Self-aligning wafer clamping manipulator

Abstract

The utility model relates to the field of wafer manufacturing, in particular to a self-aligning wafer clamping manipulator, and aims to solve the technical problem that a conventional manipulator cannot position a wafer. The self-aligning wafer clamping manipulator comprises a mounting table and at least three positioning mechanisms, the at least three positioning mechanisms are distributed in an annular array around the longitudinal axis of the mounting table; the positioning mechanism comprises a positioning column, a sensing piece, a triggering piece, a positioning fixing piece and a first linear driving piece; the positioning column is fixed on the positioning fixing piece; one of the sensing piece and the triggering piece is fixed on the positioning fixing piece, and the other one is fixed on the mounting table; the positioning fixing piece is in sliding fit with the mounting table; the first linear driving piece is arranged on the mounting table and is in transmission connection with the positioning fixing piece. The self-aligning wafer clamping manipulator has an aligning function, and can realize fine adjustment of the position of the wafer when the center of the wafer deviates, so that the grabbing accuracy is improved, and the product quality is ensured.

Description

Technical Field

[0001] The utility model relates to the field of wafer manufacturing, in particular to a self-aligning wafer clamping manipulator. Background Art

[0002] Wafers generally refer to silicon discs used to manufacture semiconductor chips. Today, domestic wafer production specifications are mainly divided into 8-inch and 12-inch sizes. As the characteristic dimensions of semiconductor equipment structures continue to improve and optimize, wafer handling equipment has become increasingly advanced, resulting in new technical features in the wafer handling process.

[0003] During the manufacturing process, wafers are mainly transported by robots. Nowadays, most robots can only perform the function of grasping. If the center of the wafer is inconsistent with the center of the workbench, the robot's grasping will produce a certain error, which will damage the product and cause product quality failure. Utility Model Content

[0004] The utility model aims to provide a self-aligning wafer clamping robot to alleviate the technical problem that the existing robot cannot position the wafer.

[0005] In order to solve the above technical problems, the technical solution provided by the utility model is:

[0006] The self-aligning wafer gripping manipulator provided by the utility model comprises: a mounting platform, at least three positioning mechanisms and gripping mechanisms corresponding to the positioning mechanisms one by one;

[0007] Around the longitudinal axis of the mounting platform, at least three of the positioning mechanisms are distributed in a circular array;

[0008] The positioning mechanism includes a positioning column, a sensing element, a trigger element, a positioning fixing element and a first linear driving element;

[0009] The positioning column is fixed to the positioning fixture, and its axis is parallel to the longitudinal axis of the mounting platform, and the positioning columns of each positioning mechanism enclose a positioning space opening downward;

[0010] One of the sensing element and the triggering element is fixed to the positioning fixing element, and the other is fixed to the mounting platform;

[0011] The positioning fixture is slidably matched with the mounting platform, and the sliding direction is consistent with the radial direction of the annular array;

[0012] The first linear driving member is disposed on the mounting platform and is in transmission connection with the positioning fixing member to drive the positioning fixing member to slide on the mounting platform, so that the sensing member and the triggering member move toward or away from each other to overlap or separate correspondingly;

[0013] The clamping mechanism is fixed to the positioning fixture.

[0014] Furthermore, the first linear drive component includes a motor, a lead screw and a nut, wherein the lead screw is fixed to an output end of the motor, and the nut is threadedly connected to the lead screw and fixed to the positioning fixture.

[0015] Furthermore, a guide rail is fixed on the mounting platform, and a slider is slidably fitted on the guide rail;

[0016] The positioning fixing member is fixed to the sliding block.

[0017] Furthermore, the positioning column is made of polyetheretherketone.

[0018] Further, the mounting platform includes a top plate, a bottom plate and a plurality of pillars;

[0019] The top plate is distributed in parallel with the bottom plate;

[0020] Around the longitudinal axis of the center of the top plate and the bottom plate, a plurality of the pillars are spaced apart, and the upper ends of the pillars are fixedly connected to the bottom surface of the top plate, and the lower ends are fixedly connected to the top surface of the bottom plate;

[0021] The positioning mechanism is arranged on the bottom plate.

[0022] Furthermore, the self-aligning wafer gripping robot also includes a protective cover, which is arranged on the positioning mechanism and fixedly connected to the mounting platform.

[0023] Further, the clamping mechanism includes a clamping claw head and a second linear drive member;

[0024] The clamping claw head is columnar, and its axis is parallel to the axis of the positioning column. The clamping claw heads of each clamping mechanism enclose a clamping space opening downward.

[0025] The second linear driving member is fixed to the positioning and fixing member and is transmission-connected with the clamping jaw head so as to drive the clamping jaw head to move in a direction parallel to the sliding path of the positioning and fixing member.

[0026] Furthermore, the clamping mechanism further comprises a flexible component, and the flexible component comprises a clamping claw fixing member, a step bolt and a compression spring;

[0027] The clamping jaw fixing member is fixed to the output end of the second linear driving member by the step bolt, wherein the extending direction of the step bolt is consistent with the driving direction of the second linear driving member;

[0028] The compression spring is sleeved on the step bolt, and two ends of the compression spring are respectively in contact with the step bolt and the clamp fixing piece.

[0029] Furthermore, a groove is provided on the side surface of the clamping jaw head, and the opening of the groove faces the longitudinal axis.

[0030] Furthermore, the clamping jaw head is made of polyetheretherketone.

[0031] Based on the above technical solutions, the technical effects that can be achieved by the self-aligning wafer gripping manipulator provided by the utility model are:

[0032] In the self-aligning wafer clamping robot, the positioning column and the clamping mechanism are fixed to the positioning fixture, one of the sensing member and the triggering member is fixed to the positioning fixture, and the other is fixed to the mounting table. The positioning fixture and the mounting table are slidably matched. When the first linear drive member is started, the sensing member or the triggering member will slide on the mounting table with the positioning fixture, and when the sensing member slides to the point where the sensing member overlaps the triggering member, the sensing member is in a triggered state, controlling the first linear drive member to stop running. At this time, the positioning column and the clamping mechanism stop moving with the positioning fixture.

[0033] In specific applications, the wafer is pre-placed on the carrier in an orderly manner through the front end, and the positioning columns are distributed around the wafer; the first linear drive components of the self-aligning wafer clamping robot are all started, and under the drive of the first linear drive components, the positioning and fixing components slide toward the longitudinal axis, and drive the positioning columns and the clamping mechanism to move synchronously; when the positioning column moves, it contacts the edge of the wafer and drives the wafer to move; during the entire centering process, the sensing component cooperates with the trigger component to play the role of motion limiter, and controls the stroke displacement of the overall movement of the positioning mechanism. When the sensing component is triggered, the positioning column moves into place. At this time, the spacing between each positioning column and the longitudinal axis is equal, so that the axis of the wafer coincides with the longitudinal axis, thereby realizing the positioning and fixation of the wafer; after positioning is completed, the clamping mechanism can start the clamping function.

[0034] It can be seen that compared with the existing technology, the self-aligning wafer gripping robot has a centering function, which can achieve fine-tuning of the wafer position when the center of the wafer deviates, so as to ensure the accuracy of grasping and the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 A schematic diagram of the structure of a self-aligning wafer gripping robot provided in an embodiment of the utility model;

[0037] Figure 2 A schematic diagram of the structure of the positioning mechanism provided by an embodiment of the utility model;

[0038] Figure 3 A schematic diagram of the structure of a clamping mechanism provided in an embodiment of the utility model;

[0039] Figure 4 An exploded view of the positioning mechanism and the clamping mechanism provided in an embodiment of the utility model.

[0040] Icon: 1-mounting table; 11-top plate; 12-bottom plate; 13-pillar;

[0041] 2-positioning mechanism; 21-positioning column; 22-sensing member; 23-triggering member; 24-positioning fixing member; 25-first linear driving member; 26-guide rail; 27-sliding block; 28-motor fixing seat;

[0042] 3- Protective cover;

[0043] 4-gripping mechanism; 41-gripping jaw head; 42-second linear driving member; 43-gripping jaw fixing member; 44-step bolt; 45-compression spring; 411-groove. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0045] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0047] The existing robot can only perform the function of grasping. If the center of the wafer is inconsistent with the center of the workbench, the robot's grasping will produce a certain error, thereby damaging the product and causing product quality failure.

[0048] In view of this, the utility model provides a self-aligning wafer gripping robot, comprising a mounting platform 1, at least three positioning mechanisms 2 and gripping mechanisms 4 corresponding to the positioning mechanisms 2 one by one; around the longitudinal axis of the mounting platform 1, at least three positioning mechanisms 2 are distributed in a ring array; the positioning mechanism 2 comprises a positioning column 21, a sensing member 22, a trigger member 23, a positioning fixing member 24 and a first linear driving member 25; the positioning column 21 is fixed to the positioning fixing member 24, and its axis is parallel to the longitudinal axis of the mounting platform 1, and the positioning columns 21 of each positioning mechanism 2 enclose a shape A positioning space is formed with an opening downward; one of the sensing member 22 and the triggering member 23 is fixed to the positioning fixing member 24, and the other is fixed to the mounting platform 1; the positioning fixing member 24 is slidably matched with the mounting platform 1, and the sliding direction is consistent with the radial direction of the annular array; the first linear driving member 25 is arranged on the mounting platform 1 and is transmission-connected with the positioning fixing member 24 to drive the positioning fixing member 24 to slide on the mounting platform 1, so that the sensing member 22 and the triggering member 23 move toward or away from each other to correspond to overlap or disengagement; the clamping mechanism 4 is fixed to the positioning fixing member 24.

[0049] In the self-aligning wafer clamping robot, the positioning column 21 and the clamping mechanism 4 are all fixed to the positioning fixing part 24, one of the sensing part 22 and the triggering part 23 is fixed to the positioning fixing part 24, and the other is fixed to the mounting table 1, and the positioning fixing part 24 is slidably matched with the mounting table 1. Then, when the first linear drive part 25 is started, the sensing part 22 or the triggering part 23 will slide on the mounting table 1 with the positioning fixing part 24, and when sliding to the point where the sensing part 22 and the triggering part 23 overlap, the sensing part 22 is in a triggered state, controlling the first linear drive part 25 to stop running, and at this time, the positioning column 21 and the clamping mechanism 4 stop moving with the positioning fixing part 24.

[0050] In specific applications, the wafer is pre-placed on the carrier in a regular manner through the front end, and the positioning columns 21 are distributed around the wafer; the first linear drive components 25 of the self-aligning wafer clamping robot are all started, and under the drive of the first linear drive components 25, the positioning and fixing components 24 slide toward the longitudinal axis, and drive the positioning columns 21 and the clamping mechanism 4 to move synchronously; when the positioning column 21 moves, it contacts the edge of the wafer and drives the wafer to move; during the entire centering process, the sensing component 22 cooperates with the trigger component 23 to play a role in motion limiting, and controls the stroke displacement of the overall movement of the positioning mechanism 2. When the sensing component 22 is triggered, the positioning column 21 moves into place. At this time, the spacing between each positioning column 21 and the longitudinal axis is equal, so that the axis of the wafer coincides with the longitudinal axis, thereby realizing the positioning and fixation of the wafer; after positioning is completed, the clamping mechanism 4 can start the clamping function.

[0051] It can be seen that compared with the existing technology, the self-aligning wafer gripping robot has a centering function, which can achieve fine-tuning of the wafer position when the center of the wafer deviates, so as to ensure the accuracy of grasping and the quality of the product.

[0052] The following combination Figures 1 to 4 The structure and shape of the self-aligning wafer gripping robot provided in this embodiment are described in detail:

[0053] refer to Figure 1 The mounting platform 1 includes a top plate 11, a bottom plate 12 and a plurality of pillars 13; the top plate 11 and the bottom plate 12 are arranged in parallel; around the longitudinal axis of the center of the top plate 11 and the bottom plate 12, a plurality of pillars 13 are arranged at intervals, and the upper end of the pillar 13 is fixedly connected to the bottom surface of the top plate 11, and the lower end is fixedly connected to the top surface of the bottom plate 12; the positioning mechanism 2 is arranged on the bottom plate 12. Optionally, three positioning mechanisms 2 are provided, and the three positioning mechanisms 2 are distributed on the bottom plate 12 in a 120° circumference. A protective cover 3 is also fixed on the bottom plate 12, and the protective cover 3 is arranged on the positioning mechanism 2.

[0054] Regarding the positioning mechanism 2, specifically:

[0055] refer to Figure 2 and Figure 4, the first linear drive member 25 includes a motor and a lead screw; a motor fixing seat 28 is fixed on the base plate 12, and the motor is fixed to the motor fixing seat 28; the lead screw is fixedly connected to the output end of the motor passing through the motor fixing seat 28; the motor fixing seat 28 is made of AL6061 aluminum alloy. A guide rail 26 is also fixed on the base plate 12, and the positioning fixture 24 is made of AL6061 aluminum alloy, which is locked to the guide rail 26 through a slider 27 at its bottom, and a nut is also fixed thereon, and the nut is threadedly connected to the lead screw. The positioning column 21 is made of polyetheretherketone, which is fixed to the bottom of the front end of the positioning fixture 24 by bolts. Optionally, the trigger member 23 adopts a photoelectric sensor, and the photoelectric sensor is made of SUS304 stainless steel, which is installed and fixed on the right side of the positioning fixture 24; the sensor 22 adopts a photoelectric sensor, which is locked on the base plate 12 and located on the right side of the guide rail 26.

[0056] When in use, the wafer is pre-placed on the stage through the front end, and the self-aligning manipulator starts the motors in three directions. The motor drives the lead screw to rotate. Through the cooperation of the lead screw and the nut, the positioning fixture 24 moves outward and inward with the assistance of the guide rail 26 below, and the positioning column 21 located below the positioning fixture 24 is driven to move; the two photoelectric sensors fixed on the right side of the positioning fixture 24 can play the role of motion limiter. Under the action of the photoelectric sensor sheet fixed on the right side of the positioning fixture 24, it can control the stroke displacement of the overall movement of the positioning mechanism 2, thereby positioning and fixing the wafer. If the center of the wafer deviates, the three motors in the positioning mechanism 2 will gradually make fine adjustments in the direction of deviation from the center, so as to achieve the effect of precise three-point positioning. In addition, it should be noted here that the positioning column 21 is made of polyetheretherketone material, and the polyetheretherketone material has a self-lubricating function, thereby reducing the wear of the positioning column 21 on the edge of the wafer.

[0057] refer to Figure 1 and Figure 3 The clamping mechanism 4 corresponds to the positioning mechanism 2 one by one, and is installed on the positioning fixture 24, and is also distributed in a 120° circle. Regarding the clamping mechanism 4, specifically:

[0058] refer to Figure 3 and Figure 4The clamping mechanism 4 includes a clamping jaw head 41, a second linear drive member 42 and a flexible component, and the flexible component includes a clamping jaw fixing member 43, a step bolt 44 and a compression spring 45; wherein, the clamping jaw head 41 is connected to the clamping jaw fixing member 43 by bolts, and a groove 411 is provided on the side near the bottom end thereof, and optionally, the groove 411 extends along the circumference of the clamping jaw head 41, and the material of the clamping jaw head 41 is polyetheretherketone; the second linear drive member 42 can adopt a slide cylinder, and the slide cylinder is locked and fixed on the side of the positioning fixing member 24 away from the photoelectric sensor sheet; the material of the clamping jaw fixing member 43 is SUS304 stainless steel, and is installed and fixed to the output end of the side of the slide cylinder by a step bolt 44; the compression spring 45 is sleeved on the step bolt 44.

[0059] When in use, after the positioning mechanism 2 realizes the precise positioning function, the slide cylinder in the clamping mechanism 4 starts to work, and controls the movement of the clamping jaw fixing part 43 fixed thereon, and clamps the wafer by means of the groove 411 of the clamping jaw head 41 installed below the clamping jaw fixing part 43, thereby realizing the efficient clamping function of the precisely positioned wafer. When placing the wafer, the slide cylinder controls the clamping jaw fixing part 43 to drive the clamping jaw head 41 to open, and the wafer will automatically fall to the predetermined position with the help of the positioning and guiding function of the positioning column 21. In addition, when the cylinder opens and closes the clamping jaw, the clamping jaw head 41 is subjected to the outward force from the wafer, and the compression spring 45 makes the clamping jaw fixing part 43 have a tendency to move inward on the step bolt 44. In this way, if the movement of the clamping jaw fixing part 43 generates an unstable force, the flexible component can play a role in unloading the force.

[0060] refer to Figures 1 to 4 The self-aligning wafer clamping robot provided by the utility model includes a mounting table 1, three positioning mechanisms 2 and three clamping mechanisms 4. On the whole, the three positioning mechanisms 2 and the three clamping mechanisms 4 cooperate with each other to clamp and fix the wafer on the carrier, which not only ensures the accuracy of positioning, but also avoids the wafer from falling off. The clamping claw head 41 adopts a flexible mechanical structure such as a compression spring 45 in terms of structural design, which can effectively buffer the force generated by the slide cylinder, thereby avoiding the risk of damaging the edge of the wafer when clamping with traditional clamps.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A self-aligning wafer gripping robot, characterized in that: include: A mounting platform, at least three positioning mechanisms, and clamping mechanisms corresponding one to each of the positioning mechanisms; Around the longitudinal axis of the mounting platform, at least three of the positioning mechanisms are distributed in a circular array; The positioning mechanism includes a positioning column, a sensing element, a trigger element, a positioning fixing element and a first linear driving element; The positioning column is fixed to the positioning fixture, and its axis is parallel to the longitudinal axis of the mounting platform, and the positioning columns of each positioning mechanism enclose a positioning space opening downward; One of the sensing element and the triggering element is fixed to the positioning fixing element, and the other is fixed to the mounting platform; The positioning fixture is slidably matched with the mounting platform, and the sliding direction is consistent with the radial direction of the annular array; The first linear driving member is disposed on the mounting platform and is in transmission connection with the positioning fixing member to drive the positioning fixing member to slide on the mounting platform, so that the sensing member and the triggering member move toward or away from each other to overlap or separate correspondingly; The clamping mechanism is fixed to the positioning fixture.

2. The self-centering wafer gripping robot according to claim 1, characterized in that: The first linear drive component includes a motor, a lead screw and a nut, wherein the lead screw is fixed to the output end of the motor, and the nut is threadedly connected to the lead screw and fixed to the positioning fixture.

3. The self-centering wafer gripping robot according to claim 1, characterized in that: A guide rail is fixed on the mounting platform, and a slider is slidably fitted on the guide rail; The positioning fixing member is fixed to the sliding block.

4. The self-centering wafer gripping robot according to claim 1, characterized in that: The positioning column is made of polyetheretherketone.

5. The self-centering wafer gripping robot according to claim 1, characterized in that: The mounting platform comprises a top plate, a bottom plate and a plurality of pillars; The top plate is distributed in parallel with the bottom plate; Around the longitudinal axis of the center of the top plate and the bottom plate, a plurality of the pillars are spaced apart, and the upper ends of the pillars are fixedly connected to the bottom surface of the top plate, and the lower ends are fixedly connected to the top surface of the bottom plate; The positioning mechanism is arranged on the bottom plate.

6. The self-centering wafer gripping robot according to claim 1, characterized in that: The self-aligning wafer gripping robot also includes a protective cover, which is arranged on the positioning mechanism and fixedly connected to the mounting platform.

7. The self-centering wafer gripping robot according to any one of claims 1 to 6, characterized in that: The clamping mechanism includes a clamping claw head and a second linear drive member; The clamping claw head is columnar, and its axis is parallel to the axis of the positioning column. The clamping claw heads of each clamping mechanism enclose a clamping space opening downward. The second linear driving member is fixed to the positioning fixing member and is transmission-connected with the clamping jaw head so as to drive the clamping jaw head to move in a direction parallel to the sliding path of the positioning fixing member.

8. The self-centering wafer gripping robot according to claim 7, characterized in that: The clamping mechanism further comprises a flexible component, wherein the flexible component comprises a clamping claw fixing member, a step bolt and a compression spring; The clamping jaw fixing member is fixed to the output end of the second linear driving member by the step bolt, wherein the extending direction of the step bolt is consistent with the driving direction of the second linear driving member; The compression spring is sleeved on the step bolt, and two ends of the compression spring are respectively in contact with the step bolt and the clamp fixing piece.

9. The self-aligning wafer gripping robot according to claim 7, characterized in that: A groove is provided on the side surface of the clamping jaw head, and the opening of the groove faces the longitudinal axis.

10. The self-aligning wafer gripping robot according to claim 9, characterized in that: The clamping claw head is made of polyetheretherketone.

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