Heat dissipation structure for enhancing camera PCB

Abstract

The utility model discloses a heat radiation structure for strengthening a camera PCB, comprising an aluminum alloy lens seat used for installation and fixation and a lens fixedly arranged above the aluminum alloy lens seat in a penetrating manner, the bottom of the aluminum alloy lens seat is fixedly provided with a PCB, the PCB is provided with a copper exposing area, the copper exposing area is in contact with the aluminum alloy lens seat for heat conduction, two sides of the aluminum alloy lens seat are provided with side notches, and the side notches are arranged in the aluminum alloy lens seat. The side clamping blocks are arranged in the side notches, so that efficient heat conduction is realized, heat generated by components is quickly conducted into the shell for heat dissipation, the heat in the camera is effectively reduced, the size change of the shell is reduced, the offset of a lens focus is improved, and the imaging effect of the camera is improved.

Description

Technical Field

[0001] The utility model relates to the field of electronic accessories, and in particular to a heat dissipation structure for strengthening a camera PCB. Background Art

[0002] In the digital high-definition era, as the pixels of camera modules become higher and higher, the heat generated by components also becomes higher and higher. The high heat generation will cause the temperature inside the module to rise, which will cause thermal expansion and contraction. The shell and lens size will change slightly, causing the lens imaging focus to shift, thereby blurring the image at the original focus point. Utility Model Content

[0003] The purpose of the utility model is to solve any one of the problems in the above-mentioned technologies, thereby proposing a heat dissipation structure for strengthening the camera PCB.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a heat dissipation structure for strengthening the camera PCB, including an aluminum alloy lens holder for installation and fixation and a lens fixedly installed on the top, a PCB board is fixedly installed at the bottom of the aluminum alloy lens holder, the PCB board is provided with a copper exposed area, the copper exposed area is in contact with the aluminum alloy lens holder for heat conduction, side notches are provided on both sides of the aluminum alloy lens holder, and side clamping blocks are provided in the side notches.

[0005] Furthermore, the top of the aluminum alloy mirror mount is a round sleeve and the bottom is a square platform. The lens is fixed in the round sleeve at the top of the aluminum alloy mirror mount. A lens fixing rubber ring is placed between the aluminum alloy mirror mount and the lens. The side wall of the round sleeve of the aluminum alloy mirror mount is provided with a countersunk side slot with a round head, a rectangular fixing slot is provided in the center of the side slot, and air holes are provided on both sides of the side slot that penetrate into the inner wall. An installation cavity is provided in the square platform at the bottom of the aluminum alloy mirror mount.

[0006] Furthermore, a side clamp block is embedded and fixed in the side groove of the aluminum alloy mirror base, and the center of the side clamp block is a rectangular fixed clamp platform. The fixed clamp platform is embedded and fixed in the fixed groove of the aluminum alloy mirror base. There are wing panels on both sides of the fixed clamp platform. The wing panels are covered on the outer wall of the air vent. The wing panels are made of double-layer heat-conducting metal material and the thermal deformation of the outer metal of the wing panel is greater than the thermal deformation of the inner metal of the wing panel.

[0007] Furthermore, a PCB board is fixed in the mounting cavity of the aluminum alloy mirror holder by screws, the central original area on the upper surface of the PCB board is an insulating area, and a copper exposed area is arranged around the insulating area. The copper exposed area of ​​the PCB board fits the top surface of the mounting cavity of the aluminum alloy mirror holder for heat conduction.

[0008] The beneficial effects of the utility model are:

[0009] The exposed copper area of ​​the PCB board fits well with the top surface of the mounting cavity of the aluminum alloy lens holder to conduct heat, achieving efficient heat conduction, so that the heat generated by the components is quickly transferred to the outer casing for heat dissipation, thereby effectively reducing the heat inside the camera and reducing the size change of the shell, thereby improving the offset of the lens focus and improving the camera imaging effect.

[0010] Side clamps are provided in the side grooves on both sides of the aluminum alloy mirror base, and the wing plates of the side clamps are covered on the outer wall of the air vent. The wing plates are made of double-layer heat-conducting metal material and the thermal deformation of the outer metal of the wing plates is greater than the thermal deformation of the inner metal of the wing plates. When the aluminum alloy mirror base is transmitted to the side clamps, the wing plates of the side clamps are heated and flattened outwards under the action of the thermal deformation of the double-layer metal, and the wing plates are separated from the air vent. The high-temperature gas in the aluminum alloy mirror base escapes from the air vent and dissipates heat alternately with the outside gas, thereby effectively reducing the heat inside the camera and reducing the size change of the shell, thereby improving the offset of the lens focus and improving the camera imaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0012] Figure 2 It is a cross-sectional view of the utility model as a whole;

[0013] Figure 3 An exploded view of the utility model as a whole;

[0014] Figure 4 This is a schematic diagram of the structure of the aluminum alloy mirror holder of the utility model;

[0015] Figure 5 This is a schematic diagram of the structure of the PCB board of the utility model;

[0016] Figure 6 It is a structural schematic diagram of the side clamp block of the utility model.

[0017] exist Figures 1 to 6 The corresponding relationship between the component names or lines and the figure numbers is: lens 1, side notch 11, fixing notch 12, vent hole 13, mounting cavity 14, lens fixing rubber ring 2, aluminum alloy lens holder 3, PCB board 4, exposed copper area 41, insulating area 42, screw 5, side clamp block 6, wing plate 61, fixing clamp table 62 DETAILED DESCRIPTION

[0018] Please refer to Figures 1 to 6 ;

[0019] The present embodiment provides a heat dissipation structure for strengthening the camera PCB, including an aluminum alloy lens holder 3 for installation and fixation and a lens 1 fixedly installed on the top thereof, a PCB board 4 is fixedly installed at the bottom of the aluminum alloy lens holder 3, the PCB board 4 is provided with a copper exposed area 41, the copper exposed area 41 is in contact with the aluminum alloy lens holder 3 for heat conduction, side notches 11 are provided on both sides of the aluminum alloy lens holder 3, and side clamping blocks 6 are provided in the side notches 11.

[0020] Preferably, the top of the aluminum alloy mirror base 3 is a round sleeve and the bottom is a square platform. The lens 1 is fixedly inserted into the round sleeve at the top of the aluminum alloy mirror base 3. A lens fixing rubber ring 2 is placed between the aluminum alloy mirror base 3 and the lens 1. The side wall of the round sleeve of the aluminum alloy mirror base 3 is provided with a countersunk side slot 11 with a round head, a rectangular fixing slot 12 is provided at the center of the side slot 11, and air holes 13 that penetrate to the inner wall are provided on both sides of the side slot 11. An installation cavity 14 is provided in the square platform at the bottom of the aluminum alloy mirror base 3.

[0021] In a specific embodiment, the outer wall of the aluminum alloy mirror base 3 is an anodized layer, and the installation cavity 14 of the aluminum alloy mirror base 3 is an area where the anodized layer is removed, and has a good thermal conductivity. The PCB board 4 is locked by screws 5 to generate a certain locking force and is fixed on the aluminum alloy mirror base 3, so that the aluminum alloy mirror base 3 is in good contact with the exposed copper area 41, and the heat generated by the components is quickly discharged into the aluminum alloy mirror base 3.

[0022] Preferably, a side clamp block 6 is embedded and fixed in the side slot 11 of the aluminum alloy mirror base 3, and the center of the side clamp block 6 is a rectangular fixed clamp platform 62. The fixed clamp platform 62 is embedded and fixed in the fixed slot 12 of the aluminum alloy mirror base 3. The fixed clamp platform 62 has wing plates 61 on both sides. The wing plates 61 are covered on the outer wall of the air vent 13. The wing plates 61 are made of double-layer heat-conducting metal material and the thermal deformation of the outer metal of the wing plate 61 is greater than the thermal deformation of the inner metal of the wing plate 61.

[0023] In a specific embodiment, when the temperature of the aluminum alloy mirror base 3 is low, the side clamp block 6 is at room temperature, the wing plate 61 of the side clamp block 6 is covered on the outer wall of the air vent 13, and the gas inside the aluminum alloy mirror base 3 does not interact with the external gas. When the temperature of the aluminum alloy mirror base 3 is high, the wing plate 61 of the side clamp block 6 is heated and flattened to the outside under the effect of the thermal deformation of the double-layer metal, and the wing plate 61 is separated from the air vent 13. The high-temperature gas in the aluminum alloy mirror base 3 escapes from the air vent 13 to interact with the external gas for heat dissipation.

[0024] Preferably, a PCB board 4 is fixed in the installation cavity 14 of the aluminum alloy mirror base 3 by screws 5, the central original area on the upper surface of the PCB board 4 is an insulating area 42, and a copper exposed area 41 is arranged outside the insulating area 42, and the copper exposed area 41 of the PCB board 4 is in thermal contact with the top surface of the installation cavity 14 of the aluminum alloy mirror base 3.

[0025] When the present invention is used, the exposed copper area 41 of the PCB board 4 and the top surface of the installation cavity 14 of the aluminum alloy mirror base 3 are in thermal contact and conduct heat, thereby achieving efficient heat conduction, so that the heat generated by the components is quickly conducted to the shell for heat dissipation. When the aluminum alloy mirror base 3 is transferred to the side clamp block 6, the wing plate 61 of the side clamp block 6 is heated and flattened outwardly under the action of the thermal deformation of the double-layer metal, and the wing plate 61 is separated from the air vent 13. The high-temperature gas in the aluminum alloy mirror base 3 escapes from the air vent 13 and alternately dissipates heat with the outside air, thereby effectively reducing the heat inside the camera, reducing the size change of the shell, thereby improving the offset of the lens focus, and improving the camera imaging effect.

[0026] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat dissipation structure for strengthening a camera PCB, comprising an aluminum alloy lens holder (3) for mounting and fixing and a lens (1) fixedly arranged on the upper portion thereof, a PCB board (4) being fixedly arranged at the bottom of the aluminum alloy lens holder (3), characterized in that: The PCB board (4) is provided with a copper exposed area (41), the copper exposed area (41) is in contact with the aluminum alloy mirror base (3) for heat conduction, side notches (11) are provided on both sides of the aluminum alloy mirror base (3), and side clamping blocks (6) are provided in the side notches (11).

2. The heat dissipation structure for strengthening the camera PCB according to claim 1, characterized in that: The aluminum alloy mirror base (3) has a round sleeve on the top and a square platform on the bottom. The lens (1) is fixedly inserted into the round sleeve on the top of the aluminum alloy mirror base (3). A lens fixing rubber ring (2) is provided between the aluminum alloy mirror base (3) and the lens (1). A round-headed countersunk side notch (11) is provided on the side wall of the round sleeve of the aluminum alloy mirror base (3). A rectangular fixing notch (12) is provided at the center of the side notch (11). Air holes (13) penetrating to the inner wall are provided on both sides of the side notch (11). A mounting cavity (14) is provided in the square platform at the bottom of the aluminum alloy mirror base (3).

3. The heat dissipation structure for strengthening the camera PCB according to claim 2, characterized in that: A side clamping block (6) is fixedly embedded in the side notch (11) of the aluminum alloy mirror base (3); the center of the side clamping block (6) is a rectangular fixed clamping platform (62); the fixed clamping platform (62) is fixedly embedded in the fixed notch (12) of the aluminum alloy mirror base (3); two sides of the fixed clamping platform (62) are wing plates (61); the wing plates (61) are coated on the outer wall of the air vent (13); the wing plates (61) are made of a double-layer heat-conducting metal material; and the heat deformation of the outer layer of the wing plate (61) is greater than the heat deformation of the inner layer of the wing plate (61).

4. The heat dissipation structure for strengthening the camera PCB according to claim 2, characterized in that: A PCB board (4) is fixedly secured in the mounting cavity (14) of the aluminum alloy mirror holder (3) by means of screws (5); a central component area on the upper surface of the PCB board (4) is an insulating area (42); a copper-exposed area (41) is arranged outside the insulating area (42); the copper-exposed area (41) of the PCB board (4) is in contact with the top surface of the mounting cavity (14) of the aluminum alloy mirror holder (3) for heat conduction.

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