove. Both ends of the thermal conduction layer and the thermal conduction module fit with the two ends of the inner wall of the mounting groove.

[0010] Furthermore, the surfaces of the thermal conductive layer and the thermal conductive module are respectively provided with a first through hole and a second through hole, the first through hole and the second through hole overlap each other, and the boss is arranged on the outside of the thermal conductive module and fits with the inner wall of the mounting groove.

[0011] Furthermore, the refrigeration assembly is composed of a semiconductor refrigeration sheet and a heat sink, the semiconductor refrigeration sheet is installed on a side of the boss away from the laser body, and the heat sink is installed on a side of the semiconductor refrigeration sheet away from the laser body.

[0012] Furthermore, the temperature sensor is installed in the planar groove, and a wire is provided between the temperature sensor and the semiconductor cooling plate, and passes through the first through hole, the second through hole and the boss in sequence.

[0013] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:

[0014] The utility model uses a temperature conducting module and a temperature conducting layer, in conjunction with a semiconductor refrigeration sheet and a temperature sensor. The temperature sensor can control the start-up of the semiconductor refrigeration sheet by sensing the temperature of the tube core. The temperature conducting module not only fits with the installation groove to form a seal, but is also connected to the temperature conducting layer to work. The sealed installation groove can prevent normal temperature air from entering the interior, so as to prevent normal temperature air from contacting with the low-temperature temperature conducting module and the temperature conducting layer to liquefy and produce water droplets, thereby affecting the structure inside the laser body. The semiconductor refrigeration sheet cools and controls the temperature of the tube core through the transmission of the temperature conducting module and the temperature conducting layer, so that the temperature of the tube core can be in a low-temperature stable state, thereby ensuring the stability of the wavelength emission of the tube core. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a coaxial laser with cooling provided in an embodiment of the utility model;

[0016] Figure 2 This is a schematic diagram of the cross-sectional structure of the laser body in the embodiment of the utility model;

[0017] Figure 3 It is a cross-sectional structural schematic diagram of the connection relationship between the laser body and the temperature conducting layer in the embodiment of the utility model;

[0018] Figure 4 This is a structural schematic diagram of the connection relationship between the semiconductor refrigeration sheet and the temperature conduction module in the embodiment of the utility model;

[0019] Figure 5 This is a structural schematic diagram of the connection relationship between the wire and the semiconductor cooling plate in the embodiment of the utility model;

[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0021] 1. Laser body; 11. Tube core; 12. Pin; 13. Planar groove; 2. Mounting groove; 3. Thermal conductive layer; 31. First through hole; 4. Thermal conductive module; 41. Boss; 42. Second through hole; 5. Semiconductor cooling plate; 6. Heat sink; 7. Temperature sensor; 71. Wire. DETAILED DESCRIPTION

[0022] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0024] See also Figure 1-5 The utility model is a coaxial laser with cooling, comprising a laser body 1 and a tube core 11 and a pin 12 arranged on both sides of the laser body 1 close to each other, a mounting groove 2 surrounding the outside of the tube core 11 is arranged on the outside of the laser body 1, a temperature conducting structure is installed in the mounting groove 2, a cooling component is arranged on the outside of the temperature conducting structure, and a temperature sensor 7 connected to the cooling component is installed on the outside of the tube core 11.

[0025] See also Figure 2 The tube core 11 is arranged in the center of the laser body 1 and extends to the outside of the laser body 1. The pin 12 is arranged on the side of the laser body 1 close to the tube core 11. The mounting groove 2 is opened in the center of the outside of the laser body 1. The end of the mounting groove 2 close to the center of the laser body 1 is U-shaped and surrounds the outside of the tube core 11. The shape of the mounting groove 2 facilitates the installation of the thermal conductive layer 3 and the thermal conductive module 4, and can also make the thermal conductive layer 3 and the thermal conductive module 4 wrapped around the outside of the tube core 11 after installation, so as to fully cool the tube core 11. A plane groove 13 is opened on the side of the surface of the tube core 11 away from the center of the laser body 1.

[0026] See also Figure 5The thermal conductive structure is composed of a thermal conductive layer 3, a thermal conductive module 4 and a boss 41. The thermal conductive layer 3 is installed on the outside of the tube core 11. The thermal conductive layer 3 is a silicone grease layer, which can not only play a thermal conductive role, but also prevent the thermal conductive module 4 from directly contacting the tube core 11, causing the surface of the tube core 11 to liquefy and produce water droplets after cooling. The thermal conductive module 4 is installed on the outside of the thermal conductive layer 3 and fits with the arc surface of the inner wall of the installation groove 2. Both ends of the thermal conductive layer 3 and the thermal conductive module 4 fit with the two ends of the inner wall of the installation groove 2. The thermal conductive layer 3 and the thermal conductive module 4 is respectively provided with a first through hole 31 and a second through hole 42, which overlap each other. The first through hole 31 and the second through hole 42 are used for arranging the wire 71 of the temperature sensor 7. The boss 41 is arranged on the outside of the thermal conductive module 4 and fits with the inner wall of the mounting groove 2. The thermal conductive module 4 and the boss 41 are a metal thermal conductive material, which can transfer the low temperature generated by the cooling surface of the semiconductor refrigeration plate 5 to the thermal conductive layer 3 and the surface of the tube core 11, thereby cooling the tube core 11.

[0027] See also Figure 5 The refrigeration component is composed of a semiconductor refrigeration sheet 5 and a heat sink 6. The semiconductor refrigeration sheet 5 is installed on the side of the boss 41 away from the laser body 1, and the heat sink 6 is installed on the side of the semiconductor refrigeration sheet 5 away from the laser body 1. The temperature sensor 7 is installed in the plane groove 13. A wire 71 is arranged between the temperature sensor 7 and the semiconductor refrigeration sheet 5, which passes through the first through hole 31, the second through hole 42 and the boss 41 in sequence. The temperature control sensor is an integrated temperature control sensor and a temperature control switch. The temperature sensor 7 senses the temperature of the surface of the tube core 11 and controls the opening of the semiconductor refrigeration sheet 5 through the temperature control switch part. When the semiconductor refrigeration sheet 5 is started, the cooling surface transfers the temperature through the temperature conduction module 4 and the temperature conduction layer 3, which plays a role in cooling and controlling the temperature of the tube core 11. The heating surface of the semiconductor refrigeration sheet 5 quickly dissipates heat through the heat sink 6 to avoid excessive temperature and load.

[0028] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0029] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A coaxial laser with cooling, comprising a laser body (1) and a tube core (11) and a lead (12) arranged on both sides of the laser body (1) close to each other, characterized in that: The outer side of the laser body (1) is provided with a mounting groove (2) surrounding the outer side of the tube core (11); a temperature conducting structure is installed in the mounting groove (2); a refrigeration component is arranged on the outer side of the temperature conducting structure; and a temperature sensor (7) connected to the refrigeration component is installed on the outer side of the tube core (11).

2. The coaxial laser with cooling according to claim 1, characterized in that: The tube core (11) is arranged at the center of the interior of the laser body (1) and extends to the outside of the laser body (1); the pin (12) is arranged on a side of the laser body (1) close to the tube core (11); and the mounting groove (2) is opened at the center of the outside of the laser body (1).

3. The coaxial laser with cooling according to claim 1, characterized in that: The end of the mounting groove (2) close to the center of the laser body (1) is U-shaped and surrounds the outside of the tube core (11); a plane groove (13) is provided on the side of the surface of the tube core (11) away from the center of the laser body (1).

4. The coaxial laser with cooling according to claim 3, characterized in that: The thermal conduction structure is composed of a thermal conduction layer (3), a thermal conduction module (4) and a boss (41); the thermal conduction layer (3) is mounted on the outside of the tube core (11); the thermal conduction module (4) is mounted on the outside of the thermal conduction layer (3) and fits with the arc surface of the inner wall of the mounting groove (2); and both ends of the thermal conduction layer (3) and the thermal conduction module (4) fit with the two ends of the inner wall of the mounting groove (2).

5. The coaxial laser with cooling according to claim 4, characterized in that: The surfaces of the thermal conductive layer (3) and the thermal conductive module (4) are respectively provided with a first through hole (31) and a second through hole (42); the first through hole (31) and the second through hole (42) overlap each other; the boss (41) is arranged on the outside of the thermal conductive module (4) and fits with the inner wall of the mounting groove (2).

6. The coaxial laser with cooling according to claim 5, characterized in that: The refrigeration component is composed of a semiconductor refrigeration plate (5) and a heat sink (6); the semiconductor refrigeration plate (5) is mounted on a side of the boss (41) away from the laser body (1); and the heat sink (6) is mounted on a side of the semiconductor refrigeration plate (5) away from the laser body (1).

7. The coaxial laser with cooling according to claim 6, characterized in that: The temperature sensor (7) is installed in the planar groove (13), and a wire (71) is provided between the temperature sensor (7) and the semiconductor cooling plate (5), which wire passes through the first through hole (31), the second through hole (42) and the boss (41) in sequence.

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