A metal plate for welding electronic devices

Abstract

The utility model discloses a metal plate for welding electronic devices, the metal plate comprising a metal substrate, a material storage bin and a material leakage hole, the metal substrate comprising a first surface and a second surface, the first surface and the second surface being arranged opposite to each other, the first surface of the metal substrate being arranged with a plurality of material storage bins, the bottom of the material storage bin being provided with a material leakage hole, and the material leakage hole passing through the metal substrate, wherein the depth of the material leakage hole is less than the thickness of the metal substrate. The metal plate provided in the utility model is formed by an electroforming process, and due to the inherent characteristics of the electroplating process, the side wall of the material leakage hole on the metal plate is smooth, and a material storage bin is also provided on one side of the material leakage hole, so that the conductive slurry is first filled into the material storage bin and then slides through the material leakage hole to reduce the sliding path, and the conductive slurry slides more evenly; the other side of the material leakage hole of the metal plate is arranged as a trumpet-shaped opening, which is conducive to forming a more uniform conductor morphology.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic device welding, in particular to a metal plate used for welding electronic devices. Background Art

[0002] During the manufacturing process of electronic devices or semiconductor devices, it is necessary to weld the electronic devices, and conductive materials are arranged on the pins of the electronic devices to fix them on a carrier, so as to achieve the purpose of fixation and electrical conduction.

[0003] In the prior art, the auxiliary tool required for welding electronic devices is a metal plate. However, the preparation of the metal plate in the prior art is basically to form a leakage hole at a preset position on the steel plate surface by laser cutting on the steel plate, so that the conductive paste slides through the leakage hole onto the electronic device or semiconductor device to be welded. However, since the metal plate in the prior art is formed by laser cutting, the side wall of the leakage hole has a certain degree of roughness, which is not conducive to the sliding of the conductive paste. Moreover, since the hole is cut by laser, the distance of the sliding path of the conductive paste is the depth of the leakage hole or the thickness of the metal plate, which will cause the conductive paste to slide unevenly, resulting in poor connection of the electronic device or semiconductor device; finally, the conductive paste that slides off the metal plate in the prior art forms an uneven conductor morphology on the electronic device or semiconductor device to be welded, which may cause conductive instability of the device and affect the life of the device.

[0004] In view of this, it is necessary to provide a new structural design of a metal plate to solve the technical problems existing in the prior art. Utility Model Content

[0005] In view of the problems that the existing leakage holes have a certain roughness that is not conducive to the sliding of the conductive paste, the sliding path of the conductive paste is too long, and the conductor morphology formed on the electronic device or semiconductor device is uneven, the metal plate provided in the present application is formed by an electroforming process. The side walls of the leakage holes formed in this way are relatively smooth, which is conducive to the sliding of the conductive paste, and a storage bin is provided at the starting end of the leakage hole. In this way, the conductive paste is first filled into the storage bin and then slides through the leakage hole, reducing the sliding path and making the conductive paste slide more evenly. Finally, a trumpet-shaped opening is set at one end of the leakage hole of the metal plate close to the electronic device or semiconductor device to be welded, which is conducive to a more uniform conductor morphology formed on the electronic device or semiconductor device to be welded. The metal plate formed by this new design and preparation process can effectively solve the above problems.

[0006] To solve the above problems, the utility model adopts the following technical solutions.

[0007] A metal plate for welding electronic devices, characterized in that: the metal plate includes a metal substrate, a material storage bin and a material leakage hole, the metal substrate includes a first surface and a second surface, the first surface and the second surface are arranged opposite to each other, the first surface of the metal substrate is arranged with a plurality of material storage bins, the bottom of the material storage bin is provided with a material leakage hole, and the leakage hole penetrates the metal substrate, wherein the depth of the leakage hole is less than the thickness of the metal substrate.

[0008] In one embodiment, the side wall of the storage bin is an arc-shaped structure, and the storage bin is trumpet-shaped.

[0009] In one embodiment, a plurality of buffer cavities are disposed on the second surface of the metal substrate, and the buffer cavities are connected to the leakage holes.

[0010] In one embodiment, the side wall of the buffer cavity is an arc-shaped structure, and the buffer cavity is trumpet-shaped.

[0011] In one embodiment, a protruding arc-shaped support portion is provided between at least one group of adjacent buffer cavities, and the arc-shaped support portion and the metal substrate are an integral structure.

[0012] In one embodiment, there is at least one group of adjacent leakage holes on the second surface of the metal substrate, and a protruding arc-shaped support portion is provided between the holes, and the arc-shaped support portion and the metal substrate are an integral structure.

[0013] In one embodiment, at least one of the adjacent storage bins has a spacing distance of 0, and there is a metal partition portion between the adjacent storage bins, and the top of the metal partition portion is arc-shaped.

[0014] In one embodiment, at least one of the storage bins has a plurality of leakage holes arranged at the bottom, and the plurality of leakage holes share the storage bin.

[0015] In one embodiment, the projection shape of the leakage hole on the first surface or the second surface of the metal substrate is circular, polygonal, elliptical or irregular; the projection shape of the storage bin on the first surface or the second surface of the metal substrate is circular, polygonal, elliptical or irregular.

[0016] In one embodiment, the thickness of the metal substrate is not less than 20 microns, and the average pore size of the storage bin is not less than 8 microns.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] (1) In the present invention, the metal plate provided in the present application is formed by an electroforming process. Due to the inherent characteristics of the electroplating process, the side walls of the leakage holes on the metal plate are smooth, which is more suitable for the sliding of the conductive paste.

[0019] (2) In the present invention, a material storage bin is provided on the side of the material leakage hole away from the electronic device or semiconductor device to be welded, so that the conductive paste is first filled into the material storage bin and then slides through the material leakage hole, thereby reducing the sliding path and making the conductive paste slide more evenly.

[0020] (3) In the present invention, the leakage hole of the metal plate is configured as a trumpet-shaped opening on one side close to the electronic device or semiconductor device to be welded, which is conducive to a more uniform conductor morphology formed on the electronic device or semiconductor device to be welded. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of a metal plate structure used for welding electronic devices in the utility model;

[0022] Figure 2 This is a schematic diagram of the cross-sectional structure of a metal plate used for welding electronic devices in the utility model;

[0023] Figure 3 This is another structural schematic diagram of a metal plate cross section used for welding electronic devices in the utility model;

[0024] Figure 4 This is another structural schematic diagram of a metal plate cross section used for welding electronic devices in the utility model;

[0025] Figure 5 This is another structural schematic diagram of a metal plate cross section used for welding electronic devices in the utility model;

[0026] Figure 6 This is another structural schematic diagram of a metal plate used for welding electronic devices according to the utility model;

[0027] Figure 7 This is a schematic diagram of the cross-sectional structure of a metal plate used for welding electronic devices in the utility model;

[0028] Figure 8 This is another structural schematic diagram of a metal plate used for welding electronic devices according to the utility model;

[0029] Fig. 9 This is a schematic diagram of the cross-sectional structure of a metal plate used for welding electronic devices in the utility model;

[0030] Fig.10 This is a schematic diagram of a metal plate material storage bin and a material leakage hole structure for welding electronic devices in the utility model;

[0031] Fig.11 This is another structural schematic diagram of a metal plate material storage bin and a material leakage hole for welding electronic devices in the utility model. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Example 1

[0034] like Figures 1 to 5 As shown, a metal plate for welding electronic devices, the metal plate includes a metal substrate 110, a plurality of leakage holes 120 and a plurality of storage bins 130, the metal substrate 110 includes a first surface and a second surface, the first surface and the second surface are arranged opposite to each other; the storage bins 130 are arranged on the first surface of the metal substrate 110 in a preset manner, and the leakage holes 120 are located inside the storage bins 130, so that the conductive material is first filled in the storage bins 130, and then slides from the leakage holes 120 to the electronic devices or semiconductor devices to be welded. Due to the existence of the storage bins 130, it can be ensured that the leakage holes 120 can have sufficient conductive material to slide, and there will be no shortage of material or broken material, so that there is no possibility of cold welding or leaking welding, and the working stability of the electronic devices or semiconductor devices to be welded is further guaranteed. The conductive material can be solder paste, silver paste and other materials.

[0035] The metal plate provided in the present application is formed by an electroplating process, and does not need to be formed by laser cutting to form a leakage hole. The metal substrate 110 and the storage bin 130 are both completed by an existing electroplating process, such as Fig.10 as well as Fig.11 As shown, the shape of the storage bin 130 can be circular, polygonal, elliptical or special-shaped; the shape of the leakage hole 120 can be circular, polygonal, elliptical or special-shaped, and the special-shaped shape can be as follows: Fig.10The shape of the flower is shown; the shapes of the leakage hole 120 and the storage bin 130 can be designed according to specific requirements. The thickness of the metal substrate is not less than 20 microns, and the general thickness of the metal substrate 110 can reach 800 microns. The depth of the leakage hole 120 is less than the thickness of the metal substrate 110. The average pore size of the storage bin 130 is not less than 8 microns, and the average pore size of the storage bin 130 can reach 200 microns. The material of the metal substrate 110 can be a single metal or an alloy material. For example, the material of the metal substrate is nickel, nickel-chromium alloy, nickel-tungsten alloy, etc. The selection of the metal substrate material can be selected according to the requirements of the specific product.

[0036] like Figure 2 Combination Figure 1 As shown, a metal plate for welding electronic devices, the first surface of the metal substrate 110 is provided with a material storage bin 130, the material leakage hole 120 is located at the bottom of the material storage bin 130, and it can be seen from the figure that the material storage bin 130 and the material leakage hole 120 penetrate the metal substrate 110. The side wall of the material storage bin 130 is arc-shaped, and the formation of the material storage bin 130 is trumpet-shaped or funnel-shaped, so that the conductive material will be filled into the material storage bin 130 first, and then slide from the material leakage hole 120. Since the electroplating technology is used in this application, the side walls of the material storage bin 130 and the material leakage hole 120 are relatively smooth, which is more conducive to the sliding of the conductive material.

[0037] like Figure 3 As shown, another structure of a metal plate is given; a material storage bin 130 is provided on the first surface of the metal substrate 110, and the leakage hole 121 is located at the bottom of the material storage bin 130, wherein a buffer cavity is also provided on the second surface of the metal substrate 110, and the buffer cavity is connected to the leakage hole 121, and the conductive material slides from the material storage bin 130, through the leakage hole 121 and the buffer cavity to the electronic device or semiconductor device to be welded; the side wall of the buffer cavity is an arc structure, and the shape of the buffer cavity is a trumpet shape or an inverted funnel shape, and the buffer cavity is conducive to the conductive material having a plastic effect when sliding onto the electronic device or semiconductor device to be welded, so that the shape formed by the conductive material can be more uniform.

[0038] like Figure 4As shown, another structure of a metal plate is given; a storage bin 130 is provided on the first surface of the metal substrate 110, and the leakage hole 121 is located at the bottom of the storage bin 130, wherein a buffer cavity is also provided on the second surface of the metal substrate 110, and the buffer cavity is connected to the leakage hole 121, and a raised arc-shaped support portion 140 is provided between adjacent buffer cavities, and the arc-shaped support portion 140 and the metal substrate 110 are an integral structure, so that when the metal plate is used, the arc-shaped support portion 140 forms a line contact with the electronic device or semiconductor device to be welded, effectively reducing the contact area between the metal plate and the device, and avoiding damage to the device during use. Furthermore, the sliding height of the conductive material can be effectively increased by the arc-shaped support portion, which is more conducive to the forming of the conductive material.

[0039] like Figure 5 As shown, another structure of a metal plate is given; a storage bin 130 is provided on the first surface of the metal substrate 110, the leakage hole 122 is located at the bottom of the storage bin 130, and a raised arc-shaped support portion 140 is provided between at least one group of adjacent leakage holes 122 on the second surface of the metal substrate 110, and the arc-shaped support portion 140 and the metal substrate 110 are an integral structure; this structure is similar to Figure 2 The difference given in the figure is that the support portion 140 is provided in the present structure, so that although Figure 5 There is no buffer cavity in the middle structure, but the support portion 140 can indirectly raise the metal substrate 110, and since the support portion 140 is an arc-shaped structure, the buffer effect can also be achieved. Figure 3 as well as Figure 4 The effect of structure.

[0040] Example 2

[0041] like Figure 6 , Figure 7 As shown, another metal plate for welding electronic devices includes a metal substrate 210, a plurality of leakage holes 220 and a plurality of storage bins 230. The metal substrate 210 includes a first surface and a second surface, and the first surface and the second surface are arranged opposite to each other; the storage bins 230 are arranged on the first surface of the metal substrate 210 in a preset manner. Figure 6 It can be seen that the storage bins 230 are closely arranged, or the spacing between adjacent storage bins 230 is 0. It can also be seen that the storage bins 230 are arranged in the shape of "="; the leakage hole 220 is located inside the storage bin 230, so that the conductive material is first filled in the storage bin 230, and then slides from the leakage hole 220 onto the electronic device or semiconductor device to be welded.

[0042] like Figure 7 As shown, a material storage bin 230 is provided on the first surface of the metal substrate 210, and the leakage hole 220 is located at the bottom of the material storage bin 230, wherein a buffer cavity is also provided on the second surface of the metal substrate 210, and the buffer cavity is connected to the leakage hole 220, and a raised arc-shaped support portion 240 is provided between adjacent buffer cavities, and the arc-shaped support portion 240 and the metal substrate 210 are an integral structure; wherein a metal partition portion is provided between adjacent material storage bins 230, and the top of the metal partition portion is arc-shaped.

[0043] Example 3

[0044] like Figure 8 , Fig. 9 As shown, another metal plate for welding electronic devices, the metal plate includes a metal substrate 310, a plurality of leakage holes 320 and a plurality of storage bins 330, the metal substrate 310 includes a first surface and a second surface, the first surface and the second surface are arranged opposite to each other; the storage bins 330 are arranged on the first surface of the metal substrate 310 in a preset manner; Figure 8 as well as Fig. 9 It can be seen from the figure that the storage bin 330 is rectangular, and a plurality of leakage holes 320 are arranged in the storage bin 330. It can be seen from the figure that four leakage holes 320 are arranged in one storage bin 330, and the leakage holes 320 are located at the bottom of the storage bin 330, wherein the bottom of the storage bin 330 is a relative plane; wherein a buffer cavity is also provided on the second surface of the metal substrate 310, and the buffer cavity is connected to the leakage hole 320, and a raised arc-shaped support portion 340 is provided between adjacent buffer cavities, and the arc-shaped support portion 340 and the metal substrate 310 are an integral structure.

[0045] For Example 1, Example 2 and Example 3, the metal plate structures given are just different arrangements to be designed in different product requirements, wherein some technical solutions in these different embodiments can be replaced with each other or used in combination, such as the shape of the storage bin, the shape of the buffer cavity, the shape of the storage bin or the shape of the leakage hole, etc.

[0046] The above content is a further detailed description of the utility model in combination with specific implementation methods. It cannot be determined that the specific implementation of the utility model is limited to these descriptions. For ordinary technicians in the technical field to which the utility model belongs, without departing from the concept of the utility model, they can also make several simple deductions or substitutions, which should be regarded as belonging to the scope of protection determined by the claims submitted for the utility model.

Claims

1. A metal plate for welding electronic devices, characterized in that: The metal plate includes a metal substrate, a material storage bin and a leakage hole. The metal substrate includes a first surface and a second surface. The first surface and the second surface are arranged opposite to each other. A plurality of material storage bins are arranged on the first surface of the metal substrate. A leakage hole is provided at the bottom of the material storage bin, and the leakage hole passes through the metal substrate, wherein the depth of the leakage hole is less than the thickness of the metal substrate.

2. A metal plate for welding electronic devices according to claim 1, characterized in that: The side wall of the storage bin is an arc-shaped structure, and the storage bin is in a trumpet shape.

3. The metal plate for welding electronic devices according to claim 1, characterized in that: A plurality of buffer cavities are arranged on the second surface of the metal substrate, and the buffer cavities are communicated with the material leakage holes.

4. A metal plate for welding electronic devices according to claim 3, characterized in that: The side wall of the buffer cavity is an arc-shaped structure, and the buffer cavity is in a trumpet shape.

5. The metal plate for welding electronic devices according to claim 3, characterized in that: There is at least one group of adjacent buffer cavities with a raised arc-shaped support portion disposed therebetween, and the arc-shaped support portion and the metal substrate are an integral structure.

6. The metal plate for welding electronic devices according to claim 1, characterized in that: There is at least one group of adjacent material leakage holes on the second surface of the metal substrate, and a protruding arc-shaped support portion is provided between the holes, and the arc-shaped support portion and the metal substrate are an integral structure.

7. The metal plate for welding electronic devices according to claim 1, characterized in that: There is at least one adjacent storage bin with a spacing distance of 0, and there is a metal partition portion between the adjacent storage bins, and the top of the metal partition portion is arc-shaped.

8. The metal plate for welding electronic devices according to claim 1, characterized in that: At least one of the storage bins has a plurality of leakage holes arranged at the bottom, and the plurality of leakage holes share the storage bin.

9. A metal plate for welding electronic devices according to any one of claims 1 to 8, characterized in that: The projection shape of the leakage hole on the first surface or the second surface of the metal substrate is circular, polygonal, elliptical or irregular; the projection shape of the storage bin on the first surface or the second surface of the metal substrate is circular, polygonal, elliptical or irregular.

10. A metal plate for welding electronic devices according to any one of claims 1 to 8, characterized in that: The thickness of the metal substrate is not less than 20 microns, and the average pore size of the storage bin is not less than 8 microns.

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