A circuit board with ultra-thin waterproof coating

Abstract

The utility model discloses a circuit board with an ultra-thin waterproof coating, including a circuit board body, an electronic device and a slot are arranged on the front of the circuit board body, a nano waterproof coating is applied on the front and back of the circuit board body, a heat dissipation channel is provided on the top of the nano waterproof coating, the heat dissipation channel is a linear mutually interpenetrating structure, and an air inlet is provided on one side of the heat dissipation channel. The utility model can avoid short circuits caused by the conduction of electronic devices in the circuit board body by coating the front, back and peripheral edges of the circuit board body with a nano waterproof coating, and the nano waterproof coating is also coated with an insulator layer inwardly, so as to avoid short circuits caused by the conduction of the electronic devices in the circuit board body; a heat dissipation duct is arranged on the top of the nano waterproof coating, and the heat dissipation duct is made of heat dissipation aluminum profile and has a "mouth"-shaped structure, and after blowing air from the air inlet on one side, cold air can be sent to various places of the circuit board body, effectively dissipating the heat of the circuit board body, quickly and continuously taking away the heat, and avoiding heating caused by long-term operation, which affects the use. The utility model has a novel structure and is suitable for promotion.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board with an ultra-thin waterproof coating. Background Art

[0002] Circuit board is an important electronic component, a support for electronic components, and a carrier for the electrical interconnection of electronic components. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, must use circuit boards to make electrical interconnections between various components. In the process of using existing circuit boards, there are the following problems: first, the existing circuit boards are installed inside the equipment when in use, and the circuit boards need to be used when powered on. When the circuit boards encounter water, short circuits are likely to occur, thereby affecting the use of the equipment. Second, the circuit boards themselves generate heat energy when in use. Although heat dissipation components are set around the circuit boards, they are not directly in contact with the circuit boards, resulting in slow heat dissipation efficiency, unable to quickly take away the heat energy of the circuit boards, and easily affecting the normal operation of the circuit boards. In view of this, the inventors have proposed a circuit board with an ultra-thin waterproof coating. By applying the ultra-thin waterproof coating to the circuit board, the circuit board has a good waterproof function. At the same time, the coating is also provided with ventilation ducts, which can effectively and quickly dissipate heat.

[0003] In order to improve the waterproof function of the circuit board and avoid the problem of short circuit caused by water ingress, a Chinese patent (authorization announcement number: CN219659999U) discloses a circuit board with good waterproof performance. The utility model includes a circuit board body, a fixing hole and a connecting wire. The surface of the circuit board body is provided with a fixing hole, the surface of the circuit board body is electrically connected with a connecting wire, the surface of the circuit board body is provided with a waterproof mechanism, and a wire binding mechanism is provided between the circuit board body and the connecting wire. The utility model can waterproof the surface of the circuit board body through a waterproof coating and edge sealing, and at the same time, the metal pins of the integrated circuit electronic components on the surface of the circuit board body can be wrapped, so that water can be prevented from directly contacting the metal position, thereby preventing a short circuit from occurring when encountering water, and playing a waterproof role.

[0004] This solution still has some shortcomings in application. When the circuit board is running, the electronic devices it carries are prone to heat up. If good heat dissipation is not performed, it is easy to run slowly or even burn out the electronic devices, affecting the stability and safety of the equipment. Therefore, it is necessary to improve the structure and heat dissipation method of the circuit board to make it have good waterproof and heat dissipation performance. Utility Model Content

[0005] The utility model discloses a circuit board with an ultra-thin waterproof coating, the main purpose of which is to overcome the above-mentioned deficiencies and shortcomings of the prior art.

[0006] The technical solution adopted by the utility model is as follows:

[0007] A circuit board with an ultra-thin waterproof coating comprises a circuit board body, a plurality of electronic devices and slots are arranged on the front of the circuit board body, a nano waterproof coating is coated on the front and back of the circuit board body, a plurality of heat dissipation channels are arranged on the top of the nano waterproof coating, the heat dissipation channels are in a linear mutually interpenetrating structure, and an air inlet is arranged on one side of the heat dissipation channel.

[0008] Furthermore, the periphery of the circuit board is also coated with the nano waterproof coating.

[0009] Furthermore, the inner side of the nano waterproof coating is coated with an insulating layer.

[0010] Furthermore, the heat dissipation channel is internally provided with a heat dissipation pipe, and the heat dissipation pipe is made of heat dissipation aluminum profile.

[0011] Furthermore, the heat dissipation channels are in a "mouth"-shaped interconnected structure.

[0012] Furthermore, a plurality of air outlets are provided at the end of the heat dissipation channel, and the detachable sleeves of the air outlets are provided with plugs.

[0013] It can be seen from the above description of the utility model that, compared with the prior art, the advantages of the utility model are:

[0014] The utility model firstly coats the front, back and periphery of the circuit board with a nano waterproof coating, which can prevent the circuit board from being damaged by water ingress and short circuit. The nano waterproof coating is also coated with an insulator layer inward, which can further prevent the short circuit of the electronic components of the circuit board from being caused by conduction. Then, a heat dissipation duct is arranged on the top of the nano waterproof coating. The heat dissipation duct is made of heat dissipation aluminum profile and has a "mouth"-shaped structure. After blowing air from the air inlet on one side, cold air can be sent to various places of the circuit board, effectively dissipating the heat of the circuit board, quickly and continuously taking away the heat, and avoiding heating caused by long-term operation, which affects the use. Finally, the heat dissipation duct is provided with multiple air outlets, which can be blocked by plugs according to actual conditions, so that the cold air can circulate according to actual conditions, and achieve better heat dissipation effect. The utility model has a novel structure, ingenious design, good waterproof and heat dissipation functions, and is suitable for promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model.

[0016] Figure 2It is a side structural schematic diagram of the utility model.

[0017] Figure 3 It is a schematic diagram of the top structure of the utility model. DETAILED DESCRIPTION

[0018] The specific implementation of the present utility model will be further described below with reference to the accompanying drawings.

[0019] like Figures 1 to 3 As shown, a circuit board with an ultra-thin waterproof coating includes a circuit board body 1, a plurality of electronic devices 11 and slots 12 are arranged on the front of the circuit board body 1, a nano waterproof coating 2 is coated on the front and back of the circuit board body 1, the nano waterproof coating 2 has a plurality of heat dissipation channels 3, the heat dissipation channels 3 are linear and mutually interpenetrating structures, and an air inlet 4 is arranged on one side of the heat dissipation channel 3.

[0020] Furthermore, the circuit board body 1 is also coated with the nano waterproof coating 2 around its periphery.

[0021] Furthermore, the nano waterproof coating 2 is coated with an insulating layer 5 on the inner side.

[0022] Furthermore, the heat dissipation channel 3 is internally provided with a heat dissipation pipe, and the heat dissipation pipe is made of heat dissipation aluminum profile.

[0023] Furthermore, the heat dissipation channels 3 are in a "mouth"-shaped interconnected structure.

[0024] Furthermore, a plurality of air outlets are provided at the end of the heat dissipation channel 3 , and the air outlets are detachably covered with plugs 6 .

[0025] It can be seen from the above description of the utility model that, compared with the prior art, the advantages of the utility model are:

[0026] The utility model firstly coats the front, back and periphery of the circuit board with a nano waterproof coating, which can prevent the circuit board from being damaged by water ingress and short circuit. The nano waterproof coating is also coated with an insulator layer inward, which can further prevent the short circuit of the electronic components of the circuit board from being caused by conduction. Then, a heat dissipation duct is arranged on the top of the nano waterproof coating. The heat dissipation duct is made of heat dissipation aluminum profile and has a "mouth"-shaped structure. After blowing air from the air inlet on one side, cold air can be sent to various places of the circuit board, effectively dissipating the heat of the circuit board, quickly and continuously taking away the heat, and avoiding heating caused by long-term operation, which affects the use. Finally, the heat dissipation duct is provided with multiple air outlets, which can be blocked by plugs according to actual conditions, so that the cold air can circulate according to actual conditions, and achieve better heat dissipation effect. The utility model has a novel structure, ingenious design, good waterproof and heat dissipation functions, and is suitable for promotion.

[0027] The above is only a specific implementation method of the utility model, but the design concept of the utility model is not limited to this. Any non-substantial improvement of the utility model using this concept should be regarded as an infringement of the protection scope of the utility model.

Claims

1. A circuit board with an ultra-thin waterproof coating, characterized in that: It includes a circuit board body, a plurality of electronic devices and slots are arranged on the front of the circuit board body, a nano waterproof coating is coated on the front and back of the circuit board body, a plurality of heat dissipation channels are arranged on the top of the nano waterproof coating, the heat dissipation channels are in a linear mutually interpenetrating structure, and an air inlet is arranged on one side of the heat dissipation channel.

2. A circuit board with an ultra-thin waterproof coating according to claim 1, characterized in that: The periphery of the circuit board is also coated with the nano waterproof coating.

3. A circuit board with an ultra-thin waterproof coating according to claim 1, characterized in that: The inner side of the nano waterproof coating is coated with an insulating layer.

4. A circuit board with an ultra-thin waterproof coating according to claim 1, characterized in that: The heat dissipation channel is internally provided with a heat dissipation pipeline, and the heat dissipation pipeline is made of heat dissipation aluminum profile.

5. A circuit board with an ultra-thin waterproof coating according to claim 1, characterized in that: The heat dissipation channels are in a "mouth"-shaped interconnected structure.

6. A circuit board with an ultra-thin waterproof coating according to claim 1, characterized in that: A plurality of air outlets are arranged at the end of the heat dissipation channel, and the detachable sleeves of the air outlets are provided with plugs.

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