A PCB buried copper circuit board

Abstract

The utility model discloses a PCB buried copper circuit board, comprising a circuit board body, the circuit board body comprising a bottom plate, connecting rods are evenly connected at the corners of the bottom plate, a ground layer is installed on the top side of the bottom plate, a power layer is installed on the side of the ground layer away from the bottom plate, a copper component is installed on the side of the power layer away from the ground layer, a first semi-cured welding layer is connected between the power layer and the copper component, a top plate is installed on the side of the copper component away from the power layer, a second cured welding layer is connected between the copper component and the top plate, a glue injection groove is opened at the side of the top plate away from the bottom plate and at a position corresponding to the connecting rod, and a heat dissipation device is screwed to the side of the bottom plate away from the top plate. Compared with the existing PCB circuit board, the utility model can make the circuit board production more convenient and quick through design, and at the same time help the circuit board to dissipate heat and increase the service life of the circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a PCB buried copper circuit board. Background Art

[0002] With the rapid development of electronic technology, the design of thin and light electronic products has become more and more mainstream. At the same time, the electronic components on the printed circuit board are also developing in the direction of miniaturization, high density and integrated packaging. The circuit board can be divided into three major categories according to the number of layers: single-sided board, double-sided board, and multi-layer circuit board. The first is single-sided board. On the most basic PCB, the parts are concentrated on one side and the wires are concentrated on the other side. Because the wires only appear on one side, this PCB is called a single-sided circuit board. Single-sided boards are usually simple to make and low in cost, but the disadvantage is that they cannot be applied to too complex products. Double-sided boards are an extension of single-sided boards. When single-layer wiring cannot meet the needs of electronic When the product needs it, a double-sided board is used. Both sides have copper cladding and routing, and the lines between the two layers can be conducted through vias to form the required network connection. A multi-layer board refers to a printed board with more than three layers of conductive graphic layers and insulating materials laminated apart, and the conductive graphics therebetween are interconnected as required. The multi-layer circuit board is the product of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness and lightness. The existing PCB board processing process is cumbersome and complicated, and the heat dissipation is poor. When a large current passes through, it is easy to burn the circuit board itself. Therefore, it is urgent to design a PCB buried copper circuit board to solve the above defects, which is particularly important. Utility Model Content

[0003] 1) Technical problems to be solved by the utility model

[0004] In view of the deficiencies in the prior art, the utility model designs a PCB buried copper circuit board, which aims to solve the technical problems of complex circuit board manufacturing process and poor heat dissipation under the prior art.

[0005] 2) Technical solution

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A PCB buried copper circuit board comprises a circuit board body, the circuit board body comprises a bottom plate, connecting rods are evenly connected at the corners of the bottom plate, a ground layer is installed on the top side of the bottom plate, a power layer is installed on the side of the ground layer away from the bottom plate, a copper component is installed on the side of the power layer away from the ground layer, a first semi-cured welding layer is connected between the power layer and the copper component, a top plate is installed on the side of the copper component away from the power layer, a second cured welding layer is connected between the copper component and the top plate, a glue injection groove is opened at the side of the top plate away from the bottom plate and at the position corresponding to the connecting rod, and a heat dissipation device is screwed to the side of the bottom plate away from the top plate.

[0008] As a preferred solution of the utility model, the bottom plate and the top plate are both epoxy resin plates.

[0009] As a preferred solution of the utility model, fixing grooves are provided at both ends of the bottom plate, and fixing buckles are connected to the positions of the top plate corresponding to the fixing grooves. The fixing buckle has a triangular design at one end close to the fixing groove, and the internal structure size of the fixing groove matches the external structure size of the fixing buckle.

[0010] As a preferred solution of the utility model, the copper component includes a copper plate, an aluminum sheet is installed on the side of the copper plate close to the first semi-solidified welding layer, and a copper foil is installed on the side of the copper plate close to the second solidified welding layer.

[0011] As a preferred solution of the utility model, a limiting groove is provided at a position of the top plate corresponding to the connecting rod, and a glue injection hole is connected between the limiting groove and the glue injection groove.

[0012] As a preferred solution of the utility model, the heat dissipation device includes a plug-in heat sink, a thermal pad is connected to the surface of the plug-in heat sink, a connecting block is evenly connected to the corner of one side of the plug-in heat sink, and a plurality of connecting holes are evenly opened on the surface of the connecting block.

[0013] As a preferred solution of the utility model, the outer sides of the plurality of groups of connecting rods are uniformly coated with insulating paint, and the connecting rods penetrate the second solidified welding layer and extend to the inner side of the top plate.

[0014] 3) Beneficial effects

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] Firstly, through the design of the connecting rod and the heat sink, when the user installs the circuit board, the connecting rod can quickly position the internal parts of the circuit board. At the same time, the connecting rod on the top plate cover can further strengthen the connection between the top plate and the bottom plate. When the user uses the circuit board, if the temperature of the circuit board is too high during operation, the heat inside the circuit board can be transferred out through the heat sink to dissipate the heat of the circuit board.

[0017] Secondly, through the design of the glue injection groove, after the user covers the top plate, the limit groove on the inner side of the top plate limits the connecting rod. Then the user can use the glue injection groove and the glue injection hole to inject glue into the limit groove, thereby fixing the connecting rod and preventing the top plate from separating from the bottom plate.

[0018] Finally, through the design of the fixing groove and the fixing buckle, the user presses the fixing buckle on the top plate against the fixing groove on the bottom plate, which can simply and quickly fix the top plate and the bottom plate, making it convenient for subsequent users to carry out installation and reinforcement work. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of the circuit board main body and the heat dissipation device of the utility model.

[0020] Figure 2 It is a schematic diagram of the overall structure of the utility model.

[0021] Figure 3 This is a schematic diagram of the cross-sectional structure of the circuit board main body of the utility model.

[0022] Figure 4 It is a schematic diagram of the enlarged structure of A of the utility model.

[0023] In the figure: 1. circuit board body; 2. bottom plate; 201. connecting rod; 202. fixing groove; 3. ground layer; 4. power layer; 5. copper component; 501. copper plate; 502. aluminum sheet; 503. copper foil; 6. first semi-cured welding layer; 7. top plate; 701. fixing buckle; 702. limiting groove; 703. glue injection groove; 704. glue injection hole; 8. second cured welding layer; 9. heat dissipation device; 901. plug-in heat sink; 902. thermal pad; 903. connecting block; 9031. connecting hole. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0025] Example:

[0026] The embodiment of the utility model provides a PCB buried copper circuit board, which is intended to solve the technical problems of complex circuit board manufacturing process and poor heat dissipation in the prior art.

[0027] See also Figure 1-Figure 4 , the utility model provides a technical solution:

[0028] First, see Figure 1-Figure 3 A PCB buried copper circuit board includes a circuit board body 1, the circuit board body 1 includes a base plate 2, the corners of the base plate 2 are evenly connected with connecting rods 201, and the outer sides of multiple groups of connecting rods 201 are evenly coated with insulating paint. When the circuit board is working, the insulating paint on the outer sides of the connecting rods 201 can protect the connecting rods 201 and increase the life of the connecting rods 201.

[0029] For further information, see Figure 1-Figure 3 A ground layer 3 is installed on the top side of the bottom plate 2, a power layer 4 is installed on the side of the ground layer 3 away from the bottom plate 2, a copper component 5 is installed on the side of the power layer 4 away from the ground layer 3, the copper component 5 includes a copper plate 501, a first semi-cured welding layer 6 is connected between the power layer 4 and the copper component 5, a top plate 7 is installed on the side of the copper component 5 away from the power layer 4, a second cured welding layer 8 is connected between the copper component 5 and the top plate 7, a connecting rod 201 penetrates the second cured welding layer 8 and extends to the inner side of the top plate 7, when making a circuit board, the first semi-cured welding layer 6 is laid on the power layer 4, and then the copper component 5 is installed on the surface of the first semi-cured welding layer 6 in sequence, after installation, the second cured welding layer 8 is laid on the surface of the copper component 5, and then the top plate 7 is installed, and the user performs hot pressing molding after installation, which can increase the shear force between the bottom plate 2 and the top plate 7 and the copper component 5, and prevent the bottom plate 2 and the top plate 7 from separating from the copper component 5, and the bottom plate 2 and the top plate 7 are both epoxy resin boards.

[0030] Among them, see Figure 3 An aluminum sheet 502 is installed on the side of the copper plate 501 close to the first semi-cured welding layer 6, and a copper foil 503 is installed on the side of the copper plate 501 close to the second cured welding layer 8. The aluminum sheet 502 and the copper foil 503 are pressed and connected to the copper plate 501. When the circuit board is working, the copper foil 503 and the aluminum sheet 502 play a buffering role.

[0031] For further information, see Figure 3-Figure 4 , fixing grooves 202 are provided at both ends of the bottom plate 2, and fixing buckles 701 are connected to the positions of the top plate 7 corresponding to the fixing grooves 202. The end of the fixing buckle 701 close to the fixing groove 202 is triangular in design, and the internal structure size of the fixing groove 202 matches the external structure size of the fixing buckle 701. The user presses the fixing buckle 701 on the top plate 7 against the fixing groove 202 on the bottom plate 2, which can simply and quickly fix the top plate 7 and the bottom plate 2, making it convenient for subsequent users to perform installation and reinforcement work.

[0032] For further information, see Figure 1-Figure 3A limiting groove 702 is provided at the position of the top plate 7 corresponding to the connecting rod 201, and a glue injection groove 703 is provided at the side of the top plate 7 away from the bottom plate 2 and corresponding to the position of the connecting rod 201. A glue injection hole 704 is connected between the limiting groove 702 and the glue injection groove 703. When the user fixes the top plate 7 to the bottom plate 2, the connecting rod 201 on the inner side of the bottom plate 2 also enters the limiting groove 702 at the same time. At this time, the glue injection groove 703 and the glue injection hole 704 cooperate with each other. The user injects glue into the limiting groove 702 to fix the connecting rod 201, thereby effectively preventing the top plate 7 from separating from the bottom plate 2.

[0033] Finally, see Figure 1-Figure 2 A heat sink 9 is screwed to one side of the bottom plate 2 away from the top plate 7. The heat sink 9 includes a plug-in heat sink 901. A thermal pad 902 is connected to the surface of the plug-in heat sink 901. Connecting blocks 903 are evenly connected to the corners of one side of the plug-in heat sink 901. A plurality of connecting holes 9031 are evenly arranged on the surface of the connecting block 903. The user can fix the heat sink 9 to the bottom plate 2 through the connecting block 903. When the circuit board is working, the thermal pad 902 can help the circuit board transfer the heat to the plug-in heat sink 901. In this way, the heat on the circuit board can be dissipated outward through the plug-in heat sink 901, so that the circuit board will not burn itself due to high temperature, the life of the circuit board can be extended, and it is more convenient to use.

[0034] In addition, it should be added based on the content of the above embodiment that the insert heat sink 901 and the thermal pad 902 are both existing technologies, and their internal working principles and operating procedures will not be described in detail here.

[0035] The working process of the utility model is as follows: when installing the circuit board body 1, the ground layer 3 and the power layer 4 are installed on the bottom plate 2, and then the first semi-cured welding layer 6 is laid on the surface of the power layer 4, and then the aluminum sheet 502 is installed on the surface of the first semi-cured welding layer 6, and then the copper plate 501 is installed on the surface of the aluminum sheet 502, and after the installation, the copper foil 503 is installed on the surface of the copper plate 501, and then the second cured welding layer 8 is laid on the surface of the copper foil 503, and then the fixing buckle 701 on the top plate 7 is pressed against the fixing groove 202 on the bottom plate 2 for simple positioning, at this time the connecting rod 201 on the inner side of the bottom plate 2 At the same time, it also enters the limiting groove 702 on the inner side of the top plate 7. Then the user uses the glue injection groove 703 and the glue injection hole 704 to cooperate with each other, injects glue into the limiting groove 702, and fixes the connecting rod 201. At the same time, the first semi-cured welding layer 6 and the second cured welding layer 8 are hot-pressed to form a stable structure, which increases the shear force between the bottom plate 2 and the top plate 7 and the copper component 5. Then the user screws the heat dissipation device 9 to the bottom plate 2 through the connecting hole 9031. When the circuit board body 1 is working, the heat can be transferred to the plug-in heat sink 901 through the thermal pad 902 to dissipate the heat of the circuit board body 1.

[0036] The entire operation process is simple and convenient. Compared with the existing PCB circuit board, the utility model can make the circuit board production more convenient and quick through design, and at the same time help the circuit board to dissipate heat and increase the service life of the circuit board.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB buried copper circuit board, comprising a circuit board body (1), characterized in that: The circuit board body (1) comprises a bottom plate (2), the corners of the bottom plate (2) are evenly connected with connecting rods (201), a ground layer (3) is installed on the top side of the bottom plate (2), a power layer (4) is installed on the side of the ground layer (3) away from the bottom plate (2), a copper component (5) is installed on the side of the power layer (4) away from the ground layer (3), a first semi-cured welding layer (6) is connected between the power layer (4) and the copper component (5), a top plate (7) is installed on the side of the copper component (5) away from the power layer (4), a second cured welding layer (8) is connected between the copper component (5) and the top plate (7), a glue injection groove (703) is provided on the side of the top plate (7) away from the bottom plate (2) and at a position corresponding to the connecting rod (201), and a heat dissipation device (9) is screwed to the side of the bottom plate (2) away from the top plate (7).

2. The PCB buried copper circuit board according to claim 1, characterized in that: The bottom plate (2) and the top plate (7) are both epoxy resin plates.

3. The PCB buried copper circuit board according to claim 1, characterized in that: The bottom plate (2) is provided with fixing grooves (202) at both ends, and the top plate (7) is connected with a fixing buckle (701) at a position corresponding to the fixing groove (202), and one end of the fixing buckle (701) close to the fixing groove (202) is triangular in design, and the internal structure size of the fixing groove (202) matches the external structure size of the fixing buckle (701).

4. The PCB buried copper circuit board according to claim 1, characterized in that: The copper component (5) comprises a copper plate (501), an aluminum sheet (502) is installed on the side of the copper plate (501) close to the first semi-solidified welding layer (6), and a copper foil (503) is installed on the side of the copper plate (501) close to the second solidified welding layer (8).

5. The PCB buried copper circuit board according to claim 1, characterized in that: A limiting groove (702) is provided on the top plate (7) at a position corresponding to the connecting rod (201), and a glue injection hole (704) is connected between the limiting groove (702) and the glue injection groove (703).

6. The PCB buried copper circuit board according to claim 5, characterized in that: The heat dissipation device (9) comprises a plug-in heat sink (901), the surface of the plug-in heat sink (901) is connected to a thermal pad (902), a corner of one side of the plug-in heat sink (901) is evenly connected to a connection block (903), and the surface of the connection block (903) is evenly provided with a plurality of groups of connection holes (9031).

7. The PCB buried copper circuit board according to claim 1, characterized in that: The outer sides of the plurality of groups of connecting rods (201) are uniformly coated with insulating paint, and the connecting rods (201) penetrate the second solidified welding layer (8) and extend to the inner side of the top plate (7).

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