Multilayer circuit board with good heat dissipation effect

Abstract

The utility model discloses a multilayer circuit board with good heat dissipation effect, and relates to the technical field of multilayer circuit boards, including a multilayer circuit board body and a heat dissipation through hole opened inside the multilayer circuit board body, wherein a heat dissipation auxiliary part for assisting the multilayer circuit board body in heat dissipation is installed inside the heat dissipation through hole; the heat dissipation auxiliary part includes a heat dissipation cylinder column, an inner heat dissipation straight groove sheet, and an outer heat dissipation fan-shaped sheet. The utility model transfers heat to the air in contact with the heat dissipation cylinder column, the inner heat dissipation straight groove sheet, and the outer heat dissipation fan-shaped sheet by setting the heat dissipation auxiliary part, thereby realizing high-speed heat dissipation. Compared with the traditional columnar heat dissipation structure, the heat dissipation area is larger, and at the same time, the external flowing air can flow into the inner cavity of the inner heat dissipation straight groove sheet through the ventilation slot, and flow vertically along the inner cavity of the inner heat dissipation straight groove sheet, thereby performing heat exchange with the inner cavity of the inner heat dissipation straight groove sheet and the inner wall of the heat dissipation cylinder column at the corresponding position, so that the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of multilayer circuit boards, in particular to a multilayer circuit board with good heat dissipation effect. Background Art

[0002] A multilayer board is a board with multiple wiring layers. There is a dielectric layer between every two layers. The dielectric layer can be made very thin. A multilayer circuit board has at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board.

[0003] In order to ensure good heat dissipation performance, multilayer circuit boards are generally equipped with heat dissipation vias. Heat dissipation vias are a method of dissipating heat by conducting heat to the back side through channels (vias) that run through the PCB board. They are arranged directly below the heating element or as close to the heating element as possible.

[0004] Thermal vias are a method of using PCB boards to improve the heat dissipation effect of surface mount components. Structurally, through holes are set on the PCB board. If it is a single-layer double-sided PCB board, the copper foil on the surface and back of the PCB board is connected to increase the area and volume for heat dissipation, that is, to reduce thermal resistance. If it is a multi-layer PCB board, the surfaces between the layers can be connected or the partially connected layers can be limited, etc. The purpose is the same;

[0005] The copper foil used for heat conduction inside the heat dissipation via is cylindrical as a whole, and the inner wall of the cylinder has a smooth surface, so the contact area with the air is small. In order to further expand the contact and heat dissipation area between the heat dissipation via and the air, the heat dissipation effect of the multi-layer circuit board is improved, and a multi-layer circuit board with good heat dissipation effect is provided. Utility Model Content

[0006] The purpose of the utility model is to provide a multilayer circuit board with good heat dissipation effect in order to solve the above-mentioned problems.

[0007] To achieve the above object, the utility model provides the following technical solution: a multilayer circuit board with good heat dissipation effect, comprising a multilayer circuit board body and a heat dissipation through hole opened inside the multilayer circuit board body, wherein a heat dissipation auxiliary part for assisting the multilayer circuit board body in heat dissipation is installed inside the heat dissipation through hole;

[0008] The heat dissipation auxiliary parts include heat dissipation cylinders, inner heat dissipation straight groove plates and outer heat dissipation fan-shaped plates;

[0009] The heat dissipation cylinder is installed in the inner cavity of the heat dissipation through hole and extends to the upper and lower ends of the multi-layer circuit board body. The inner heat dissipation straight groove sheet is integrally formed on the inner side of the heat dissipation cylinder. The inner heat dissipation straight groove sheet is used to increase the contact and heat dissipation area between the inner cavity of the heat dissipation cylinder and the air;

[0010] The heat dissipation cylinder protrudes from the upper and lower ends of the multi-layer circuit board body and is provided with ventilation slots on the outside. The ventilation slots are connected to the inner cavity of the inner heat dissipation straight slot sheet, and are used to allow horizontally flowing air to enter the inner cavity of the inner heat dissipation straight slot sheet through the ventilation slots.

[0011] The outer heat dissipation fan-shaped piece is integrally formed on the outer side of the heat dissipation column protruding from the upper and lower ends of the multi-layer circuit board body, and is staggered with the ventilation slot. The outer heat dissipation fan-shaped piece is used to increase the heat dissipation area between the upper and lower ends of the heat dissipation column and the air.

[0012] As a further solution of the utility model: the number of the inner heat dissipation straight groove plates is multiple and distributed in an annular circumference, and the number of the ventilation slots matches the number of the inner heat dissipation straight groove plates.

[0013] As a further solution of the utility model: the external heat dissipation fan-shaped fins are provided in multiple groups, and the multiple groups of the external heat dissipation fan-shaped fins and the multiple ventilation slots are staggered and distributed along the circumferential direction;

[0014] Each group of the external heat dissipation fan-shaped fins includes a plurality of external heat dissipation fan-shaped fins, and the plurality of external heat dissipation fan-shaped fins are evenly distributed along the vertical direction.

[0015] As a further solution of the utility model: the upper surface of the highest external heat dissipation fan-shaped plate in each group is flush with the end faces of the heat dissipation cylinder and the internal heat dissipation straight groove plate, and the lower surface of the lowest external heat dissipation fan-shaped plate is in contact with the end face of the multi-layer circuit board body.

[0016] As a further solution of the utility model: the heat dissipation cylinder in each of the heat dissipation holes is composed of an upper and a lower part that are bonded and spliced ​​together, and an annular gear seat for docking is formed at the upper and lower splicing locations.

[0017] As a further solution of the utility model: the heat dissipation cylinder, the inner heat dissipation straight groove plate, the ventilation notch, the outer heat dissipation fan-shaped plate, and the annular gear seat are integrally formed by a ceramic injection molding process.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] By setting up heat dissipation accessories, heat is transferred to the air in contact with the heat dissipation column, inner heat dissipation straight groove sheet, and outer heat dissipation fan-shaped sheet, so as to achieve high-speed heat dissipation. Compared with the traditional columnar heat dissipation structure, the heat dissipation area is larger. At the same time, the external flowing air can flow into the inner cavity of the inner heat dissipation straight groove sheet through the ventilation slots, and flow vertically along the inner cavity of the inner heat dissipation straight groove sheet, thereby performing heat exchange with the inner cavity of the inner heat dissipation straight groove sheet and the inner wall of the heat dissipation column at the corresponding position, so as to further improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a structural cross-sectional view of the main body of the multilayer circuit board of the utility model;

[0022] Figure 3 It is an exploded view of the heat dissipation auxiliary component and the multi-layer circuit board body of the utility model;

[0023] Figure 4 This is a cross-sectional view of the heat dissipation auxiliary component of the utility model;

[0024] Figure 5 It is a schematic diagram of the docking state of the heat dissipation auxiliary component of the utility model.

[0025] In the figure: 1. multi-layer circuit board body; 2. heat dissipation accessories; 201. heat dissipation cylinder; 202. inner heat dissipation straight groove plate; 203. ventilation slot; 204. outer heat dissipation fan-shaped plate; 205. annular gear seat; 3. heat dissipation through hole. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figures 1 to 5 In the embodiment of the utility model, a multilayer circuit board with good heat dissipation effect comprises a multilayer circuit board body 1 and a heat dissipation through hole 3 provided inside the multilayer circuit board body 1, and a heat dissipation auxiliary part 2 for assisting the multilayer circuit board body 1 in heat dissipation is installed inside the heat dissipation through hole 3;

[0028] The heat dissipation auxiliary component 2 includes a heat dissipation column 201, an inner heat dissipation straight groove sheet 202 and an outer heat dissipation fan-shaped sheet 204;

[0029] The heat dissipation column 201 is installed in the inner cavity of the heat dissipation through hole 3 and extends to the upper and lower ends of the multilayer circuit board body 1. The inner heat dissipation straight groove sheet 202 is integrally formed on the inner side of the heat dissipation column 201. The inner heat dissipation straight groove sheet 202 is used to increase the contact and heat dissipation area between the inner cavity of the heat dissipation column 201 and the air;

[0030] The heat dissipation column 201 protrudes from the upper and lower ends of the multilayer circuit board body 1 and is provided with ventilation slots 203 on the outside. The ventilation slots 203 are connected to the inner cavity of the inner heat dissipation straight slot sheet 202, and the ventilation slots 203 are used to allow horizontally flowing air to enter the inner cavity of the inner heat dissipation straight slot sheet 202;

[0031] The outer heat dissipation fan-shaped sheet 204 is integrally formed on the heat dissipation column 201 and protrudes from the outer side of the upper and lower ends of the multi-layer circuit board body 1, and is staggered with the ventilation slot 203. The outer heat dissipation fan-shaped sheet 204 is used to increase the heat dissipation area between the upper and lower ends of the heat dissipation column 201 and the air;

[0032] There are multiple inner heat dissipation straight groove plates 202 and they are distributed in an annular circumference, and the number of ventilation slots 203 matches the number of inner heat dissipation straight groove plates 202;

[0033] There are multiple groups of external heat dissipation fan-shaped fins 204, and the multiple groups of external heat dissipation fan-shaped fins 204 and the multiple ventilation slots 203 are staggered and distributed along the circumferential direction;

[0034] Each group of external heat dissipation fan-shaped fins 204 includes a plurality of external heat dissipation fan-shaped fins 204 , and the plurality of external heat dissipation fan-shaped fins 204 are evenly distributed along the vertical direction.

[0035] In this embodiment: it should be supplemented that: the heat dissipation through hole 3 is opened at the periphery or bottom of the component with large heat generation according to the component layout on the multi-layer circuit board body 1, and the heat dissipation auxiliary component 3 is installed inside the heat dissipation through hole 3 outside the component, which will not interfere with the installation of the component;

[0036] During the actual use of the multilayer circuit board body 1, the heat generated by the multilayer circuit board body 1 and the operation of the components will be transferred to the heat dissipation column 201, and the heat dissipation column 201 will transfer the heat to the inner heat dissipation straight groove sheet 202 and the outer heat dissipation fan-shaped sheet 204. Then, the heat dissipation column 201, the inner heat dissipation straight groove sheet 202, and the outer heat dissipation fan-shaped sheet 204 will transfer the heat to the air in contact with them, thereby achieving high-speed heat dissipation. Compared with the traditional columnar heat dissipation structure, the heat dissipation area is larger, which further improves the heat dissipation efficiency.

[0037] In addition, in the environment where the multi-layer circuit board body 1 is installed and used, a corresponding external heat dissipation device is generally provided, such as a heat dissipation fan, which blows air to dissipate heat at the position of the multi-layer circuit board body 1. When the flowing air contacts the external heat dissipation fan-shaped sheet 204, heat exchange can be better performed. At the same time, part of the air will flow into the inner cavity of the inner heat dissipation straight groove sheet 202 through the ventilation slot 204, and flow vertically along the inner cavity of the inner heat dissipation straight groove sheet 202, thereby performing heat exchange with the inner cavity of the inner heat dissipation straight groove sheet 202 and the inner wall of the heat dissipation cylinder 201 at the corresponding position, thereby further improving the heat dissipation efficiency.

[0038] Please refer to Figures 1 to 4 The upper surface of the highest external heat dissipation fan-shaped sheet 204 in each group of external heat dissipation fan-shaped sheets 204 is flush with the end surfaces of the heat dissipation cylinder 201 and the internal heat dissipation straight groove sheet 202, and the lower surface of the lowest external heat dissipation fan-shaped sheet 204 is in contact with the end surface of the multi-layer circuit board body 1;

[0039] The heat dissipation column 201 in each heat dissipation through hole 3 is composed of two parts, the upper and lower parts are bonded and spliced ​​together, and an annular gear seat 205 for docking is formed at the upper and lower splicing parts;

[0040] The heat dissipation cylinder 201, the inner heat dissipation straight groove sheet 202, the ventilation notch 203, the outer heat dissipation fan-shaped sheet 204, and the annular gear seat 205 are integrally formed by a ceramic injection molding process.

[0041] In this embodiment: the heat dissipation column 201 structure connected up and down enables the heat dissipation auxiliary component 2 to be conveniently installed inside the heat dissipation through hole 3;

[0042] The heat dissipation auxiliary component 2 made of ceramic material has good thermal conductivity and insulation performance, and has high strength. It can achieve efficient heat dissipation while also being able to resist daily collisions. At the same time, the heat dissipation auxiliary component 2 can also be installed at the mounting hole position of the multi-layer circuit board main body 1. The diameter of the area in the middle of the multiple inner heat dissipation straight groove sheets 202 is larger than the outer diameter of the stud of the fixing screws of the multi-layer circuit board main body 1. The fixing screws pass through the heat dissipation auxiliary component 2 to fix the multi-layer circuit board main body 1. After the fixing screws are installed, the inner cavity of the inner heat dissipation straight groove sheet 202 is connected to the external space through the ventilation slot 203. In this way, the mounting hole position of the multi-layer circuit board main body 1 can also provide heat dissipation assistance, thereby further improving the heat dissipation performance of the multi-layer circuit board main body 1.

[0043] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A multilayer circuit board with good heat dissipation effect, comprising a multilayer circuit board body (1) and a heat dissipation through hole (3) provided inside the multilayer circuit board body (1), characterized in that: A heat dissipation auxiliary component (2) is installed inside the heat dissipation through hole (3) to assist the multilayer circuit board body (1) in dissipating heat; The heat dissipation auxiliary component (2) comprises a heat dissipation column (201), an inner heat dissipation straight groove sheet (202) and an outer heat dissipation fan-shaped sheet (204); The heat dissipation column (201) is installed in the inner cavity of the heat dissipation through hole (3) and extends to the upper and lower ends of the multilayer circuit board body (1); the inner heat dissipation straight groove sheet (202) is integrally formed on the inner side of the heat dissipation column (201); the inner heat dissipation straight groove sheet (202) is used to increase the contact and heat dissipation area between the inner cavity of the heat dissipation column (201) and the air; The heat dissipation column (201) protrudes from the upper and lower ends of the multilayer circuit board body (1) and is provided with ventilation slots (203) on the outside, the ventilation slots (203) being connected to the inner cavity of the inner heat dissipation straight slot sheet (202), and the ventilation slots (203) are used to allow horizontally flowing air to enter the inner cavity of the inner heat dissipation straight slot sheet (202); The external heat dissipation fan-shaped sheet (204) is integrally formed on the heat dissipation column (201) and protrudes outside the upper and lower ends of the multilayer circuit board body (1), and is staggered with the ventilation slot (203). The external heat dissipation fan-shaped sheet (204) is used to increase the heat dissipation area between the upper and lower ends of the heat dissipation column (201) and the air.

2. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: The number of the inner heat dissipation straight groove plates (202) is multiple and distributed in an annular circumference, and the number of the ventilation slots (203) matches the number of the inner heat dissipation straight groove plates (202).

3. The multilayer circuit board with good heat dissipation effect according to claim 2, characterized in that: The external heat dissipation fan-shaped fins (204) are provided in a plurality of groups, and the plurality of groups of external heat dissipation fan-shaped fins (204) and the plurality of ventilation slots (203) are distributed in an interlaced manner along the circumferential direction; Each group of the external heat dissipation fan-shaped fins (204) comprises a plurality of external heat dissipation fan-shaped fins (204), and the plurality of external heat dissipation fan-shaped fins (204) are evenly distributed along the vertical direction.

4. The multilayer circuit board with good heat dissipation effect according to claim 3, characterized in that: The upper surface of the highest external heat dissipation fan-shaped sheet (204) in each group of the external heat dissipation fan-shaped sheets (204) is flush with the end surfaces of the heat dissipation cylinder (201) and the internal heat dissipation straight groove sheet (202), and the lower surface of the lowest external heat dissipation fan-shaped sheet (204) is in contact with the end surface of the multi-layer circuit board body (1).

5. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: The heat dissipation column (201) in each heat dissipation through hole (3) is composed of two upper and lower parts that are bonded and spliced ​​together, and an annular gear seat (205) for docking is formed at the upper and lower splicing locations.

6. The multilayer circuit board with good heat dissipation effect according to claim 5, characterized in that: The heat dissipation cylinder (201), the inner heat dissipation straight groove sheet (202), the ventilation notch (203), the outer heat dissipation fan-shaped sheet (204), and the annular gear seat (205) are integrally formed by a ceramic injection molding process.

Images