Semiconductor cooling device

Abstract

The utility model belongs to the technical field of equipment cooling, and discloses a semiconductor cooling device. The semiconductor cooling device comprises a cooling plate; the sealing assembly is arranged on one side of the cooling plate and attached to the side face of the cooling plate in a sealed mode to define a cooling space used for installing a to-be-cooled device. And the cooling assembly is arranged on the other side of the cooling plate and is attached to the cooling plate, so that the cooling plate exchanges heat with the to-be-cooled device to dissipate heat of the to-be-cooled device. When the semiconductor cooling device is used, the device to be cooled is sealed in the cooling space, and the moisture content in the cooling space is low, so that when the device to be cooled is quickly cooled, water vapor in the air cannot enter the device, dew cannot be formed and attached to the surface of the device to be cooled, the safe operation of the device to be cooled can be ensured, and the service life of the device to be cooled is prolonged. And heat exchange is completed only through the cooling plate, and high heat exchange efficiency can be maintained only by controlling the cooling plate to be in a proper thickness, so that efficient heat dissipation of the to-be-cooled device is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of equipment cooling, in particular to a semiconductor cooling device. Background Art

[0002] When electronic components are running, they will continuously generate heat, causing the temperature to rise. In order to ensure that the electronic components can operate stably, for example in the optical industry, the temperature of the light source will directly affect its output power. Therefore, a cooling device needs to be set up to exchange heat with the electronic components in time to maintain the temperature of the electronic components within an appropriate range.

[0003] In the prior art, in order to improve the cooling effect, the refrigeration device can use semiconductor refrigeration. Conventional semiconductor refrigeration devices will be equipped with a piping system to transport a circulating cooling fluid. When the cooling fluid passes through structures such as electronic components, it can take away the heat generated by them, thereby achieving efficient heat dissipation.

[0004] However, this heat dissipation method can easily cause the electronic components to cool down quickly, and the water vapor in the air will form dew that adheres to the surface of the electronic components, affecting the safe operation of the electronic components. Utility Model Content

[0005] The utility model aims to provide a semiconductor cooling device, which solves the problem in the prior art that when a conventional semiconductor refrigeration device is used to cool structures such as electronic components, water vapor in the air easily forms dew and adheres to the surface of the electronic components, thereby affecting the safe operation of the electronic components.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a semiconductor cooling device, which comprises:

[0008] Cooling plate;

[0009] A closing component is arranged on one side of the cooling plate and is sealed and fitted with the side of the cooling plate to enclose a cooling space for installing a device to be cooled;

[0010] The cooling assembly is arranged on the other side of the cooling plate and is attached to the cooling plate so as to dissipate heat from the device to be cooled by heat exchange between the cooling plate and the device to be cooled.

[0011] Optionally, a side of the cooling plate close to the closing component has a mounting portion; the closing component comprises:

[0012] A mounting frame, arranged opposite to the cooling plate;

[0013] A sealing member is arranged between the mounting frame and the cooling plate and is arranged around the periphery of the mounting portion. One side of the sealing member is pressed against the mounting frame and the other side is pressed against the cooling plate to form the cooling space between the mounting frame, the sealing member and the cooling plate.

[0014] Optionally, the closure assembly further comprises:

[0015] A drying component is arranged between the cooling plate and the mounting frame, and the drying component is located on the inner side of the sealing component.

[0016] Optionally, there is a thermal insulation gap between the mounting frame and the cooling plate.

[0017] Optionally, the closure assembly further comprises:

[0018] The heat insulating part is arranged between the cooling plate and the mounting frame.

[0019] Optionally, the mounting frame comprises:

[0020] A bottom plate, arranged opposite to the cooling plate;

[0021] A connecting piece is arranged on a side of the base plate away from the cooling plate.

[0022] Optionally, the device to be cooled is a light source, and the light source is fixed to the mounting portion through a substrate;

[0023] The connecting piece is a mounting tube, and a lens tube corresponding to the light source is arranged in the mounting tube.

[0024] Optionally, the device to be cooled is a chip;

[0025] The connecting piece is a cable gland.

[0026] Optionally, the cooling assembly includes a semiconductor refrigerator, and a cold surface of the semiconductor refrigerator is attached to a side surface of the cooling plate.

[0027] Optionally, the cooling assembly further comprises a heat sink, and the heat sink is arranged on the hot surface of the semiconductor refrigerator.

[0028] Beneficial effects of the utility model:

[0029] By forming a cooling space between the cooling plate and the closed component, the device to be cooled is arranged in the cooling space, and the heat generated by the device to be cooled during operation can be heat-exchanged with the cooling component through the cooling plate, thereby achieving heat dissipation of the device to be cooled. In this way, when the semiconductor cooling device is in use, since the device to be cooled is enclosed in the cooling space, the moisture content in the cooling space is low. When the device to be cooled is cooled rapidly, water vapor in the external air cannot enter, and dew will not form and adhere to the surface of the device to be cooled, which can ensure the safe operation of the device to be cooled. Moreover, the heat exchange is only completed through the cooling plate, and it is only necessary to control the cooling plate at an appropriate thickness to maintain a high heat exchange efficiency, thereby ensuring efficient heat dissipation of the device to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of a semiconductor cooling device in an embodiment of the utility model;

[0031] Figure 2 It is a structural cross-sectional view of a semiconductor cooling device in an embodiment of the utility model;

[0032] Figure 3 It is a structural schematic diagram when the device to be cooled arranged in the semiconductor cooling device in the embodiment of the utility model is a light source;

[0033] Figure 4 The utility model is a schematic structural diagram of a semiconductor cooling device in which a device to be cooled is a chip.

[0034] In the figure:

[0035] 1. Cooling plate; 11. Cooling space; 12. Mounting part; 2. Enclosing assembly; 21. Mounting frame; 211. Bottom plate; 212. Connector; 22. Sealing member; 23. Drying member; 24. Insulating gap; 25. Insulating part; 3. Cooling assembly; 31. Semiconductor refrigerator; 32. Heat sink; 321. Heat sink; 322. Heat sink fin; 4. Light source; 41. Lens barrel; 5. Chip. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] The utility model embodiment discloses a semiconductor cooling device.

[0041] Reference Figure 1 and Figure 2 The semiconductor cooling device includes a cooling plate 1, a sealing component 2 and a cooling component 3. The sealing component 2 is arranged on one side of the cooling plate 1 and is sealed and fitted with the side of the cooling plate 1 to enclose a cooling space 11 for installing the device to be cooled; the cooling component 3 is arranged on the other side of the cooling plate 1 and is fitted with the cooling plate 1 to generate heat exchange with the device to be cooled through the cooling plate 1 to dissipate heat from the device to be cooled.

[0042] Specifically, a closed component 2 is provided on one side of the cooling plate 1, and a cooling component 3 is provided on the other side. The closed component 2 is directly attached to the side of the cooling plate 1 to form a sealed connection, and a sealing structure can also be provided between the two to form a sealed connection. A concave slot-like structure is provided on the closed component 2 or the cooling plate 1 to form a cooling space 11. The specific shape can be designed according to the shape of the device to be cooled. The device to be cooled can be a light source equipped with a lens barrel, a chip equipped with an adapter, or other electronic components. In some embodiments, the cross-section of the cooling plate 1 can be rectangular.

[0043] The cooling component 3 can be an air cooling module, a water cooling module, or other refrigeration modules, which can generate heat exchange with the device to be cooled through the cooling plate 1. The cooling plate 1 can be made of a material with a high thermal conductivity, such as a metal material. The specific structure of the cooling plate 1 can be designed according to the actual application scenario, and the utility model does not limit this.

[0044] By forming a cooling space 11 between the cooling plate 1 and the enclosed component 2, the device to be cooled is arranged in the cooling space 11, and the heat generated by the device to be cooled during operation can be heat-exchanged with the cooling component 3 through the cooling plate 1, thereby achieving heat dissipation of the device to be cooled. In this way, when the semiconductor cooling device is in use, since the device to be cooled is enclosed in the cooling space 11, the moisture content in the cooling space 11 is small. When the device to be cooled is cooled rapidly, water vapor in the external air cannot enter, and dew will not form and adhere to the surface of the device to be cooled, which can ensure the safe operation of the device to be cooled. Moreover, the heat exchange is only completed through the cooling plate 1, and it is only necessary to control the cooling plate 1 at an appropriate thickness to maintain a high heat exchange efficiency, thereby ensuring efficient heat dissipation of the device to be cooled.

[0045] Optionally, the cooling plate 1 has a mounting portion 12 on one side close to the enclosing assembly 2; the enclosing assembly 2 includes a mounting frame 21 and a sealing member 22. The mounting frame 21 is arranged opposite to the cooling plate 1; the sealing member 22 is arranged between the mounting frame 21 and the cooling plate 1, and is arranged around the periphery of the mounting portion 12, one side of the sealing member 22 is pressed against the mounting frame 21, and the other side is pressed against the cooling plate 1, so as to form a cooling space 11 between the mounting frame 21, the sealing member 22 and the cooling plate 1.

[0046] Specifically, the side of the cooling plate 1 is concave to form a mounting portion 12, and the device to be cooled can be fixed to the mounting portion 12 through a substrate, and the fixing method can be bonding, welding, or bolt connection. The mounting frame 21 is arranged opposite to the cooling plate 1, and a mounting groove is arranged on one side of the cooling plate 1 close to the mounting frame 21, and a sealing member 22 is arranged in the mounting groove. The sealing member 22 can be a sealing ring made of rubber material, which has a certain deformation ability. One side of the sealing ring abuts against the cooling plate 1, and the other side abuts against the side of the mounting frame 21, so that the mounting frame 21, the sealing member 22 and the cooling plate 1 are enclosed to form a sealed cooling space 11. In addition, the connection between the mounting frame 21 and the cooling plate 1 can be achieved by bolt connection or clamping. After the mounting frame 21 is fixedly connected to the cooling plate 1, the sealing ring is respectively pressed against the mounting frame 21 and the cooling plate 1. The specific connection method can be designed according to the actual assembly requirements, and the utility model does not limit this.

[0047] In other embodiments, by providing a mounting frame 21 and a seal 22, the mounting frame 21, the seal 22 and the cooling plate 1 enclose a cooling space 11. At the same time, the seal 22, the mounting frame 21 and the cooling plate 1 can be fixedly connected by adhesives, etc., and there is no need to provide an additional separate fixing structure, thereby reducing the complexity of the overall structure.

[0048] Optionally, the sealing assembly 2 further includes a drying member 23 . The drying member 23 is disposed between the cooling plate 1 and the mounting frame 21 , and the drying member 23 is located on the inner side of the sealing member 22 .

[0049] Specifically, the drying member 23 may also be annular, one side of which abuts against the mounting frame 21, and the other side abuts against the cooling plate 1. The drying member 23 is made of a loose porous moisture-absorbing material to absorb moisture in the cooling space 11, thereby further reducing the possibility of dew in the cooling space 11 during the cooling process. In other embodiments, the drying member 23 may also be fixedly connected to the mounting frame 21 and the cooling plate 1, respectively.

[0050] Optionally, a heat insulating gap 24 is provided between the mounting frame 21 and the cooling plate 1 .

[0051] Specifically, by setting the thermal insulation gap 24, a certain distance is maintained between the mounting frame 21 and the cooling plate 1 without forming surface contact, so that the heat exchange efficiency between the cooling plate 1 and the mounting frame 21 is low, thereby ensuring that the heat on the device to be cooled can be quickly transferred to the cooling assembly 3, thereby further improving the cooling effect.

[0052] Optionally, the sealing assembly 2 further includes a heat insulating portion 25. The heat insulating portion 25 is disposed between the cooling plate 1 and the mounting frame 21.

[0053] Specifically, the heat insulating part 25 can be located between the sealing part 22 and the drying part 23. The heat insulating part 25 has a low thermal conductivity coefficient and poor thermal conductivity. The heat insulating part 25 can be arranged in a ring shape around the outside of the mounting part 12, or in a plurality of blocks distributed in a ring shape. The two ends of the heat insulating part 25 are respectively in contact with the cooling plate 1 and the mounting frame 21 to further reduce the heat transfer efficiency between the two.

[0054] Optionally, the cooling assembly 3 includes a semiconductor refrigerator 31 . The cold surface of the semiconductor refrigerator 31 is attached to the side surface of the cooling plate 1 .

[0055] Specifically, the specific structure of the semiconductor refrigerator 31 can refer to the prior art, and the utility model will not go into details here. The cold surface of the semiconductor refrigerator 31 can be adhered to the side of the cooling plate 1 away from the closed component 2 by a structure such as a thermal conductive adhesive, or the semiconductor refrigerator 31 is fixedly connected to the side of the cooling plate 1 away from the closed component 2 by a fastener, and the semiconductor refrigerator 31 is arranged directly opposite to the device to be cooled, so that the distance between the semiconductor refrigerator 31 and the device to be cooled is small, which effectively improves the heat dissipation effect. A heat-conducting structure can be arranged on the hot surface of the semiconductor cooling surface to quickly export the heat, and the heat-conducting structure can be a fan, a water cooling plate, a heat-conducting plate, etc.

[0056] Optionally, the cooling assembly 3 further includes a heat sink 32 , and the heat sink 32 is disposed on the hot surface of the semiconductor refrigerator 31 .

[0057] Specifically, the heat sink 32 is made of a material with a high thermal conductivity, and includes a heat sink 321, which is fixed to the hot surface of the semiconductor refrigerator 31 by bonding or other means, and the cross-sectional area of ​​the heat sink 321 is larger than the cross-sectional area of ​​the hot surface of the semiconductor refrigerator 31, thereby improving the heat dissipation effect. A plurality of heat dissipation fins 322 are spaced apart on one side of the heat sink 321 away from the semiconductor refrigerator 31, so as to increase the contact area between the heat sink 321 and the air, thereby further improving the heat dissipation effect.

[0058] Reference Figure 3 Optionally, the mounting frame 21 includes a bottom plate 211 and a connecting member 212. The bottom plate 211 is arranged opposite to the cooling plate 1. The connecting member 212 is arranged on a side of the bottom plate 211 away from the cooling plate 1.

[0059] Specifically, the bottom plate 211 is arranged corresponding to the cooling plate 1, and the sealing member 22 and the drying member 23 are placed between the bottom plate 211 and the cooling plate 1. The connecting member 212 can be an integral structure with the bottom plate 211, or can be fixedly connected by a snap connection. A through hole corresponding to the mounting portion 12 is provided in the middle of the mounting frame 21.

[0060] Reference Figure 3Optionally, in one embodiment, the device to be cooled is a light source 4, the light source 4 is fixed to the mounting portion 12 through a substrate, the connecting member 212 is a mounting tube, and a lens barrel 41 corresponding to the light source 4 is arranged in the mounting tube.

[0061] Specifically, the light source 4 can be an LED light source or a laser light source. The light source 4 is welded on the substrate, and the substrate is fixed to the mounting portion 12 by bonding or welding. The mounting tube extends to the side away from the cooling plate 1, and the mounting tube and the bottom plate 211 are in an integrated structure. A lens barrel 41 is arranged in the mounting tube, and a lens group is built in the lens barrel 41. The lens group can modulate the outgoing light emitted by the light source 4 to meet the operation requirements.

[0062] Reference Figure 4 Optionally, in another embodiment, the device to be cooled is a chip 5, and the connecting member 212 is a cable gland.

[0063] Specifically, the chip 5 can also be fixed on the substrate by bonding or welding, and the substrate is mounted on the mounting portion 12. At this time, a card interface is opened at the through hole in the middle of the bottom plate 211, and the end of the cable gland close to the chip 5 is clamped in the card interface. The cable gland has a circuit hole for the circuit electrically connected to the chip 5 to pass through, and the end of the cable gland can form an end seal for the circuit to ensure a sealing effect.

[0064] The device to be cooled can be a light source 4 or a chip 5, and the structure of the mounting frame 21 changes with the device to be cooled to ensure that the device to be cooled can operate normally, thereby making the semiconductor cooling device adaptable to a variety of electronic components, effectively improving the versatility of the semiconductor cooling device.

[0065] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A semiconductor cooling device, characterized in that: include: Cooling plate (1); A sealing component (2) is arranged on one side of the cooling plate (1) and is sealed and fitted with the side of the cooling plate (1) to enclose a cooling space (11) for installing a device to be cooled; A cooling assembly (3) is arranged on the other side of the cooling plate (1) and is in contact with the cooling plate (1) so as to dissipate heat from the device to be cooled by exchanging heat between the cooling plate (1) and the device to be cooled.

2. The semiconductor cooling device according to claim 1, characterized in that: The cooling plate (1) has a mounting portion (12) on one side close to the closing component (2); the closing component (2) comprises: A mounting frame (21) arranged opposite to the cooling plate (1); A sealing member (22) is disposed between the mounting frame (21) and the cooling plate (1), and is arranged around the periphery of the mounting portion (12). One side of the sealing member (22) is pressed against the mounting frame (21), and the other side is pressed against the cooling plate (1), so as to form the cooling space (11) between the mounting frame (21), the sealing member (22) and the cooling plate (1).

3. The semiconductor cooling device according to claim 2, characterized in that: The closure assembly (2) further comprises: A drying component (23) is arranged between the cooling plate (1) and the mounting frame (21), and the drying component (23) is located on the inner side of the sealing component (22).

4. The semiconductor cooling device according to claim 2, characterized in that: A heat insulating gap (24) is provided between the mounting frame (21) and the cooling plate (1).

5. The semiconductor cooling device according to claim 2, characterized in that: The closure assembly (2) further comprises: The heat insulating portion (25) is arranged between the cooling plate (1) and the mounting frame (21).

6. The semiconductor cooling device according to claim 2, characterized in that: The mounting frame (21) comprises: A bottom plate (211) arranged opposite to the cooling plate (1); A connecting piece (212) is arranged on a side of the bottom plate (211) away from the cooling plate (1).

7. The semiconductor cooling device according to claim 6, characterized in that: The device to be cooled is a light source (4), and the light source (4) is fixed to the mounting portion (12) via a substrate; The connecting member (212) is a mounting tube, and a lens tube (41) corresponding to the light source (4) is arranged inside the mounting tube.

8. The semiconductor cooling device according to claim 6, characterized in that: The device to be cooled is a chip (5); The connecting piece (212) is a cable gland.

9. The semiconductor cooling device according to any one of claims 1 to 8, characterized in that: The cooling assembly (3) comprises a semiconductor refrigerator (31), and the cold surface of the semiconductor refrigerator (31) is attached to the side surface of the cooling plate (1).

10. The semiconductor cooling device according to claim 9, characterized in that: The cooling assembly (3) further comprises a heat sink (32), wherein the heat sink (32) is arranged on the hot surface of the semiconductor refrigerator (31).

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