Semiconductor module assembly apparatus

Abstract

The utility model provides a semiconductor module assembling device, and belongs to the technical field of semiconductors. In order to solve the problems of large required space, low efficiency and low yield of semiconductor module assembling, the semiconductor module assembling device comprises a mounting platform, and a sheet feeding mechanism, a plate feeding mechanism and a mechanical arm which are arranged on the mounting platform; the mechanical arm comprises a mechanical arm body, a first executing mechanism and a second executing mechanism, the first executing mechanism and the second executing mechanism are arranged at the tail end of the mechanical arm body, and the mechanical arm carries sheets through the first executing mechanism and carries plates through the second executing mechanism. Moreover, the sheet feeding mechanism comprises a discharging position, the discharging position is provided with an arc-shaped surface, and the bending direction of the arc-shaped surface is opposite to that of the sheet; the first executing mechanism comprises a first executing part, and the first executing part is used for applying pressure to the sheets on the arc-shaped face of the discharging position to enable the sheets to be attached to the arc-shaped face and then picking up the sheets. According to the invention, the space required for assembly is reduced, and the assembly efficiency and the yield are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor module assembly device. Background Art

[0002] In order to improve the integration of equipment and reduce the possibility of failure, modular design is increasingly used in the semiconductor field. Semiconductor modules are usually assembled from multiple components, which are divided into sheets and plates according to their sizes, such as Single Side Direct Cooling (SSDC) modules.

[0003] The SSDC module is a special power module design that aims to improve efficiency and reduce thermal resistance by directly dissipating heat on one side of the module. This design is often used in high power density applications such as electric vehicles, data centers, and renewable energy systems. The SSDC module includes a stacked heat sink, tin sheet, and ceramic substrate, and welding is achieved by tin sheets set between the heat sink and the ceramic substrate, so that the heat sink and the ceramic substrate are reliably, evenly, and tightly fixed. The tin sheet and the ceramic substrate are both small and thin, and are sheets; the heat sink is large and thick, and is a plate.

[0004] Conventional semiconductor module assembly systems usually only complete one task at each workstation, that is, multiple workstations complete the assembly of multiple components one by one, resulting in a large assembly system space and low assembly efficiency. At the same time, for semiconductor modules that ultimately require welding processes, such as SSDC modules, not only do they have the above problems, but they also have the problem of low yield rate due to poor welding. Utility Model Content

[0005] The purpose of the present application is to solve the problems in the prior art that the semiconductor module assembly requires a large space, has low efficiency and low yield. Therefore, the present application provides a semiconductor module assembly device, which realizes multiple operations through a mechanical arm with two actuators, reduces the space required for assembly, improves assembly efficiency, and improves the semiconductor module yield by improving the flatness of the sheet.

[0006] The embodiment of the present application provides a semiconductor module assembly device, wherein the semiconductor module includes a sheet and a plate, and the assembly device includes a mounting platform, and a sheet loading mechanism, a plate loading mechanism and a robot arm arranged on the mounting platform;

[0007] The sheet material feeding mechanism is used to provide the sheet material;

[0008] The plate feeding mechanism is used to provide the plate;

[0009] The robot arm includes a robot arm body, and a first actuator and a second actuator disposed at the end of the robot arm body. The robot arm transports the sheet material through the first actuator and transports the plate material through the second actuator; and,

[0010] The sheet material feeding mechanism comprises a material discharging position, the material discharging position has an arc-shaped surface, and the arc-shaped surface is opposite to the bending direction of the sheet material;

[0011] The first actuator includes a first actuator, which is used to first apply pressure to the sheet material on the arc surface at the discharge position so that the sheet material fits the arc surface, and then pick up the sheet material.

[0012] By adopting the above technical solution, a single robotic arm can perform the handling of sheets and plates through a robotic arm with two actuators, thereby reducing the space required for assembly and improving assembly efficiency; at the same time, through the cooperation of the sheet feeding mechanism and the first actuator, the flatness of the sheet is trimmed, that is, the flatness of the sheet is improved, thereby improving the assembly accuracy and further improving the yield rate of the semiconductor module.

[0013] In some embodiments, the discharge position further has two supporting surfaces respectively arranged at two ends of the arc-shaped surface, and the supporting surfaces are used to support the ends of the sheet.

[0014] By adopting the above technical solution, the stability of the sheet on the curved surface is improved through the support surface, thereby improving the position accuracy of the sheet, and then improving the deformation accuracy of the sheet, improving the flatness of the sheet, and improving the yield rate of the semiconductor module.

[0015] In some embodiments, the sheet material feeding mechanism further includes a feeding assembly and a feeding assembly;

[0016] The material supply assembly is used to store the sheet material and is connected to the material feeding assembly to provide the sheet material to the material feeding assembly;

[0017] The feeding assembly is used to transfer the sheets one by one along the first direction to the discharging position;

[0018] The feeding assembly also includes a limiting frame and a pressing piece;

[0019] The limiting frame is used to limit the sheet material in the circumferential direction, and the bottom of the limiting frame is set as a feed port, and the feed port is located above the feeding assembly;

[0020] The material pressing member is arranged in the limiting frame and can apply pressure to the sheet material in the limiting frame along a direction toward the feeding port.

[0021] By adopting the above technical scheme, the sheet-by-sheet discharging is realized through the feeding assembly, thereby controlling the number of sheets located at the discharging position, which can improve the degree of reverse deformation of the sheet and the fit with the curved surface, further improve the flatness of the sheet, and improve the yield rate of the semiconductor module; through the cooperation of the feeding assembly and the feeding assembly, the feeding assembly can realize uninterrupted discharging, thereby improving the assembly efficiency; and, the feeding assembly cooperates with the limit frame and the pressure piece to realize the circumferential and height restrictions on the sheet, improve the stability of the sheet in storage, and improve the stability of the feeding assembly providing the sheet to the feeding assembly, thereby improving the sheet loading stability and assembly stability; at the same time, by applying pressure to the sheet in the limit frame by the pressure piece toward the feeding port, the reverse deformation of the sheet can be initially realized, thereby further improving the flatness of the sheet and improving the yield rate of the semiconductor module.

[0022] In some embodiments, the feeding assembly includes a carrier, and the carrier can be switched between a first position and a second position along the first direction;

[0023] The bearing platform is provided with a discharging portion and an abutting portion, and the discharging portion is provided with the arc surface; the bottom of the limiting frame is provided with a discharging port in the first direction;

[0024] When the carrying platform is located at the first position, the discharging portion is opposite to the feeding port and obtains the sheet in the limiting frame;

[0025] When the support platform is switched from the first position to the second position, the discharge portion supports the sheet material to be discharged from the discharge port and forms the discharge position;

[0026] When the supporting platform is located at the second position, the abutting portion abuts against the feeding port of the limiting frame.

[0027] By adopting the above technical solution, the discharge position is formed by switching the supporting platform between the first position and the second position, so that the feeding component has a simple structure and a small volume, and the volume of the feeding mechanism can be effectively controlled, thereby reducing the space required for assembly. At the same time, the feeding is reliable, thereby improving the assembly reliability and yield rate.

[0028] In some embodiments, the robotic arm further comprises a mounting seat disposed at the end of the robotic arm body, and the first actuator and the second actuator are symmetrically disposed on both sides of the mounting seat;

[0029] The first actuator includes a first lifting driving member and a first actuator disposed at a driving end of the first lifting driving member through a connecting frame, wherein the first actuator is a suction cup to pick up the sheet;

[0030] The second actuator includes a second lifting drive member, a horizontal drive member and a clamping jaw assembly, wherein the horizontal drive member is connected to the driving end of the second lifting drive member, and the clamping jaw assembly is connected to the driving end of the horizontal drive member to clamp the plate.

[0031] By adopting the above technical solution, the sheet is picked up by the suction cup and the plate is clamped by the clamping claw assembly, which improves the reliability of the robot arm in handling the sheet and plate, thereby improving the assembly reliability and yield rate; at the same time, the first actuator and the second actuator are symmetrically arranged on both sides of the mounting base, which can improve the stability of the end of the robot arm body, thereby improving the handling reliability, assembly reliability and yield rate.

[0032] In some embodiments, the plate includes a plurality of positioning holes extending through the plate in a thickness direction; and the plate feeding mechanism includes:

[0033] A storage rack, comprising a storage space, wherein the storage space is used to store the plate;

[0034] A plurality of plate position detection members are arranged on the storage rack and are used to detect the position of the plate in the storage space through the positioning holes;

[0035] At least one material discharging detection member is arranged outside the storage space and is used for calculating the quantity of the plates moved out of the storage space.

[0036] By adopting the above technical solution, the position of the plates in the storage space is detected by multiple plate position detection components, which can reduce the damage rate of the plates when the robot arm grabs the plates through the second actuator, and the number of plates can be obtained through the discharge detection component, thereby facilitating the robot arm's control over the handling of the plates.

[0037] In some embodiments, the assembly device further includes a plate positioning platform disposed on the mounting platform, the plate positioning platform having a limiting space, and the limiting space is used to accommodate the plate.

[0038] By adopting the above technical solution, the plate is positioned through the limit space of the plate positioning platform, which improves the accuracy and reliability of the robot arm in handling the plate, thereby improving the accuracy and reliability of assembly.

[0039] In some embodiments, the plate includes a plurality of vertex positioning holes extending through the thickness direction thereof and located at the vertex corners thereof;

[0040] The plate positioning platform includes a plurality of positioning pins corresponding to the plurality of vertex positioning holes one by one, and the limiting space is formed between the plurality of positioning pins.

[0041] Other features and corresponding beneficial effects of the present application are described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the records in the specification of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 This is a schematic diagram of the structure of the semiconductor module assembly device of the present application;

[0043] Figure 2 It is a partial structural schematic diagram of the mechanical arm of the device;

[0044] Figure 3 A schematic diagram of a portion of the structure of the mechanical arm of the device from another angle;

[0045] Figure 4 It is a structural schematic diagram of the sheet material feeding mechanism of the device;

[0046] Figure 5 It is a schematic diagram of the discharge position of the sheet material feeding mechanism of the device in the use state;

[0047] Figure 6 It is a structural schematic diagram of the plate feeding mechanism of the device;

[0048] Figure 7 It is a structural schematic diagram of the plate positioning platform of the device.

[0049] Description of reference numerals: 1, sheet; 2, plate; 21, positioning hole; 22, vertex positioning hole;

[0050] 100. Installation platform;

[0051] 200, sheet material feeding mechanism; 201, frame; 210, limit frame; 220, material pressing member; 221, connecting arm; 222, second driving member; 230, bearing platform; 231, material discharging part; 232, abutting part; 233, first driving member; 240, limit frame; 241, U-shaped limit member; 250, presence or absence detection member; 260, material discharging position; 261, arc surface; 262, supporting surface;

[0052] 300, plate feeding mechanism; 310, storage rack; 311, storage space; 320, plate position detection member; 330, material discharging detection member;

[0053] 400, mechanical arm; 410, mechanical arm body; 420, mounting seat; 430, first actuator; 431, first lifting drive member; 432, first actuator; 440, second actuator; 441, second lifting drive member; 442, horizontal drive member; 443, clamping claw assembly;

[0054] 500. Plate positioning platform; 510. Positioning pin. DETAILED DESCRIPTION

[0055] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0056] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0057] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0058] In the description of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description created by the present application, unless otherwise specified, "multiple" means two or more.

[0059] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0060] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0061] Semiconductor modules usually use metal connecting pieces to weld different layers. For example, in SSDC modules, the ceramic substrate and the heat sink are welded by tin sheets.

[0062] Metal connecting sheets in semiconductor modules, such as tin sheets, are usually cut from coiled materials, that is, the strip material is first coiled and bent into a disc shape to facilitate transportation and transfer, and then gradually unrolled and cut into sheet materials for easy use. The sheet material formed in this way will bend in the unrolling direction and have poor flatness, resulting in low assembly accuracy and uneven contact surface with the layer board, which affects the assembly accuracy of the subsequent layer boards, and causes poor welding uniformity during welding, and even offsets and contaminates the layer board, resulting in a low yield rate of semiconductor modules.

[0063] See also Figure 1 , Figure 1 This is a schematic structural diagram of the semiconductor module assembly device of the present application.

[0064] The embodiment of the present application provides a semiconductor module assembly device, which is particularly suitable for a semiconductor module including a sheet 1 and a plate 2, and can reduce the space required for assembly, improve assembly efficiency, and improve the yield rate of the semiconductor module.

[0065] Specifically, the assembling device includes a mounting platform 100 , and a sheet material loading mechanism 200 , a plate material loading mechanism 300 and a robot arm 400 which are arranged on the mounting platform 100 .

[0066] The sheet material feeding mechanism 200 is used to provide the sheet material 1 .

[0067] The plate material feeding mechanism 300 is used to provide the plate 2 .

[0068] The robot 400 includes a robot body 410 and a first actuator 430 and a second actuator 440 disposed at the end of the robot body 410 .

[0069] The robot 400 carries the sheet 1 through the first actuator 430 and carries the plate 2 through the second actuator 440, that is, the present method uses the robot 400 with two actuators to realize that a single robot 400 can carry the sheet 1 and the plate 2, thereby reducing the space required for assembly and improving assembly efficiency. In addition, for the sheet 1 that is easy to bend and deform, and for the semiconductor module assembly in which the assembly order is that the plate 2 covers the sheet 1, the harder plate 2 quickly covers the softer sheet 1 and can also limit the deformation of the sheet 1, thereby improving the yield rate.

[0070] See also Figure 2-3 , Figure 2 It is a partial structural schematic diagram of the mechanical arm 400 of the present device; Figure 3 FIG. 4 is a schematic diagram of a portion of the structure of the robot arm 400 of the device from another angle.

[0071] In one embodiment, the robot 400 also includes a mounting base 420 disposed at the end of the robot body 410, and the first actuator 430 and the second actuator 440 are symmetrically disposed on both sides of the mounting base 420, which can improve the stability of the end of the robot body 410, thereby improving the handling reliability, assembly reliability and yield rate.

[0072] In one embodiment, the first actuator 430 includes a first lifting driving member 431 and a first actuator 432 disposed at a driving end of the first lifting driving member 431 via a connecting frame. The first actuator 432 is a suction cup to pick up the sheet 1 .

[0073] In one embodiment, the second actuator 440 includes a second lifting drive member 441, a horizontal drive member 442 and a clamping jaw assembly 443, the horizontal drive member 442 is connected to the driving end of the second lifting drive member 441, and the clamping jaw assembly 443 is connected to the driving end of the horizontal drive member 442 to clamp the plate 2.

[0074] This method uses the suction cup to pick up the sheet 1 and the clamping claw assembly 443 to clamp the plate 2, which improves the reliability of the robot arm 400 in handling the sheet 1 and the plate 2, thereby improving the assembly reliability and yield rate.

[0075] In one embodiment, the plate 2 includes a plurality of positioning holes 21 extending through the thickness direction thereof, and the second actuator 440 includes a plurality of positioning pins 510. The plurality of positioning pins 510 contact the plate 2 before the clamping jaw assembly 443, thereby positioning the plate 2. The clamping jaw assembly 443 then clamps the plate 2, thereby improving the clamping reliability.

[0076] See also Figure 4-5 , Figure 4 It is a structural schematic diagram of the sheet material feeding mechanism 200 of the device; Figure 5It is a schematic diagram of the discharge position 260 of the sheet material feeding mechanism 200 of the device in use.

[0077] In one embodiment, the sheet material loading mechanism 200 includes a discharge position 260 .

[0078] The discharge position 260 has a curved surface 261 , and the curved surface 261 is opposite to the bending direction of the sheet 1 .

[0079] The first actuator 430 includes a first actuator 432 , which is used to first apply pressure to the sheet 1 located on the arc surface 261 of the discharge position 260 so that the sheet 1 fits the arc surface 261 , and then pick up the sheet 1 .

[0080] This method realizes the reverse deformation of the sheet 1 before picking up by cooperating the arc surface 261 of the discharge position 260 in the opposite direction of the bending direction of the sheet 1 with the first actuator 432 of the robot 400. In the process of picking up and transferring the sheet 1 by the first actuator 432, the reversely deformed sheet 1 can gradually recover to the original direction and offset its original bending deformation, thereby improving the flatness of the sheet 1, and then improving the assembly accuracy of the subsequent layer board, as well as the welding uniformity, and improving the semiconductor module yield. In addition, compared with adjusting the flatness of the sheet 1 by other mechanisms alone, this mechanism combines the flatness adjustment structure with the feeding structure, which can effectively control the overall volume and improve assembly efficiency.

[0081] In one embodiment, the discharge position 260 also has two supporting surfaces 262 respectively arranged at both ends of the arc surface 261, and the supporting surfaces 262 are used to support the ends of the sheet 1, so that the stability of the sheet 1 on the arc surface 261 is higher, thereby improving the position accuracy of the sheet 1, and then improving the deformation accuracy of the sheet 1, improving the flatness of the sheet 1, and improving the yield rate of the semiconductor module.

[0082] In one embodiment, the sheet material loading mechanism 200 further includes a material supply component and a material delivery component.

[0083] The supply assembly is used to store the sheet material 1 and is connected to the feeding assembly to provide the sheet material 1 to the feeding assembly.

[0084] The feeding assembly is used to transfer the sheets 1 piece by piece along the first direction to the discharge position 260 .

[0085] This method realizes sheet-by-sheet discharging through a feeding assembly, and can control the number of sheets 1 located at the discharging position 260, thereby increasing the pressure applied by the first actuator 432 of the robot 400 to make the sheet 1 deform in reverse and fit the curved surface 261, further improving the flatness of the sheet 1 and improving the yield rate of the semiconductor module.

[0086] In addition, the cooperation between the feeding assembly and the feeding assembly can realize uninterrupted material discharge of the feeding assembly, thereby improving assembly efficiency.

[0087] In one embodiment, the two support surfaces 262 are arranged along a first direction, that is, consistent with the direction in which the feeding assembly transfers the sheet 1 to the discharge position 260 , thereby improving the discharge reliability. In one embodiment, the feeding assembly includes a limit frame 210 and a press member 220 .

[0088] Specifically, the limiting frame 210 is used to limit the sheet 1 in the circumferential direction, and the bottom of the limiting frame 210 is configured as a feed port, which is located above the feeding assembly.

[0089] The pressing member 220 is disposed in the limiting frame 210 and can apply pressure to the sheet 1 in the limiting frame 210 in a direction toward the feed port.

[0090] This method achieves circumferential and height restrictions on the sheet 1 through the cooperation of the limit frame 210 and the pressure piece 220, thereby improving the stability of the sheet 1 in storage, thereby improving the stability of the feeding component providing the sheet 1 to the feeding component, and further improving the feeding stability of the sheet 1.

[0091] At the same time, by applying pressure to the sheet 1 in the limiting frame 210 through the material pressing piece 220 in the direction of the feeding port, the reverse deformation of the sheet 1 can be preliminarily achieved, thereby further improving the flatness of the sheet 1 and improving the yield rate of the semiconductor module.

[0092] It is understandable that the pressing member 220 controls the magnitude of the pressure applied to the sheet 1 as the number of sheets 1 in the limiting frame 210 changes, thereby avoiding damage to the sheet 1 and facilitating the subsequent feeding assembly to feed out the sheet 1.

[0093] In one embodiment, the feeding assembly includes a carrier 230 , and the carrier 230 can be switched between a first position and a second position along a first direction.

[0094] The supporting platform 230 is provided with a discharge portion 231 and a contact portion 232 , and the discharge portion 231 is provided with an arc surface 261 .

[0095] A discharge port is provided at the bottom of the limiting frame 210 in the first direction.

[0096] When the supporting platform 230 is located at the first position, the discharging portion 231 is opposite to the feeding port and obtains the sheet 1 in the limiting frame 210 .

[0097] When the supporting platform 230 is switched from the first position to the second position, the discharging portion 231 supports the sheet 1 to be sent out from the discharging port, and a discharging position 260 is formed.

[0098] When the supporting platform 230 is located at the second position, the abutting portion 232 abuts against the feeding port of the limiting frame 210 .

[0099] In this manner, the material discharging position 260 is formed by switching the support platform 230 between the first position and the second position, so that the feeding component has a simple structure and a small volume, and the volume of the feeding mechanism can be effectively controlled, while the feeding is reliable.

[0100] It can be understood that the size of the discharge port is adapted to the size of the sheet 1 being fed out, so as to ensure that the feeding assembly feeds the sheet one by one.

[0101] In one embodiment, a friction surface is provided on the discharge portion 231, and the friction surface faces the feed port of the limit frame 210, so that when the support platform 230 switches from the first position to the second position, the friction surface supports and drives the sheet 1 to be sent out from the discharge port, which can improve the reliability of the sheet-by-sheet feeding of the discharge portion 231 of the support platform 230, thereby improving the matching accuracy between the arc surface 261 of the discharge position 260 and the first actuator 432 of the robot arm 400, and further improving the flatness of the sheet 1.

[0102] In order to improve the reliability of feeding the sheet by sheet by the discharge portion 231 of the supporting platform 230, in other alternative embodiments, a discharge block is provided at one end of the discharge portion 231 close to the abutment portion 232, and the height of the discharge block matches the thickness of the sheet 1, so that when the supporting platform 230 switches from the first position to the second position, the discharge block drives the sheet 1 to be fed out from the discharge port.

[0103] In other alternative embodiments, the discharge portion 231 is connected to an air control component so that when the support platform 230 switches from the first position to the second position, the air control component sucks the sheet 1 and sends it out from the discharge port, which can also improve the reliability of the discharge portion 231 of the support platform 230 in feeding the sheet one by one.

[0104] It is understandable that the above methods for improving the reliability of feeding piece by piece by the discharge portion 231 of the carrier 230 can also be combined with two or all or other methods, so as to further improve the reliability of feeding piece by piece by the discharge portion 231 of the carrier 230.

[0105] In one embodiment, a limit frame 240 is disposed on the circumference of the carrying platform 230 to limit the movement of the carrying platform 230 along the first direction, thereby improving the movement reliability of the carrying platform 230 .

[0106] In one embodiment, a presence detector 250 is provided near the end of the moving path of the carrier 230 to detect the position of the carrier 230, thereby improving the reliability of loading. The presence detector 250 can be, but is not limited to, a proximity switch, a photoelectric switch, and the like.

[0107] In one embodiment, a U-shaped limiting member 241 is disposed above the end of the limiting frame 240 to circumferentially limit the sheet 1 located at the discharge position 260 , thereby improving the safety of the sheet 1 located at the discharge position 260 .

[0108] In one embodiment, the sheet material feeding mechanism 200 further includes a frame 201 , on which a first driving member 233 and a second driving member 222 are disposed.

[0109] Specifically, the first driving member 233 is connected to the carrying platform 230 to drive the carrying platform 230 to move along the first direction.

[0110] The second driving member 222 is connected to the pressing member 220 via the connecting arm 221 to drive the pressing member 220 to apply pressure to the sheet 1 in the limiting frame 210 along the direction toward the feeding port.

[0111] In one embodiment, the first driving member 233 and the second driving member 222 are both cylinders, thereby ensuring efficient reciprocating movement of the supporting platform 230 and the pressing member 220, improving assembly efficiency, and being light and simple in structure, thereby reducing the volume and weight of the mechanism.

[0112] In other alternative embodiments, at least one of the first driving member 233 and the second driving member 222 is a linear motor.

[0113] In one embodiment, see again Figure 3 There are two first actuators 432 , both of which are suction cups. The two suction cups are used to first apply pressure to the sheet 1 on the curved surface 261 of the discharge position 260 so that the sheet 1 fits with the curved surface 261 , and then suck the sheet 1 .

[0114] This method uses a suction cup to pick up the sheet 1, which improves the safety of picking up the sheet 1 and reduces the risk of damage to the sheet 1. In addition, it is convenient to achieve the fit of the sheet 1 and the curved surface 261 through the deformation of the suction cup, improves the degree of fit between the reverse deformation of the sheet 1 and the curved surface 261, and further improves the flatness of the sheet 1. At the same time, the two suction cups can further improve the fit between the sheet 1 and the curved surface 261, thereby further improving the flatness of the sheet 1 and improving the yield rate of the semiconductor module.

[0115] In one embodiment, the feeding assembly includes a supporting platform 230 and a pushing rod, the supporting platform 230 is used to support the sheet 1, and the pushing rod is used to push the sheet 1 from the supporting platform 230 to the discharge position 260 piece by piece along the first direction, so that the discharge position 260 is separated from the feeding assembly to facilitate the assembly of the feeding assembly.

[0116] See also Figure 6 , Figure 6 It is a structural schematic diagram of the plate feeding mechanism 300 of the device.

[0117] In one embodiment, the plate 2 includes a plurality of positioning holes 21 extending through the plate 2 in its thickness direction.

[0118] The plate material loading mechanism 300 includes a storage rack 310 , a plurality of plate position detection components 320 and at least one material discharging detection component 330 .

[0119] The storage rack 310 includes a storage space 311 , and the storage space 311 is used to store the plates 2 .

[0120] Multiple plate position detection components 320 are arranged on the storage rack 310, and are used to detect the position of the plate 2 located in the storage space 311 through the positioning hole 21, so as to determine whether the plate 2 is placed accurately in the storage space 311, which can reduce the damage rate of the plate 2 when the robot arm 400 grabs the plate 2 through the second actuator 440.

[0121] At least one discharge detection member 330 is disposed outside the storage space 311 and is used to calculate the number of plates 2 moved out of the storage space 311 , that is, the number of plates 2 remaining in the storage space 311 , thereby facilitating the control of the handling of the plates 2 by the robot arm 400 .

[0122] See also Figure 7 , Figure 7 It is a structural schematic diagram of the plate positioning platform 500 of the device.

[0123] In one embodiment, the assembly device further includes a plate positioning platform 500 disposed on the mounting platform 100, the plate positioning platform 500 having a limiting space, the limiting space being used to accommodate the plate 2, that is, the plate 2 is positioned by the limiting space of the plate positioning platform 500, which can improve the accuracy and reliability of the robot arm 400 in carrying the plate 2, thereby improving the assembly accuracy and reliability. It should be noted that the plate 2 may include a plurality of special positioning holes 21, such as vertex positioning holes 22, that is, the plate 2 includes a plurality of vertex positioning holes 22 that penetrate the thickness direction thereof and are located at the vertex thereof.

[0124] Furthermore, in one embodiment, the plate positioning platform 500 includes a plurality of positioning pins 510 corresponding one-to-one to the plurality of vertex positioning holes 22 , and a limiting space is formed between the plurality of positioning pins 510 , thereby achieving positioning of the plate 2 at the second position.

[0125] It can be understood that when the second actuator 440 is also provided with a positioning pin 510, the positioning pin 510 of the plate positioning platform 500 and the positioning pin 510 of the second actuator 440 are staggered and correspond to different positioning holes 21 of the plate 2, thereby facilitating the second actuator 440 to grab the plate 2 from the plate positioning platform 500.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor module assembly device, wherein the semiconductor module comprises a sheet and a plate, characterized in that: The assembly device comprises a mounting platform, and a sheet material feeding mechanism, a plate material feeding mechanism and a mechanical arm arranged on the mounting platform; The sheet material feeding mechanism is used to provide the sheet material; The plate feeding mechanism is used to provide the plate; The robot arm includes a robot arm body, and a first actuator and a second actuator disposed at the end of the robot arm body. The robot arm transports the sheet material through the first actuator and transports the plate material through the second actuator; and, The sheet material feeding mechanism comprises a material discharging position, the material discharging position has an arc-shaped surface, and the arc-shaped surface is opposite to the bending direction of the sheet material; The first actuator includes a first actuator, which is used to first apply pressure to the sheet material on the arc surface at the discharge position so that the sheet material fits the arc surface, and then pick up the sheet material.

2. The semiconductor module assembly device according to claim 1, wherein: The material discharging position also has two supporting surfaces which are respectively arranged at two ends of the arc-shaped surface, and the supporting surfaces are used to support the ends of the sheet material.

3. The semiconductor module assembly device according to claim 1, wherein: The sheet material feeding mechanism also includes a feeding component and a feeding component; The material supply assembly is used to store the sheet material and is connected to the material feeding assembly to provide the sheet material to the material feeding assembly; The feeding assembly is used to transfer the sheets one by one along the first direction to the discharging position; The feeding assembly also includes a limiting frame and a pressing piece; The limiting frame is used to limit the sheet material in the circumferential direction, and the bottom of the limiting frame is set as a feed port, and the feed port is located above the feeding assembly; The material pressing member is arranged in the limiting frame and can apply pressure to the sheet material in the limiting frame along a direction toward the feeding port.

4. The semiconductor module assembly device according to claim 3, characterized in that: The feeding assembly includes a carrying platform, and the carrying platform can be switched between a first position and a second position along the first direction; The bearing platform is provided with a discharging portion and an abutting portion, and the discharging portion is provided with the arc surface; the bottom of the limiting frame is provided with a discharging port in the first direction; When the carrying platform is located at the first position, the discharging portion is opposite to the feeding port and obtains the sheet in the limiting frame; When the support platform is switched from the first position to the second position, the discharge portion supports the sheet material to be discharged from the discharge port and forms the discharge position; When the supporting platform is located at the second position, the abutting portion abuts against the feeding port of the limiting frame.

5. The semiconductor module assembly device according to claim 1, wherein: The mechanical arm further comprises a mounting seat arranged at the end of the main body of the mechanical arm, and the first actuator and the second actuator are symmetrically arranged on both sides of the mounting seat; The first actuator includes a first lifting driving member and a first actuator disposed at a driving end of the first lifting driving member through a connecting frame, wherein the first actuator is a suction cup to pick up the sheet; The second actuator includes a second lifting drive member, a horizontal drive member and a clamping jaw assembly, wherein the horizontal drive member is connected to the driving end of the second lifting drive member, and the clamping jaw assembly is connected to the driving end of the horizontal drive member to clamp the plate.

6. The semiconductor module assembly device according to claim 1, wherein: The plate includes a plurality of positioning holes extending through the thickness direction thereof; The plate feeding mechanism comprises: A storage rack, comprising a storage space, wherein the storage space is used to store the plate; A plurality of plate position detection members are arranged on the storage rack and are used to detect the position of the plate in the storage space through the positioning holes; At least one material discharging detection member is arranged outside the storage space and is used for calculating the quantity of the plates moved out of the storage space.

7. The semiconductor module assembly device according to claim 1, wherein: The assembling device further comprises a plate positioning platform disposed on the mounting platform, wherein the plate positioning platform has a limiting space, and the limiting space is used to accommodate the plate.

8. The semiconductor module assembly device according to claim 7, wherein: The plate includes a plurality of vertex positioning holes extending through the thickness direction thereof and located at the vertex corners thereof; The plate positioning platform includes a plurality of positioning pins corresponding to the plurality of vertex positioning holes one by one, and the limiting space is formed between the plurality of positioning pins.

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