Pin glue scraping tool
By designing a pin scraping tool that includes positioning horizontal plates, vertical guide rods, downward plates, L-shaped plates, scrapers and pull plates, the problem of packaging materials adhering to the pins is solved, efficient and safe scraping effect is achieved, and the welding effect and appearance quality of the semiconductor are improved.
Patent Information
- Application Number
- CN202420768062.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-04-15
AI Technical Summary
During semiconductor packaging, the packaging material is easily adhered to the pins, affecting the appearance quality and welding effect. The existing glue scraping method is inefficient and has safety hazards.
A pin scraping tool is designed, including positioning horizontal plates, vertical guide rods, down pressure plates, L-shaped plates, scrapers and pulling plates. The pin roots are clamped by the down pressure plates, the scrapers scrape the packaging material, and the pullers pull the scrapers to improve scraping efficiency and safety.
It realizes efficient and safe removal of packaging materials, avoids damage to semiconductors, and improves welding effect and appearance quality.
Smart Images

Figure CN222720350U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing, in particular to a pin scraping tool. Background Art
[0002] During semiconductor processing, especially during semiconductor packaging, a certain amount of packaging material is likely to adhere to the pins of semiconductor devices due to misoperation or mold and other reasons. When the packaging material adheres to the pins, it will first affect the appearance quality of the semiconductor and secondly affect the welding effect of the semiconductor. Therefore, if Figure 1 As shown, 1 is the semiconductor package, 10 is the root of the pin, which is a rectangular structure, and 11 is the soldering section of the pin, and in order to facilitate its insertion on the circuit board, its width is smaller than the width of the root 10. When the packaging material adheres to the root, it will only affect the appearance quality, but if it adheres to the soldering section 11, it will affect the soldering effect. Therefore, it is necessary to scrape the glue, and the conventional scraping method is to scrape it with a knife, which is inefficient and prone to safety accidents during operation. Utility Model Content
[0003] The utility model provides a pin scraping tool to solve the deficiencies of the prior art, facilitate the scraping operation of packaging materials, and ensure safety during scraping, thus having strong practicality.
[0004] In order to achieve the purpose of this utility model, the following technologies are proposed:
[0005] A pin scraping tool includes a positioning horizontal plate, a pair of vertical guide rods are provided on the positioning horizontal plate, and a lower pressure plate is sleeved on the vertical guide rods. A pair of transverse guide rods are respectively provided at both ends of the outer wall of the lower pressure plate and the positioning horizontal plate, and an L-shaped plate is sleeved on each pair of transverse guide rods. The outer end of the L-shaped plate is bent inward with a scraper, and the inner end of the scraper is provided with a concave scraping groove, and a pull plate is provided between the scrapers at the same height. When the lower pressure plate moves downward through the provided lower pressure plate and the positioning horizontal plate, the root of the pin can be clamped, so that when the scraper is used for scraping, the package material is prevented from blocking the scraper, thereby pulling the root of the pin, thereby avoiding damage to the semiconductor. The concave scraping groove provided on the scraper can wrap the entire welding section of the pin through the concave scraping groove, thereby improving the scraping effect.
[0006] Furthermore, the upper walls at both ends of the positioning transverse plate and the lower walls at both ends of the lower pressure plate are respectively provided with positioning grooves, through which the roots of the pins can be positioned, thereby improving the clamping and limiting effect on the roots of the pins.
[0007] Furthermore, the pulling plate has a concave structure, and the concave structure makes it convenient for the operator to pull the scraper, thereby facilitating the scraping operation.
[0008] Furthermore, the peripheral side of the concave scraping groove is in a blade-shaped structure to improve the scraping effect.
[0009] Furthermore, a guide sleeve is provided on the L-shaped plate, and a transverse guide rod is passed through the guide sleeve to improve the guiding effect and ensure the stability of the scraper movement to avoid scratching the pins.
[0010] The lockhole that is formed on the upper part of the body is formed on the second lateral movement of the spring clip, and the spring clip has a first end, and the second end of the body is connected to the second lateral movement of the spring clip, and the second end of the body is connected to the second lateral movement of the spring clip. By means of the first cross bar, the third cross bar and the concave clamping bar, when performing a scraping operation, the operator can clamp the concave clamping bar on one side of the semiconductor package, and by moving the first cross bar, the third cross bar can act on the oblique hole, thereby causing the lower pressure plate to act on the root of the pin, thereby clamping the root of the pin, thereby increasing the clamping force on the pin.
[0011] Furthermore, a pair of limiting rings are provided on the third cross bar, and the limiting rings are located on both sides of the upper convex plate to further limit the third cross bar.
[0012] The advantages of the above technical solution are:
[0013] The utility model facilitates the scraping operation of the package body material on the pin and can avoid damage to the semiconductor during the operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to make the purpose, technical solutions and advantages of the utility model clearer, the utility model will be further described in detail below with reference to the accompanying drawings.
[0015] Figure 1 The three-dimensional structure of one embodiment is shown Figure 1 .
[0016] Figure 2 The three-dimensional structure of one embodiment is shown Figure 2 .
[0017] Figure 3 An enlarged view of A is shown.
[0018] Figure 4 An enlarged view of B is shown. DETAILED DESCRIPTION
[0019] like Figure 1~Figure 4 As shown, a pin scraping tool comprises a positioning horizontal plate 2, a pair of vertical guide rods 20 are arranged on the positioning horizontal plate 2, a lower pressing plate 21 is sleeved on the vertical guide rods 20, and positioning grooves 22 are respectively provided on the upper wall at both ends of the positioning horizontal plate 2 and the lower wall at both ends of the lower pressing plate 21. A pair of transverse guide rods 24 are respectively provided at both ends of the outer wall of the lower pressing plate 21 and the positioning horizontal plate 2, and an L-shaped plate 26 is sleeved on each pair of transverse guide rods 24, a scraper 50 is bent inwardly at the outer end of the L-shaped plate 26, and a concave scraping groove 27 is opened at the inner end of the scraper 50, and a pull plate 28 is arranged between the scrapers 50 at the same height, the pull plate 28 is a concave structure, and the surrounding side of the concave scraping groove 27 is a blade-shaped structure, and a guide sleeve 25 is provided on the L-shaped plate 26, and the transverse guide rod 24 is inserted into the guide sleeve 25.
[0020] In addition, an end ring 29 is provided at the upper end of the vertical guide rod 20, and a first cross bar 30 is sleeved on the end ring 29. A concave clamping rod 32 is bent between one end of the first cross bar 30, and an end plate 33 is provided at the other end of the first cross bar 30. A spring 31 is provided between the end plate 33 and the end ring 29. The spring 31 is sleeved on the first cross bar 30, and a first vertical rod 34 is bent at the other end of the first cross bar 30. A second cross bar 35 is bent inwardly at the lower end of the first vertical rod 34, and a second vertical rod 36 is bent at the other end of the second cross bar 35. A third cross bar 37 is bent between the lower ends of the second vertical rod 36, and the third cross bar 37 is bent between the lower ends of the second vertical rod 36. The axial direction of 37 is perpendicular to the axial direction of the second cross bar 35, and the axial direction of the second cross bar 35 is parallel to the axial direction of the first cross bar 30. The lower pressure plate 21 is provided with an upper convex plate 39, and the lower end of the upper convex plate 39 is provided with a first transverse hole 40, the other end of the first transverse hole 40 is connected with an oblique hole 41, and the other end of the oblique hole 41 is connected with a second transverse hole, and the second transverse hole is located above the first transverse hole 40. The third cross bar 37 moves in the first transverse hole 40, the oblique hole 41 and the second transverse hole. A pair of limit rings 38 are provided on the third cross bar 37, and the limit rings 38 are located on both sides of the upper convex plate 39.
[0021] When operating, the operator inserts the root 10 of the pin into the positioning groove 22, then pulls the concave clamping rod 32, and clamps the concave clamping rod 32 on the other side of the semiconductor. At the same time, when the concave clamping rod 32 is pulled to move, the third cross bar 37 will be pulled to move, and then the third cross bar 37 will move from the first cross hole 40 through the oblique hole 41 to the second cross hole. When the third cross bar 37 moves into the second cross hole, the lower pressure plate 21 will move downward, and the pin will be clamped by the lower pressure plate 21. After clamping is completed, since the spring 31 is compressed, the elastic force generated by it provides a pre-tightening force for stable clamping, and then the scraper 50 is pulled to move by the pull plate 28. The scraper 50 will scrape off the packaging material on the pin when it moves.
[0022] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalents, the utility model is also intended to include these modifications and variations.
Claims
1. A pin scraping tool, characterized in that: It comprises a positioning horizontal plate (2), on which a pair of vertical guide rods (20) are provided; A lower pressing plate (21) is sleeved on the vertical guide rod (20); A pair of transverse guide rods (24) are respectively provided at both ends of the outer walls of the lower pressure plate (21) and the positioning horizontal plate (2), and an L-shaped plate (26) is sleeved on each pair of transverse guide rods (24). A scraper (50) is bent inwardly at the outer end of the L-shaped plate (26), and a concave scraper groove (27) is formed at the inner end of the scraper (50). A pull plate (28) is provided between the scrapers (50) at the same height.
2. The pin scraping tool according to claim 1, characterized in that: Positioning grooves (22) are respectively formed on the upper walls at both ends of the positioning transverse plate (2) and the lower walls at both ends of the lower pressing plate (21).
3. The pin scraping tool according to claim 1, characterized in that: The pull plate (28) has a concave structure.
4. The pin scraping tool according to claim 1, characterized in that: The circumferential side of the concave scraping groove (27) is in a blade-shaped structure.
5. The pin scraping tool according to claim 1, characterized in that: A guide sleeve (25) is provided on the L-shaped plate (26), and a transverse guide rod (24) is inserted into the guide sleeve (25).
6. The pin scraping tool according to claim 1, characterized in that: An end ring (29) is provided at the upper end of the vertical guide rod (20), a first cross bar (30) is sleeved on the end ring (29), a concave clamping rod (32) is bent between one end of the first cross bar (30), an end plate (33) is provided at the other end of the first cross bar (30), a spring (31) is provided between the end plate (33) and the end ring (29), the spring (31) is sleeved on the first cross bar (30), a first vertical rod (34) is bent at the other end of the first cross bar (30), a second cross bar (35) is bent inwardly at the lower end of the first vertical rod (34), a second vertical rod (36) is bent at the other end of the second cross bar (35), and the second vertical rod (36) is bent at the other end of the second cross bar (35). A third cross bar (37) is provided between the lower ends of the first and second cross bars (36), the axial direction of the third cross bar (37) is perpendicular to the axial direction of the second cross bar (35), the axial direction of the second cross bar (35) is parallel to the axial direction of the first cross bar (30), an upper convex plate (39) is provided on the lower pressure plate (21), a first transverse hole (40) is provided at the lower end of the upper convex plate (39), the other end of the first transverse hole (40) is connected to an oblique hole (41), the other end of the oblique hole (41) is connected to a second transverse hole, the second transverse hole is located above the first transverse hole (40), and the third cross bar (37) moves in the first transverse hole (40), the oblique hole (41) and the second transverse hole.
7. The pin scraping tool according to claim 6, characterized in that: A pair of limiting rings (38) are provided on the third crossbar (37), and the limiting rings (38) are located on both sides of the upper convex plate (39).