High thermal conductivity copper clad ceramic substrate

Abstract

The utility model discloses a high thermal conductivity copper-clad ceramic substrate, including a metal heat sink, a lower ceramic layer and an upper ceramic layer; the metal heat sink has a cooling water tank, and water inlet joints and water outlet joints are fixed on both sides of the metal heat sink respectively; the lower ceramic layer is laminated and bonded to the lower surface of the metal heat sink; the upper ceramic layer is laminated and bonded to the upper surface of the metal heat sink, and a positioning cavity for positioning electronic devices is recessed on the upper surface of the upper ceramic layer. By placing the metal heat sink between the lower ceramic layer and the upper ceramic layer and bonding and fixing them, the metal heat sink can greatly enhance the toughness of the product and avoid the product from being easily broken and damaged. At the same time, the metal heat sink has a cooling water tank and is equipped with a graphene filler. The graphene filler can be used to quickly conduct the heat of the electronic device to the metal heat sink, and then the metal heat sink is quickly cooled and cooled by water cooling, which effectively improves the heat dissipation efficiency and meets the needs of use.

Description

Technical Field

[0001] The utility model relates to the field of ceramic substrate technology, in particular to a high thermal conductivity copper-clad ceramic substrate. Background Art

[0002] Ceramic substrate refers to copper foil directly bonded to alumina (Al 2 O 3 ) or aluminum nitride (AlN) ceramic substrate surface (single or double sides). The ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent soft solderability and high adhesion strength, and can be etched with various patterns like PCB boards, with great current carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology.

[0003] Ceramic substrates are widely used in various electronic devices to package various electronic devices with high heat generation. In the prior art, the main structure of a ceramic substrate used to package electronic devices includes a ceramic substrate body and a conductive circuit layer; the conductive circuit layer is arranged on the surface of the ceramic substrate body by copper coating. When in use, the electronic device is placed on the surface of the ceramic substrate body and is welded to the conductive circuit layer.

[0004] However, in the prior art, the ceramic substrate body is a single-layer structure. Due to the high brittleness of the ceramic material, the ceramic substrate is easily broken and damaged. In addition, after the heat generated by the electronic device is transferred to the ceramic substrate body, it is mainly dissipated by air cooling, and the heat dissipation efficiency is relatively low, which cannot meet the needs of use. Therefore, it is necessary to improve the current ceramic substrate. Utility Model Content

[0005] In view of this, the present invention aims to solve the deficiencies in the prior art, and its main purpose is to provide a high thermal conductivity copper-clad ceramic substrate, which can effectively solve the problems of the existing ceramic substrate being easily broken and damaged and having low heat dissipation efficiency.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A high thermal conductivity copper-clad ceramic substrate, comprising a metal heat sink, a lower ceramic layer and an upper ceramic layer; the metal heat sink is provided with a cooling water trough, and water inlet joints and water outlet joints are respectively fixed on both sides of the metal heat sink, and the water inlet joints and water outlet joints are respectively connected to the two ends of the cooling water trough; the lower ceramic layer is laminated and bonded to the lower surface of the metal heat sink; the upper ceramic layer is laminated and bonded to the upper surface of the metal heat sink, and a positioning cavity for positioning electronic devices is concavely provided on the upper surface of the upper ceramic layer, and a through groove is concavely provided on the bottom surface of the positioning cavity, and the through groove passes through to the upper surface of the metal heat sink, and a graphene filler is filled in the through groove, and the graphene filler is attached to the upper surface of the metal heat sink and is located directly above the cooling water trough, and the graphene filler is exposed in the positioning cavity and contacts with the electronic device, and the upper surface of the upper ceramic layer is copper-clad to form a conductive circuit layer, and the conductive circuit layer is located on the side of the positioning cavity.

[0008] As a preferred solution, a first pin extends downward from the lower surface of the metal heat sink, and a first countersunk hole is recessed on the upper surface of the lower ceramic layer. The first pin is inserted into the first countersunk hole for positioning, so that the lower ceramic layer and the metal heat sink are firmly combined to prevent horizontal dislocation and separation.

[0009] As a preferred solution, a second pin extends upward from the upper surface of the metal heat sink, and a second countersunk hole is recessed on the lower surface of the upper ceramic layer. The second pin is inserted into the second countersunk hole for positioning, so that the upper ceramic layer and the metal heat sink are firmly combined to prevent horizontal dislocation and separation.

[0010] As a preferred solution, the metal heat sink is a copper plate structure with a simple structure and good thermal conductivity.

[0011] As a preferred solution, the cooling water troughs are multiple and evenly spaced, and both ends of each cooling water trough are respectively connected to a water inlet joint and a water outlet joint to improve heat dissipation efficiency.

[0012] As a preferred solution, the bottom of both sides of the metal heat sink is respectively provided with a first screw hole and a second screw hole, and the first screw hole and the second screw hole are respectively connected to the two ends of the cooling water tank, and the upper and lower surfaces on both sides of the lower ceramic layer are penetrated to form a first through hole and a second through hole, respectively, the water inlet joint passes through the first through hole and is screwed and sealed with the first screw hole, and the water outlet joint passes through the second through hole and is screwed and sealed with the second screw hole, and the water inlet joint and the water outlet joint are both exposed from the lower surface of the lower ceramic layer, with a simple structure and easy assembly.

[0013] As a preferred solution, the lower ceramic layer is fixed to the lower surface of the metal heat sink by laminating and bonding with the first thermally conductive adhesive layer, which has a stable structure, is easy to assemble, and has a good thermal conductivity.

[0014] As a preferred solution, the upper ceramic layer is fixed to the upper surface of the metal heat sink by laminating and bonding through the second thermally conductive adhesive layer, which has a stable structure, is easy to assemble, and has a good thermal conductivity.

[0015] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0016] By placing the metal heat sink between the lower ceramic layer and the upper ceramic layer and bonding them to fix them, the metal heat sink can greatly enhance the toughness of the product and prevent the product from being easily broken or damaged. At the same time, the metal heat sink has a cooling water tank and is equipped with a graphene filler. The graphene filler can be used to quickly transfer the heat of the electronic device to the metal heat sink, and then the metal heat sink is quickly cooled by water cooling, which effectively improves the heat dissipation efficiency and meets the needs of use.

[0017] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a transverse cross-sectional schematic diagram of a preferred embodiment of the utility model;

[0019] Figure 2 It is a longitudinal cross-sectional schematic diagram of a preferred embodiment of the utility model.

[0020] Description of the accompanying drawings:

[0021] 10. Metal heat sink 11. Cooling water tank

[0022] 12. First pin 13. Second pin

[0023] 14. First screw hole 15. Second screw hole

[0024] 20. Lower ceramic layer 21. First sink hole

[0025] 22. First through hole 23. Second through hole

[0026] 30. Upper ceramic layer 31. Positioning cavity

[0027] 32. Through groove 33. Second countersunk hole

[0028] 34, groove 41, water inlet joint

[0029] 42. Water outlet connector 51. First thermal conductive adhesive layer

[0030] 52. Second thermal conductive adhesive layer 60. Graphene filler

[0031] 70. Conductive circuit layer. DETAILED DESCRIPTION

[0032] Please refer to Figure 1 and Figure 2 As shown, it shows the specific structure of a preferred embodiment of the utility model, including a metal heat sink 10, a lower ceramic layer 20 and an upper ceramic layer 30.

[0033] The metal heat sink 10 has a cooling water tank 11, and a water inlet joint 41 and a water outlet joint 42 are fixed on both sides of the metal heat sink 10, and the water inlet joint 41 and the water outlet joint 42 are connected to the two ends of the cooling water tank 11 respectively. In this embodiment, the metal heat sink 10 is a copper plate structure, which has a simple structure and good thermal conductivity. In addition, the metal heat sink 10 is formed by hot pressing and compounding two copper sheets stacked up and down, and is easy to manufacture. A first pin 12 extends downward from the lower surface of the metal heat sink 10, and the first pin 12 is multiple and distributed on the edge of the lower surface of the metal heat sink 10. A second pin 13 extends upward from the upper surface of the metal heat sink 10, and the second pin 13 is multiple and distributed on the edge of the upper surface of the metal heat sink 10. The cooling water tanks 11 are multiple and evenly spaced, and the two ends of each cooling water tank 11 are connected to the water inlet joint 41 and the water outlet joint 42 respectively to improve the heat dissipation efficiency, and the cross section of the cooling water tank 11 is square. Furthermore, a first screw hole 14 and a second screw hole 15 are respectively formed at the bottom of both sides of the metal heat dissipation plate 10 . The first screw hole 14 and the second screw hole 15 are respectively connected to the two ends of the cooling water tank 11 .

[0034] The lower ceramic layer 20 is overlapped and bonded to the lower surface of the metal heat sink 10. In this embodiment, the lower ceramic layer 20 is overlapped and bonded to the lower surface of the metal heat sink 10 by the first thermal conductive adhesive layer 51, and the structure is stable, the assembly is convenient, and the thermal conductivity is good. The upper surface of the lower ceramic layer 20 is recessed with a first countersunk hole 21, and the first pin 12 is inserted into the first countersunk hole 21 for positioning, so that the lower ceramic layer 20 is firmly combined with the metal heat sink 10 to prevent horizontal dislocation and separation. In addition, the upper and lower surfaces on both sides of the lower ceramic layer 20 are penetrated to form a first through hole 22 and a second through hole 23 respectively, the water inlet joint 41 passes through the first through hole 22 and is screwed and sealed with the first screw hole 14, and the water outlet joint 42 passes through the second through hole 23 and is screwed and sealed with the second screw hole 15. The water inlet joint 41 and the water outlet joint 42 are both exposed from the lower surface of the lower ceramic layer 20, and the structure is simple and easy to assemble.

[0035] The upper ceramic layer 30 is laminated and bonded to the upper surface of the metal heat sink 10. The upper surface of the upper ceramic layer 30 is concavely provided with a positioning cavity 31 for positioning the electronic device (not shown in the figure). The bottom surface of the positioning cavity 31 is concavely provided with a through groove 32. The through groove 32 penetrates to the upper surface of the metal heat sink 10. The through groove 32 is filled with a graphene filler 60. The graphene filler 60 is attached to the upper surface of the metal heat sink 10 and is located directly above the cooling water tank 11. The graphene filler 60 is exposed in the positioning cavity 31 and contacts the electronic device. The upper surface of the upper ceramic layer 30 is copper-clad to form a conductive circuit layer 70. The conductive circuit layer 70 is located beside the positioning cavity 31. In this embodiment, the upper ceramic layer 30 is laminated and bonded to the upper surface of the metal heat sink 10 by the second thermal conductive adhesive layer 52. The structure is stable, the assembly is convenient, and the thermal conductivity is good. The lower surface of the upper ceramic layer 30 is recessed with a second countersunk hole 33, and the second pin 13 is inserted into the second countersunk hole 33 for positioning, so that the upper ceramic layer 30 is firmly combined with the metal heat sink 10 to prevent horizontal dislocation and separation. In addition, there are multiple positioning cavities 31, and the bottom surface of each positioning cavity 31 is recessed with the aforementioned through groove 32, and each through groove 32 is filled with the aforementioned graphene filler 60, so as to install multiple electronic devices. In addition, the upper surface of the upper ceramic layer 30 is recessed with an embedding groove 34, and the conductive circuit layer 70 is located in the embedding groove 34, so that the conductive circuit layer 70 is firmly combined with the upper ceramic layer 30. In addition, the through groove 32 is located at the center of the bottom surface of the positioning cavity 31, and the cross-sectional area of ​​the through groove 32 is at least half of the bottom surface area of ​​the locator 31, so as to better improve the heat conduction effect.

[0036] The method of using this embodiment is described in detail as follows:

[0037] When in use, the electronic device is embedded in the positioning cavity 31 and fixed, so that the bottom surface of the electronic device is in full contact with the graphene filler 60, and each pin of the electronic device is welded and connected with the corresponding circuit of the conductive circuit layer 70, and the water inlet joint 41 and the water outlet joint 42 are respectively connected to the output end and the input end of the external cold water supply device. When the electronic device is powered on and operated, the electronic device generates a large amount of heat, and the heat is quickly transferred to the metal heat sink 10 through the graphene filler 60. At the same time, the external cold water supply device works, and the cold water supply device outputs cold water. The cold water enters the cooling water tank 11 through the water inlet joint 41 to quickly absorb the heat on the metal heat sink 10. The water after absorbing the heat is output from the water outlet joint 42 and flows back to the cold water supply device. The cold water supply device cools and cools the refluxed water and then outputs it, so as to form a circulating cooling water circuit, continuously cool the electronic device, so that the operation of the electronic device remains stable.

[0038] The design focus of the utility model is: by placing a metal heat sink between the lower ceramic layer and the upper ceramic layer and bonding and fixing them, the metal heat sink can greatly enhance the toughness of the product and prevent the product from being easily broken or damaged. At the same time, a cooling water tank is provided in the metal heat sink, and a graphene filler is arranged in combination. The graphene filler can be used to quickly conduct the heat of the electronic device to the metal heat sink, and then the metal heat sink is quickly cooled and cooled by water cooling, thereby effectively improving the heat dissipation efficiency and meeting the needs of use.

[0039] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A high thermal conductivity copper-clad ceramic substrate, characterized in that: It includes a metal heat sink, a lower ceramic layer and an upper ceramic layer; the metal heat sink is provided with a cooling water trough, and water inlet joints and water outlet joints are respectively fixed on both sides of the metal heat sink, and the water inlet joints and water outlet joints are respectively connected to the two ends of the cooling water trough; the lower ceramic layer is laminated and bonded to the lower surface of the metal heat sink; the upper ceramic layer is laminated and bonded to the upper surface of the metal heat sink, and a positioning cavity for positioning electronic devices is recessed on the upper surface of the upper ceramic layer, and a through groove is recessed on the bottom surface of the positioning cavity, which passes through the upper surface of the metal heat sink, and is filled with graphene filler, which is attached to the upper surface of the metal heat sink and is located directly above the cooling water trough, and the graphene filler is exposed in the positioning cavity and contacts with the electronic device, and the upper surface of the upper ceramic layer is copper-covered to form a conductive circuit layer, and the conductive circuit layer is located on the side of the positioning cavity.

2. The high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: A first pin is extended downward from the lower surface of the metal heat sink plate, and a first countersunk hole is recessed on the upper surface of the lower ceramic layer. The first pin is inserted into the first countersunk hole for positioning.

3. The high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: A second pin is extended upward from the upper surface of the metal heat dissipation plate, and a second countersunk hole is recessed on the lower surface of the upper ceramic layer. The second pin is inserted into the second countersunk hole for positioning.

4. The high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: The metal heat sink is a copper plate structure.

5. The high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: The cooling water tanks are multiple and evenly spaced, and both ends of each cooling water tank are connected to a water inlet joint and a water outlet joint respectively.

6. The high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: The bottom of both sides of the metal heat sink are respectively provided with a first screw hole and a second screw hole, and the first screw hole and the second screw hole are respectively connected to the two ends of the cooling water tank, and the upper and lower surfaces on both sides of the lower ceramic layer are penetrated to form a first through hole and a second through hole, respectively, the water inlet joint passes through the first through hole and is screwed and sealed with the first screw hole, and the water outlet joint passes through the second through hole and is screwed and sealed with the second screw hole, and the water inlet joint and the water outlet joint are both exposed from the lower surface of the lower ceramic layer.

7. The high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: The lower ceramic layer is fixed on the lower surface of the metal heat sink by laminating and bonding through a first heat conductive adhesive layer.

8. The high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: The upper ceramic layer is fixed on the upper surface of the metal heat dissipation plate by laminating and bonding with the second heat conductive adhesive layer.

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