Dustproof film of electronic product structural member

By uniformly coating the hot melt adhesive layer on the mesh body and setting the hydrophobic oleophobic layer, the problems of inconvenient installation and low quality of the speaker dustproof film are solved, and a more efficient installation process and quality are achieved.

CN222691856UActive Publication Date: 2025-03-28JIANGYIN WEIKANG TEXTILE CO LTD
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Patent Information

Application Number
CN202323396697.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-13
Publication Date
2025-03-28
Estimated Expiration
2033-12-13

AI Technical Summary

Technical Problem

The existing speaker dustproof film has problems of inconvenience and low quality during installation, especially the pressure-sensitive tape process is complicated and the spraying method is uneven.

Method used

A yarn mesh body is adopted, the first side is uniformly coated with a hot melt adhesive layer, and a hydrophobic oleophobic layer is provided on the second side. The yarn mesh body is bonded and fixed to the designated position of the speaker through the hot melt adhesive layer.

Benefits of technology

The uniformity of the preset adhesive layer is ensured, which improves the installation quality and convenience of the yarn body, simplifies the installation process, and improves the installation efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a dustproof film of an electronic product structural member, which comprises a gauze element body, a first surface of the gauze element body is uniformly coated with an adhesive layer, a second surface of the gauze element body is provided with a hydrophobic and oleophobic layer, and the adhesive layer is configured to adhere and fix the gauze element body at a specified position of the electronic product structural member. The mesh number of the gauze element body is 58-175, the aperture ratio is 34%-52%, the wire diameter is 67-145 microns, and the air permeability is 5400-8300 L / m < 2 > s. According to the dustproof film coated with the hot melt adhesive, the adhesion layer is arranged on one side of the gauze element body in advance, the uniformity of the adhesion layer can be guaranteed, and the effect of improving the installation quality of the gauze element body is achieved.
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Description

Technical Field

[0001] The utility model embodiment relates to a dustproof film, in particular to a dustproof film for a structural part of an electronic product. Background Art

[0002] A speaker is a transducer device that converts electrical signals into sound signals. It is the weakest component in audio equipment, but it is also the most important component for sound effects. Audio electrical energy vibrates the cone or diaphragm through electromagnetic, piezoelectric or electrostatic effects and resonates with the surrounding air to produce sound.

[0003] When the speaker is in use, the static electricity effect it generates will attract dust in the air to the speaker, affecting the use and function of the speaker, so a dust-proof film should be installed on the speaker.

[0004] For the dustproofing of loudspeakers, the use of pressure-sensitive tape has many process problems, and the use of the spray method has a high unevenness problem. Therefore, the existing loudspeaker dustproofing technology has problems with inconvenient installation and installation quality. Utility Model Content

[0005] In order to solve the related technical problems, the utility model provides a dustproof film for a structural part of an electronic product to solve the problems of inconvenient installation and installation quality.

[0006] To achieve the above purpose, the embodiment of the utility model adopts the following technical solutions:

[0007] A dustproof film for an electronic product structural part, comprising a gauze body, wherein a first surface of the gauze body is evenly coated with an adhesive layer, a second surface of the gauze body is provided with a hydrophobic and oleophobic layer, the adhesive layer is configured to bond and fix the gauze body to a designated position of the electronic product structural part, the mesh number of the gauze body is 58-175 meshes, the opening rate is 34%-52%, the wire diameter is 67-145μm, and the air permeability is 5400-8300L / ㎡s.

[0008] The adhesive layer is a hot melt adhesive uniformly coated on the first surface of the gauze body.

[0009] The gauze body is made of polyester monofilament gauze, the pore size of the gauze body is 120-285 μm, the air permeability is 5400-8300 L / ㎡s, and the thickness is 65-255 μm.

[0010] The thickness of the adhesive layer is between 160 μm and 180 μm.

[0011] The adhesive layer has a bonding strength of 6.86 N / 20 mm.

[0012] The gauze body is made of any one of PET, PC, ABS, PS, PC and PMMA.

[0013] The standard width of the gauze body is 500 mm.

[0014] The pore size of the gauze body is 120-285 μm.

[0015] The wire diameter of the gauze body is 67-145 μm.

[0016] The beneficial effects of the utility model are as follows: compared with the prior art, the dust-proof film of the electronic product structure provided by the utility model has the following beneficial effects:

[0017] 1. By pre-setting an adhesive layer on one side of the gauze body, the uniformity of the adhesive layer can be ensured, which has the effect of improving the installation quality of the gauze body;

[0018] 2. The adhesive layer is hot melt adhesive, which can be preset on the electronic product structure when in use, and heated after adjusting the position, which is convenient for installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following briefly introduces the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the structure of a dustproof film for a structural part of an electronic product provided by an embodiment of the utility model;

[0021] Figure 2 The utility model is a schematic diagram of the structure of a dustproof film for an electronic product structural component provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0022] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0023] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings. The preferred embodiments of the utility model are given in the drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thoroughly understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on another component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the utility model. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] See also Figure 1 to Figure 2 As shown, this embodiment provides

[0025] A dustproof film for an electronic product structural part, comprising a gauze body 1, a first surface of the gauze body 1 being evenly coated with an adhesive layer 2, a second surface of the gauze body 1 being provided with a hydrophobic and oleophobic layer 3, the adhesive layer 2 being configured to bond and fix the gauze body 1 to a designated position of an electronic product structural part 4, the mesh number of the gauze body 1 being 58-175 meshes, the opening rate being 34%-52%, the wire diameter being 67-145 μm, and the air permeability being 5400-8300 L / ㎡s; the adhesive layer 2 being a hot melt adhesive evenly coated on the first surface of the gauze body 1; the gauze body 1 being made of polyester monofilament gauze, the pore size of the gauze body 1 being 120-285 μm, the air permeability being 5400-8300 L / ㎡s, and the thickness being 65-255 μm.

[0026] It can be seen that by pre-setting the adhesive layer 2 on one side of the gauze mesh body 1, the uniformity of the adhesive layer 2 can be ensured, thereby improving the installation quality of the gauze mesh body 1. By hot melting, the gauze mesh body 1 can be preset on the electronic product structure 4 during installation, and heated after adjusting the position, so that the gauze mesh body 1 is bonded to the electronic product structure 4, which is convenient for installation and improves the installation efficiency.

[0027] The thickness of the adhesive layer 2 is between 160 μm and 180 μm.

[0028] Preferably, the thickness of the adhesive layer 2 is 170 μm.

[0029] The bonding strength of the adhesive layer 2 is 6.86N / 20mm, the mesh body 1 is made of any one of PET, PC, ABS, PS, PC and PMMA, the standard width of the mesh body 1 is 500mm, the pore size of the mesh body is 120-285μm, and the wire diameter of the mesh body 1 is 67-145μm.

[0030] It can be seen that the adhesive layer 2 can be adhered to a variety of materials and has a wide range of uses.

[0031] Specifically, the following tests were conducted:

[0032] 1. The bonding strength of the adhesive layer on various types of carriers at 180° peel strength

[0033] Before measurement, the dust-proof film was left at room temperature for one hour.

[0034] When the adhesive carrier is: ET, PC, ABS, PS, PC, PMMA

[0035] Bonding area: 25X50mm

[0036] Bonding conditions

[0037] Temperature: 90℃ to 120℃

[0038] Pressure: 0.26 to 0.90 MPa

[0039] Time: 10 to 20 seconds Measurement conditions: 23℃±5℃60%±20%RH Cutting speed: 300mm / min

[0040]

[0041]

[0042]

[0043]

[0044]

[0045] 2. Test specimen conditions for reliability test of bonding strength under hot and wet environment at 180° peel strength

[0046] Adhesive carrier: PS

[0047] Bonding area: 25X 50mm

[0048] Bonding conditions: temperature 120℃

[0049] Pressure: 0.26MPa

[0050] Time: 10 seconds

[0051] Measurement conditions: 23℃±5℃60%±20%RH

[0052] Clean speed: 300mm / min

[0053] Measured after aging at 60C90%RH for 10 days

[0054] Test results: initial bonding strength was 12.6N / 20mm, and bonding strength on the 10th day was 15.1N / 20mm.

[0055] The specific working principle of the dustproof film of the electronic product structural part is as follows:

[0056] The dustproof film is arranged on the electronic product structure 4 , and after adjusting the position, the dustproof film is heated by a hair dryer to adhere to the electronic product structure 4 .

[0057] In the embodiments disclosed in the present invention, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "connect" can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the embodiments disclosed in the present invention can be understood according to specific circumstances.

[0058] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A dustproof film for a structural part of an electronic product, characterized in that: The dust-proof film of the electronic product structural part includes a gauze body, wherein the first surface of the gauze body is evenly coated with an adhesive layer, the second surface of the gauze body is provided with a hydrophobic and oleophobic layer, and the adhesive layer is configured to bond and fix the gauze body to a designated position of the electronic product structural part. The mesh number of the gauze body is 58-175 meshes, the opening rate is 34%-52%, the wire diameter is 67-145μm, and the air permeability is 5400-8300L / ㎡s.

2. The dustproof film for electronic product structural parts according to claim 1, characterized in that: The adhesive layer is a hot melt adhesive uniformly coated on the first surface of the gauze body.

3. The dustproof film for electronic product structural parts according to claim 1, characterized in that: The gauze mesh body is made of polyester monofilament gauze, the pore size of the gauze mesh body is 120-285 μm, the air permeability is 5400-8300 L / ㎡s, and the thickness is 65-255 μm.

4. The dustproof film for electronic product structural parts according to claim 1, characterized in that: The thickness of the adhesive layer is between 160 μm and 180 μm.

5. The dustproof film for electronic product structural parts according to claim 1, characterized in that: The adhesive layer has a bonding strength of 6.86 N / 20 mm.

6. The dustproof film for electronic product structural parts according to claim 1, characterized in that: The gauze body is made of any one of PET, PC, ABS, PS, PC and PMMA.

7. The dustproof film for electronic product structural parts according to claim 1, characterized in that: The standard width of the gauze body is 500 mm.

8. The dust-proof film for a structural part of an electronic product according to claim 1, characterized in that: The pore size of the gauze body is 120-285 μm.

9. The dustproof film for electronic product structural parts according to claim 1, characterized in that: The wire diameter of the gauze body is 67-145 μm.