Radiator and power conversion equipment

Abstract

The utility model discloses a radiator and power conversion equipment, and belongs to the technical field of heat dissipation. The radiator comprises a condensation structure, an evaporation structure and at least two temperature sensors. The condensation structure comprises at least two independent condensation cavities. The evaporation structure comprises at least two independent evaporation cavities, and the evaporation cavities and the condensation cavities are in one-to-one correspondence and communicate to form a heat dissipation loop. By forming at least two independent heat dissipation loops, it is ensured that when heat dissipation is conducted on the power device, even if leakage of a heat dissipation working medium in one heat dissipation loop cannot be found in time, the other heat dissipation loops can still be used for conducting heat dissipation on the power device, and the heat dissipation efficiency of the power device is improved. The operation time of the power conversion equipment is prolonged while the heat dissipation effect is ensured as far as possible.

Description

Technical Field

[0001] The present application belongs to the field of heat dissipation technology, and in particular relates to a heat sink and a power conversion device. Background Art

[0002] The power and integration of chips are getting higher and higher, and the power density is also increasing exponentially, which makes the heat generated by electronic components higher and higher. Usually, a radiator is needed to dissipate heat from electronic components. Therefore, the requirements for radiators are getting higher and higher. Compared with the module radiators used before, the phase change radiators currently used can further improve the heat dissipation efficiency through the absorption and release of heat by the phase change working fluid combined with gas-liquid circulation. However, due to the limitations of existing manufacturing processes, radiators with phase change cooling working fluid flowing inside are prone to internal fluid leakage when used in harsh environments, resulting in reduced heat dissipation performance and affecting the service life of electronic equipment. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a heat sink and a power conversion device, which form at least two independent heat dissipation circuits to ensure that when the power device is cooled, even if the heat dissipation medium in one of the heat dissipation circuits fails to be discovered in time to leak, the remaining heat dissipation circuits can be used to dissipate heat for the power device, so as to ensure the heat dissipation effect as much as possible while extending the operating time of the power conversion device.

[0004] In a first aspect, the present application provides a heat sink, comprising:

[0005] A condensation structure, wherein the condensation structure comprises at least two mutually independent condensation chambers;

[0006] The evaporation structure comprises at least two mutually independent evaporation chambers, the evaporation chambers correspond to each other one by one and are connected to the condensation chambers to form a heat dissipation loop, and the evaporation structure is used for heat exchange of power devices.

[0007] According to the radiator of the present application, since the condensation chambers are independent of each other and the evaporation chambers are independent of each other, at least two independent heat dissipation circuits can be formed, thereby ensuring that when cooling the power device, even if a leakage of the heat dissipation medium in one of the heat dissipation circuits is not discovered in time, the remaining heat dissipation circuits can be used to cool the power device, so as to ensure the heat dissipation effect as much as possible while extending the operating time of the power conversion equipment.

[0008] According to one embodiment of the present application, it also includes:

[0009] At least two temperature sensors, the temperature sensors corresponding to the heat dissipation circuits one by one.

[0010] According to one embodiment of the present application, the evaporation structure includes:

[0011] The shell comprises a plurality of enclosing surfaces and is provided with the evaporation chamber.

[0012] According to an embodiment of the present application, the evaporation structure further includes an evaporation substrate, and the evaporation substrate is installed on one of the enclosed surfaces, or one side of the evaporation substrate is one of the enclosed surfaces.

[0013] According to one embodiment of the present application, the evaporation structure further includes:

[0014] At least one partition is connected to the enclosing surface and is used to divide the internal space of the shell into at least two evaporation chambers.

[0015] According to one embodiment of the present application, it also includes:

[0016] At least two temperature sensors are provided, each of the temperature sensors corresponds to the heat dissipation circuit on a one-to-one basis, and are arranged on the same side of the evaporation substrate as the power device.

[0017] According to one embodiment of the present application, the evaporation structure further includes:

[0018] A temperature-averaging component is installed in the evaporation substrate.

[0019] According to one embodiment of the present application, the evaporation substrates have at least two, the shells have at least two, the evaporation substrates correspond to and are connected to the shells one by one, and the evaporation structure further includes:

[0020] At least one heat transfer element is disposed between two adjacent evaporation substrates.

[0021] According to one embodiment of the present application, it also includes:

[0022] At least two pressure sensors, each of which corresponds to each of the heat dissipation circuits;

[0023] At least one control valve is provided between each of two adjacent evaporation chambers, and the control valve is used to control the connection and disconnection between the corresponding two adjacent evaporation chambers.

[0024] According to one embodiment of the present application, it also includes:

[0025] A liquid storage device, wherein a liquid storage cavity is defined in the liquid storage device;

[0026] A connecting pipe, wherein the inlet end of the connecting pipe is connected to the liquid storage chamber, and the outlet end of the connecting pipe is connected to each of the evaporation chambers;

[0027] At least two control valves can be selectively arranged on the connecting pipe, and the control valves correspond to the heat dissipation circuits one by one.

[0028] According to one embodiment of the present application, it also includes:

[0029] At least two pressure sensors, the pressure sensors corresponding to the heat dissipation circuits one by one.

[0030] According to an embodiment of the present application, the liquid storage device is integrated with the evaporation structure.

[0031] In a second aspect, the present application provides a power conversion device, the power conversion device comprising:

[0032] Power devices; and

[0033] The power device is mounted on the heat sink as described above.

[0034] According to the power conversion device of the present application, by forming at least two independent heat dissipation circuits in the radiator, it is ensured that when the power device is cooled, even if the leakage of the heat dissipation medium in one of the heat dissipation circuits is not discovered in time, the remaining heat dissipation circuits can be used to cool the power device, so as to ensure the heat dissipation effect as much as possible while extending the operating time of the power conversion device.

[0035] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0037] Figure 1 It is one of the structural schematic diagrams of the radiator provided in the embodiment of the present application;

[0038] Figure 2 This is the second structural schematic diagram of the radiator provided in the embodiment of the present application;

[0039] Figure 3 This is the third structural schematic diagram of the radiator provided in the embodiment of the present application;

[0040] Figure 4 This is the fourth structural schematic diagram of the radiator provided in the embodiment of the present application;

[0041] Figure 5 This is the fifth structural schematic diagram of the radiator provided in the embodiment of the present application;

[0042] Figure 6This is the fifth structural schematic diagram of the radiator provided in the embodiment of the present application.

[0043] Reference numerals:

[0044] 110. Condensation chamber;

[0045] 210, shell; 211, evaporation chamber; 212, partition; 220, evaporation substrate; 230, temperature equalizing element; 240, heat transfer element;

[0046] 300, temperature sensor; 400, evaporation tube; 500, condensation tube;

[0047] 600, liquid storage device; 700, connecting pipe; 800, control valve; 810, pressure sensor;

[0048] 900. Power devices. DETAILED DESCRIPTION

[0049] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0050] Reference below Figure 1-Figure 6 A heat sink provided in an embodiment of the present application is described, wherein the heat sink includes a condensation structure and an evaporation structure.

[0051] At least two mutually independent condensation chambers 110 are defined in the condensation structure, and the condensation chambers 110 are used to condense the gaseous heat dissipation medium entering through the evaporation tube 400 into a liquid heat dissipation medium. It should be noted that the size, shape and number of the condensation chambers 110 can be designed according to actual needs, and this embodiment does not impose any specific restrictions on this.

[0052] At least two independent evaporation chambers 211 are defined in the evaporation structure. The evaporation chambers 211 correspond to the condensation chambers 110 one by one and are connected to form a heat dissipation circuit. The evaporation structure is used to perform heat exchange on the power device 900. The interior of the evaporation chamber 211 is used to absorb heat and evaporate the liquid heat dissipation medium entering through the condenser 500 into a gaseous heat dissipation medium. It should be noted that the size, shape and number of the evaporation chambers 211 can be designed according to actual needs, and this embodiment does not impose specific restrictions on this.

[0053] It is understandable that the power device 900 generates a large amount of heat during operation. The liquid heat sink in the evaporation chamber 211 absorbs heat and changes to a gaseous or supercritical state to enter the condensation chamber 110. The gaseous heat sink in the condensation chamber 110 releases heat and condenses and then flows back to the evaporator, thereby forming a circulating heat dissipation circuit that does not require external pump power input, while also ensuring that the temperature of the power device 900 is always maintained at a suitable operating temperature.

[0054] It can be understood that since the condensing chambers 110 are independent of each other and the evaporating chambers 211 are independent of each other, at least two independent heat dissipation circuits can be formed, thereby ensuring that when the power device 900 is cooled, even if the leakage of the heat dissipation medium in one of the heat dissipation circuits is not discovered in time, the remaining heat dissipation circuits can be used to cool the power device 900, so as to ensure the heat dissipation effect as much as possible while extending the operating time of the power conversion equipment.

[0055] It should be noted that the heat dissipation medium may be an object with large latent heat properties, including but not limited to water, tetrafluoroethane and chlorotrifluoropropylene, which can absorb a large amount of heat when converted from liquid to gas, thereby maximizing the heat dissipation efficiency.

[0056] According to the heat sink provided in the embodiment of the present application, by forming at least two independent heat dissipation circuits, it is ensured that when the power device 900 is cooled, even if the leakage of the heat dissipation medium in one of the heat dissipation circuits is not discovered in time, the remaining heat dissipation circuits can be used to cool the power device 900, so as to ensure the heat dissipation effect as much as possible while extending the power conversion equipment time rate.

[0057] In this embodiment, Figures 1 to 6 As shown, based on the principle of upward movement of hot air and using gravity to facilitate the reflux of the condensed liquid heat sink, the condensation chamber 110 is located above the corresponding evaporation chamber 211 .

[0058] In this embodiment, Figures 1 to 6 As shown, in order to ensure the heat dissipation effect, the power device 900 is attached to the lower side of the evaporation structure to maximize the contact area and improve the heat dissipation effect. In some embodiments, the power device 900 and the evaporation structure can also be placed in the same sealing structure to adopt non-contact heat dissipation, which is not specifically limited in this embodiment.

[0059] In some embodiments, Figures 1 to 6 As shown, the radiator further includes at least two temperature sensors 300, and the temperature sensors 300 correspond to the heat dissipation circuits one by one. The temperature sensors 300 include but are not limited to thermocouple temperature sensors 300 and thermal resistance temperature detectors. It should be noted that the number of temperature sensors 300 can be designed according to actual needs, and this embodiment does not impose specific restrictions on this.

[0060] It can be understood that the temperature sensor 300 obtains the temperature signal of the corresponding heat dissipation circuit, which can not only obtain the temperature signal in real time, but also facilitate the staff to timely understand the temperature changes of each heat dissipation circuit, and provide a hardware basis for determining the heat dissipation circuit where the heat dissipation fluid leakage occurs, thereby maximizing the service life and maintenance efficiency of the power equipment.

[0061] In this embodiment, Figures 1 to 6 As shown, the temperature sensor 300 is mounted on the evaporation structure.

[0062] It should be noted that, considering that the temperature of the gas is not uniform and changes slowly relative to the temperature of the liquid, the temperature sensor 300 is installed at the evaporation structure to obtain the temperature of the heat dissipation medium of the liquid, thereby ensuring more accurate temperature detection. In addition, since the liquid level in the evaporation chamber 211 will change as the heat dissipation medium absorbs or releases heat, the temperature sensor 300 detects the temperature of the power device 900 near the evaporator to further ensure the accuracy of temperature detection. In addition, by setting the temperature sensor 300 to obtain the temperature signal of the corresponding evaporation chamber 211, a hardware basis is provided for determining the specific heat dissipation medium leakage of the heat dissipation circuit, thereby maximizing the service life and maintenance efficiency of the power equipment.

[0063] It can be understood that detecting leakage based on the temperature sensor 300 is a prior art solution, which is only described here for the purpose of clearly describing the solution, that is, the temperature of the evaporation chamber 211 of each heat dissipation circuit is obtained in real time through the temperature sensor 300. When one of the heat dissipation circuits leaks, the difference between the temperature of the temperature sensor 300 corresponding to the heat dissipation circuit and the temperature at the previous moment is smaller than the temperature difference between two adjacent moments before the leakage of the heat dissipation circuit, and is also smaller than the temperature difference between two adjacent moments of other heat dissipation circuits.

[0064] In some embodiments, Figures 1 to 6 As shown, the radiator further includes at least two evaporation tubes 400 and at least two condensation tubes 500, the evaporation tubes 400 correspond to the condensation chamber 110 one by one, the inlet end of the evaporation tube 400 is connected to the corresponding evaporation chamber 211, and the outlet end of the evaporation tube 400 is connected to the corresponding condensation chamber 110; the condensation tube 500 corresponds to the condensation chamber 110 one by one, the inlet end of the condensation tube 500 is connected to the corresponding condensation chamber 110, and the outlet end of the condensation tube 500 is connected to the corresponding evaporation chamber 211. It should be noted that the specifications of the evaporation tube 400 and the condensation tube 500 can be designed according to actual needs, and this embodiment does not impose specific restrictions on this.

[0065] It can be understood that the heat of the power device 900 is transferred to the evaporation chamber 211, so that the liquid heat dissipation medium is converted into a gaseous heat dissipation medium and enters the condensation chamber 110 through the evaporation tube 400. The gaseous heat dissipation medium releases heat and condenses in the condensation chamber 110 to be converted into a liquid heat dissipation medium and flows back to the evaporation chamber 211 through the condensation tube 500, thereby forming a circulating heat dissipation circuit, ensuring the heat dissipation effect of the power device 900.

[0066] In some embodiments, Figures 1 to 6 As shown, the evaporation structure includes a shell 210, which includes a plurality of enclosed surfaces and is provided with an evaporation chamber 211. The material of the shell 210 includes but is not limited to one or more of aluminum, copper alloy, stainless steel, nickel-chromium alloy, iron-chromium-aluminum alloy, pure titanium, pure nickel, alumina ceramics and silicon nitride ceramics.

[0067] It is understandable that the power device 900 is located below the housing 210, and multiple enclosure surfaces are sequentially connected to directly or indirectly form the evaporation chamber 211. It should be noted that the number and shape of the enclosure surfaces can be designed according to actual needs, and this embodiment does not impose specific restrictions on this.

[0068] Similarly, the condensation structure includes a shell, and the shell forms a condensation chamber 110. The material of the shell includes but is not limited to one or more of aluminum, copper alloy, stainless steel, nickel-chromium alloy, iron-chromium-aluminum alloy, pure titanium, pure nickel, alumina ceramics and silicon nitride ceramics.

[0069] In some embodiments, Figures 1 to 6 As shown, the evaporation structure further includes an evaporation substrate 220, which is mounted on one of the enclosed surfaces, or one side of the evaporation substrate 220 is one of the enclosed surfaces. The materials of the evaporation substrates 220 include, but are not limited to, one or more of aluminum, copper alloy, stainless steel, nickel-chromium alloy, iron-chromium-aluminum alloy, pure titanium, pure nickel, alumina ceramics, and silicon nitride ceramics.

[0070] It can be understood that when the evaporation substrate 220 is installed on one of the enclosing surfaces, that is, multiple enclosing surfaces are connected in sequence and the enclosing surface at the head end is connected to the enclosing surface at the tail end so that the evaporation chamber 211 is directly formed in the shell 210, and the connection method between the evaporation substrate 220 and one of the enclosing surfaces includes but is not limited to bonding or welding, etc., which can facilitate the maintenance and replacement of the evaporation substrate 220. When one side of the evaporation substrate 220 is one of the enclosing surfaces, that is, the evaporation substrate 220 is a part of the shell 210, the remaining multiple enclosing surfaces except the evaporation substrate 220 are connected in sequence and the two sides of the evaporation substrate 220 are respectively connected to the two adjacent enclosing surfaces to form the evaporation chamber 211 together, which can reduce the manufacturing cost.

[0071] In this embodiment, Figures 1 to 6As shown, the upper surface of the evaporation substrate 220 is mounted on the bottom surface of the enclosure surface below, that is, the housing 210 is located on the evaporation substrate 220, and the lower surface of the evaporation substrate 220 is in direct or indirect contact with the power device 900, so as to ensure the heat transfer performance as much as possible.

[0072] In some embodiments, Figures 1 to 6 As shown, the temperature sensor 300 and the power device 900 are arranged on the same side of the evaporation substrate 220. That is, the temperature sensor 300 and the housing 210 are respectively located on both sides of the evaporation substrate 220, and the temperature sensor 300 is installed on the lower surface of the evaporation substrate 220 as close to the power device 900 as possible to ensure the accuracy of temperature monitoring.

[0073] In some embodiments, Figure 2 As shown, the evaporation structure also includes a temperature equalizer 230, which is installed in the evaporation substrate 220 to effectively control the temperature, thereby ensuring that the liquid heat dissipation medium in each part of the evaporation chamber 211 absorbs heat evenly and improves the heat dissipation effect. The temperature equalizer 230 includes but is not limited to a heat pipe or a VC (Vapor Chambers, temperature equalizer).

[0074] In some embodiments, Figure 1 , Figure 2 , Figures 4 to 6 As shown, the evaporation structure further includes at least one partition 212, which is connected to the enclosure surface and is used to divide the internal space of the shell 210 into at least two evaporation chambers 211. It can be understood that by connecting the upper end of the partition 212 to the upper enclosure surface and the lower end of the partition 212 to the lower enclosure surface (including the evaporation substrate 220), at least two evaporation chambers 211 are formed using only one shell 210 and one evaporation substrate 220. It should be noted that the number of partitions 212 can be designed according to actual needs, and this embodiment does not impose specific restrictions on this.

[0075] In other embodiments, Figure 3 As shown, there are at least two evaporation substrates 220, and there are at least two shells 210. The evaporation substrates 220 correspond to and are connected to the shells 210 one by one. The evaporation structure also includes at least one heat transfer member 240, and a heat transfer member 240 is provided between two adjacent evaporation substrates 220. The heat transfer member 240 includes but is not limited to heat pipes, VC, graphene sheets and other materials with high thermal conductivity. The connection method between the heat transfer member 240 and the evaporation substrate 220 includes but is not limited to bolt connection, rivet connection or snap connection. Similarly, there are at least two shells, and the shells correspond to the shells 210 one by one.

[0076] It can be understood that whether at least two evaporation substrates 220 are in contact with one power device 900 for heat conduction at the same time, or when there are multiple power devices 900 arranged at intervals in the horizontal direction, the power device 900 and the evaporation substrate 220 are in contact with each other for heat conduction in a one-to-one correspondence, both can help reduce manufacturing and maintenance costs.

[0077] In order to further extend the service life of the radiator and to prolong the movement time of the power conversion device as much as possible, the embodiments of the present application are specifically described below from two different implementation perspectives.

[0078] 1. If Figure 4 As shown, the radiator also includes at least two pressure sensors 810 and at least two control valves 800. The pressure sensors 810 correspond to the heat dissipation circuits one by one. A control valve 800 is provided between two adjacent evaporation chambers 211. The control valve 800 is used to control the connection between the corresponding two adjacent evaporation chambers 211.

[0079] It is understandable that the pressure sensor 810 is used to detect the liquid pressure in the heat dissipation circuit. When the pressures between adjacent heat dissipation circuits are inconsistent, the control valve 800 can be opened to connect the two adjacent evaporation chambers 211, so as to replenish the evaporation chamber 211 with insufficient pressure, thereby further extending the operation time of the power conversion device. The pressure sensor 810 includes but is not limited to piezoresistance and capacitance pressure sensors. It should be noted that the pressure sensor 810 can be installed in the evaporation chamber 211 or in the condensation chamber 110, and this embodiment does not impose specific restrictions on this.

[0080] 2. Figure 5 and Figure 6 As shown, the radiator also includes a liquid storage device 600, a connecting pipe 700 and at least two control valves 800. The liquid storage device 600 defines a liquid storage chamber for accommodating liquid heat dissipating medium; the inlet end of the connecting pipe 700 is connected to the liquid storage chamber, and the outlet end of the connecting pipe 700 is connected to the inlet end of each evaporation chamber 211; the control valve 800 can be selectively arranged on the connecting pipe 700 and corresponds to the heat dissipation circuit one by one.

[0081] It is understandable that when a heat dissipation circuit leaks, the control valve 800 corresponding to the heat dissipation circuit can be opened to allow the liquid storage device 600 to replenish the corresponding evaporation chamber 211 through the connecting pipe 700, thereby further extending the operating time of the power conversion device.

[0082] In some embodiments, the radiator also includes at least two pressure sensors 810, and the pressure sensors 810 correspond one-to-one to the heat dissipation circuits. The pressure sensors 810 are used to detect the liquid pressure in the heat dissipation circuit. When the pressures of the two circuits are inconsistent, the control valve 800 can be opened to replenish the evaporation chamber 211 with insufficient pressure through the liquid storage device 600.

[0083] It is understandable that when a heat dissipation medium leaks in a heat dissipation circuit, the corresponding control valve 800 is opened to connect the liquid storage chamber and the evaporation chamber 211, and the corresponding pressure sensor 810 detects the real-time liquid pressure value to determine whether the liquid replenishment needs to be ended, thereby improving the heat dissipation efficiency and heat dissipation effect. The pressure sensor 810 includes but is not limited to piezoresistive and capacitive pressure sensors. It should be noted that the pressure sensor 810 can be installed in the evaporation chamber 211 or in the condensation chamber 110, and this embodiment does not impose specific restrictions on this.

[0084] It should be noted that when the radiator includes a pressure sensor 810 and a control valve 800, a control valve 800 is provided between two adjacent evaporation chambers 211; when the radiator includes a liquid storage device 600, a connecting pipe 700 and a control valve 800, the control valve 800 is provided on the connecting pipe 700; when the radiator includes a liquid storage device 600, a connecting pipe 700, a pressure sensor 810 and a control valve 800, all the control valves 800 can be provided on the connecting pipe 700, or control valves 800 can be provided between two adjacent evaporation chambers 211 and one control valve 800 can be provided on the connecting pipe 700, so as to replenish the evaporation chamber 211 corresponding to the leaking heat dissipation circuit.

[0085] In some embodiments, Figure 5 As shown, the liquid storage device 600 is integrated with the evaporation structure to further improve the integration of the entire radiator and reduce the complexity and space of laying pipelines. In this embodiment, the liquid storage device 600 is installed on the side of the shell 210 away from the evaporation substrate 220. The connection method between the liquid storage device 600 and the shell 210 includes but is not limited to bolt connection, rivet connection, welding or snap connection, etc.

[0086] The embodiment of the present application also provides a power conversion device. The power conversion device includes a power device 900 and the above-mentioned heat sink, and the power device 900 is installed on the evaporation substrate 220 of the heat sink. The connection method between the power device 900 and the evaporation substrate 220 includes but is not limited to bolt connection, rivet connection, welding or snap connection, etc.

[0087] According to the power conversion device provided in the embodiment of the present application, by forming at least two independent heat dissipation circuits in the radiator, it is ensured that when the power device 900 is cooled, even if the leakage of the heat dissipation medium in one of the heat dissipation circuits is not discovered in time, the remaining heat dissipation circuits can be used to cool the power device 900, so as to ensure the heat dissipation effect as much as possible while extending the operating time of the power conversion device.

[0088] In some embodiments, the power conversion device further includes a heat conductor, one side of the heat conductor is connected to the evaporation structure, and the other side of the heat conductor is connected to the power device 900 .

[0089] It is understandable that, due to the uneven surface of the power device 900, it is difficult to ensure the contact area when the power device 900 is directly mounted on the evaporation substrate 220. Therefore, the heat conductive part is set between the evaporation substrate 220 and the power device 900 to increase the contact area as much as possible and improve the heat dissipation effect. The heat conductive part includes but is not limited to thermal conductive silica gel and thermal conductive silicone grease.

[0090] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0091] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0092] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0093] In the description of the present application, “plurality” means two or more.

[0094] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0095] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0096] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0097] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A radiator, characterized in that: include: A condensation structure, wherein the condensation structure comprises at least two mutually independent condensation chambers; The evaporation structure comprises at least two mutually independent evaporation chambers, the evaporation chambers correspond to each other one by one and are connected to the condensation chambers to form a heat dissipation loop, and the evaporation structure is used for heat exchange of power devices.

2. The heat sink according to claim 1, characterized in that: Also includes: At least two temperature sensors, the temperature sensors corresponding to the heat dissipation circuits one by one.

3. The heat sink according to claim 1, characterized in that: The evaporation structure comprises: The shell comprises a plurality of enclosing surfaces and is provided with the evaporation chamber.

4. The heat sink according to claim 3, characterized in that: The evaporation structure further includes an evaporation substrate, which is mounted on one of the enclosed surfaces, or one side of the evaporation substrate is one of the enclosed surfaces.

5. The heat sink according to claim 3, characterized in that: The evaporation structure further comprises: At least one partition is connected to the enclosing surface and is used to divide the internal space of the shell into at least two evaporation chambers.

6. The heat sink according to claim 4, characterized in that: Also includes: At least two temperature sensors are provided, each of the temperature sensors corresponds to the heat dissipation circuit on a one-to-one basis, and are arranged on the same side of the evaporation substrate as the power device.

7. The heat sink according to claim 4, characterized in that: The evaporation structure further comprises: A temperature-averaging component is installed in the evaporation substrate.

8. The heat sink according to claim 4, characterized in that: The evaporation substrates have at least two, the shells have at least two, the evaporation substrates correspond to and are connected to the shells one by one, and the evaporation structure further includes: At least one heat transfer element is disposed between two adjacent evaporation substrates.

9. The radiator according to any one of claims 1 to 8, characterized in that: Also includes: At least two pressure sensors, each of which corresponds to each of the heat dissipation circuits; At least one control valve is provided between each of two adjacent evaporation chambers, and the control valve is used to control the connection and disconnection between the corresponding two adjacent evaporation chambers.

10. The radiator according to any one of claims 1 to 8, characterized in that: Also includes: A liquid storage device, wherein a liquid storage cavity is defined in the liquid storage device; A connecting pipe, wherein the inlet end of the connecting pipe is connected to the liquid storage chamber, and the outlet end of the connecting pipe is connected to each of the evaporation chambers; At least two control valves can be selectively arranged on the connecting pipe, and the control valves correspond to the heat dissipation circuits one by one.

11. The heat sink according to claim 10, characterized in that Also includes: At least two pressure sensors, the pressure sensors corresponding to the heat dissipation circuits one by one.

12. The heat sink according to claim 10, characterized in that The liquid storage device is integrated with the evaporation structure.

13. A power conversion device, characterized in that: include: Power devices; as well as The heat sink according to any one of claims 1 to 12, wherein the power device is mounted on the heat sink.

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